Surface plasma resonance sensing system

Abstract

The utility model discloses a surface plasma resonance sensing system, which comprises a sensing element, a light source module, a detection module, a support plate, a semiconductor heating module and a temperature sensor, and is characterized in that the light source module is connected to one end of the sensing element; the detection module is connected to the other end of the sensing element; the supporting plate is provided with a mounting groove, the sensing element comprises a sensing area, and the sensing area is fixed in the mounting groove; the semiconductor heating module is arranged on one side, back on to the sensing element, of the supporting plate, and the semiconductor heating module is used for adjusting the temperature of the surface of the sensing element; the temperature sensor is arranged between the supporting plate and the semiconductor heating module and used for detecting the surface temperature of the sensing element and feeding back the surface temperature to the semiconductor heating module. Through the arrangement, experiment conditions can be accurately controlled, and the detection precision is improved.

Description

Technical Field

[0001] The utility model relates to a surface plasma resonance sensing system, belonging to the technical field of sensors. Background Art

[0002] Fiber-optic SPR sensors have been increasingly used due to their small size, stable physical and chemical properties, anti-electromagnetic interference, and high sensitivity. During the detection process of fiber-optic SPR sensors, if there are water droplets on the surface of the optical fiber, the detection results will be affected. Utility Model Content

[0003] The utility model aims to provide a surface plasmon resonance sensing system, which can accurately control experimental conditions and improve detection accuracy.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A surface plasmon resonance sensing system, comprising:

[0006] Sensing element;

[0007] A light source module, the light source module is connected to one end of the sensor element;

[0008] A detection module, the detection module is connected to the other end of the sensor element;

[0009] A support plate, wherein the support plate is provided with a mounting groove, and the sensor element comprises a sensing area, and the sensing area is fixed to the mounting groove;

[0010] A semiconductor heating module, which is disposed on a side of the support plate facing away from the sensor element, and is used to adjust the temperature of the surface of the sensor element;

[0011] A temperature sensor is disposed between the support plate and the semiconductor heating module, and is used to detect the surface temperature of the sensing element and feed back the temperature to the semiconductor heating module.

[0012] As a further improved technical solution of the utility model, the temperature sensor is connected to a side of the semiconductor heating module close to the support plate.

[0013] As a further improved technical solution of the utility model, the semiconductor heating module includes a semiconductor heating plate, and the semiconductor heating plate is used to adjust the temperature of the surface of the sensor element after being powered on.

[0014] As a further improved technical solution of the utility model, it also includes a heat dissipation structure, which is arranged on a side of the semiconductor heating module facing away from the support plate.

[0015] As a further improved technical solution of the utility model, the heat dissipation structure includes a heat dissipation base and a plurality of heat dissipation fins fixed on the heat dissipation base.

[0016] As a further improved technical solution of the utility model, the sensor element includes a first sensor element and a second sensor element, one end of the first sensor element is connected to one end of the second sensor element, the light source module is connected to the other end of the first sensor element, the detection module is connected to the other end of the second sensor element, and the first sensor element and the second sensor element are configured to test different physical quantities.

[0017] As a further improved technical solution of the utility model, the mounting groove includes a first mounting groove and a second mounting groove, the first sensing element includes a first sensing area, the second sensing element includes a second sensing area, the first sensing area is arranged in the first mounting groove, the second sensing area is arranged in the second mounting groove, and the first mounting groove and the second mounting groove are both V-shaped grooves.

[0018] As a further improved technical solution of the utility model, the first sensing area is bonded and fixed to the first mounting groove, and the second sensing area is bonded and fixed to the second mounting groove.

[0019] As a further improved technical solution of the utility model, the first sensing element includes a first fiber core and a first outer shell covering the first fiber core, the first sensing area is the area where the first fiber core is exposed outside the first outer shell, the second sensing element includes a second fiber core and a second outer shell covering the second fiber core, and the second sensing area is the area where the second fiber core is exposed outside the second outer shell.

[0020] As a further improved technical solution of the present invention, the diameter of the first fiber core is greater than 62.5 μm, and the diameter of the second fiber core is equal to the diameter of the first fiber core.

[0021] Compared with the prior art, the beneficial effects of the present invention are:

[0022] The present application sets up a semiconductor heating module and a temperature sensor, and controls the temperature of the surface of the sensor element by adjusting the temperature of the support plate to remove liquid water on its surface; based on the different refractive indices of water vapor, liquid water, solid ice and other states, the spectral curves measured by the detection module are also different accordingly. The spectral curves of liquid water, solid ice, etc. are adjusted to be consistent or close to those of water vapor. The spectral curves can accurately reflect the removal of water droplets on the surface of the sensor element, so that reasonable experimental conditions can be obtained, which is conducive to improving detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the surface plasmon resonance sensing system of the utility model;

[0024] Figure 2 yes Figure 1 A top view of the middle support plate;

[0025] Figure 3 yes Figure 1 A cross-sectional view of a first sensing element;

[0026] Figure 4 yes Figure 3 A magnified schematic diagram of the middle A area;

[0027] Figure 5 yes Figure 1 A cross-sectional view of a second sensing element;

[0028] Figure 6 yes Figure 5 A magnified schematic diagram of the middle B area;

[0029] Figure 7 It is a schematic diagram of the structure of the semiconductor heating module and the temperature sensor;

[0030] Figure 8 yes Figure 7 Top view of the heat dissipation structure. DETAILED DESCRIPTION

[0031] The exemplary embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. If there are several embodiments, the features of these embodiments can be combined with each other without conflict. When the description refers to the drawings, unless otherwise specified, the same numbers in different drawings represent the same or similar elements. The contents described in the following exemplary embodiments do not represent all embodiments consistent with the present invention; on the contrary, they are merely examples of devices, products and / or methods that are consistent with some aspects of the present invention and are recorded in the claims of the present invention.

[0032] The terms used in the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the scope of protection of the present invention. The singular forms "a", "said" or "the" used in the specification and claims of the present invention are also intended to include plural forms, unless the context clearly indicates other meanings.

[0033] It should be understood that the words used in the specification and claims of the present invention, such as "first", "second" and similar words, do not indicate any order, quantity or importance, but are only used to distinguish the names of features. Similarly, words such as "one" or "an" do not indicate a quantitative limitation, but indicate the existence of at least one. Unless otherwise specified, words such as "front", "rear", "upper", "lower" and similar words appearing in the present invention are only for the convenience of description and are not limited to a specific position or a spatial orientation. Words such as "include" or "comprise" are an open-ended expression, meaning that the elements appearing before "include" or "comprise" include the elements appearing after "include" or "comprise" and their equivalents, which does not exclude that the elements appearing before "include" or "comprise" may also include other elements. If "several" appears in the present invention, it means two or more.

[0034] Please refer to Figures 1 to 8 As shown, the utility model discloses a surface plasmon resonance sensing system, a sensing element, a light source module 3, a detection module 4 and a support plate 5, wherein the light source module 3 is connected to one end of the sensing element, and the detection module 4 is connected to the other end of the sensing element. The support plate 5 is provided with a mounting groove, and the sensing element includes a sensing area, and the sensing area is fixed to the mounting groove.

[0035] The sensor element comprises a first sensor element 1 and a second sensor element 2, one end of the first sensor element 1 is connected to one end of the second sensor element 2, a light source module 3 is connected to the other end of the first sensor element 1, and a detection module 4 is connected to the other end of the second sensor element 2. The first sensor element 1 and the second sensor element 2 are configured to test different physical quantities.

[0036] In some embodiments, the first sensor element 1 and the second sensor element 2 are both made of multimode optical fiber. The first sensor element 1 is configured to detect the refractive index of the sample, and the second sensor element 2 is configured to detect the ambient temperature, that is, two sensor elements are connected in series on an optical path, and temperature compensation can be performed while measuring the refractive index. The resonant wavelength of the first sensor element 1 is different from the resonant wavelength range of the second sensor element 2, so that the resonance peaks do not overlap.

[0037] See also Figure 3 The first sensor element 1 includes a first fiber core 11 and a first outer sheath 12 covering the first fiber core 11. The first fiber core 11 includes a first sensing region 110. The first sensing region 110 is exposed outside the first outer sheath 12 by peeling off a section of the first outer sheath 12. The first sensing region 110 is polished to form a D-shaped cross section. For details, see Figure 4The first sensing area 110 includes a first polished surface 1101, and the first polished surface 1101 is provided with a first chromium layer 13, and the first chromium layer 13 is provided with a first gold layer 14. The first chromium layer 13 can tightly connect the first gold layer 14 and the first fiber core 11, so that the first gold layer 14 is not easy to fall off when the first sensing element 1 is subjected to a liquid immersion test, which is beneficial to the repeatability and reproducibility of the detection. The first gold layer 14 is provided in the first sensing area 110 because Au has stable chemical properties and can excite surface plasma resonance. By polishing the first sensing area 110 to form a smooth first polished surface 1101, it is beneficial to measure a smooth spectrum curve.

[0038] See also Figure 5 The second sensing element 2 includes a second fiber core 21 and a second outer sheath 22 covering the second fiber core 21. The second fiber core 21 includes a second sensing region 210. The second sensing region 210 is exposed outside the second outer sheath 22 by peeling off a section of the second outer sheath 22. The second sensing region 210 is polished to form a D-shaped cross section. For details, see Figure 6 The second sensing area 210 includes a second polished surface 2101, the second polished surface 2101 is provided with a second chromium layer 23, the second chromium layer 23 is provided with a second gold layer 24, the second gold layer 24 is provided with a polymer layer 25, and the polymer layer 25 is made of polydimethylsiloxane. The second chromium layer 23 can tightly connect the second gold layer 24 and the second fiber core 21 together, so that the second gold layer 24 is not easy to fall off when the second sensing element 2 is subjected to a liquid immersion test, which is beneficial to the repeatability and reproducibility of the detection. Polydimethylsiloxane (PDMS) is a functional material for temperature sensing. By polishing the second sensing area 210, a smooth second polished surface 2101 is formed, which is beneficial to measuring a smooth spectrum curve.

[0039] The diameter of the first fiber core 11 is greater than 62.5 μm, and the diameter of the second fiber core 21 is equal to the diameter of the first fiber core 11. In the embodiment shown in the figure of the utility model, the diameters of the first fiber core 11 and the second fiber core 21 are both 105 μm. Compared with multimode optical fibers with core diameters of 50 μm and 62.5 μm, the multimode optical fiber used in the utility model has higher sensitivity and coupling efficiency.

[0040] For details, see Figure 3 The first outer sheath 12 includes a first cladding 121 and a first coating layer 122 covering the first cladding 121. The first cladding 121 covers the first core 11. The diameter of the first coating layer 122 is 250 μm, and the diameter of the first cladding 121 is 125 μm. Figure 5The second outer sheath 22 includes a second cladding 221 and a second coating layer 222 covering the second cladding 221. The second cladding 221 covers the second core 21. The diameter of the second coating layer 222 is 250 μm, and the diameter of the second cladding 221 is 125 μm.

[0041] The mounting grooves include a first mounting groove 51 and a second mounting groove 52 provided on the support plate 5 , the first sensing area 110 is fixed to the first mounting groove 51 , and the second sensing area 210 is fixed to the second mounting groove 52 , so as to facilitate polishing of the first sensing area 110 and the second sensing area 210 .

[0042] The first mounting groove 51 and the second mounting groove 52 are both V-shaped grooves, and the first sensing area 110 is bonded and fixed to the first mounting groove 51, and the second sensing area 210 is bonded and fixed to the second mounting groove 52. The arc surface of the first sensing area 110 or the second sensing area 210 is in contact with the V-shaped groove and there is a gap between the arc surface and the V-shaped groove, and the gap can be used to fill more glue to improve the connection stability. The glue can be UV glue. Taking the first sensing element 1 as an example, specifically, UV glue can be evenly applied in the V-shaped groove, a section of the first outer layer 12 of the first sensing element 1 is peeled off, and the exposed part of the first fiber core 11 is pressed into the first mounting groove 51, and the UV glue is irradiated with a 365nm UV lamp to solidify the UV glue.

[0043] In some embodiments, see Figure 2 The first mounting groove 51 and the second mounting groove 52 each include a middle area 511, 521, two first gradient zones 512, 522 located on both sides of the middle area 511, 521, a first extension zone 513, 523 located outside each first gradient zone 512, 522, a second gradient zone 514, 524 located outside each first extension zone 513, 523, and a second extension zone 515, 525 located outside each second gradient zone 514, 524, the groove depth of the middle area 511, 521 is H1, the groove depth of the first gradient zone 512, 522 gradually changes from H1 to H2, the groove depth of the first extension zone 513, 523 is H2, the groove depth of the second gradient zone 514, 524 gradually changes from H2 to H3, and the groove depth of the second extension zone 515, 525 is H3, wherein H3>H2>H1.

[0044] Specifically, the value of H1 is 130 μm, the length of the middle area 511, 521 is 5 mm, and the vertex angle is 60°; the value of H2 is 370 μm, the length of the first gradient area 512, 522 is 3.5 mm, the depth of the groove gradually changes from 130 μm to 370 μm, and the vertex angle is 60°; the value of H3 is 800 μm, the length of the second gradient area 514, 524 is 3.5 mm, the depth of the groove gradually changes from 370 μm to 800 μm, and the vertex angle is 60°. The angle between the two groove walls of the V-shaped groove is defined as the vertex angle.

[0045] The first sensing area 110 is fixed to the middle area 511 of the first mounting groove 51. Figure 3 The first sensing element 1 also includes two first transition areas 111 located on both sides of the first sensing area 110. The first transition area 111 only peels off the first coating layer 122. The first transition area 111 is fixed to the first extension area 513. The second extension area 515 is used to accommodate a section of the first sensing element 1 that has not peeled off the first outer layer 12. The second sensing area 210 is fixed to the middle area 521 of the second mounting groove 52. Figure 5 The second sensor element 2 also includes two second transition zones 211 located on both sides of the second sensor area 210. The second transition zone 211 only peels off the second coating layer 222. The second transition zone 211 is fixed to the first extension zone 523. The second extension zone 525 is used to accommodate a section of the second sensor element 2 that has not peeled off the second outer layer 22. The first sensor element 1 and the second sensor element 2 need to be ground before polishing. Grinding paper can be used for grinding. The width of the grinding surface can be observed under a microscope to reach a suitable width. By setting the first gradient zone 512, 522 and the second gradient zone 514, 524, the contact area between the first sensor element 1 or the second sensor element 2 and the V-shaped optical groove can be increased, thereby increasing the tension during grinding.

[0046] The light source module 3 uses a halogen lamp light source, which is used to generate incident light in the visible light band of 500-1000nm. The outgoing light is detected by the detection module 4. The detection method is to record the wavelength of the light with the maximum resonance peak multiple times and then perform numerical analysis.

[0047] See also Figure 1 The detection module 4 includes a first spectrometer 41 and a computer 42, and the computer 42 is electrically connected to the first spectrometer 41. The first spectrometer 41 is used to obtain a spectral signal, and the refractive index of the sample measured by the first sensor element 1 and the temperature measured by the second sensor element 2 are obtained through the spectral signal. The first spectrometer 41 transmits the measured spectral signal to the computer 42, and the computer 42 calculates and outputs the spectrum curve.

[0048] See also Figure 7The surface plasmon resonance sensing system further includes a semiconductor heating module and a temperature sensor 7. The semiconductor heating module is arranged on the side of the support plate 5 facing away from the sensing element. The semiconductor heating module is used to adjust the temperature of the surface of the sensing element.

[0049] See also Figure 7 The semiconductor heating module includes a semiconductor heating sheet 61, which is used to adjust the temperature of the surface of the sensor element after being powered on. The temperature sensor 7 is arranged between the support plate 5 and the semiconductor heating module, and the temperature sensor 7 is used to detect the surface temperature of the sensor element and feed it back to the semiconductor heating module. Specifically, the temperature sensor 7 is connected to a side of the semiconductor heating module close to the support plate 5.

[0050] The temperature sensor 7 can detect the temperature of the surface of the sensor element at any time, and then feed the detected temperature back to the semiconductor heating module. The semiconductor heating plate 61 can heat or cool the support plate 5 according to demand to ensure that the temperature of the surface of the sensor element is at a reasonable level.

[0051] The refractive index spectrum is measured by the detection module 4. Since the measured refractive index curves are different when there are no water drops on the surface of the sensor element and when there are water drops on the surface of the sensor element, the refractive index curve is offset. The temperature measured by the temperature sensor 7 is fed back to the semiconductor heating module, and the semiconductor heating plate 61 heats the support plate 5 to remove the water drops on its surface, that is, the spectrum curve is adjusted to be consistent with or close to the spectrum curve without water drops. The spectrum curve can accurately reflect the removal of water drops on the surface of the sensor element.

[0052] In the present application, the semiconductor heating plate 61 can not only heat the support plate 5 but also cool the support plate 5, and can meet different detection conditions.

[0053] The surface plasmon resonance sensing system further includes a heat dissipation structure, which is disposed on the side of the semiconductor heating module facing away from the support plate 5. Figure 7 and Figure 8 The heat dissipation structure includes a heat dissipation base 81 and a plurality of heat dissipation fins 82 fixed on the heat dissipation base 81 .

[0054] The above implementation modes are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. The understanding of the present invention should be based on the technical personnel in the relevant technical field. Although the present invention has been described in detail in this specification with reference to the above implementation modes, ordinary technical personnel in the field should understand that the technical personnel in the relevant technical field can still modify or make equivalent substitutions to the present invention, and all technical solutions and improvements thereof that do not depart from the spirit and scope of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A surface plasmon resonance sensing system, characterized in that: include: Sensing element; A light source module (3), the light source module (3) being connected to one end of the sensor element; A detection module (4), the detection module (4) being connected to the other end of the sensor element; A support plate (5), the support plate (5) being provided with a mounting groove, the sensor element comprising a sensing area, the sensing area being fixed to the mounting groove; a semiconductor heating module, the semiconductor heating module being arranged on a side of the support plate (5) facing away from the sensor element, the semiconductor heating module being used to adjust the temperature of the surface of the sensor element; as well as A temperature sensor (7), wherein the temperature sensor (7) is arranged between the support plate (5) and the semiconductor heating module, and the temperature sensor (7) is used to detect the surface temperature of the sensing element and feed back to the semiconductor heating module.

2. The surface plasmon resonance sensing system according to claim 1, characterized in that: The temperature sensor (7) is connected to a side of the semiconductor heating module close to the support plate (5).

3. The surface plasmon resonance sensing system according to claim 1, wherein: The semiconductor heating module comprises a semiconductor heating plate (61), and the semiconductor heating plate (61) is used to adjust the temperature of the surface of the sensor element after being powered on.

4. The surface plasmon resonance sensing system according to claim 1, wherein: It also comprises a heat dissipation structure, which is arranged on a side of the semiconductor heating module facing away from the support plate (5).

5. The surface plasmon resonance sensing system according to claim 4, characterized in that: The heat dissipation structure comprises a heat dissipation base (81) and a plurality of heat dissipation fins (82) fixed on the heat dissipation base (81).

6. The surface plasmon resonance sensing system according to claim 1, wherein: The sensor element comprises a first sensor element (1) and a second sensor element (2), one end of the first sensor element (1) is connected to one end of the second sensor element (2), the light source module (3) is connected to the other end of the first sensor element (1), the detection module (4) is connected to the other end of the second sensor element (2), and the first sensor element (1) and the second sensor element (2) are configured to test different physical quantities.

7. The surface plasmon resonance sensing system according to claim 6, characterized in that: The mounting groove comprises a first mounting groove (51) and a second mounting groove (52); the first sensing element (1) comprises a first sensing area (110); the second sensing element (2) comprises a second sensing area (210); the first sensing area (110) is arranged in the first mounting groove (51); the second sensing area (210) is arranged in the second mounting groove (52); and the first mounting groove (51) and the second mounting groove (52) are both V-shaped grooves.

8. The surface plasmon resonance sensing system according to claim 7, characterized in that: The first sensing area (110) is bonded and fixed to the first mounting groove (51), and the second sensing area (210) is bonded and fixed to the second mounting groove (52).

9. The surface plasmon resonance sensing system according to claim 7, characterized in that: The first sensing element (1) comprises a first fiber core (11) and a first outer shell (12) covering the first fiber core (11); the first sensing area (110) is an area where the first fiber core (11) is exposed outside the first outer shell (12); the second sensing element (2) comprises a second fiber core (21) and a second outer shell (22) covering the second fiber core (21); the second sensing area (210) is an area where the second fiber core (21) is exposed outside the second outer shell (22).

10. The surface plasmon resonance sensing system according to claim 9, characterized in that: The diameter of the first fiber core (11) is greater than 62.5 μm, and the diameter of the second fiber core (21) is equal to the diameter of the first fiber core (11).

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