Package structure

Abstract

The utility model provides a packaging structure, comprising a plastic package body having a first surface and a second surface which are oppositely arranged in a first direction; the first base island is located in the plastic package body, and the first base island is provided with a chip placement area and a slot located in the periphery of the chip placement area; the chip is arranged on one surface, deviating from the first surface of the plastic package body, of the first base island, and is positioned in the chip placement area; the bridge-type heat conduction piece is located in the plastic package body, the bridge-type heat conduction piece stretches across the chip, the two ends of the bridge-type heat conduction piece are inserted into the inserting grooves respectively, the bridge surface of the bridge-type heat conduction piece is exposed out of the second surface of the plastic package body, the two ends of the bridge-type heat conduction piece are inserted into the inserting grooves respectively, and therefore the bridge-type heat conduction piece can make contact with the first base island, and the second base island can make contact with the second base island. The heat of the chip can be conducted to the bridge-type heat conduction piece from the first base island and is dissipated through the bridge-type heat conduction piece, so that the heat dissipation performance of the packaging structure is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a packaging structure. Background Art

[0002] QFN (Quad Flat No-lead) / DFN (Dual Flat No-lead Package) packaging is an advanced packaging form. It has the advantages of small size, high density, good thermal conductivity, etc., and is widely used in the field of integrated circuit packaging.

[0003] The traditional QFN / DFN has a relatively simple heat dissipation channel. Since it can only rely on the back of the base island located in the center of the bottom of the package to dissipate heat, and its heat dissipation area is small, the heat dissipation speed is slow. To improve this phenomenon, the industry has introduced reverse QFN / DFN. Reverse QFN / DFN sets the base island and the external pins on two opposite surfaces of the plastic package, so that the base island can dissipate heat upward, but its heat dissipation channel is also relatively simple. In addition, its internal pins are overhead structures, which are prone to jitter during wire bonding operations, causing abnormal operations or poor solder joints.

[0004] Therefore, how to improve the heat dissipation performance of the QFN / DFN packaging structure has become one of the technical problems that urgently need to be solved. Summary of the invention

[0005] The technical problem to be solved by the utility model is how to improve the heat dissipation performance of the packaging structure.

[0006] In order to solve the above problems, the utility model provides a packaging structure, which includes: a plastic package body, having a first surface and a second surface arranged opposite to each other in a first direction; a first base island, located in the plastic package body, the first base island having a chip placement area and a slot located at the periphery of the chip placement area; a chip, arranged on a side of the first base island away from the first surface of the plastic package body and located in the chip placement area; a bridge-type heat conductor, located in the plastic package body, the bridge-type heat conductor spans the chip, and both ends are respectively inserted into the slots, and the bridge surface of the bridge-type heat conductor is exposed to the second surface of the plastic package body.

[0007] In one embodiment, the bridge-type thermal conductor includes: a second base island, which is arranged above the first base island in the first direction, and the second base island serves as a bridge surface of the bridge-type thermal conductor, and the top surface of the second base island is exposed to the second surface of the plastic package body; a thermal bridge, which passes through the gap between the chip and the second base island, and has two ends respectively inserted into the slots, and a portion of the upper surface of the thermal bridge is connected to the bottom surface of the second base island.

[0008] In one embodiment, the thermal bridge extends along a second direction, and in a third direction, the width of the second base island is greater than the width of the thermal bridge, wherein the second direction is perpendicular to the first direction, and the third direction is perpendicular to the first direction and the second direction respectively.

[0009] In one embodiment, the orthographic projection of the second base island on the first base island covers the orthographic projection of the thermal conductive bridge on the first base island.

[0010] In one embodiment, in a direction perpendicular to the extension of the heat-conducting bridge, the width of the heat-conducting bridge is smaller than the width of the chip, and pads of the chip for connecting with pins are located outside the orthographic projection of the heat-conducting bridge on the first base island.

[0011] In one embodiment, a portion of the upper surface of the heat-conducting bridge is connected to the bottom surface of the second base island via a heat-conducting and electrically-conductive adhesive.

[0012] In one embodiment, the bridge-type heat conductor includes: a bridge deck section, which is arranged above the first base island in the first direction, and the top surface of the bridge deck section is exposed to the second surface of the plastic package body; a connecting section, which is located in the plastic package body and is extended from both ends of the bridge deck section, and the connecting section is bent toward the first base island and inserted into the slot.

[0013] In one embodiment, the width of the bridge deck section is greater than the width of the connecting section.

[0014] In one embodiment, both ends of the bridge-shaped heat conductive member have protruding insertion portions, the insertion portions are inserted into the slots, and the width of the insertion portions is smaller than the width of the ends of the bridge-shaped heat conductive member.

[0015] In one embodiment, at least a portion of a lower surface of the bridge-type heat conducting member contacts a top surface of the chip.

[0016] In one embodiment, the bridge-type heat-conducting member is a conductive structure.

[0017] In one embodiment, the bottom surface of the first base island is exposed to the first surface of the plastic package body, or the bottom surface of the first base island is located in the plastic package body.

[0018] In one embodiment, the packaging structure further includes a pin, which is arranged on the periphery of the first base island, and the bottom surface of the pin is exposed to the first surface of the plastic package body and / or the side surface of the pin is exposed to the side surface of the plastic package body adjacent to the first surface.

[0019] In the packaging structure provided by the embodiment of the utility model, the two ends of the bridge-type heat conductor are respectively inserted into the slots, so that the bridge-type heat conductor can contact the first base island. The heat of the chip can be conducted from the first base island to the bridge-type heat conductor and dissipated through the bridge-type heat conductor, thereby improving the heat dissipation performance of the packaging structure and facilitating the promotion and application of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1A It is a schematic diagram of a QFN / DFN package structure;

[0022] Figure 1B It is a schematic diagram of a reverse QFN / DFN package structure;

[0023] Figure 2 is a top view schematic diagram of a packaging structure provided by an embodiment of the utility model;

[0024] Figure 3 is along Figure 2 Sectional view in the AA direction;

[0025] Figure 4 is along Figure 2 Cross-sectional view in the BB direction;

[0026] Figure 5 is a schematic top view of a first base island of a packaging structure provided by an embodiment of the utility model;

[0027] Figure 6 It is a top view schematic diagram of a packaging structure provided by an embodiment of the utility model, in which a heat-conducting bridge is arranged above the first base island;

[0028] Figure 7 It is a schematic diagram of the connection between the slot and the heat-conducting bridge of the packaging structure provided by one embodiment of the utility model;

[0029] Figure 8 This is another schematic diagram of the connection between the slot and the heat-conducting bridge of the packaging structure provided by one embodiment of the utility model;

[0030] Fig. 9 is a schematic diagram of a packaging structure provided by another embodiment of the utility model;

[0031] Fig.10A schematic top view of a packaging structure provided by yet another embodiment of the present utility model;

[0032] Fig.11 For along Fig.10 Sectional view along AA direction. DETAILED DESCRIPTION

[0033] like Figure 1A As shown in FIG. 1 , it is a schematic diagram of a QFN / DFN packaging structure, in which a base island 100 and pins 101 are arranged on the same surface of a plastic package 102, a chip 103 is arranged on the base island 100, and connected to the pins 101 through a lead 104. In this packaging structure, heat can only be dissipated by relying on the back side of the base island 100 located at the bottom center of the plastic package 102, and the heat dissipation area is small, and the heat dissipation speed is slow.

[0034] like Figure 1B As shown, it is a schematic diagram of a reverse QFN / DFN packaging structure, in which the base island 110 and the outer pin 111A are arranged on two opposite surfaces (such as the bottom surface and the top surface) of the plastic package 112, the inner pin 111B is arranged in the plastic package 112, and the chip 113 is arranged on the surface of the base island 110 facing the inside of the plastic package 112, and is connected to the side of the inner pin 111B facing the bottom surface of the plastic package 112 through the lead 114, wherein the inner pin 111B and the outer pin 111A are different regions of the same pin. In this packaging structure, the base island 110 can dissipate heat upward, the single heat dissipation channel is relatively simple, and the heat dissipation speed is slow. In addition, in this packaging structure, the inner pin 111B is an overhead structure, and the side of the inner pin 111B facing away from the bottom surface of the plastic package body 112 has no support. Therefore, when the wire bonding operation is performed on the side of the inner pin 111B facing the bottom surface of the plastic package body 112, it is easy to cause operation abnormalities or poor solder joints due to shaking, thereby affecting the reliability of the packaging structure.

[0035] In view of the above technical problems existing in the packaging structure, the utility model provides a new packaging structure, which can improve the heat dissipation performance of the packaging structure.

[0036] Figure 2 is a top view schematic diagram of a packaging structure provided by an embodiment of the utility model, Figure 3 is along Figure 2 Sectional view along the AA direction, Figure 4 is along Figure 2 For the cross-sectional view in the BB direction, please refer to Figure 2 to Figure 4, the packaging structure includes: a plastic package 200, having a first surface 201 and a second surface 202 arranged opposite to each other in a first direction D1; a first base island 210, located in the plastic package 200, the first base island 210 having a chip placement area 211 and a slot 212 located at the periphery of the chip placement area 211; a chip 220, arranged on a side of the first base island 210 away from the first surface 201 of the plastic package 200, and located in the chip placement area 211; a bridge-type heat conductive member 230, located in the plastic package 200, the bridge-type heat conductive member 230 spans the chip 220, and the two ends are respectively inserted into the slots 212, and the bridge surface of the bridge-type heat conductive member 230 is exposed to the second surface 202 of the plastic package 200. In order to clearly show the packaging structure, the plastic package 200 is illustrated in FIG. Figure 3-4 Not shown in Figure 2 middle.

[0037] In the packaging structure provided by the embodiment of the utility model, the two ends of the bridge-type heat conductive member 230 are respectively inserted into the slots 212, so that the bridge-type heat conductive member 230 can contact the first base island 210, and the heat of the chip 220 can be transferred from the first base island 210 to the bridge-type heat conductive member 230, and dissipated through the bridge-type heat conductive member 230, thereby improving the heat dissipation performance of the packaging structure. Furthermore, the heat dissipation performance can be increased by increasing the exposed area of ​​the bridge-type heat conductive member 230.

[0038] The plastic package 200 serves as a protection and support structure, which covers the first base island 210 , the chip 220 , and the bridge-type heat conducting member 230 .

[0039] Figure 5 is a top view of a first base island of a packaging structure provided by an embodiment of the present utility model, please refer to Figure 3 and Figure 5 The chip placement area 211 is provided on the side of the first base island 210 away from the first surface 201 of the plastic package body 200. In the chip placement area 211, the chip 220 can be bonded to the surface of the first base island 210 through a conductive adhesive layer 221. The slot 212 runs through the first base island 210. The shape of the slot 212 needs to match the end of the bridge-type heat conductor 230 so that both ends of the bridge-type heat conductor 230 can be inserted into the slot 212. For example, in some embodiments, the shape of the slot 212 is rectangular, and the end of the bridge-type heat conductor 230 is also rectangular. In this embodiment, the two slots 212 are respectively arranged on opposite sides of the chip placement area 211.

[0040] For further information, please refer to Figure 2 to Figure 4In this embodiment, the bottom surface of the first base island 210 is exposed to the first surface 201 of the plastic package 200, so the heat of the chip 220 can be dissipated through the bottom surface of the first base island 210 and the bridge-type heat conductor 230, thereby realizing double-sided heat dissipation of the packaging structure and greatly improving the heat dissipation performance of the packaging structure. In another embodiment, in order to strengthen the protection and support of the first base island 210, the bottom surface of the first base island 210 can also be located in the plastic package 200 and covered by the plastic package 200. Specifically, Fig. 9 As shown, it is a schematic diagram of a packaging structure provided by another embodiment of the utility model. In this embodiment, the bottom surface of the first base island 210 is located in the plastic packaging body 200 and is not exposed to the first surface 201 of the plastic packaging body 200. The plastic packaging body 200 at the bottom of the first base island 210 can support the first base island 210, thereby increasing the strength of the first base island 210.

[0041] Furthermore, in the present embodiment, the bridge-type heat conductor 230 is a conductive structure, and the electrical properties of the back of the chip 220 can be transferred from the first base island 210 on the back of the plastic package 200 to the bridge-type heat conductor 230, and then the electrical connection with other packaging structures can be achieved in the area where the bridge-type heat conductor 230 is exposed to the second surface 202 of the plastic package 200, which can meet the needs of more packaging unit integration and application scenarios. For example, the bridge-type heat conductor 230 is a metal part, which can realize the electrical lead-out of the back of the chip 220. In another embodiment, the bridge-type heat conductor 230 can also be a non-conductive structure, and the bridge-type heat conductor 230 with higher thermal conductivity can be selected to improve the heat dissipation performance of the packaging structure.

[0042] The bridge-type heat conducting member 230 may be a split structure or an integrated structure. In this embodiment, the bridge-type heat conducting member 230 is a split structure. Figure 2 to Figure 4 As shown, the bridge-type heat-conducting member 230 includes a second base island 231 and a heat-conducting bridge 232. The second base island 231 is arranged above the first base island 210 in the first direction D1, and the second base island 231 serves as a bridge surface of the bridge-type heat-conducting member 230. The top surface of the second base island 231 is exposed to the second surface 202 of the plastic package 200. The heat-conducting bridge 232 passes through the gap between the chip 220 and the second base island 231, and both ends are respectively inserted into the slot 212, and part of the upper surface of the heat-conducting bridge 232 is connected to the bottom surface of the second base island 231.

[0043] In this embodiment, the second base island 231 and the heat-conducting bridge 232 are independent structures, and part of the upper surface of the heat-conducting bridge 232 and the bottom surface of the second base island 231 can be connected by a heat-conducting conductive adhesive 233, which can realize the mutual fixation of the second base island 231 and the heat-conducting bridge 232 on the one hand, and realize the electrical connection and heat conduction between the second base island 231 and the heat-conducting bridge 232 on the other hand. In other embodiments, the second base island 231 and the heat-conducting bridge 232 can also be in direct contact, not connected by the heat-conducting conductive adhesive 233, and the two are fixed by the plastic package 200, thereby reducing the overall thickness of the packaging structure.

[0044] The heat-conducting bridge 232 is a bridge-shaped configuration that bends in a first direction D1 toward a side away from the first base island 210 , and the heat-conducting bridge 232 extends along a second direction D2 , and the distance between the two ends of the heat-conducting bridge 232 and the chip 220 is smaller than the distance between the center of the heat-conducting bridge 232 and the chip 220 . In this embodiment, in order to prevent the heat-conducting bridge 232 from affecting the electrical connection between the pad 222 of the chip 220 and the pin 240, in the direction perpendicular to the extension of the heat-conducting bridge 232, that is, in the perpendicular second direction D2, for example, the third direction D3, the width of the heat-conducting bridge 232 is smaller than the width of the chip 220, and the pad 222 of the chip 220 for connecting with the pin 240 is located outside the positive projection of the heat-conducting bridge 232 on the first base island 210, and the pad 222 of the chip 220 is connected to the pin 240 through the lead 250. The heat-conducting bridge 232 will not affect the height of the lead 250 and will not press the lead 250, so that the lead 250 can be prevented from being deformed, thereby ensuring the reliability of the packaging structure. For details, please refer to Figure 6 , which is a top view schematic diagram of a heat-conducting bridge 232 disposed above the first base island 210. The second direction D2 is perpendicular to the first direction D1, and the third direction D3 is perpendicular to the first direction D1 and the second direction D2, respectively. In this embodiment, the first direction D1 is the Z direction in the Cartesian coordinate system, the second direction D2 is the Y direction in the Cartesian coordinate system, and the third direction D3 is the X direction in the Cartesian coordinate system.

[0045] Furthermore, in this embodiment, in the third direction D3, the width of the second base island 231 is greater than the width of the heat-conducting bridge 232. By increasing the width of the second base island 231, the surface area of ​​the bridge-type heat-conducting member 230 exposed to the plastic package 200 is increased, the heat dissipation performance of the packaging structure is further improved, and a larger platform can be provided for the electrical connection between the packaging structure and other components.

[0046] Further, in this embodiment, the orthographic projection of the second base island 231 on the first base island 210 covers the orthographic projection of the heat-conducting bridge 232 on the first base island 210, that is, the edges of the orthographic projection of the second base island 231 on the first base island 210 are all beyond the edges of the orthographic projection of the heat-conducting bridge 232 on the first base island 210, see Figure 3 as well as Figure 4 , which can further increase the area of ​​the bridge-type heat conductor 230 exposed to the plastic package body 200 and improve the heat dissipation performance of the packaging structure.

[0047] Further, in the present embodiment, the orthographic projection of the second base island 231 on the first base island 210 is located within the range of the first base island 210, that is, the area of ​​the second base island 231 is smaller than the area of ​​the first base island 210; in other embodiments, the orthographic projection of the second base island 231 on the first base island 210 covers the first base island 210, that is, the area of ​​the second base island 231 is larger than the area of ​​the first base island 210, so as to increase the heat dissipation performance of the packaging structure.

[0048] For further information, see Figure 7 , which is a schematic diagram of the connection between the slot 212 and the heat-conducting bridge 232. The two ends of the bridge-type heat-conducting member 230 have protruding insertion portions 234, which are inserted into the slot 212, and the width of the insertion portion 234 is smaller than the width of the end of the bridge-type heat-conducting member 230. Specifically, in this embodiment, the two ends of the heat-conducting bridge 232 have protruding insertion portions 234, which are inserted into the slot 212. In the third direction D3, the width of the insertion portion 234 is smaller than the width of the end of the heat-conducting bridge 232. The insertion depth of the heat-conducting bridge 232 is limited by setting the width, so as to avoid adverse effects on the packaging structure caused by artificial control of the insertion depth.

[0049] In some embodiments, Figure 8 As shown, it is another schematic diagram of the connection between the slot 212 and the heat-conducting bridge 232. A plurality of slots 212 independent of each other may be arranged on the same side of the chip placement area 211. The plurality of slots 212 are arranged in parallel along the third direction D3. The end of the bridge-type heat conductor 230 has a plurality of protruding insertion portions 234. Each of the insertion portions 234 can be inserted into the corresponding slot 212 to further increase the connection strength between the bridge-type heat conductor 230 and the slot 212, and to limit the insertion depth of the bridge-type heat conductor 230.

[0050] Furthermore, at least part of the lower surface of the bridge-type heat conducting member 230 is in contact with the top surface of the chip 220, and the heat on the top surface of the chip 220 can be dissipated through the bridge-type heat conducting member 230, further improving the heat dissipation performance of the packaging structure. Figure 3 , a portion of the lower surface of the heat-conducting bridge 232 contacts a portion of the top surface of the chip 220 through the heat-conducting layer 260, and the heat on the top surface of the chip 220 is conducted to the heat-conducting bridge 232 through the heat-conducting layer 260, and then to the second base island 231, and dissipated through the exposed surface of the second base island 231. The heat-conducting layer 260 may be an insulating layer to achieve electrical insulation between the top surface of the chip 220 and the bridge-type heat-conducting member 230.

[0051] Furthermore, the packaging structure further includes a pin 240, which is disposed on the periphery of the first base island 210, and the bottom surface of the pin 240 is exposed to the first surface 201 of the plastic package 200 and / or the side surface of the pin 240 is exposed to the side surface of the plastic package 200 adjacent to the first surface 201. In this embodiment, please refer to Figure 3 , the bottom surface of the pin 240 is exposed to the first surface 201 of the plastic package 200, and the side surface of the pin 240 is exposed to the side surface of the plastic package 200 adjacent to the first surface 201. In other embodiments, the bottom surface of the pin 240 is exposed to the first surface 201 of the plastic package 200, or the side surface of the pin 240 is exposed to the side surface of the plastic package 200 adjacent to the first surface 201. The pad 222 of the chip 220 is electrically connected to the pin 240 through the lead 250. Since the pin 240 does not exist Figure 1B In the case where the inner pins are suspended, there is no abnormal operation or poor solder joint bonding due to jitter during the wire bonding operation, thereby ensuring the reliability of the packaging structure. In the packaging structure, the pins 240 and the second base island 231 are respectively located on two opposite surfaces (the first surface 201 and the second surface 202) of the plastic package body 200, and water cooling can be used to dissipate heat above the second base island 231, which can further improve the heat dissipation performance of the packaging structure.

[0052] In the above embodiment, the bridge-type heat conducting member 230 is a split structure. In another embodiment, the bridge-type heat conducting member 230 is an integrated structure, which greatly improves the heat conduction capacity of the bridge-type heat conducting member 230. Fig.10 and Fig.11 ,in, Fig.10 A top view schematic diagram of a packaging structure provided by yet another embodiment of the utility model, Fig.11 For along Fig.10In the cross-sectional view along the AA direction, in this embodiment, the bridge-type heat conductor 230 includes a bridge section 235 and a connecting section 236. In the first direction D1, the bridge section 235 is arranged above the first base island 210, and the top surface of the bridge section 235 is exposed to the second surface 202 of the plastic package 200; the connecting section 236 is located in the plastic package 200, and is formed by extending the two ends of the bridge section 235. The connecting section 236 is bent toward the first base island 210 and inserted into the slot 212, wherein the second direction D2 is perpendicular to the first direction D1. The bridge-type heat conductor 230 can be integrally formed by a heat conductive sheet, without the need for splicing through an adhesive layer, which greatly improves the thermal conductivity of the bridge-type heat conductor 230. In the second direction D2 , both ends of the bridge section 235 extend to form the connecting section 236 . The connecting section 236 can be bent toward the first base island 210 and then inserted into the slot 212 to achieve contact between the bridge-type heat conductor 230 and the first base island 210 .

[0053] Further, in this embodiment, the width of the bridge section 235 is greater than the width of the connecting section 236. Specifically, in the third direction D3, the width of the bridge section 235 is greater than the width of the connecting section 236, so as to increase the surface area of ​​the bridge-type heat conductor 230 exposed to the plastic package 200 and improve the heat dissipation performance of the packaging structure.

[0054] Furthermore, in the present embodiment, at least a portion of the lower surface of the bridge deck section 235 contacts the top surface of the chip 220, so that the heat on the top surface of the chip 220 can be dissipated through the bridge-type heat conductor 230. For example, at least a portion of the lower surface of the bridge deck section 235 contacts the top surface of the chip 220 through the heat conductive layer 260, and the heat on the top surface of the chip 220 is conducted to the bridge deck section 235 through the heat conductive layer 260 and dissipated through the exposed surface of the bridge deck section 235.

[0055] Further, in this embodiment, both ends of the connecting section 236 have protruding insertion portions 234, and the insertion portions 234 are inserted into the slot 212. In the third direction D3, the width of the insertion portion 234 is smaller than the width of the end of the connecting section 236, thereby limiting the insertion depth of the heat-conducting bridge 232 by setting the width, thereby avoiding adverse effects on the packaging structure caused by artificial control of the insertion depth. Figure 7 as well as Figure 8 .

[0056] In the packaging structure provided by the embodiment of the utility model, the heat dissipation performance of the packaging structure is improved by disposing the bridge-type heat conducting member 230 .

[0057] It should be noted that the terms "including" and "having" and their variations involved in the documents of the present utility model are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, unless the context clearly indicates, and it should be understood that the data used in this way can be interchanged under appropriate circumstances. The term "one or more" depends at least in part on the context, and can be used to describe features, structures or characteristics in a singular sense, or can be used to describe a combination of features, structures or features in a plural sense. The term "based on" can be understood as not necessarily intended to express a set of exclusive factors, but can alternatively, also at least in part depending on the context, allow the presence of other factors that are not necessarily explicitly described. In addition, in the absence of conflict, the embodiments of the present utility model and the features in the embodiments can be combined with each other. In addition, in the above description, the description of known components and technologies is omitted to avoid unnecessary confusion of the concept of the present utility model. In the above embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.

[0058] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A packaging structure, characterized in that: include: The plastic package body has a first surface and a second surface which are arranged opposite to each other in a first direction; A first base island is located in the plastic package, and the first base island has a chip placement area and a slot located outside the chip placement area; A chip is arranged on a side of the first base island away from the first surface of the plastic package body and is located in the chip placement area; The bridge-type heat conductive member is located in the plastic package body, spans the chip, and has two ends respectively inserted into the slots, and a bridge surface of the bridge-type heat conductive member is exposed to the second surface of the plastic package body.

2. The packaging structure according to claim 1, characterized in that: The bridge-type heat conducting member comprises: A second base island, wherein the second base island is arranged above the first base island in the first direction, the second base island serves as a bridge surface of the bridge-type heat conducting member, and a top surface of the second base island is exposed to a second surface of the plastic package body; A heat-conducting bridge passes through a gap between the chip and the second base island, and two ends of the heat-conducting bridge are respectively inserted into the slots, and a portion of the upper surface of the heat-conducting bridge is connected to the bottom surface of the second base island.

3. The packaging structure according to claim 2, characterized in that: The heat-conducting bridge extends along a second direction, and in a third direction, a width of the second base island is greater than a width of the heat-conducting bridge, wherein the second direction is perpendicular to the first direction, and the third direction is perpendicular to the first direction and the second direction respectively.

4. The packaging structure according to claim 2, characterized in that: The orthographic projection of the second base island on the first base island covers the orthographic projection of the heat conductive bridge on the first base island.

5. The packaging structure according to claim 2, characterized in that: In a direction perpendicular to the extension of the heat-conducting bridge, the width of the heat-conducting bridge is smaller than the width of the chip, and a pad of the chip for connecting with a pin is located outside the orthographic projection of the heat-conducting bridge on the first base island.

6. The packaging structure according to claim 2, characterized in that: Part of the upper surface of the heat-conducting bridge is connected to the bottom surface of the second base island via a heat-conducting and electrically-conductive adhesive.

7. The packaging structure according to claim 1, characterized in that: The bridge-type heat conducting member comprises: A bridge deck segment, wherein the bridge deck segment is arranged above the first base island in the first direction, and a top surface of the bridge deck segment is exposed to the second surface of the plastic package body; The connecting section is located in the plastic package body and is formed by extending the two ends of the bridge deck section. The connecting section is bent toward the first base island and inserted into the slot.

8. The packaging structure according to claim 7, characterized in that: The width of the bridge deck section is greater than the width of the connecting section.

9. The packaging structure according to any one of claims 1 to 8, characterized in that: Both ends of the bridge-type heat conductor have protruding insertion portions, the insertion portions are inserted into the slots, and the width of the insertion portions is smaller than the width of the ends of the bridge-type heat conductor.

10. The packaging structure according to any one of claims 1 to 8, characterized in that: At least a portion of a lower surface of the bridge-type heat conducting member contacts a top surface of the chip.

11. The packaging structure according to any one of claims 1 to 8, characterized in that: The bridge-type heat-conducting member is a conductive structure.

12. The packaging structure according to any one of claims 1 to 8, characterized in that: The bottom surface of the first base island is exposed to the first surface of the plastic package body, or the bottom surface of the first base island is located in the plastic package body.

13. The packaging structure according to any one of claims 1 to 8, characterized in that: The packaging structure further includes a pin, which is arranged at the periphery of the first base island, and the bottom surface of the pin is exposed to the first surface of the plastic package body and / or the side surface of the pin is exposed to the side surface of the plastic package body adjacent to the first surface.

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