Heat dissipation structure of embedded computer

Abstract

The utility model relates to the technical field of embedded computers, and discloses a radiating structure of an embedded computer, which comprises a panel, a case and radiating fins, the case is mounted on the rear side of the panel, the radiating fins are mounted on two sides of the case, radiating holes are arranged at the bottom of the case, and four radiating ports are arranged at the bottom of the case. According to the computer case, the heat dissipation assembly, the heat dissipation holes, the heat dissipation openings and the through holes are arranged, then the air pump and the heat dissipation fan are started, the air pump conveys air to the conduction disc through the conveying pipe, the conduction disc conveys the air to the heat dissipation openings through the through holes, and then the air is conveyed into the computer case through the heat dissipation fan, so that cooling is achieved; the problems that in the prior art, no capacity for optimizing heat dissipation of the embedded computer exists, the heat dissipation problem of the embedded computer is an important consideration factor, and due to overheating, performance is reduced, hardware is damaged, and even system faults are caused are solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of embedded computers, and in particular relates to a heat dissipation structure of an embedded computer. Background Art

[0002] An embedded computer is a special computer technology that is mainly used for a specific application, such as networking, communications, audio, video, industrial control, etc. It is based on computer technology, but the software and hardware can be tailored to meet the application system's strict requirements for functionality, reliability, cost, size and power consumption. An embedded system usually consists of four parts: an embedded microprocessor, peripheral hardware devices, an embedded operating system, and user applications. Compared with commonly used computers, embedded computers are more integrated. For example, a single-board computer integrates a motherboard, CPU, memory, and even a hard disk. When choosing the hardware for an embedded computer, you need to choose according to the actual application needs.

[0003] Embedded computers generate high heat during use. The problem with the above technology is that the existing technology does not have the ability to optimize the heat dissipation of embedded computers. The heat dissipation problem of embedded computers is an important consideration because overheating can lead to performance degradation, hardware damage, and even system failure. Utility Model Content

[0004] In view of the problems existing in the prior art, the utility model provides a heat dissipation structure of an embedded computer which can overcome the above problems or at least partially solve the above problems.

[0005] The utility model is implemented as follows: a heat dissipation structure of an embedded computer comprises a panel, a chassis and a heat sink, wherein the chassis is installed at the rear side of the panel, the heat sink is installed at both sides of the chassis, a heat dissipation hole is provided at the bottom of the chassis, four heat dissipation ports are provided at the bottom of the chassis, a through opening leading to the heat dissipation port is provided on the inner wall of the heat dissipation hole, a heat dissipation component is provided at the bottom of the chassis, a limiting block is provided at the rear side of the chassis, a limiting hole is provided at the front side of the limiting block, a limiting rod is provided in the inner cavity of the limiting hole, and a fixing mechanism used in conjunction with the limiting rod is provided in the inner cavity of the limiting block;

[0006] The heat dissipation component is used to dissipate heat inside the chassis;

[0007] The fixing mechanism is used for positioning the limit block.

[0008] In order to improve the heat dissipation capacity of the chassis, preferably, the heat dissipation component includes an air pump, the bottom of the air pump is fixedly connected to a delivery pipe, one end of the delivery pipe is fixedly connected to a conduction disk, the inner cavity of the heat dissipation port is provided with a heat dissipation fan used in conjunction with the conduction disk, and the cooperation of the heat dissipation component with the heat dissipation holes and the heat dissipation port can dissipate heat from the chassis.

[0009] In order to fix and limit the air pump, preferably, the fixing mechanism includes a fixing rod, the bottom of the fixing rod is fixedly connected to a stabilizing block, the inner cavity of the stabilizing block is provided with a stabilizing rod, a spring is provided on the opposite side of the two fixing rods, a movable block is provided at the bottom of the stabilizing block, and a movable rod is provided on the rear side of the movable block. The fixing mechanism can cooperate with the limiting block to fix and limit the air pump.

[0010] In order to enhance the limiting ability of the limiting block, preferably, the side of the limiting rod close to the inner wall of the limiting hole contacts the inner wall of the limiting hole, the surface of the limiting rod is provided with a fixing groove used in conjunction with the fixing rod, the top of the limiting block is fixedly connected to the air pump, and the limiting rod and the limiting hole can limit the limiting block.

[0011] For heat dissipation efficiency, preferably, a support block is provided at the bottom of the air pump, one end of the conduction plate is in close contact with the heat dissipation hole, and the heat dissipation fan is installed in the inner cavity of the heat dissipation port. The air pump can speed up the flow rate of air and transport air into the inner cavity of the chassis to reduce the temperature.

[0012] In order to fix and limit the air pump, preferably, the side of the fixing rod close to the inner wall of the fixing groove contacts the inner wall of the fixing groove, and one side of the stabilizing rod is fixedly connected to the inner wall of the limiting block. The fixing mechanism can cooperate with the limiting block to fix and limit the air pump.

[0013] In order to fix and limit the air pump, preferably, both sides of the spring are fixedly connected to the fixing rod, and the side of the movable rod close to the movable block is in contact with the movable block, and the fixing mechanism can cooperate with the limiting block to fix and limit the air pump.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0015] The utility model provides a heat dissipation component, heat dissipation holes, heat dissipation ports and through holes, and then turns on an air pump and a heat dissipation fan. The air pump conveys air to a conduction disk through a delivery pipe, and the conduction disk conveys air to the heat dissipation ports through the through holes, and then conveys air to the chassis through the heat dissipation fan to reduce the temperature. This solves the problem that the prior art does not have the ability to optimize the heat dissipation of embedded computers. The heat dissipation problem of embedded computers is an important consideration because overheating can lead to performance degradation, damage to hardware, and even cause system failures. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of a three-dimensional structure provided by an embodiment of the utility model;

[0017] Figure 2 It is a three-dimensional schematic diagram of the bottom of the structure provided by the embodiment of the utility model;

[0018] Figure 3 It is a three-dimensional schematic diagram of a local structure provided by an embodiment of the utility model;

[0019] Figure 4 It is a three-dimensional schematic diagram of a vertical section of a limit block provided by an embodiment of the utility model.

[0020] In the figure: 1. panel; 2. chassis; 3. heat sink; 4. heat dissipation holes; 5. heat dissipation port; 6. through port; 7. heat dissipation assembly; 701. air pump; 702. delivery pipe; 703. conduction plate; 704. cooling fan; 8. limit block; 9. limit hole; 10. limit rod; 11. fixing mechanism; 1101. fixing rod; 1102. stabilizing block; 1103. stabilizing rod; 1104. spring; 1105. movable block; 1106. movable rod; 12. support block; 13. fixing groove. DETAILED DESCRIPTION

[0021] In order to further understand the content, features and effects of the present invention, the following embodiments are given as examples and described in detail with reference to the accompanying drawings.

[0022] The structure of the utility model is described in detail below in conjunction with the accompanying drawings.

[0023] like Figures 1 to 4 As shown, the heat dissipation structure of the embedded computer provided by the embodiment of the utility model comprises a panel 1, a chassis 2 and a heat sink 3, the chassis 2 is installed on the rear side of the panel 1, the heat sink 3 is installed on both sides of the chassis 2, a heat dissipation hole 4 is provided at the bottom of the chassis 2, four heat dissipation ports 5 are provided at the bottom of the chassis 2, a through hole 6 leading to the heat dissipation port 5 is provided on the inner wall of the heat dissipation hole 4, a heat dissipation component 7 is provided at the bottom of the chassis 2, a limiting block 8 is provided at the rear side of the chassis 2, a limiting hole 9 is provided at the front side of the limiting block 8, a limiting rod 10 is provided in the inner cavity of the limiting hole 9, and a fixing mechanism 11 used in conjunction with the limiting rod 10 is provided in the inner cavity of the limiting block 8;

[0024] The heat dissipation assembly 7 is used to dissipate heat inside the chassis 2; the fixing mechanism 11 is used to position the limit block 8; the heat dissipation assembly 7 includes an air pump 701, the bottom of the air pump 701 is fixedly connected to a delivery pipe 702, one end of the delivery pipe 702 is fixedly connected to a conduction plate 703, the inner cavity of the heat dissipation port 5 is provided with a heat dissipation fan 704 used in conjunction with the conduction plate 703, and the heat dissipation assembly 7 cooperates with the heat dissipation hole 4 and the heat dissipation port 5 to dissipate heat for the chassis 2; the fixing mechanism 11 includes a fixing rod 1101, a fixing rod 1102, a fixing rod 1103, a fixing rod 1104, a fixing rod 1104, a fixing rod 1105, a fixing rod 1106, a fixing rod 1107, a fixing rod 1108, a fixing rod 1109, a fixing rod 11101, a fixing rod 11107, a fixing rod 11108, a fixing rod 11109, a fixing rod 11110 The bottom of the fixed rod 1101 is fixedly connected with a stabilizing block 1102, the inner cavity of the stabilizing block 1102 is provided with a stabilizing rod 1103, the opposite side of the two fixed rods 1101 is provided with a spring 1104, the bottom of the stabilizing block 1102 is provided with a movable block 1105, and the rear side of the movable block 1105 is provided with a movable rod 1106. The fixing mechanism 11 can cooperate with the limiting block 8 to fix and limit the air pump 701; the side of the limiting rod 10 close to the inner wall of the limiting hole 9 is in contact with the inner wall of the limiting hole 9. The surface of the limiting rod 10 is provided with a fixing groove 13 used in conjunction with the fixing rod 1101. The top of the limiting block 8 is fixedly connected to the air pump 701. The limiting rod 10 and the limiting hole 9 can limit the limiting block 8. The bottom of the air pump 701 is provided with a supporting block 12. One end of the conduction plate 703 is in close contact with the heat dissipation hole 4. The heat dissipation fan 704 is installed in the inner cavity of the heat dissipation port 5. The air pump 701 can speed up the flow rate of air and transport air into the inner cavity of the chassis 2, thereby cooling down. The fixing rod 1 The side of 101 close to the inner wall of the fixed groove 13 is in contact with the inner wall of the fixed groove 13, one side of the stabilizing rod 1103 is fixedly connected to the inner wall of the limit block 8, and the fixing mechanism 11 can cooperate with the limit block 8 to fix and limit the air pump 701; both sides of the spring 1104 are fixedly connected to the fixed rod 1101, and the side of the movable rod 1106 close to the movable block 1105 is in contact with the movable block 1105, and the fixing mechanism 11 can cooperate with the limit block 8 to fix and limit the air pump 701.

[0025] The working principle of this utility model:

[0026] When in use, the user pulls the movable rod 1106, and the movable rod 1106 squeezes the movable block 1105. After the movable block 1105 is subjected to force, it drives the stabilizing block 1102 to move. The stabilizing block 1102 slides on the surface of the stabilizing rod 1103. The stabilizing block 1102 drives the fixed rod 1101 to move. The fixed rod 1101 squeezes the spring 1104, and the fixed rod 1101 leaves the inner cavity of the fixed groove 13. Then, the conductive plate 703 is placed at the bottom of the heat dissipation hole 4, and the limiting rod 10 passes through the limiting rod 10. The hole 9 enters the inner cavity of the limit block 8, the support block 12 contacts with the air pump 701, and then the movable rod 1106 is loosened. The force released after the spring 1104 is compressed resets the fixing rod 1101, and the fixing rod 1101 enters the inner cavity of the fixing groove 13. Then the air pump 701 and the cooling fan 704 are turned on. The air pump 701 conveys air to the conduction disk 703 through the delivery pipe 702, and the conduction disk 703 conveys air to the heat dissipation port 5 through the through hole, and then conveys air to the chassis 2 through the cooling fan 704 to reduce the temperature.

[0027] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0028] The above description is only a preferred embodiment of the utility model, and does not constitute any form of limitation to the utility model. Although the utility model has been disclosed as a preferred embodiment as above, it is not used to limit the utility model. Any technician familiar with this patent will not depart from the scope of the technical solution of the utility model.

Claims

1. A heat dissipation structure for an embedded computer, comprising a panel (1), a chassis (2) and a heat sink (3), wherein the chassis (2) is mounted on the rear side of the panel (1), and the heat sink (3) is mounted on both sides of the chassis (2), characterized in that: The bottom of the case (2) is provided with a heat dissipation hole (4), the bottom of the case (2) is provided with four heat dissipation ports (5), the inner wall of the heat dissipation hole (4) is provided with a through hole (6) leading to the heat dissipation port (5), the bottom of the case (2) is provided with a heat dissipation component (7), the rear side of the case (2) is provided with a limit block (8), the front side of the limit block (8) is provided with a limit hole (9), the inner cavity of the limit hole (9) is provided with a limit rod (10), and the inner cavity of the limit block (8) is provided with a fixing mechanism (11) used in conjunction with the limit rod (10); The heat dissipation component (7) is used to dissipate heat inside the chassis (2); The fixing mechanism (11) is used for positioning the limit block (8).

2. The heat dissipation structure of an embedded computer as claimed in claim 1, characterized in that: The heat dissipation component (7) comprises an air pump (701), the bottom of the air pump (701) is fixedly connected to a delivery pipe (702), one end of the delivery pipe (702) is fixedly connected to a conduction disk (703), and the inner cavity of the heat dissipation port (5) is provided with a heat dissipation fan (704) used in conjunction with the conduction disk (703).

3. The heat dissipation structure of an embedded computer as claimed in claim 2, characterized in that: The fixing mechanism (11) comprises a fixing rod (1101), the bottom of the fixing rod (1101) is fixedly connected to a stabilizing block (1102), the inner cavity of the stabilizing block (1102) is provided with a stabilizing rod (1103), springs (1104) are provided on opposite sides of the two fixing rods (1101), a movable block (1105) is provided at the bottom of the stabilizing block (1102), and a movable rod (1106) is provided on the rear side of the movable block (1105).

4. The heat dissipation structure of an embedded computer as claimed in claim 3, characterized in that: The side of the limiting rod (10) close to the inner wall of the limiting hole (9) contacts the inner wall of the limiting hole (9), and the surface of the limiting rod (10) is provided with a fixing groove (13) used in conjunction with the fixing rod (1101), and the top of the limiting block (8) is fixedly connected to the air pump (701).

5. The heat dissipation structure of an embedded computer as claimed in claim 2, characterized in that: A support block (12) is provided at the bottom of the air pump (701), one end of the conduction disk (703) is in close contact with the heat dissipation hole (4), and the heat dissipation fan (704) is installed in the inner cavity of the heat dissipation port (5).

6. The heat dissipation structure of an embedded computer as claimed in claim 4, characterized in that: One side of the fixing rod (1101) close to the inner wall of the fixing groove (13) contacts the inner wall of the fixing groove (13), and one side of the stabilizing rod (1103) is fixedly connected to the inner wall of the limiting block (8).

7. The heat dissipation structure of an embedded computer as claimed in claim 4, characterized in that: Both sides of the spring (1104) are fixedly connected to the fixed rod (1101), and the side of the movable rod (1106) close to the movable block (1105) is in contact with the movable block (1105).

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