Fan-free heat dissipation structure and industrial personal computer

Abstract

The utility model provides a fan-free heat radiation structure, comprising a heat radiation top cover, the top of the heat radiation top cover is uniformly provided with heat radiation fin assemblies, and the bottom of the heat radiation top cover is detachably and fixedly provided with a heat conduction member corresponding to a heating component in an industrial personal computer; the heat conduction piece is provided with an upper heat conduction plate abutting against the bottom of the heat dissipation top cover, a lower heat conduction plate is arranged below the upper heat conduction plate, and the upper heat conduction plate and the lower heat conduction plate are connected into an integrated structure through an elastic supporting piece. Good contact with components is kept, overlarge pressure is avoided, the heat dissipation effect is ensured, and the components are prevented from being damaged by pressure.

Description

Technical Field

[0001] The utility model belongs to the technical field of industrial control computers, and in particular relates to a fanless heat dissipation structure and an industrial control computer. Background Art

[0002] Generally speaking, industrial computers are computers designed specifically for industrial sites. Industrial computers generate a lot of heat during operation. If this heat cannot be dissipated in time, the temperature inside the industrial computer will rise, affecting the normal operation of the industrial computer.

[0003] Existing industrial computers usually use cooling fans to dissipate heat, which requires the internal and external parts of the industrial computer to be connected, so that the fan drives the air flow to achieve the purpose of heat dissipation. However, for some industrial sites with a lot of dust, dust can easily enter the internal part of the industrial computer, affecting the heat dissipation effect and equipment operation.

[0004] At present, there are also some closed industrial computers, such as the Chinese utility model patent document with authorization announcement number CN218567972U, which discloses a fanless heat dissipation integrated industrial control chassis, which conducts the heat emitted by the components with large heat dissipation on the mainboard to the heat dissipation plate through the heat absorption member at the bottom of the heat dissipation plate, and then dissipates the heat to the outside air through the cooperation of the heat dissipation columns, heat dissipation ribs and heat dissipation fins on the heat dissipation plate; wherein the heat absorption member is a fixed integrated structure, and during use, due to the limitation of assembly accuracy or the reasons of thermal expansion and contraction, it is easy to generate gaps or excessive pressure between the heat absorption member and the internal components of the industrial computer, which affects the heat dissipation effect or causes component failure.

[0005] Therefore, it is necessary to design a fanless heat dissipation structure and industrial computer that can maintain good contact with components while avoiding excessive pressure, ensuring heat dissipation effect, and avoiding pressure damage to components to solve the current technical problems. Summary of the invention

[0006] In view of the deficiencies in the prior art, the utility model provides a fanless heat dissipation structure and an industrial computer which can maintain good contact with components while avoiding excessive pressure, ensuring heat dissipation effect, and avoiding pressure damage to components.

[0007] The technical solution of the utility model is: a fanless heat dissipation structure, comprising a heat dissipation top cover, the top of the heat dissipation top cover is evenly provided with heat dissipation fin components, the bottom of the heat dissipation top cover is detachably and fixedly equipped with a heat-conducting member corresponding to the internal heating components of the industrial computer; the heat-conducting member has an upper heat-conducting plate abutting against the bottom of the heat dissipation top cover, a lower heat-conducting plate is arranged below the upper heat-conducting plate, and the upper heat-conducting plate and the lower heat-conducting plate are connected to form an integrated structure through an elastic support sheet.

[0008] A central support piece is centrally arranged on the top of the lower heat conducting plate, and a top end of the central support piece is connected to the bottom of the upper heat conducting plate.

[0009] The central support member has an outer sleeve fixedly arranged on the top of the lower heat conducting plate, and the bottom of the upper heat conducting plate is fixedly provided with an inner sleeve slidably arranged inside the outer sleeve.

[0010] A spring is arranged inside the inner sleeve, one end of the spring abuts against the top of the lower heat conducting plate, and the other end of the spring abuts against the bottom of the upper heat conducting plate.

[0011] Elastic heat-conducting pads are fixedly arranged on the top of the upper heat-conducting plate and the bottom of the lower heat-conducting plate.

[0012] The elastic thermally conductive pad is a thermally conductive silicone sheet.

[0013] Both ends of the upper heat conducting plate are symmetrically provided with fixing plates, and the fixing plates are provided with fixing holes, and the fixing holes can be detachably fixedly assembled on the bottom of the heat dissipation top cover.

[0014] The elastic support sheet is a V-shaped elastic support sheet, and the upper heat conducting plate, the lower heat conducting plate and the elastic support sheet are an integrated copper structure.

[0015] The heat dissipation fin assembly comprises vertical fins fixedly arranged on the top of the heat dissipation top cover, oblique fins are symmetrically arranged on both sides of the vertical fins, and an angle of 45° is formed between the oblique fins and the vertical fins.

[0016] An industrial computer comprises a fanless heat dissipation structure as described in any one of the above items.

[0017] Beneficial effects of the utility model:

[0018] (1) In the present invention, the heat conducting member is installed between the heat dissipation top cover and the heat generating components inside the industrial computer. The heat generated by the heat generating components inside the industrial computer can be transferred to the heat dissipation top cover through the heat dissipation top cover and the heat dissipation fin assembly on the top of the heat dissipation top cover;

[0019] (2) The upper heat conducting plate in the heat conducting member contacts the heat dissipation top cover to transfer heat, and the lower heat conducting plate contacts the heat generating components inside the industrial computer to transfer heat. The upper heat conducting plate and the lower heat conducting plate transfer heat through the elastic support sheet. At the same time, the elasticity of the elastic support sheet acts between the upper heat conducting plate and the lower heat conducting plate, so that the lower heat conducting plate elastically abuts against the top of the heat generating components inside the industrial computer. The lower heat conducting plate and the heat generating components inside the industrial computer maintain good contact and moderate pressure to avoid excessive pressure that may damage the heat generating components inside the industrial computer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the fanless heat dissipation structure in the utility model.

[0021] Figure 2 This is one of the structural schematic diagrams of the heat conducting element in the utility model.

[0022] Figure 3 This is the second structural schematic diagram of the heat conducting element in the utility model.

[0023] Figure 4 This is the third structural schematic diagram of the heat conducting element in the utility model.

[0024] Figure 5 for Figure 4 Cross-section view at AA in the middle.

[0025] Figure 6 for Figure 1 A partial enlarged view of point B in the middle. DETAILED DESCRIPTION

[0026] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is merely illustrative and is by no means intended to limit the present invention and its application or use. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided to make the present invention thorough and complete and to fully express the scope of the present invention to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the components and steps, the composition of the materials, the numerical expressions and the numerical values ​​set forth in these embodiments should be interpreted as being merely exemplary and not as limiting.

[0027] The words "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different parts. The words "include" or "comprise" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of including other elements. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0028] like Figures 1 to 5As shown, the fanless heat dissipation structure includes a heat dissipation top cover 1, the top of the heat dissipation top cover 1 is evenly provided with heat dissipation fin assemblies 3, and the bottom of the heat dissipation top cover 1 is detachably fixedly equipped with a heat-conducting member 2 corresponding to the internal heat-generating components of the industrial computer; the heat-conducting member 2 has an upper heat-conducting plate 21 abutting against the bottom of the heat dissipation top cover 1, and a lower heat-conducting plate 22 is arranged below the upper heat-conducting plate 21, and the upper heat-conducting plate 21 and the lower heat-conducting plate 22 are connected to form an integral structure through an elastic supporting sheet 23; in this embodiment, the heat-conducting member 2 is installed between the heat dissipation top cover 1 and the internal heat-generating components of the industrial computer, and the heat generated by the internal heat-generating components of the industrial computer can be transferred to the heat dissipation top cover 1 through the heat dissipation top cover 1, and the heat is dissipated outward through the heat dissipation top cover 1 and the heat dissipation fin assembly 3 on the top of the industrial computer; The upper heat conducting plate 21 in the heat piece 2 is in contact with the heat dissipation top cover 1 to transfer heat, and the lower heat conducting plate 22 is in contact with the heat generating components inside the industrial computer to transfer heat. The upper heat conducting plate 21 and the lower heat conducting plate 22 transfer heat through the elastic support sheet 23. At the same time, the elasticity of the elastic support sheet 23 acts between the upper heat conducting plate 21 and the lower heat conducting plate 22, so that the lower heat conducting plate 22 elastically abuts against the top of the heat generating components inside the industrial computer, so that the lower heat conducting plate 22 and the heat generating components inside the industrial computer maintain good contact and moderate pressure, avoiding excessive pressure and causing damage to the heat generating components inside the industrial computer; the heat generating components inside the industrial computer refer to the CPU, GPU, hard disk and other heat generating components inside the industrial computer that have a flat surface and generate more heat during operation.

[0029] In some embodiments, a central support member 27 is centrally disposed on the top of the lower heat conducting plate 22, and the top of the central support member 27 is connected to the bottom of the upper heat conducting plate 21. The central support member 27 can limit the vertical movement between the lower heat conducting plate 22 and the upper heat conducting plate 21, thereby avoiding horizontal displacement between the lower heat conducting plate 22 and the upper heat conducting plate 21, and reducing wear on the internal heat generating components of the industrial computer.

[0030] In some embodiments, Figure 5 As shown, the central support member 27 has an outer sleeve 271 fixedly disposed on the top of the lower heat conducting plate 22 , and an inner sleeve 272 slidably disposed inside the outer sleeve 271 is fixedly disposed on the bottom of the upper heat conducting plate 21 .

[0031] In some embodiments, a spring 273 is disposed inside the inner sleeve 272 , one end of the spring 273 abuts against the top of the lower heat conducting plate 22 , and the other end of the spring 273 abuts against the bottom of the upper heat conducting plate 21 .

[0032] In some embodiments, elastic thermal pads 26 are fixedly disposed on the top of the upper thermal conductive plate 21 and the bottom of the lower thermal conductive plate 22 ; specifically, the elastic thermal conductive pads 26 are thermal conductive silicone sheets.

[0033] In some embodiments, fixing plates 24 are symmetrically arranged at both ends of the upper heat conducting plate 21, and fixing holes 25 are opened on the fixing plates 24. The fixing holes 25 can be removably fixedly assembled at the bottom of the heat dissipation top cover 1; specifically, a screw matching the fixing hole 25 is fixedly arranged at the bottom of the heat dissipation top cover 1, and the fixing plates 24 are assembled at the corresponding screws through nuts.

[0034] In some embodiments, the elastic support sheet 23 is a V-shaped elastic support sheet. Metal copper has excellent thermal conductivity. The upper heat conducting plate 21, the lower heat conducting plate 22 and the elastic support sheet 23 are an integrated copper structure to ensure good thermal conductivity of the heat conducting member 2.

[0035] In some embodiments, Figure 6 As shown, the heat dissipation fin assembly 3 has a vertical fin 31 fixedly arranged on the top of the heat dissipation top cover 1, and oblique fins 32 are symmetrically arranged on both sides of the vertical fin 31, and an angle of 45° is formed between the oblique fins 32 and the vertical fins 31; by setting the oblique fins 32, the contact area between the heat dissipation fin assembly 3 and the air can be increased, thereby increasing the heat dissipation area.

[0036] In some embodiments, an industrial computer is disclosed, comprising a fanless heat dissipation structure as in any of the above embodiments.

[0037] So far, various embodiments of the present invention have been described in detail. In order to avoid obscuring the concept of the present invention, some details known in the art are not described. Based on the above description, those skilled in the art can fully understand how to implement the technical solution disclosed here.

[0038] The above-mentioned embodiments only express some implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A fanless heat dissipation structure, characterized in that: It comprises a heat dissipation top cover, the top of which is evenly provided with heat dissipation fin assemblies, and the bottom of which is detachably and fixedly equipped with heat-conducting parts corresponding to the internal heat-generating components of the industrial computer; The heat conducting member comprises an upper heat conducting plate abutting against the bottom of the heat dissipation top cover, a lower heat conducting plate is arranged below the upper heat conducting plate, and the upper heat conducting plate and the lower heat conducting plate are connected to form an integral structure via an elastic supporting sheet.

2. The fanless heat dissipation structure according to claim 1, characterized in that: A central support piece is centrally arranged on the top of the lower heat conducting plate, and a top end of the central support piece is connected to the bottom of the upper heat conducting plate.

3. The fanless heat dissipation structure according to claim 2, characterized in that: The central support member has an outer sleeve fixedly arranged on the top of the lower heat conducting plate, and the bottom of the upper heat conducting plate is fixedly provided with an inner sleeve slidably arranged inside the outer sleeve.

4. The fanless heat dissipation structure according to claim 3, characterized in that: A spring is arranged inside the inner sleeve, one end of the spring abuts against the top of the lower heat conducting plate, and the other end of the spring abuts against the bottom of the upper heat conducting plate.

5. The fanless heat dissipation structure according to claim 1, characterized in that: Elastic heat-conducting pads are fixedly arranged on the top of the upper heat-conducting plate and the bottom of the lower heat-conducting plate.

6. The fanless heat dissipation structure according to claim 5, characterized in that: The elastic thermally conductive pad is a thermally conductive silicone sheet.

7. The fanless heat dissipation structure according to claim 1, characterized in that: Both ends of the upper heat conducting plate are symmetrically provided with fixing plates, and the fixing plates are provided with fixing holes, and the fixing holes can be detachably fixedly assembled on the bottom of the heat dissipation top cover.

8. The fanless heat dissipation structure according to claim 1, characterized in that: The elastic support sheet is a V-shaped elastic support sheet, and the upper heat conducting plate, the lower heat conducting plate and the elastic support sheet are an integrated copper structure.

9. The fanless heat dissipation structure according to claim 1, characterized in that: The heat dissipation fin assembly comprises vertical fins fixedly arranged on the top of the heat dissipation top cover, oblique fins are symmetrically arranged on both sides of the vertical fins, and an angle of 45° is formed between the oblique fins and the vertical fins.

10. An industrial computer, characterized in that: It comprises a fanless heat dissipation structure as described in any one of claims 1 to 9.

Images