Computer host

Abstract

The utility model discloses a computer host which comprises a shell and a heat dissipation structure, and the shell is provided with an installation cavity and an air outlet communicated with the installation cavity. The heat dissipation structure comprises a heat dissipation assembly, an air guide part and an air supply part, the heat dissipation assembly corresponds to the CPU and is arranged in the mounting cavity, the heat dissipation assembly is suitable for transmitting heat dissipated by the CPU, the air supply part and the air guide part are arranged on the two sides of the heat dissipation assembly respectively, the air guide part is provided with an air guide channel, and the air guide channel communicates with the air outlet; and the heat radiated by the CPU and transmitted by the heat dissipation assembly is discharged out of the mounting cavity through the air supply piece. According to the computer host with the structure, the heat dissipated into the air guide channel through the heat dissipation assembly can be discharged out of the air guide channel through the air supply piece, so that the heat discharge efficiency is improved, the heat is prevented from staying in the air guide channel, and the heat dissipation efficiency of the computer host is finally improved.

Description

Technical Field

[0001] The utility model relates to the technical field of computers, in particular to a computer host. Background Art

[0002] The computer host includes a case and electronic components such as a motherboard, CPU, graphics card, hard disk, memory stick, etc. placed inside the case. The CPU, graphics card, hard disk, memory stick and other components are generally fixed on the motherboard, and the motherboard is fixed to the case so that the CPU, graphics card, hard disk, memory stick and other components are fixed inside the case.

[0003] In the prior art, when a computer host is in use, components such as the CPU, graphics card, hard disk, and memory stick fixed on the motherboard will generate heat under the action of electricity. Among them, the CPU generates the most heat. Therefore, a radiator is needed to dissipate the heat of the CPU separately to avoid damage to the CPU. Since the heat dissipated by each component is in the chassis, an air supply part is needed to discharge the heat in the chassis to the outside of the chassis. At the same time, most chassis adopt a system air duct design with a front panel and side panel openings for air intake and a rear panel for air outlet to discharge the heat in the chassis to the outside of the chassis.

[0004] However, the existing computer host discharges the heat emitted by the CPU into the chassis through the radiator, and then discharges it to the outside of the chassis through the air supply part, which will cause the heat to stay in the chassis for a period of time. During this period of time, the retained heat will increase the ambient temperature in the chassis, thereby increasing the temperature of each component, thereby reducing the heat dissipation efficiency of the computer host. Utility Model Content

[0005] Therefore, the technical problem to be solved by the utility model is to overcome the defect that the existing computer host discharges the heat emitted by the CPU into the chassis through the radiator, which increases the ambient temperature in the chassis, thereby increasing the temperature of each component, and further reducing the heat dissipation efficiency of the computer host.

[0006] To this end, the utility model provides a computer host, comprising:

[0007] A housing having a mounting cavity and an air outlet communicating with the mounting cavity;

[0008] The heat dissipation structure includes a heat dissipation component, an air guide component and an air supply component. The heat dissipation component is arranged in the installation cavity corresponding to the CPU. The heat dissipation component is suitable for transferring the heat dissipated by the CPU. The air supply component and the air guide component are respectively arranged on both sides of the heat dissipation component, and the air guide component has an air guide channel. The air guide channel is connected to the air outlet so that the heat dissipated by the CPU transferred by the heat dissipation component can be discharged to the outside of the installation cavity through the air supply component.

[0009] Optionally, in the above-mentioned computer host, an exhaust duct is formed between the air supply member and the air outlet, and the exhaust duct is arranged in the air guide channel to discharge the heat emitted by the CPU transmitted by the heat dissipation component to the outside of the installation cavity.

[0010] Optionally, in the above-mentioned computer host, the shell also has an air inlet connected to the installation cavity, and an air supply duct is formed between the air supply member and the air inlet to deliver the air flowing into the installation cavity from the air inlet side into the air guide channel.

[0011] Optionally, in the above-mentioned computer host, the air supply member has an air inlet surface and an air exhaust surface, the air supply duct is formed between the air inlet surface and the air inlet, and the air exhaust duct is formed between the air exhaust surface and the air outlet.

[0012] Optionally, in the above-mentioned computer host, the heat dissipation structure also includes an exhaust member, and the exhaust member is arranged in the air guide channel and at the air outlet to discharge the heat in the air guide channel to the outside.

[0013] Optionally, in the above-mentioned computer host, the heat dissipation assembly includes a heat sink and a mounting seat, the mounting seat is arranged in the mounting cavity corresponding to the CPU, and the heat sink is arranged on the mounting seat and in the air guide channel.

[0014] Optionally, in the above-mentioned computer host, the heat sink includes a plurality of transmission parts and a plurality of heat dissipation parts, any one of the transmission parts is arranged between all the heat dissipation parts, and one end of any one of the transmission parts abuts against the mounting seat to transfer the heat dissipated by the CPU to the heat dissipation part and discharge it to the outside through the air supply part.

[0015] Optionally, the above-mentioned computer host further includes a board assembly, the board assembly includes a mainboard and a CPU, the CPU is arranged on the mainboard, the mainboard is arranged in the installation cavity, and the mounting seat is arranged on the mainboard corresponding to the CPU.

[0016] Optionally, in the above-mentioned computer host, the board assembly also includes a graphics card, a memory stick and a hard disk, and the graphics card, the memory stick and the hard disk are all arranged on the mainboard, and the heat dissipated by the graphics card, the memory stick and the hard disk is all delivered into the air guide channel through the air supply member.

[0017] Optionally, the above-mentioned computer host further includes a power supply component, which is arranged in the installation cavity and electrically connected to the mainboard.

[0018] The technical solution provided by the utility model has the following advantages:

[0019] 1. The computer host provided by the utility model includes a shell and a heat dissipation structure, the shell has an installation cavity and an air outlet connected to the installation cavity; the heat dissipation structure includes a heat dissipation component, an air guide and an air supply component, the heat dissipation component is arranged in the installation cavity corresponding to the CPU, the heat dissipation component is suitable for transferring the heat dissipated by the CPU, the air supply component and the air guide component are respectively arranged on both sides of the heat dissipation component, and the air guide component has an air guide channel, which is connected to the air outlet, so as to discharge the heat dissipated by the CPU transferred by the heat dissipation component to the outside of the installation cavity through the air supply component.

[0020] The computer host of this structure has a heat dissipation structure arranged in a shell, the shell has an installation cavity and an air outlet connected to the installation cavity, the heat dissipation structure is arranged in the installation cavity, and the heat dissipation structure includes a heat dissipation component, an air guide and an air supply component, wherein the heat dissipation component is arranged corresponding to the CPU arranged in the installation cavity and contacts the CPU, so as to transfer the heat generated by the CPU when it is working, and avoid the heat generated by the CPU from not being dissipated, thereby affecting the normal operation of the CPU, the air guide and the air supply are respectively arranged on both sides of the heat dissipation component, the air guide has an air guide channel connected to the air outlet, and part of the heat dissipation component is arranged in the air guide channel, so that the heat dissipated by the CPU transferred by the heat dissipation component can be dissipated into the air guide channel, rather than directly dissipated into the installation cavity through the heat dissipation component and increasing the temperature in the installation cavity, thereby avoiding the heat from affecting other components in the installation cavity, so that other components in the installation cavity can work normally, and at the same time, the heat dissipated into the air guide channel through the heat dissipation component can be discharged to the outside of the air guide channel through the air supply component, thereby improving the heat discharge efficiency, avoiding the heat from staying in the air guide channel, and ultimately improving the heat dissipation efficiency of the computer host. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A schematic diagram of the structure of a computer host provided in an embodiment of the utility model;

[0023] Figure 2 A schematic diagram of the structure of the heat dissipation structure provided in an embodiment of the utility model;

[0024] Figure 3 It is a structural schematic diagram of a heat dissipation assembly provided in an embodiment of the utility model;

[0025] Figure 4It is a structural schematic diagram of a plate assembly provided in an embodiment of the utility model;

[0026] Description of reference numerals:

[0027] 1-housing; 11-installation cavity; 12-air inlet;

[0028] 2-heat dissipation structure; 21-heat dissipation assembly; 211-heat dissipation member; 2111-transmission part; 2112-heat dissipation part; 212-mounting seat; 22-air guide member; 23-air supply member; 24-air exhaust member;

[0029] 3-board assembly; 31-motherboard; 32-CPU; 33-graphics card; 34-memory bar; 35-hard disk;

[0030] 4- Power supply unit. DETAILED DESCRIPTION

[0031] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0035] Example 1

[0036] This embodiment provides a computer host, such as Figures 1 to 4 As shown, it includes a shell 1 and a heat dissipation structure 2, the shell 1 has an installation cavity 11 and an air outlet connected to the installation cavity 11; the heat dissipation structure 2 includes a heat dissipation component 21, an air guide member 22 and an air supply member 23, the heat dissipation component 21 is arranged in the installation cavity 11 corresponding to the CPU 32, the heat dissipation component 21 is suitable for transferring the heat dissipated by the CPU 32, the air supply member 23 and the air guide member 22 are respectively arranged on both sides of the heat dissipation component 21, and the air guide member 22 has an air guide channel, which is connected to the air outlet, so as to discharge the heat dissipated by the CPU 32 transferred by the heat dissipation component 21 to the outside of the installation cavity 11 through the air supply member 23.

[0037] The computer host of the above structure is provided with a heat dissipation structure 2 in a housing 1. The housing 1 has an installation cavity 11 and an air outlet connected to the installation cavity 11. The heat dissipation structure 2 is provided in the installation cavity 11, and the heat dissipation structure 2 includes a heat dissipation component 21, an air guide 22 and an air supply component 23. The air guide 22 is an air guide cover in this embodiment, and the air supply component 23 is a first fan in this embodiment. The heat dissipation component 21 is provided corresponding to the CPU 32 provided in the installation cavity 11 and is in contact with the CPU 32, so as to transfer the heat generated by the CPU 32 when working, so as to avoid the heat generated by the CPU 32 from not being dissipated, thereby affecting the normal operation of the CPU 32. The air guide 22 and the air supply component 23 are respectively provided in the heat dissipation component 21 and the air supply component 23. On both sides of 21, the air guide member 22 has an air guide channel connected to the air outlet, and part of the heat dissipation component 21 is arranged in the air guide channel, so that the heat dissipated by the CPU 32 transmitted by the heat dissipation component 21 can be dissipated into the air guide channel, rather than directly dissipated into the installation cavity 11 through the heat dissipation component 21 and increasing the temperature in the installation cavity 11, thereby avoiding the heat from affecting other components in the installation cavity 11, so that other components in the installation cavity 11 can work normally, and at the same time, the heat dissipated into the air guide channel through the heat dissipation component 21 can be discharged to the outside of the air guide channel through the air supply member 23, thereby improving the heat discharge efficiency, avoiding the heat from staying in the air guide channel, and ultimately improving the heat dissipation efficiency of the computer host.

[0038] The computer host provided in this embodiment is as follows: Figure 1 As shown, an exhaust air duct is formed between the air supply member 23 and the air outlet, and the exhaust air duct is arranged in the air guide channel to discharge the heat emitted by the CPU 32 transmitted by the heat dissipation component 21 to the outside of the installation cavity 11.

[0039] The computer host of the above structure has an exhaust duct formed between the air supply member 23 and the air outlet, and the exhaust duct is formed in the air guide channel. Therefore, when the heat dissipation component 21 transfers the heat emitted by the CPU 32 to the air guide channel, the air supply member 23 can discharge the heat from the air outlet to the outside through the exhaust duct.

[0040] The computer host provided in this embodiment is as follows: Figure 1 As shown, the housing 1 also has an air inlet 12 connected to the installation cavity 11, and an air supply duct is formed between the air supply member 23 and the air inlet 12 to deliver the air flowing into the installation cavity 11 from the air inlet 12 side into the air guide channel.

[0041] The computer host of the above structure is connected with the installation cavity 11 through the air inlet 12 opened on the shell 1 and the air supply duct formed between the air supply member 23 and the air inlet 12, so that the outside air can flow into the installation cavity 11, and the air flowing into the installation cavity 11 can be sucked into the air guide channel by the air supply member 23 through the air supply duct, so that the heat in the air guide channel can be discharged to the outside by the air supply member 23 through the exhaust duct, and finally a heat dissipation cycle is formed between the installation cavity 11 and the air guide channel.

[0042] The computer host provided in this embodiment is as follows: Figure 1 As shown, the air supply member 23 has an air inlet surface and an air outlet surface. An air supply duct is formed between the air inlet surface and the air inlet 12, and an air outlet duct is formed between the air outlet surface and the air outlet.

[0043] The computer host of the above structure has an air supply surface and an air exhaust surface by setting an air supply part 23, wherein the air supply surface is set in the installation cavity 11, and the exhaust surface is set in the air guide channel, so that when the outside air flows into the installation cavity 11 through the air inlet 12, an air supply duct can be formed between the air supply surface and the air inlet 12, and the air is sucked into the air guide channel through the air supply duct, and then an exhaust duct is formed between the exhaust surface and the air outlet, and finally the heat in the air guide channel is discharged to the outside through the exhaust duct.

[0044] The computer host provided in this embodiment is as follows: Figure 2 and Figure 3 As shown, the heat dissipation structure 2 further includes an exhaust member 24, which is disposed in the air guide channel and at the air outlet to discharge the heat in the air guide channel to the outside.

[0045] The computer host of the above structure also includes an exhaust member 24 by setting the heat dissipation structure 2. The exhaust member 24 is a second fan in this embodiment. The exhaust member 24 is specifically arranged in the air guide channel and at the air outlet. Therefore, when there is too much heat in the air guide channel, the exhaust member 24 can assist the air supply member 23 to discharge the heat to the outside, thereby further improving the heat discharge efficiency. Of course, when there is less heat in the air guide channel, the exhaust member 24 can be installed at the air outlet without installing it, and the heat discharge can be completed by the air supply member 23 alone.

[0046] The computer host provided in this embodiment is as follows: Figure 2 and Figure 3As shown, the heat dissipation assembly 21 includes a heat sink 211 and a mounting seat 212. The mounting seat 212 is arranged in the mounting cavity 11 corresponding to the CPU 32. The heat sink 211 is arranged on the mounting seat 212 and in the air guide channel.

[0047] The computer host of the above structure is provided with a heat dissipation component 21 including a heat sink 211 and a mounting seat 212. The heat sink 211 is a radiator in this embodiment, wherein the mounting seat 212 is arranged in the mounting cavity 11 corresponding to the CPU 32 and is connected to the shell 1, and the heat sink 211 is arranged on the mounting seat 212, and part of the heat sink 211 is in contact with the CPU 32, and the other part is arranged in the air guide channel, so that the heat dissipated by the CPU 32 is transferred to the air guide channel, so that the heat is discharged to the outside through the air supply member 23.

[0048] The computer host provided in this embodiment is as follows: Figure 2 and Figure 3 As shown, the heat sink 211 includes a plurality of transfer parts 2111 and a plurality of heat dissipation parts 2112. Any transfer part 2111 is arranged between all the heat dissipation parts 2112. One end of any transfer part 2111 abuts against the mounting seat 212 to transfer the heat dissipated by the CPU 32 to the heat dissipation part 2112 and discharge it to the outside through the air supply part 23.

[0049] The computer host of the above structure includes a transfer part 2111 and a heat dissipation part 2112 by setting a heat dissipation part 2111. The transfer part 2111 is a heat pipe in this embodiment, and the heat dissipation part 2112 is a heat sink in this embodiment, wherein all the heat dissipation parts 2112 are stacked and arranged in the air guide channel, and the transfer part 2111 is arranged between all the heat dissipation parts 2112, and one end of the transfer part 2111 is in contact with the CPU 32, so that the heat dissipated by the CPU 32 is transferred to the heat dissipation part 2112, and the heat on the heat dissipation part 2112 is discharged to the outside through the air supply part 23 in the air guide channel to achieve heat dissipation.

[0050] The computer host provided in this embodiment is as follows: Figure 1 and Figure 4 As shown, it also includes a board assembly 3, which includes a mainboard 31 and a CPU 32. The CPU 32 is arranged on the mainboard 31, the mainboard 31 is arranged in the installation cavity 11, and the installation seat 212 is arranged on the mainboard 31 corresponding to the CPU 32.

[0051] The computer host of the above structure includes a mainboard 31 and a CPU 32 by setting a board assembly 3, wherein the mainboard 31 is arranged in the installation cavity 11 and connected to the shell 1. The mainboard 31 can provide a location for the installation of other components of the computer host and ensure the normal use of the computer host. The CPU 32 is arranged on the mainboard 31, which can provide a guarantee for the normal use of the computer host. At the same time, the mounting seat 212 corresponds to the connection between the CPU 32 and the mainboard 31, so that the transmission part 2111 can contact the CPU 32.

[0052] The computer host provided in this embodiment is as follows: Figure 4 As shown, the board assembly 3 also includes a graphics card 33, a memory stick 34 and a hard disk 35. The graphics card 33, the memory stick 34 and the hard disk 35 are all arranged on the motherboard 31. The heat emitted by the graphics card 33, the memory stick 34 and the hard disk 35 is all sent into the air guide channel through the air supply part 23.

[0053] The computer host of the above structure also includes a graphics card 33, a memory stick 34 and a hard disk 35 by setting the board assembly 3. The graphics card 33, the memory stick 34 and the hard disk 35 are all set on the main board 31, which can provide guarantee for the normal use of the computer host, and the heat generated by the graphics card 33, the memory stick 34 and the hard disk 35 during operation can be sucked into the air guide channel by the air supply part 23 through the air supply duct, and discharged to the outside by the air supply part 23 through the exhaust duct.

[0054] The computer host provided in this embodiment is as follows: Figure 1 As shown, a power supply unit 4 is also included. The power supply unit 4 is arranged in the installation cavity 11 and is electrically connected to the main board 31 .

[0055] The computer host of the above structure provides the power required for operation of various components installed on the mainboard 31 through the power supply unit 4 arranged in the installation cavity 11. The power supply unit 4 is a power supply in this embodiment and is electrically connected to the mainboard 31.

[0056] The computer host provided by the utility model has a heat dissipation structure 2 arranged in a shell 1. The shell 1 has an installation cavity 11 and an air outlet connected to the installation cavity 11. The heat dissipation structure 2 is arranged in the installation cavity 11, and the heat dissipation structure 2 includes a heat dissipation component 21, an air guide 22 and an air supply component 23. The heat dissipation component 21 is arranged corresponding to the CPU 32 arranged in the installation cavity 11 and is in contact with the CPU 32, so as to transfer the heat generated by the CPU 32 when working, so as to avoid the heat generated by the CPU 32 from not being dissipated, thereby affecting the normal operation of the CPU 32. The air guide 22 and the air supply component 23 are respectively arranged on both sides of the heat dissipation component 21, and the air guide 22 has a An air guiding channel is connected to the air outlet, and part of the heat dissipation component 21 is arranged in the air guiding channel, so that the heat dissipated by the CPU 32 transmitted by the heat dissipation component 21 can be dissipated into the air guiding channel, rather than being directly dissipated into the installation cavity 11 through the heat dissipation component 21 and increasing the temperature in the installation cavity 11, thereby avoiding the heat from affecting other components in the installation cavity 11, so that other components in the installation cavity 11 can work normally, and at the same time, the heat dissipated into the air guiding channel through the heat dissipation component 21 can be discharged to the outside of the air guiding channel through the air supply member 23, thereby improving the heat discharge efficiency, avoiding the heat from staying in the air guiding channel, and ultimately improving the heat dissipation efficiency of the computer host.

[0057] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.

Claims

1. A computer host, characterized in that: include: A housing (1) having a mounting cavity (11) and an air outlet communicated with the mounting cavity (11); A heat dissipation structure (2) comprises a heat dissipation component (21), an air guide member (22) and an air supply member (23); the heat dissipation component (21) is arranged in the installation cavity (11) corresponding to the CPU (32); the heat dissipation component (21) is suitable for transferring heat dissipated by the CPU (32); the air supply member (23) and the air guide member (22) are respectively arranged on both sides of the heat dissipation component (21); and the air guide member (22) has an air guide channel, which is connected to the air outlet so as to discharge the heat dissipated by the CPU (32) transferred by the heat dissipation component (21) to the outside of the installation cavity (11) through the air supply member (23).

2. The computer host according to claim 1, characterized in that: An exhaust air duct is formed between the air supply member (23) and the air outlet, and the exhaust air duct is arranged in the air guide channel to discharge the heat emitted by the CPU (32) transmitted by the heat dissipation component (21) to the outside of the installation cavity (11).

3. The computer host according to claim 2, characterized in that: The housing (1) further comprises an air inlet (12) connected to the installation cavity (11), and an air supply duct is formed between the air supply member (23) and the air inlet (12) so as to deliver the air flowing into the installation cavity (11) from the air inlet (12) side into the air guide channel.

4. The computer host according to claim 3, characterized in that: The air supply member (23) has an air inlet surface and an air outlet surface, the air supply duct is formed between the air inlet surface and the air inlet (12), and the air outlet duct is formed between the air outlet surface and the air outlet.

5. The computer host according to any one of claims 1 to 4, characterized in that: The heat dissipation structure (2) further comprises an exhaust member (24), wherein the exhaust member (24) is arranged in the air guide channel and at the air outlet so as to discharge the heat in the air guide channel to the outside.

6. The computer host according to claim 5, characterized in that: The heat dissipation assembly (21) comprises a heat dissipation element (211) and a mounting seat (212); the mounting seat (212) is arranged in the mounting cavity (11) corresponding to the CPU (32); and the heat dissipation element (211) is arranged on the mounting seat (212) and in the air guide channel.

7. The computer host according to claim 6, characterized in that: The heat sink (211) comprises a plurality of transfer parts (2111) and a plurality of heat sinks (2112); any one of the transfer parts (2111) is arranged between all of the heat sinks (2112); one end of any one of the transfer parts (2111) abuts against the mounting seat (212) so as to transfer the heat emitted by the CPU (32) to the heat sink (2112) and discharge the heat to the outside through the air supply part (23).

8. The computer host according to claim 7, characterized in that: The invention also comprises a board assembly (3), wherein the board assembly (3) comprises a main board (31) and a CPU (32), wherein the CPU (32) is arranged on the main board (31), the main board (31) is arranged in the installation cavity (11), and the installation seat (212) is arranged on the main board (31) corresponding to the CPU (32).

9. The computer host according to claim 8, characterized in that: The board assembly (3) further comprises a graphics card (33), a memory bar (34) and a hard disk (35); the graphics card (33), the memory bar (34) and the hard disk (35) are all arranged on the mainboard (31); and the heat emitted by the graphics card (33), the memory bar (34) and the hard disk (35) is sent into the air guide channel through the air supply member (23).

10. The computer host according to claim 9, characterized in that: It also includes a power supply component (4), which is arranged in the installation cavity (11) and is electrically connected to the main board (31).

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