Semiconductor packaging frame with temperature equalization and heat dissipation functions
By introducing thermally conductive panels, thermal adhesives and uniform temperature heat dissipation components into the semiconductor packaging frame, the problem of insufficient heat dissipation function in the prior art is solved, and more efficient heat transfer and heat dissipation effects are achieved, extending the service life and reliability of semiconductor chips sex.
Patent Information
- Application Number
- CN202420400186.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-02
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-03-02
AI Technical Summary
The existing semiconductor packaging frames have weak temperature uniformity and heat dissipation functions when used, which affects the service life and reliability of the semiconductor packaging structure.
A semiconductor packaging frame including thermal panels, thermal insulation glue, pins and uniform temperature heat dissipation components were designed. The uniform temperature heat dissipation component consists of a thermal plate, a heat dissipation fin, a channel and a copper plate. The inner wall of the channel is equipped with a copper plate and the heat dissipation hole is uniform. Arranged on the thermal conduction plate, the thermal conduction panel is made of copper, and the semiconductor chip, pins and wires are connected by thermally conductive adhesive to increase heat dissipation performance.
Improve the temperature uniformity and heat dissipation function of semiconductor chips, enhance the adhesive strength and impact resistance of the chips, accelerate heat transfer through the design of thermal conduction plates and heat dissipation holes, accelerate heat dissipation between copper plates and coolant, and multiple sets of pins Improves overall heat dissipation performance.
Smart Images
Figure CN222261033U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor packaging, and in particular relates to a semiconductor packaging frame with a uniform temperature and heat dissipation function. Background Art
[0002] Semiconductor plastic-encapsulated devices (collectively referred to as semiconductor packaging structures) are widely used in many fields such as home appliances and new energy vehicles due to their simple production process and low cost.
[0003] The existing semiconductor packaging frame has weak temperature equalization and heat dissipation functions during use, which has a negative impact on the service life and reliability of the semiconductor packaging structure. Utility Model Content
[0004] In view of the above situation, in order to overcome the defects of the prior art, the utility model provides a semiconductor packaging frame with temperature equalization and heat dissipation function, which improves the temperature equalization and heat dissipation functions of the semiconductor chip during use and avoids negative impact on the service life and reliability of the semiconductor chip.
[0005] The technical solution adopted by the utility model is as follows: a semiconductor packaging frame with a uniform temperature and heat dissipation function, comprising a frame, a heat-conducting panel penetrating the frame and fixedly embedded in the middle of the frame, a semiconductor chip bonded to the top of the heat-conducting panel by a heat-conducting insulating adhesive, pins fixedly connected to the outer wall of the frame and arranged in a uniform manner, and wires connected between the semiconductor chip and the pins, and also a uniform temperature and heat dissipation component;
[0006] The uniform temperature heat dissipation component is arranged at the bottom of the heat conduction panel, and the uniform temperature heat dissipation component comprises a heat conduction plate fixedly connected to the bottom of the heat conduction panel and heat dissipation fins fixedly installed on the bottom wall of the heat conduction plate.
[0007] Furthermore, a channel is provided inside the heat conducting plate, a copper plate is provided on the inner wall of the channel, and the channel is arranged in a continuous U-shape.
[0008] Furthermore, the heat conducting plate is provided with heat dissipation holes, the heat dissipation holes are arranged evenly, and the heat dissipation holes are all located between the channels.
[0009] Furthermore, the heat-conducting panel is a heat-conducting panel made of copper.
[0010] Furthermore, a packaging body is provided between the top of the frame and the top of the pin.
[0011] After adopting the above structure, the beneficial effects of the utility model are as follows: The utility model proposes a semiconductor packaging frame with uniform temperature and heat dissipation function:
[0012] (1) The semiconductor chip is adhered to the thermal conductive panel through an insulating thermal conductive adhesive, so that the semiconductor chip has high bonding strength and becomes elastic after curing, which has the characteristics of impact resistance and vibration resistance. At the same time, it can better conduct heat and dissipate heat from the semiconductor chip and the heat generated;
[0013] (2) The setting of heat conduction plates and heat dissipation holes is conducive to the transfer and heat dissipation of heat. An appropriate amount of coolant can be added inside the channel, and the setting of copper plates can accelerate the heat dissipation effect when the whole is blown by wind;
[0014] (3) The overall heat dissipation performance can also be increased by setting up multiple groups of pins. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention.
[0016] Figure 1 This is a schematic diagram of the overall structure of a semiconductor packaging frame with uniform temperature and heat dissipation function proposed by the utility model;
[0017] Figure 2 This is a front view of a semiconductor packaging frame with uniform temperature and heat dissipation function proposed by the utility model;
[0018] Figure 3 A half-section view of a semiconductor packaging frame with uniform temperature and heat dissipation function proposed by the utility model;
[0019] Figure 4 This is a cross-sectional schematic diagram of a semiconductor packaging frame with uniform temperature and heat dissipation function proposed by the utility model;
[0020] Figure 5 for Figure 3 A magnified schematic diagram of part A;
[0021] Figure 6 The present invention is a schematic diagram of the packaging state of a semiconductor packaging frame with uniform temperature and heat dissipation function.
[0022] In the attached drawings: 1. frame, 2. heat-conducting panel, 3. heat-conducting insulating glue, 4. semiconductor chip, 5. pins, 6. wires, 7. heat-conducting plate, 8. heat-dissipating fins, 9. channels, 10. copper plates, 11. heat-dissipating holes, 12. package body. DETAILED DESCRIPTION
[0023] like Figure 1-2As shown, a semiconductor packaging frame with uniform temperature and heat dissipation function includes a frame 1, a heat-conducting panel 2 that penetrates the frame 1 and is fixedly embedded in the middle position of the frame 1, a semiconductor chip 4 bonded to the top of the heat-conducting panel 2 by a heat-conducting insulating adhesive 3, pins 5 that are fixedly connected to the outer wall of the frame 1 and are evenly arranged, and wires 6 connected between the semiconductor chip 4 and the pins 5, and also includes a uniform temperature and heat dissipation component.
[0024] like Figure 1-6 As shown, in order to improve the temperature equalization function and heat dissipation function of the semiconductor chip 4 when in use, the temperature equalization heat dissipation component is arranged at the bottom of the heat conduction panel 2, and the temperature equalization heat dissipation component includes a heat conduction plate 7 fixedly connected to the bottom of the heat conduction panel 2 and a heat dissipation fin 8 fixedly installed on the bottom wall of the heat conduction plate 7. A channel 9 is arranged inside the heat conduction plate 7, and a copper plate 10 is arranged on the inner wall of the channel 9. The channel 9 is arranged in a continuous U-shape. The heat conduction plate 7 is provided with heat dissipation holes 11, and the heat dissipation holes 11 are arranged evenly. The heat dissipation holes 11 are all located between the channels 9. The heat conduction panel 2 is made of copper material.
[0025] A packaging body 12 is provided between the top of the frame 1 and the top of the pin 5 .
[0026] During specific use, the semiconductor chip 4 is adhered to the heat-conducting panel 2 by means of insulating heat-conducting glue, so that the semiconductor chip 4 has high bonding strength and becomes elastic after curing, and has the characteristics of impact resistance and vibration resistance. At the same time, the semiconductor chip 4 and the generated heat can be better transferred to the heat-conducting plate 7. The setting of the heat dissipation holes 11 on the heat-conducting plate 7 is conducive to the transfer and heat dissipation of heat. An appropriate amount of coolant can be added to the inside of the channel 9 in advance, and the setting of the copper plate can accelerate the heat dissipation effect when the whole is blown by the wind. The setting of multiple groups of pins 5 can also increase the overall heat dissipation performance, ensuring that the semiconductor chip 4 has good uniform temperature and heat dissipation effect when in use.
[0027] Although the embodiments of the utility model have been shown and described, it is understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the utility model, and the scope of the utility model is defined by the attached claims and their equivalents. In short, if those skilled in the art are inspired by them and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the scope of protection of the utility model.
Claims
1. A semiconductor packaging frame with uniform temperature and heat dissipation function, comprising a frame, a heat-conducting panel penetrating the frame and fixedly embedded in the middle of the frame, a semiconductor chip bonded to the top of the heat-conducting panel by a heat-conducting insulating adhesive, pins fixedly connected to the outer wall of the frame and arranged in a uniform manner, and wires connected between the semiconductor chip and the pins, characterized in that: Also included is a temperature-averaging heat dissipation component; The temperature-averaging heat dissipation component is arranged at the bottom of the heat-conducting panel, and the temperature-averaging heat dissipation component includes a heat-conducting plate fixedly connected to the bottom of the heat-conducting panel and heat-dissipating fins fixedly installed on the bottom wall of the heat-conducting plate. A channel is arranged inside the heat-conducting plate, and a copper plate is arranged on the inner wall of the channel. The channel is arranged in a continuous U-shape. The heat-conducting plate is provided with heat-dissipating holes, and the heat-dissipating holes are arranged evenly, and the heat-dissipating holes are all located between the channels.
2. The semiconductor packaging frame with uniform temperature and heat dissipation function according to claim 1, characterized in that: The heat-conducting panel is made of copper.
3. The semiconductor packaging frame with uniform temperature and heat dissipation function according to claim 2, characterized in that: A packaging body is arranged between the top of the frame and the top of the pin.