Radio frequency tag binding production line chip failure processing device
By integrating label detection, inkjet printing and high-voltage generators on the RF tag production line, the erroneous operation problems caused by weak unqualified label signals are solved, and the effective failure and production efficiency of RF tags are achieved.
Patent Information
- Application Number
- CN202420076388.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-12
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-01-12
AI Technical Summary
In the RF tag production line, when multiple labels and multiple chips are produced simultaneously, unqualified tags may cause weak signal due to chip or antenna failure, affecting the accuracy of the production line. The existing technology only uses inkjet printing to print marking points, which may lead to subsequent Misoperation.
A chip failure processing device for RF tag binding production line is designed, including a label detection device, a probe, an inkjet printing device and a high-voltage generator. By performing TID identification and detection of unqualified RF tags, inkjet printing marks and using high-voltage generation The device destroys the chip, making it completely invalid and avoids subsequent misoperation.
Ensure that unqualified RF tags cannot be read, avoid misoperation, and improve the production efficiency and accuracy of RF tag binding.
Smart Images
Figure CN222260063U_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a chip failure processing device for a radio frequency tag binding production line, belonging to the technical field of radio frequency antenna binding. Background Art
[0002] The common circularly polarized antennas used in RFID readers include: simple circularly polarized patch antennas, laminated patch antennas, and spiral antennas. On the binding equipment for existing RFID tag production, the usual way to deal with the tags that are tested and determined to be unqualified is to only use inkjet to print out the marking points, and then pick them out by the subsequent inspection line after the binding production is completed. In actual applications, the binding production line uses multiple tags and multiple chips to produce at the same time. The possible causes of unqualified tags include two aspects: the chip and the antenna. It may be that the chip is damaged, or the antenna is disconnected or has poor contact. Moreover, unqualified tags may not be completely unreadable, but the signal is weak, so it may cause subsequent workstation misoperation, affecting the accuracy of the binding production line. Summary of the invention
[0003] The technical problem to be solved by the present invention is to provide a chip failure processing device for a radio frequency tag binding production line, which can actively make the chip on the radio frequency tag completely invalid while printing unqualified radio frequency tags, ensuring that the radio frequency tag cannot be read, thereby avoiding misoperation of subsequent workstations.
[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions: the present invention designs a chip failure processing device for a radio frequency tag binding production line, which is used to detect and process each radio frequency tag moving sequentially on a horizontal production line; it includes a tag detection device, a probe, a control module, and an inkjet printing device, a power supply, and a high-voltage generator respectively connected to the control module;
[0005] Among them, the label detection device is arranged just below the preset target detection position on the upper surface of the production line, and is used to perform TID identification detection on the radio frequency tag that moves to the target detection position on the upper surface of the production line; the probe and the inkjet printing device are both arranged just above the target detection position on the upper surface of the production line, and the working end of the probe and the nozzle of the inkjet printing device are both pointed to the moving path of the radio frequency tag in the target detection position on the upper surface of the production line, the label detection device is connected and communicated with the inkjet printing device, and the label detection device sends a detection failure signal to the inkjet printing device, triggering the inkjet printing device to print and mark the radio frequency tag that fails the detection;
[0006] The power supply is connected to the high-voltage generator, and the inkjet printing device sends a detection failure signal to the control module, which triggers the control module to control the power supply to power the high-voltage generator and control the high-voltage generator to transmit high voltage to the probe, triggering the working end of the probe to emit high voltage, thereby destroying the chip in the unqualified RFID tag.
[0007] As a preferred technical solution of the utility model: it also includes an adapter plate, and the probe is connected to the inkjet printing device via the adapter plate, wherein the adapter plate includes an L-shaped connecting plate, a loading plate, and an adapter bolt, one surface of the L-shaped connecting plate can be detachably connected to the bottom of the inkjet printing device, and an internal threaded through hole penetrating its two surfaces is arranged on the other surface of the L-shaped connecting plate, and the internal thread of the internal threaded through hole matches the thread on the adapter bolt, and a strip groove penetrating its two opposite side surfaces is arranged on one end of the loading plate, and the spacing between the two side edges of the strip groove is adapted to the diameter of the cross-section of the threaded end of the adapter bolt, based on the adapter bolt passing through the strip groove on the loading plate and rotating into the internal threaded through hole on the L-shaped connecting plate, the loading plate and the L-shaped connecting plate are movably connected, and based on the change of the position of the adapter bolt in the strip groove on the loading plate, the relative position of the loading plate and the L-shaped connecting plate is changed, and the loading plate changes its posture angle with the adapter bolt as the axis, and a through fixing hole is arranged on the loading plate for inserting and setting the probe.
[0008] As a preferred technical solution of the utility model: it also includes a flat press plate and a lifting device, wherein the flat press plate is located at the bottom of the inkjet printing device in a posture parallel to the upper surface of the production line, and is connected to the inkjet printing device, and the lower surface position of the flat press plate is lower than the lowest position of the inkjet printing device and the lowest position of the probe; the control module is connected and communicated with the lifting device, the working end of the lifting device is connected to the inkjet printing device, the lifting device is controlled by the control module, the inkjet printing device moves vertically up and down as the working end of the lifting device moves up and down in the vertical direction, and the inkjet printing device moves vertically downward to a position where the lower surface of the flat press plate contacts the position of the radio frequency tag moving path in the target detection position on the upper surface of the production line.
[0009] As a preferred technical solution of the utility model: the motor used to control the operation of the production line is connected and communicated with the control module.
[0010] As a preferred technical solution of the utility model: one surface of the L-shaped connecting plate is detachably connected to the bottom of the inkjet printing device by means of bolts.
[0011] The device for processing chip failure of a radio frequency tag binding production line described in the present invention adopts the above technical solution and has the following technical effects compared with the prior art:
[0012] The present invention designs a chip failure processing device for a radio frequency tag binding production line. For each radio frequency tag moving sequentially on the production line, based on the detection of a tag detection device, an inkjet printing device prints and marks the radio frequency tags that fail the detection, and at the same time introduces a high voltage generator to destroy the chip in the radio frequency tag that fails the detection through a probe, so that the radio frequency tag that fails the detection is completely invalid, ensuring that the radio frequency tag that fails the detection cannot be read, avoiding erroneous operations caused by reading the signal of the radio frequency tag that fails the detection in the subsequent processing steps, and in the application, a combined connection structure of the inkjet printing device and the probe is designed to comprehensively improve the production efficiency of radio frequency tag binding. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is an application schematic diagram of a chip failure processing device for a radio frequency tag binding production line designed by the present invention;
[0014] Figure 2 It is a schematic diagram of the modules in the chip failure processing device of the radio frequency tag binding production line designed by the present invention;
[0015] Figure 3 It is a schematic diagram of the connection between the inkjet printing device and the probe in the chip failure processing device of the radio frequency tag binding production line designed by the present invention.
[0016] Among them, 1. production line, 2. radio frequency tag, 3. tag detection device, 4. probe, 5. inkjet printing device, 6. adapter plate, 6-1. L-shaped connecting plate, 6-2. loading plate, 7. flat pressing plate. Implementation
[0017] The specific implementation modes of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0018] The present invention designs a chip failure processing device for a radio frequency tag binding production line. In practical applications, such as Figure 1 As shown, it is used to detect and process each radio frequency tag 2 moving sequentially on the horizontal production line 1; combined with Figure 2 As shown, the design includes a label detection device 3, a probe 4, a control module, and an inkjet printing device 5, a power supply, and a high-voltage generator respectively connected to the control module. The probe 4, the inkjet printing device 5, and the high-voltage generator are combined to form an inkjet printing high-voltage failure component.
[0019] Among them, the label detection device 3 is arranged directly below the preset target detection position on the upper surface of the production line 1, and is used to perform TID identification detection on the radio frequency tag 2 that moves to the target detection position on the upper surface of the production line 1; the probe 4 and the inkjet printing device 5 are both arranged directly above the target detection position on the upper surface of the production line 1, and the working end of the probe 4 and the nozzle of the inkjet printing device 5 are both pointed to the moving path of the radio frequency tag 2 in the target detection position on the upper surface of the production line 1. The label detection device 3 is connected and communicated with the inkjet printing device 5, and the label detection device 3 sends a detection failure signal to the inkjet printing device 5, triggering the inkjet printing device 5 to print and mark the radio frequency tag 2 that fails the detection.
[0020] The power supply is connected to the high-voltage generator, and the inkjet printing device 5 sends a detection failure signal to the control module, which triggers the control module to control the power supply to power the high-voltage generator, and controls the high-voltage generator to transmit high voltage to the probe 4, triggering the working end of the probe 4 to emit high voltage, thereby destroying the chip in the unqualified RFID tag 2.
[0021] The connection diagram of the inkjet printing device 5 and the probe 4 is as follows: Figure 3 As shown, the further design also includes an adapter plate 6, and the probe 4 is connected to the inkjet printing device 5 via the adapter plate 6, wherein the adapter plate 6 includes an L-shaped connecting plate 6-1, a loading plate 6-2, and an adapter bolt 6-3, one surface of the L-shaped connecting plate 6-1 is detachably connected to the bottom of the inkjet printing device 5, and the other surface of the L-shaped connecting plate 6-1 is provided with an internal threaded through hole penetrating both surfaces thereof, and the internal thread of the internal threaded through hole matches the thread on the adapter bolt 6-3, and one end of the loading plate 6-2 is provided with a strip groove penetrating two opposite side surfaces thereof, and the two sides of the strip groove are spaced apart from each other. The spacing is adapted to the diameter of the cross-section of the threaded end of the adapter bolt 6-3. Based on the adapter bolt 6-3 passing through the strip groove on the loading plate 6-2 and rotating into the internal threaded through hole on the L-shaped connecting plate 6-1, the loading plate 6-2 and the L-shaped connecting plate 6-1 are connected flexibly. Based on the change of the position of the adapter bolt 6-3 in the strip groove on the loading plate 6-2, the relative position change of the loading plate 6-2 and the L-shaped connecting plate 6-1 is realized, and the posture angle change of the loading plate 6-2 with the adapter bolt 6-3 as the axis is realized. A through fixing hole is set on the loading plate 6-2 for inserting and setting the probe 4.
[0022] In actual application, a flat press plate 7 and a lifting device are further designed to be added, wherein the flat press plate 7 is located at the bottom of the inkjet printing device 5 in a posture parallel to the upper surface of the production line 1, and is connected to the inkjet printing device 5, and the lower surface position of the flat press plate 7 is lower than the lowest position of the inkjet printing device 5 and the lowest position of the probe 4; the control module is connected and communicated with the lifting device, the working end of the lifting device is connected to the inkjet printing device 5, and the lifting device is controlled by the control module to work, the inkjet printing device 5 moves vertically up and down as the working end of the lifting device moves up and down in the vertical direction, and the inkjet printing device 5 moves vertically downward to the position where the lower surface of the flat press plate 7 contacts the moving path position of the radio frequency tag 2 in the target detection position on the upper surface of the production line 1.
[0023] The above design is applied in practice, and the motor for controlling the operation of the production line 1 is further designed to be connected and communicated with the control module, and one surface of the L-shaped connecting plate 6-1 is detachably connected to the bottom of the inkjet printing device 5 by bolts, and the label detection device 3 specifically selects JXI 3020 RFID TESTER; in actual application, the inkjet printing device 5 and the probe 4 are initialized to be located at a preset height position directly above the target detection position on the upper surface of the production line 1. As each RFID tag 2 moves sequentially on the horizontal production line 1, the label detection device 3 sequentially performs TID identification detection on the RFID tag 2 that moves to the target detection position on the upper surface of the production line 1. If the detection obtains a qualified detection signal, no further operation is performed; if the detection obtains a failed detection signal, the label detection device 3 sends the failed detection signal to the inkjet printing device 5, which immediately triggers the inkjet printing device 5 to work on the detection. The unqualified RFID tag 2 is printed and marked. At the same time, the inkjet printing device 5 sends a detection unqualified signal to the control module, triggering the control module to work. The control module controls the lifting device to work, so that the inkjet printing device 5 moves vertically downward until the lower surface of the flat plate 7 contacts the unqualified RFID tag 2 in the target detection position on the upper surface of the production line 1, thereby pressing down the unqualified RFID tag 2. Then the control module controls the power supply to power the high-voltage generator, and controls the high-voltage generator to deliver high voltage to the probe 4, triggering the working end of the probe 4 to emit high voltage, thereby destroying the chip in the unqualified RFID tag 2.
[0024] The above technical scheme designs a chip failure processing device for a radio frequency tag binding production line. For each radio frequency tag 2 moving sequentially on the production line 1, based on the detection of the tag detection device 3, the inkjet printing device 5 prints and marks the radio frequency tag 2 that fails the detection, and at the same time, a high voltage generator is introduced to destroy the chip in the radio frequency tag 2 that fails the detection through the probe 4, so that the radio frequency tag 2 that fails the detection is completely invalid, ensuring that the radio frequency tag 2 that fails the detection cannot be read, avoiding erroneous operations caused by reading the signal of the radio frequency tag 2 that fails the detection in the subsequent processing steps, and in the application, the combined connection structure of the inkjet printing device 5 and the probe 4 is designed to comprehensively improve the production efficiency of radio frequency tag binding.
[0025] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in this field without departing from the purpose of the present invention.
Claims
1. A chip failure processing device for a radio frequency tag binding production line, characterized in that: Used to detect and process radio frequency tags (2) moving sequentially on a horizontal production line (1); comprising a tag detection device (3), a probe (4), a control module, and an inkjet printing device (5), a power supply, and a high-voltage generator respectively connected to the control module; The label detection device (3) is arranged directly below a preset target detection position on the upper surface of the production line (1) and is used to perform TID identification detection on the radio frequency tag (2) that moves to the target detection position on the upper surface of the production line (1); the probe (4) and the inkjet printing device (5) are both arranged directly above the target detection position on the upper surface of the production line (1); the working end of the probe (4) and the nozzle of the inkjet printing device (5) are both pointed to the moving path of the radio frequency tag (2) in the target detection position on the upper surface of the production line (1); the label detection device (3) and the inkjet printing device (5) are connected and communicated, and the label detection device (3) sends a detection failure signal to the inkjet printing device (5), triggering the inkjet printing device (5) to work and print a mark on the radio frequency tag (2) that fails the detection; The power supply is connected to the high-voltage generator, and the inkjet printing device (5) sends a detection failure signal to the control module, which triggers the control module to control the power supply to supply power to the high-voltage generator and control the high-voltage generator to transmit high voltage to the probe (4), thereby triggering the working end of the probe (4) to emit high voltage, thereby destroying the chip in the detection failure radio frequency tag (2).
2. According to the device for processing chip failure of a radio frequency tag binding production line according to claim 1, it is characterized by: The invention also comprises an adapter plate (6), wherein the probe (4) is connected to the inkjet printing device (5) via the adapter plate (6), wherein the adapter plate (6) comprises an L-shaped connecting plate (6-1), a loading plate (6-2), and an adapter bolt (6-3), wherein one surface of the L-shaped connecting plate (6-1) is detachably connected to the bottom of the inkjet printing device (5), and the other surface of the L-shaped connecting plate (6-1) is provided with an internal threaded through hole penetrating both surfaces thereof, and the internal thread of the internal threaded through hole matches the thread on the adapter bolt (6-3), and one end of the loading plate (6-2) is provided with a strip groove penetrating two opposite side surfaces thereof, and the spacing between the two side edges of the strip groove is the same as that of the adapter bolt (6-3). The diameter of the cross section of the threaded end of the connecting bolt (6-3) is adapted to that of the connecting bolt (6-3). Based on the connecting bolt (6-3) passing through the strip groove on the loading plate (6-2) and rotating into the internal thread through hole on the L-shaped connecting plate (6-1), the loading plate (6-2) and the L-shaped connecting plate (6-1) are movably connected. Based on the change of the position of the connecting bolt (6-3) in the strip groove on the loading plate (6-2), the relative position of the loading plate (6-2) and the L-shaped connecting plate (6-1) is changed, and the attitude angle of the loading plate (6-2) with the connecting bolt (6-3) as the axis is changed. A through fixing hole is provided on the loading plate (6-2) for inserting and setting a probe (4).
3. According to the device for processing chip failure of a radio frequency tag binding production line according to claim 2, it is characterized by: The invention also comprises a flat plate (7) and a lifting device, wherein the flat plate (7) is located at the bottom of the inkjet printing device (5) in a posture parallel to the upper surface of the production line (1), and is connected to the inkjet printing device (5), and the lower surface position of the flat plate (7) is lower than the lowest position of the inkjet printing device (5) and the lowest position of the probe (4); the control module is connected and communicated with the lifting device, and the working end of the lifting device is connected to the inkjet printing device (5), and the lifting device is controlled by the control module to work, and the inkjet printing device (5) moves vertically up and down as the working end of the lifting device moves up and down in the vertical direction, and the inkjet printing device (5) moves vertically downward to a position where the lower surface of the flat plate (7) contacts the moving path position of the radio frequency tag (2) in the target detection position on the upper surface of the production line (1).
4. According to claim 3, a chip failure processing device for a radio frequency tag binding production line is characterized in that: The motor used to control the operation of the production line (1) is connected and communicated with the control module.
5. According to claim 2, a chip failure processing device for a radio frequency tag binding production line is characterized in that: One surface of the L-shaped connecting plate (6-1) is detachably connected to the bottom of the inkjet printing device (5) by means of bolts.