Wafer calibration mechanism and semiconductor equipment

Abstract

The utility model relates to the technical field of semiconductor processing, and discloses a wafer calibration mechanism and semiconductor equipment. The wafer calibration mechanism comprises a shell, a mounting disc, a rotation driving assembly and a lifting driving assembly. The shell is provided with a cavity, and the mounting disc is in sealed connection with the cavity; the rotation driving assembly comprises a rotation driving part, a driving rod and a bearing disc, the bearing disc is located in the cavity, one end of the driving rod is connected to the output end of the rotation driving part, the rotation driving part is used for driving the driving rod to rotate, and the bearing disc is arranged at the other end of the driving rod; the lifting driving assembly is arranged at the bottom of the mounting disc, connected with the rotating driving assembly and used for driving the rotating driving assembly to ascend and descend. According to the utility model, the production cost can be reduced, and the compatibility of equipment is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a wafer calibration mechanism and semiconductor equipment. Background Art

[0002] During the wafer processing, when the robot transfers the wafer from the loading chamber to the process chamber, since the position of the wafer in the loading chamber may deviate, and the straight edge or notch position of the wafer needs to be rotated to a preset position, a calibration device is usually added to the loading chamber to calibrate the position of the wafer on the calibration device before transferring it to the process chamber. However, the vacuum calibration device for wafers on the market currently only has rotational motion and does not have lifting motion in the Z-axis direction, so the robot needs to move in the Z-axis direction to meet the wafer placement and retrieval, which increases the design difficulty and equipment cost of the robot. Furthermore, for semiconductor equipment that is not equipped with a wafer calibration device and uses a two-axis robot, if a calibration device that does not have Z-axis motion is subsequently installed, the original two-axis robot cannot be used and must be replaced with a three-axis robot, which not only increases the user's additional cost, but also causes waste of the two-axis robot, which is not conducive to product compatibility.

[0003] Based on this, there is an urgent need for a wafer calibration mechanism and semiconductor equipment to solve the above-mentioned problems. Utility Model Content

[0004] Based on the above, the purpose of the present invention is to provide a wafer calibration mechanism and semiconductor equipment, which can realize the rotation and lifting of the carrier plate, reduce production costs, and improve the compatibility of the equipment.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] In one aspect, a wafer calibration mechanism is provided, comprising:

[0007] a housing provided with a chamber;

[0008] a mounting plate, which is sealingly connected to the chamber;

[0009] A rotary drive assembly, comprising a rotary drive component, a drive rod and a carrier plate, wherein the carrier plate is located in the chamber, one end of the drive rod is connected to the output end of the rotary drive component, the rotary drive component is used to drive the drive rod to rotate, and the other end of the drive rod is provided with the carrier plate;

[0010] A lifting drive assembly is arranged at the bottom of the mounting plate, the lifting drive assembly is connected to the rotating drive assembly, and the lifting drive assembly is used to drive the rotating drive assembly to lift.

[0011] As a preferred technical solution of a wafer calibration mechanism, the mounting plate is provided with a through hole, the driving rod is slidably and rotatably connected to the through hole, and the outer wall of the driving rod is sealedly connected to the inner wall of the through hole;

[0012] The wafer calibration mechanism also includes a bushing, which is installed in the through hole, and the driving rod is slidably connected to the bushing.

[0013] As an optimal technical solution for a wafer calibration mechanism, the wafer calibration mechanism also includes a sealing assembly, which includes a pressure plate and a vacuum sealing ring, the vacuum sealing ring is arranged between the outer wall of the driving rod and the inner wall of the through hole, the pressure plate is installed at the bottom of the chamber, and the pressure plate and the bushing are respectively abutted against two ends of the vacuum sealing ring.

[0014] As a preferred technical solution for a wafer calibration mechanism, the wafer calibration mechanism also includes a calibration component, which includes a CCD transmitter and a CCD receiver arranged on one side of the carrier plate, and a detection area is formed between the CCD transmitter and the CCD receiver.

[0015] As a preferred technical solution for a wafer calibration mechanism, the calibration component also includes a transparent plate, which is installed in the chamber, and one of the CCD transmitting end and the CCD receiving end is installed on the shell, and the other is installed on the bottom of the mounting plate.

[0016] As a preferred technical solution for a wafer calibration mechanism, the lifting drive assembly includes a first connecting plate, a first motor, a lead screw and a first slider, the first connecting plate is connected to the bottom of the mounting plate, the first motor and the lead screw are installed on the first connecting plate, and the output end of the first motor is connected to the lead screw; the first slider is threadedly connected to the lead screw, and the rotating drive component includes a connecting seat, which is connected to the first slider.

[0017] As a preferred technical solution for a wafer calibration mechanism, the lifting drive assembly also includes a second connecting plate and a second slider, the second connecting plate is installed on the bottom of the mounting plate, the second connecting plate is provided with a slide rail, the second slider is slidably connected to the slide rail, the connecting seat is connected to the second slider, and the first slider and the second slider are respectively located on both sides of the connecting seat.

[0018] As an optimal technical solution for a wafer calibration mechanism, the rotating drive component includes a second motor, a reducer and a coupling, the second motor is drivingly connected to the reducer, the reducer is fixedly mounted on the connecting seat, and the reducer is drivingly connected to the driving rod through the coupling.

[0019] As a preferred technical solution for a wafer calibration mechanism, the carrier plate is provided with a plurality of bosses, the top surfaces of the bosses are provided with grooves, and a flexible ring is embedded in the grooves.

[0020] On the other hand, a semiconductor device is provided, comprising the wafer calibration mechanism described in any of the above schemes.

[0021] The beneficial effects of the utility model are:

[0022] The utility model provides a wafer calibration mechanism and semiconductor equipment. When working, the lifting drive component drives the rotating drive component to drive the carrier plate to rise, so that the wafer is separated from the robot and carried on the carrier plate. The rotating drive component drives the carrier plate to rotate through the driving rod, thereby driving the wafer to rotate, which is used to complete calibration and other operations. The lifting drive component drives the carrier plate of the rotating drive component to descend and reset, and the wafer falls back onto the fingers of the robot. The wafer calibration mechanism realizes the rotation and lifting of the driving carrier plate, and the robot does not need to lift and lower, so only a two-axis robot is needed to complete the handling work, which reduces the production cost and avoids increasing the design or purchase cost of the three-axis robot. It can also match semiconductor equipment that is not equipped with a wafer calibration mechanism and uses a two-axis robot and semiconductor equipment that uses a three-axis robot. It has a wide range of application scenarios and good equipment compatibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0024] Figure 1 It is a partial structural schematic diagram of a wafer calibration mechanism provided in a specific embodiment of the utility model;

[0025] Figure 2 is a cross-sectional view of a wafer calibration mechanism provided in a specific embodiment of the utility model;

[0026] Figure 3 It is a top view of a wafer calibration mechanism provided in a specific embodiment of the utility model;

[0027] Figure 4 yes Figure 3 Sectional view at AA;

[0028] Figure 5 yes Figure 3 Cross-sectional view at BB;

[0029] Figure 6yes Figure 5 Enlarged view at C.

[0030] The following are marked in the figure:

[0031] 10. Wafer;

[0032] 1. Shell; 11. Chamber; 12. Opening;

[0033] 2. Mounting plate; 21. Through hole;

[0034] 3. Rotation drive assembly; 31. Rotation drive component; 311. Connecting seat; 312. Second motor; 313. Speed ​​reducer; 314. Coupling; 32. Driving rod; 33. Carrying plate; 331. Boss; 332. Flexible ring;

[0035] 4. Lifting drive assembly; 41. First connecting plate; 42. First motor; 43. Lead screw; 44. First slider; 45. Second connecting plate; 46. Slide rail; 47. Second slider;

[0036] 5. Bushing;

[0037] 6. Sealing assembly; 61. Pressing plate; 62. Vacuum sealing ring; 63. Sealing ring spacer;

[0038] 7. Calibration component; 71. CCD transmitting end; 72. CCD receiving end; 73. Transparent plate. DETAILED DESCRIPTION

[0039] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0040] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0042] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0043] like Figure 1-Figure 3 As shown, this embodiment provides a semiconductor device, including a wafer calibration mechanism, which includes a housing 1, a mounting plate 2, a rotation drive component 3 and a lifting drive component 4.

[0044] Specifically, the shell 1 is provided with a chamber 11, and an opening 12 is provided at the bottom of the chamber 11; the mounting plate 2 is sealed and connected to the opening 12 of the chamber 11; the rotation drive assembly 3 includes a rotation drive component 31, a driving rod 32 and a carrying plate 33, the carrying plate 33 is located in the chamber 11, one end of the driving rod 32 is connected to the output end of the rotation drive component 31, the rotation drive component 31 is used to drive the driving rod 32 to rotate, and the other end of the driving rod 32 is provided with a carrying plate 33, and the carrying plate 33 is used to carry the wafer 10; the lifting drive assembly 4 is arranged at the bottom of the mounting plate 2, the lifting drive assembly 4 is connected to the rotation drive assembly 3, and the lifting drive assembly 4 is used to drive the rotation drive assembly 3 to rise and fall.

[0045] During operation, the lifting drive assembly 4 drives the rotating drive assembly 3 and the carrier plate 33 to rise, so that the wafer 10 is separated from the manipulator and carried on the carrier plate 33. The rotating drive component 31 drives the carrier plate 33 to rotate through the driving rod 32, thereby driving the wafer 10 to rotate, which is used to complete calibration and other operations. The lifting drive assembly 4 drives the carrier plate 33 of the rotating drive assembly 3 to descend and reset, and the wafer 10 falls back onto the fingers of the manipulator. The wafer calibration mechanism realizes the rotation and lifting of the driving carrier plate 33, and the manipulator does not need to lift and lower, so only a two-axis manipulator is needed to complete the handling work, which reduces the production cost and avoids increasing the design or purchase cost of the three-axis manipulator. It can also match semiconductor equipment that is not equipped with a wafer calibration mechanism and uses a two-axis manipulator and semiconductor equipment that uses a three-axis manipulator. It has a wide range of application scenarios and good equipment compatibility.

[0046] Preferably, if Figure 5 and Figure 6 As shown, the mounting plate 2 is provided with a through hole 21, and the driving rod 32 is slidably and rotatably connected to the through hole 21. The outer wall of the driving rod 32 is sealed with the inner wall of the through hole 21, which can ensure that the chamber 11 continues to meet the vacuum requirement; the wafer calibration mechanism also includes a bushing 5, which is installed in the through hole 21, and the driving rod 32 is slidably connected to the bushing 5. The bushing 5 guides the driving rod 32, reduces the wear between the driving rod 32 and the through hole 21, and improves the movement accuracy of the driving rod 32.

[0047] In this embodiment, the wafer calibration mechanism also includes a sealing component 6, which includes a pressure plate 61 and a vacuum sealing ring 62. The vacuum sealing ring 62 is arranged between the outer wall of the driving rod 32 and the inner wall of the through hole 21. The pressure plate 61 is installed at the bottom of the chamber 11. The pressure plate 61 and the bushing 5 are respectively abutted against the two ends of the vacuum sealing ring 62 to fix the vacuum sealing ring 62. The pressure plate 61 and the bushing 5 squeeze the vacuum sealing ring 62. The vacuum sealing ring 62 is deformed in the radial direction to fit closely to the outer wall of the driving rod 32 and the inner wall of the through hole 21, thereby improving the sealing performance.

[0048] Preferably, there are two vacuum seals 62, and a seal spacer 63 is provided between the two vacuum seals 62. The bushing 5 and the pressing plate 61 squeeze the two vacuum seals 62, and the outer wall of the driving rod 32 and the inner wall of the through hole 21 are sealed by the two vacuum seals 62, further improving the sealing performance.

[0049] Specifically, the through hole 21 is a stepped hole, including a first diameter section, a second diameter section and a third diameter section which are arranged in sequence and whose diameters decrease in sequence. The drive rod 32 is sequentially passed through the third diameter section, the second diameter section and the first diameter section, wherein the bushing 5, the vacuum sealing ring 62 and the pressure plate 61 are sequentially sleeved on the drive rod 32, the bushing 5 is located in the second diameter section, and the bottom end of the bushing 5 abuts against the step surface between the second diameter section and the third direct section, the vacuum sealing ring 62 is located in the first diameter section, and the bottom end of the vacuum sealing ring 62 partially abuts against the step surface between the first diameter section and the second diameter section, and partially abuts against the bushing 5; an installation groove is also provided at one end of the first diameter section away from the second diameter section, and the pressure plate 61 is embedded in the installation groove, and the pressure plate 61 is connected to the bottom of the installation groove by screws. At this time, the bottom end of the pressure plate 61 abuts against the end of the vacuum sealing ring 62 away from the bushing 5, thereby realizing the fixation of the sealing assembly 6 and the bushing 5.

[0050] Furthermore, if Figure 2-Figure 4 As shown, the wafer calibration mechanism also includes a calibration component 7, which includes a CCD transmitting end 71 and a CCD receiving end 72 arranged on one side of the carrier plate 33. A detection area is formed between the CCD transmitting end 71 and the CCD receiving end 72. When the rotary drive component 3 drives the carrier plate 33 to rotate and drives the wafer 10 to rotate, the edge of the wafer 10 will pass through and be located in the detection area. The calibration principle of the calibration component 7 is that the CCD transmitting end 71 can emit multi-band lasers, and the CCD receiving end 72 uses a CCD (charge coupled device) to receive multi-band lasers. The calibration component 7 is a linearly arranged light receiving component. When the target to be measured is located between the CCD transmitting end 71 and the CCD receiving end 72, a shadow will be formed on the CCD receiving end 72. By detecting the transition from light to dark and from dark to light, the position of the target to be measured can be accurately measured. When the wafer 10 is placed on the carrier plate 33, the rotary drive component 3 drives the wafer 10 to rotate, and the edge of the wafer 10 passes through the detection area. When the edge of the wafer 10 is located in the detection area, the calibration component 7 obtains instantaneous detection data. When the wafer 10 rotates one circle, the calibration component 7 obtains the coordinate detection value of the edge of the wafer 10 for one circle, and then converts the coordinate value into a rectangular coordinate, which can form a circle whose center is not at the center of the rectangular coordinate. Through the circle estimation equation (Xa) 2 +(Yb) 2 =R 2 , where X and Y are the coordinate values ​​of the arc edge of the wafer 10, and R is the radius of the circle. The actual coordinates of the center of the circle (a, b) can be calculated. At this time, the offset of the center of the circle is the coordinates (a, b). By transmitting the offset information to the robot controller, the robot can be controlled to compensate for the center offset of the wafer 10 when taking the wafer from the wafer calibration mechanism.

[0051] The calibration component 7 can also calibrate the position of the straight edge or notch of the wafer 10. The above process has obtained the coordinate values ​​of the edge of the wafer 10. The straight edge or notch position will have more obvious coordinate fluctuations than other positions. When the wafer 10 is provided with a notch similar to a parabola shape, the coordinates of the notch position can be converted into the parabola equation Y=aX by intercepting the measurement data of the fluctuation area. 2 +bX+c, simulate the center point position of the parabola, and rotate the notch position of the wafer 10 to a preset angle by rotating the rotating drive component 31. When the wafer 10 is provided with a straight edge, by intercepting the measurement data of the fluctuation area, the coordinates of the straight edge can be converted into a straight line equation Y=aX+b, simulate the center point position of the straight line, and rotate the straight edge position of the wafer 10 to a preset angle by rotating the rotating drive component 31. It should be noted that the calibration principle of the calibration component 7 is the prior art.

[0052] Preferably, the calibration component 7 further includes a transparent plate 73, and there are two transparent plates 73, which are respectively installed at the top and bottom of the chamber 11 to ensure the sealing and light transmission of the chamber 11, meet the vacuum environment and the detection requirements of the calibration component 7, and one of the CCD transmitting end 71 and the CCD receiving end 72 is installed on the housing 1, and the other is installed at the bottom of the mounting plate 2. Further preferably, the mounting plate 2 sealed with the chamber 11 is provided with a first mounting hole, and one transparent plate 73 is sealed and connected to the first mounting hole, and the top wall of the chamber 11 is provided with a second mounting hole, and the other transparent plate 73 is sealed and connected to the second mounting hole. In this embodiment, the CCD transmitting end 71 is located above the transparent plate 73 in the second mounting hole and is installed on the top of the shell 1. The CCD receiving end 72 is located below the transparent plate 73 and is installed on the bottom outer wall of the mounting disk 2. The CCD transmitting end 71, the transparent plate 73 in the second mounting hole, the transparent plate 73 in the first mounting hole and the CCD receiving end 72 are arranged in sequence from top to bottom. The transparent plate 73 is used to ensure that the vacuum state in the chamber 11 continues to be maintained without affecting the transmission of multi-band lasers between the CCD transmitting end 71 and the CCD receiving end 72.

[0053] In this embodiment, Figure 5 As shown, the lifting drive assembly 4 includes a first connecting plate 41, a first motor 42, a lead screw 43 and a first slider 44. The first connecting plate 41 is connected to the bottom of the mounting plate 2. The first motor 42 and the lead screw 43 are installed on the first connecting plate 41. The output end of the first motor 42 is connected to the lead screw 43. The first slider 44 is threadedly connected to the lead screw 43. The rotating drive component 31 includes a connecting seat 311, and the connecting seat 311 is connected to the first slider 44. The lead screw 43 is along the Z-axis direction, that is, as shown in FIG. Figure 5As shown, when the first motor 42 drives the lead screw 43 to rotate, the first slider 44 moves along the Z axis relative to the lead screw 43, thereby driving the rotary drive component 31 and the wafer 10 to rise and fall, so as to facilitate the transfer of the wafer 10 to the robot.

[0054] Preferably, the lifting drive assembly 4 further includes a second connecting plate 45 and a second slider 47. The second connecting plate 45 is mounted on the bottom of the mounting plate 2. The second connecting plate 45 is provided with a slide rail 46. The extension direction of the slide rail 46 is the same as the extension direction of the lead screw 43. The second slider 47 is slidably connected to the slide rail 46. The connecting seat 311 is connected to the second slider 47. The first slider 44 and the second slider 47 are respectively located on both sides of the connecting seat 311. The connecting seat 311 is lifted and lowered under the guidance of the first slider 44 and the second slider 47, thereby improving the movement accuracy and movement stability of the rotation drive assembly 3.

[0055] Furthermore, the rotation driving component 31 includes a second motor 312, a reducer 313 and a coupling 314. The second motor 312 is drivingly connected to the reducer 313. The reducer 313 is fixedly mounted on the connecting seat 311, and the reducer 313 is drivingly connected to the driving rod 32 through the coupling 314. The second motor 312 drives the driving rod 32 to rotate through the reducer 313 and the coupling 314, and the driving rod 32 drives the carrier plate 33 to rotate, so that the notch portion or the straight edge portion of the wafer 10 can be stably and accurately rotated to a preset position.

[0056] Preferably, the carrier plate 33 is provided with a plurality of bosses 331, the top surface of the bosses 331 is provided with a groove, and a flexible ring 332 is embedded in the groove, and the plurality of flexible rings 332 can support the wafer 10. The flexible ring 332 has a certain friction force and does not cause wear to the wafer 10. The wafer 10 is supported by the flexible ring 332, and no impurities are generated in a vacuum environment to affect the processing quality of the wafer 10. In this embodiment, there are three bosses 331 and three flexible rings 332, and the three bosses 331 are evenly arranged on the carrier plate 33.

[0057] This embodiment also provides the working steps of the wafer calibration mechanism, which are as follows:

[0058] Step 1: The robot takes out a wafer 10 from the wafer box in the loading chamber, and the carrier plate 33 is in a low position when taking out the wafer;

[0059] Step 2: The robot takes out the wafer 10 and transfers it to the top of the carrier plate 33;

[0060] Step 3: The carrier plate 33 rises to a high position to lift up the wafer 10 on the robot arm. At this time, the multiple flexible rings 332 of the carrier plate 33 support the wafer 10;

[0061] Step 4: The arm of the robot returns to the transfer chamber, and the calibration component 7 calibrates the center of the wafer 10 and the notch or straight edge position of the wafer 10, calculates the center position offset of the wafer 10 and sends the correction vector to the controller of the robot;

[0062] Step 5: When the robot arm picks up the wafer 10 from the carrier plate 33, the center of the wafer 10 is compensated for to ensure that the center of the wafer 10 is precisely located at the center of the robot finger;

[0063] Step 6: The carrier plate 33 descends to a low position, and the wafer 10 falls on the fingers of the robot. The robot is withdrawn into the transfer chamber, and then rotated and transferred into the process chamber.

[0064] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention is described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A wafer calibration mechanism, characterized in that: include: A housing (1) provided with a chamber (11); a mounting plate (2) which is sealedly connected to the chamber (11); A rotation drive assembly (3), comprising a rotation drive component (31), a drive rod (32) and a carrier plate (33), wherein the carrier plate (33) is located in the chamber (11), one end of the drive rod (32) is connected to the output end of the rotation drive component (31), the rotation drive component (31) is used to drive the drive rod (32) to rotate, and the other end of the drive rod (32) is provided with the carrier plate (33); A lifting drive assembly (4) is arranged at the bottom of the mounting plate (2); the lifting drive assembly (4) is connected to the rotating drive assembly (3); and the lifting drive assembly (4) is used to drive the rotating drive assembly (3) to lift and lower.

2. The wafer calibration mechanism according to claim 1, characterized in that: The mounting plate (2) is provided with a through hole (21), the driving rod (32) is slidably and rotatably connected to the through hole (21), and the outer wall of the driving rod (32) is sealedly connected to the inner wall of the through hole (21); The wafer calibration mechanism also includes a bushing (5), the bushing (5) is installed in the through hole (21), and the driving rod (32) is slidably connected to the bushing (5).

3. The wafer calibration mechanism according to claim 2, characterized in that: The wafer calibration mechanism also includes a sealing component (6), the sealing component (6) includes a pressure plate (61) and a vacuum sealing ring (62), the vacuum sealing ring (62) is arranged between the outer wall of the driving rod (32) and the inner wall of the through hole (21), the pressure plate (61) is installed at the bottom of the chamber (11), and the pressure plate (61) and the bushing (5) are respectively abutted against the two ends of the vacuum sealing ring (62).

4. The wafer calibration mechanism according to claim 1, characterized in that: The wafer calibration mechanism also includes a calibration component (7), and the calibration component (7) includes a CCD transmitting end (71) and a CCD receiving end (72) arranged on one side of the carrier plate (33), and a detection area is formed between the CCD transmitting end (71) and the CCD receiving end (72).

5. The wafer calibration mechanism according to claim 4, characterized in that: The calibration component (7) further comprises a transparent plate (73), wherein the transparent plate (73) is mounted on the chamber (11), and one of the CCD transmitting end (71) and the CCD receiving end (72) is mounted on the housing (1), and the other is mounted on the bottom of the mounting plate (2).

6. The wafer calibration mechanism according to claim 1, characterized in that: The lifting drive assembly (4) comprises a first connecting plate (41), a first motor (42), a lead screw (43) and a first slider (44); the first connecting plate (41) is connected to the bottom of the mounting plate (2); the first motor (42) and the lead screw (43) are mounted on the first connecting plate (41); the output end of the first motor (42) is connected to the lead screw (43); the first slider (44) is threadedly connected to the lead screw (43); the rotating drive component (31) comprises a connecting seat (311); and the connecting seat (311) is connected to the first slider (44).

7. The wafer calibration mechanism according to claim 6, characterized in that: The lifting drive assembly (4) further comprises a second connecting plate (45) and a second sliding block (47); the second connecting plate (45) is mounted on the bottom of the mounting plate (2); the second connecting plate (45) is provided with a slide rail (46); the second sliding block (47) is slidably connected to the slide rail (46); the connecting seat (311) is connected to the second sliding block (47); the first sliding block (44) and the second sliding block (47) are respectively located on both sides of the connecting seat (311).

8. The wafer calibration mechanism according to claim 6, characterized in that: The rotating drive component (31) comprises a second motor (312), a reducer (313) and a coupling (314); the second motor (312) is drivingly connected to the reducer (313); the reducer (313) is fixedly mounted on the connecting seat (311); and the reducer (313) is drivingly connected to the driving rod (32) via the coupling (314).

9. The wafer calibration mechanism according to claim 1, characterized in that: The carrying plate (33) is provided with a plurality of bosses (331), the top surface of the bosses (331) is provided with a groove, and a flexible ring (332) is embedded in the groove.

10. A semiconductor device, characterized in that: Comprising a wafer calibration mechanism as described in any one of claims 1-9.

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