Double-sided heat dissipation type packaging structure

Abstract

According to the double-sided heat dissipation type packaging structure provided by the utility model, the two surfaces of the first heat dissipation piece are respectively exposed on the two surfaces of the plastic package body, so that the packaging structure can dissipate heat upwards and downwards, double-sided heat dissipation of the packaging structure is realized, and the heat dissipation performance of the packaging structure is improved. Moreover, the heat dissipation columns are in contact with the base islands when penetrating through the jacks, the heat of the base islands is further conducted through the heat dissipation columns, and the heat dissipation performance of the packaging structure is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a double-sided heat dissipation packaging structure. Background Art

[0002] QFN (Quad Flat No-lead) / DFN (Dual Flat No-lead Package) packaging is an advanced packaging form. It has the advantages of small size, high density, good thermal conductivity, etc., and is widely used in the field of integrated circuit packaging.

[0003] The traditional QFN / DFN has a relatively simple heat dissipation channel. Since it can only rely on the back of the base island located in the center of the bottom of the package to dissipate heat, and its heat dissipation area is small, the heat dissipation speed is slow. To improve this phenomenon, the industry has introduced reverse QFN / DFN. Reverse QFN / DFN sets the base island and external pins on two opposite surfaces of the plastic package, so that the base island can dissipate heat upwards. However, the heat dissipation performance of this packaging structure still cannot meet the requirements.

[0004] Therefore, how to improve the heat dissipation performance of the packaging structure has become one of the technical problems that urgently need to be solved. Summary of the invention

[0005] The technical problem to be solved by the utility model is to provide a double-sided heat dissipation packaging structure, which can improve the heat dissipation performance of the packaging structure.

[0006] In order to solve the above problems, the utility model provides a double-sided heat dissipation packaging structure, comprising: a plastic package body, having a first end and a second end arranged opposite to each other in a first direction; a base island, located in the plastic package body, the base island having a chip placement area, and a plurality of insertion holes penetrating the base island are arranged on the periphery of the chip placement area; a chip, located in the plastic package body, the chip is arranged on a side of the base island away from the first end of the plastic package body, and is located in the chip placement area; a first heat sink, located in the plastic package body, the first heat sink comprises a heat sink and a plurality of heat sink columns arranged at intervals, in the first direction, the heat sink is located above the chip and contacts a partial area of ​​the top surface of the chip, the top surface of the heat sink is exposed to the second end of the plastic package body, the heat sink extends along the first direction, one end of the heat sink is connected to the heat sink, and the other end passes through the insertion hole and is exposed.

[0007] In one embodiment, the surface of the heat sink facing the chip has a protrusion, and the protrusion is in direct or indirect contact with a partial area of ​​the top surface of the chip.

[0008] In one embodiment, the bottom surface of the base island is exposed to the first end of the plastic package body, the bottom surface of the base island has a groove, the insertion hole is located in the groove area, and the heat dissipation column passes through the insertion hole and protrudes from the bottom of the groove.

[0009] In one embodiment, the end surface of the heat dissipation column is flush with the first end of the plastic package body or the end surface of the heat dissipation column is located in the groove.

[0010] In one embodiment, the heat dissipation column is connected to the edge of the heat dissipation fin, or the edge of the heat dissipation fin is bent to form the heat dissipation column.

[0011] In one embodiment, the packaging structure further includes a second heat sink, which is disposed at the second end of the plastic package body and contacts the surface of the heat sink.

[0012] In one embodiment, the orthographic projection of the second heat dissipation element on the base island covers the orthographic projection of the heat dissipation fin on the base island.

[0013] In one embodiment, a surface of the second heat dissipation element facing away from the second end of the plastic package body has a plurality of protrusions.

[0014] In one embodiment, the second heat dissipation element and the heat sink are integrally formed.

[0015] In one embodiment, the packaging structure further includes: pins located in the plastic package and arranged on the periphery of the base island; leads located in the plastic package, the leads passing through the gap between two adjacent heat dissipation columns to respectively connect the chip and the pins.

[0016] In the double-sided heat dissipation packaging structure provided by the embodiment of the utility model, the two surfaces of the first heat sink, i.e., the top surface of the heat sink and the end surface of the heat sink column, are respectively exposed to the two surfaces of the plastic package body, i.e., the end surface of the heat sink column is exposed to the first end of the plastic package body, and the top surface of the heat sink is exposed to the second end of the plastic package body. The packaging structure can dissipate heat both upward and downward, realizing double-sided heat dissipation of the packaging structure and improving the heat dissipation performance of the packaging structure. In addition, when the heat sink column passes through the jack, it contacts the base island, and the heat of the base island is further conducted through the heat sink column, further improving the heat dissipation performance of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1A It is a schematic diagram of a QFN / DFN package structure;

[0019] Figure 1B It is a schematic diagram of a reverse QFN / DFN package structure;

[0020] Figure 2 It is a schematic diagram of a double-sided heat dissipation packaging structure provided by an embodiment of the utility model;

[0021] Figure 3 It is a top view schematic diagram of a base island of a double-sided heat dissipation packaging structure provided by an embodiment of the utility model;

[0022] Figure 4 is a schematic diagram of a double-sided heat dissipation packaging structure provided by another embodiment of the utility model;

[0023] Figure 5 is a schematic diagram of a packaging structure provided by yet another embodiment of the utility model;

[0024] Figure 6 It is a schematic diagram of a packaging structure provided by yet another embodiment of the utility model. DETAILED DESCRIPTION

[0025] like Figure 1A As shown in FIG. 1 , it is a schematic diagram of a QFN / DFN packaging structure, in which a base island 100 and pins 101 are arranged on the same surface of a plastic package 102, a chip 103 is arranged on the base island 100, and connected to the pins 101 through a lead 104. In this packaging structure, heat can only be dissipated by relying on the back side of the base island 100 located at the bottom center of the plastic package 102, and the heat dissipation area is small, and the heat dissipation speed is slow.

[0026] like Figure 1BAs shown, it is a schematic diagram of a reverse QFN / DFN packaging structure, in which the base island 110 and the outer pin 111A are arranged on two opposite surfaces (such as the bottom surface and the top surface) of the plastic package 112, the inner pin 111B is arranged in the plastic package 112, and the chip 113 is arranged on the surface of the base island 110 facing the inside of the plastic package 112, and is connected to the side of the inner pin 111B facing the bottom surface of the plastic package 112 through the lead 114, wherein the inner pin 111B and the outer pin 111A are different regions of the same pin. In this packaging structure, the base island 110 can dissipate heat upward, but the single heat dissipation channel is relatively simple and the heat dissipation speed is slow.

[0027] In view of the above technical problems existing in the packaging structure, the utility model provides a double-sided heat dissipation packaging structure, in which the packaging structure can dissipate heat on both sides, greatly improving the heat dissipation performance of the packaging structure.

[0028] The specific implementation of the double-sided heat dissipation packaging structure provided by the utility model is described in detail below with reference to the accompanying drawings.

[0029] Figure 2 This is a schematic diagram of a double-sided heat dissipation packaging structure provided by an embodiment of the utility model. Figure 2 The packaging structure includes: a plastic package 200, having a first end 201 and a second end 202 arranged opposite to each other in a first direction D1; a base island 210, located in the plastic package 200, the base island 210 having a chip placement area 211, and a plurality of plug holes 212 penetrating the base island 210 are arranged on the periphery of the chip placement area 211; a chip 220, located in the plastic package 200, the chip 220 is arranged on a side of the base island 210 away from the first end 201 of the plastic package 200, and is located in the chip placement area 211; a first heat dissipation The first heat dissipation component 230 is located in the plastic package 200. The first heat dissipation component 230 includes a heat sink 231 and a plurality of heat dissipation columns 232 arranged at intervals. In the first direction D1, the heat sink 231 is located above the chip 220 and contacts a portion of the top surface of the chip 220. The top surface of the heat sink 231 is exposed to the second end 202 of the plastic package 200. The heat dissipation column 232 extends along the first direction D1. One end of the heat dissipation column 232 is connected to the heat sink 231, and the other end passes through the plug hole 212 and is exposed.

[0030] In the double-sided heat dissipation packaging structure provided by the embodiment of the utility model, the two surfaces of the first heat sink 230, namely the top surface of the heat sink 231 and the end surface of the heat sink column 232, are respectively exposed to the two surfaces of the plastic package 200, namely the end surface of the heat sink column 232 is exposed to the first end 201 of the plastic package 200, and the top surface of the heat sink 231 is exposed to the second end 202 of the plastic package 200. The packaging structure can dissipate heat upward and downward, realizing double-sided heat dissipation of the packaging structure and improving the heat dissipation performance of the packaging structure. Furthermore, when the heat sink column 232 passes through the plug hole 212, it contacts the base island 210, and the heat of the base island 210 is further conducted through the heat sink column 232, further improving the heat dissipation performance of the packaging structure.

[0031] The first end 201 and the second end 202 of the plastic packaging body 200 refer to two surfaces of the plastic packaging body 200 that are arranged opposite to each other in the first direction D1. In this embodiment, the first end 201 of the plastic packaging body 200 is the bottom surface of the plastic packaging body 200, and the second end 202 of the plastic packaging body 200 is the top surface of the plastic packaging body 200. The first direction D1 is a direction perpendicular to the top surface of the plastic packaging body 200.

[0032] Figure 3 is a top view schematic diagram of a base island 210 of a double-sided heat dissipation packaging structure provided by an embodiment of the present invention, please refer to Figure 2 and Figure 3 A chip placement area 211 is provided on one side of the base island 210 away from the first end 201 of the plastic package body 200. In the chip placement area 211, the chip 220 can be bonded to the surface of the base island 210 through an adhesive layer 221. The plug hole 212 passes through the base island 210, and the size of the plug hole 212 needs to be adapted to the size of the heat dissipation column 232 so that the heat dissipation column 232 can be inserted into the plug hole 212. Furthermore, the shape of the plug hole 212 matches the shape of the heat dissipation column 232, which can further improve the heat conduction of the heat dissipation column 232 and improve the heat dissipation performance of the packaging structure. For example, if the shape of the plug hole 212 is rectangular, the shape of the end of the heat dissipation column 232 is also rectangular. The number of the plug holes 212 corresponds to the number of the heat dissipation columns 232, and the heat dissipation columns 232 are inserted into the plug holes 212 one by one.

[0033] The first heat sink 230 is a structure with high thermal conductivity, for example, the first heat sink 230 is a metal member. Specifically, in this embodiment, the first heat sink 230 is a copper member.

[0034] In the first direction D1, the heat sink 231 contacts a part of the top surface of the chip 220. For example, the bottom surface of the heat sink 231 (i.e., the surface of the heat sink 231 facing away from the second end 202 of the plastic package 200) contacts a part of the top surface of the chip 220, and the heat on the top surface of the chip 220 can be transferred to the heat sink 231. The heat sink 231 can contact a part of the top surface of the chip 220 directly or indirectly through the heat conductive layer 222. The heat conductive layer 222 can be an insulating heat conductive adhesive to achieve electrical insulation and heat conduction between the top surface of the chip 220 and the heat sink 231.

[0035] Further, in this embodiment, the surface of the heat sink 231 facing the chip 220 has a protrusion 2310, and the protrusion 2310 is in direct or indirect contact with a portion of the top surface of the chip 220. By setting the protrusion 2310, the contact area between the heat sink 231 and the chip 220 can be a non-pad area of ​​the chip 220, thereby avoiding the heat sink 231 from covering the pad of the chip 220, and avoiding the heat sink 231 from affecting the setting of the lead 270 of the chip 220. In other embodiments, the non-pad area of ​​the top surface of the chip 220 can also be raised, and the heat sink 231 is in contact with the raised area of ​​the chip 220, thereby avoiding the heat sink 231 from affecting the setting of the lead 270 of the chip 220.

[0036] The top surface of the heat sink 231 is exposed to the second end 202 of the plastic package body 200 , and the heat conducted to the heat sink 231 by the chip 220 and the heat dissipation column 232 can be dissipated through the top surface of the heat sink 231 .

[0037] In the first direction D1, one end of the heat dissipation column 232 is connected to the heat sink 231, and the other end passes through the insertion hole 212. At the insertion hole 212, part of the heat of the base island 210 is conducted to the heat dissipation column 232 and dissipated through the exposed end of the heat dissipation column 232, or conducted to the heat sink 231 and dissipated through the top surface of the heat sink 231.

[0038] In some embodiments, please refer to Figure 2, one side of the base island 210 is exposed to the first end 201 of the plastic package 200, and the base island 210 can further dissipate heat through the exposed surface. Specifically, the base island 210 is located in the plastic package 200, and the bottom surface of the base island 210 is exposed to the first end 201 of the plastic package 200. The base island 210 dissipates heat through the bottom surface, and the heat of the chip 220 arranged on the surface of the base island 210 is dissipated through the base island 210 and the end surface of the heat dissipation column 232, further improving the heat dissipation performance of the packaging structure.

[0039] Furthermore, the bottom surface of the base island 210 has a groove 213, the plug hole 212 is located in the area of ​​the groove 213, and the heat dissipation column 232 passes through the plug hole 212 and protrudes from the bottom of the groove 213. Among them, the groove 213 is a groove that is recessed toward the base island 210, and the plug hole 212 passes through the base island 210 to the bottom of the groove 213. The heat dissipation column 232 protrudes from the bottom of the groove 213, which means that after the heat dissipation column 232 passes through the plug hole 212, the end face of the heat dissipation column 232 protrudes from the bottom of the groove 213, increasing the area of ​​the exposed area of ​​the heat dissipation column 232, and further improving the heat dissipation performance of the packaging structure. The groove 213 on the bottom surface of the base island 210 can increase the heat dissipation area of ​​the base island 210 on the one hand, and on the other hand provide space for air flow between the base island and the PCB after the packaging structure is subsequently mounted with the PCB, thereby accelerating heat dissipation.

[0040] In one embodiment, the end surface of the heat dissipation column 232 is flush with the first end 201 of the plastic package body 200 or the end surface of the heat dissipation column 232 is located in the groove 213. For example, Figure 2 In the embodiment shown, the end surface of the heat dissipation column 232 is flush with the first end 201 of the plastic package body 200, which can maximize the exposed area of ​​the heat dissipation column 232 without affecting the flatness of the first end 201 of the packaging structure, thereby further improving the heat dissipation performance of the packaging structure. Figure 4 As shown, it is a schematic diagram of a double-sided heat dissipation packaging structure provided by another embodiment of the utility model. The end face of the heat dissipation column 232 is located in the groove 213. The groove 213 can protect the heat dissipation column 232, thereby improving the heat dissipation performance of the packaging structure and protecting the heat dissipation column 232, thereby improving the reliability of the packaging structure.

[0041] In some embodiments, the heat dissipation column 232 is connected to the edge of the heat sink 231, or the edge of the heat sink 231 is bent to form the heat dissipation column 232. In some embodiments, the heat dissipation column 232 is connected to the edge of the heat sink 231 through a welding layer. In other embodiments, the edge of the heat sink 231 forms a serrated structure, and the serrated structure is bent toward the base island 210 to form the heat dissipation column 232.

[0042] In the above embodiment, the packaging structure dissipates heat through the top surface of the heat sink 231 and the end surface of the heat sink 232. In some embodiments, due to the size limitation of the base island 210, the exposed area of ​​the top surface of the heat sink 231 is small, and the heat dissipation performance of the packaging structure is affected. In other embodiments, the heat sink 231 can also be used as a heat conducting sheet to conduct heat to the second heat sink 250 (see Figure 5 ), the heat is dissipated through the second heat sink 250, thereby greatly improving the heat dissipation performance of the packaging structure.

[0043] Specifically, see Figure 5 , which is a schematic diagram of a packaging structure provided by another embodiment of the utility model. In this embodiment, the packaging structure further includes a second heat sink 250, which is disposed at the second end 202 of the plastic package body 200, and the second heat sink 250 is in contact with the surface of the heat sink 231. The heat of the heat sink 231 is conducted to the second heat sink 250 and dissipated through the second heat sink 250. By increasing the area of ​​the second heat sink 250, the heat dissipation area of ​​the packaging structure can be increased, and the heat dissipation performance of the packaging structure can be further improved.

[0044] In some embodiments, the orthographic projection of the second heat sink 250 on the base island 210 covers the orthographic projection of the heat sink 231 on the base island 210, that is, the area of ​​the second heat sink 250 is larger than the area of ​​the heat sink 231, thereby improving the heat dissipation performance of the packaging structure. In some embodiments, the second heat sink 250 also covers the surface of the second end 202 of the plastic package 200, and the heat of the plastic package 200 can also be dissipated through the second heat sink 250.

[0045] In some embodiments, the second heat sink 250 and the heat sink 231 are integrally formed, and the second heat sink 250 and the heat sink 231 do not need to be connected by thermal conductive adhesive, thereby increasing the heat conduction between the heat sink 231 and the second heat sink 250 and further improving the heat dissipation performance of the packaging structure.

[0046] In this embodiment, if Figure 5As shown, the surface of the second heat sink 250 facing away from the plastic package body 200 is a flat surface, which can provide a good platform for the contact between the packaging structure and external devices. Figure 6 As shown, it is a schematic diagram of a packaging structure provided by another embodiment of the utility model, and the second heat sink 250 has a plurality of protrusions 251 on a side away from the second end 202 of the plastic package body 200. The surface area of ​​the second heat sink 250 is increased by the provision of the protrusions 251, thereby increasing the heat dissipation area, which is conducive to further improving the heat dissipation performance of the packaging structure. The shape of the protrusion 251 can be rectangular, triangular, arc-shaped, irregular, etc. For example, in this embodiment, the shape of the protrusion 251 is rectangular. The plurality of protrusions 251 can be distributed in a matrix or randomly.

[0047] The double-sided heat dissipation packaging structure provided by the embodiment of the utility model greatly improves the heat dissipation performance of the packaging structure. The inventors also found that for the reverse QFN / DFN packaging structure, such as Figure 1B As shown, since the inner pin 111B and the base island 110 are located on different sides of the plastic package body 112, that is, the inner pin 111B and the base island 110 are located on different horizontal planes, and the inner pin 111B is an overhead structure, when the wire bonding operation is performed on the side of the inner pin 111B facing the bottom surface of the plastic package body 112, it is easy to cause operation abnormality or poor solder joint bonding due to jitter, thereby affecting the reliability of the packaging structure.

[0048] In view of this, in one embodiment of the present utility model, please refer to Figure 2 as well as Figure 3 The packaging structure includes: a pin 260, which is located in the plastic package 200 and is arranged on the periphery of the base island 210; a lead 270, which is located in the plastic package 200, and the lead 270 passes through the gap between two adjacent heat dissipation columns 232 to connect the chip 220 and the pin 260 respectively. In this embodiment, the pin 260 and the base island 210 are located on the same side of the plastic package 200, that is, the pin 260 and the base island 210 are basically located on the same horizontal plane, and there is no situation where the pin 260 is suspended. Therefore, when the wire bonding operation is performed on the surface of the pin 260, the wire bonding operation is stable, and there will be no abnormal operation or poor solder joint bonding due to jitter, thereby improving the reliability of the packaging structure.

[0049] It should be noted that the terms "including" and "having" and their variations involved in the documents of the present utility model are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, unless the context clearly indicates, and it should be understood that the data used in this way can be interchanged under appropriate circumstances. The term "one or more" depends at least in part on the context, and can be used to describe features, structures or characteristics in a singular sense, or can be used to describe a combination of features, structures or features in a plural sense. The term "based on" can be understood as not necessarily intended to express a set of exclusive factors, but can alternatively, also at least in part depending on the context, allow the presence of other factors that are not necessarily explicitly described. In addition, in the absence of conflict, the embodiments of the present utility model and the features in the embodiments can be combined with each other. In addition, in the above description, the description of known components and technologies is omitted to avoid unnecessary confusion of the concept of the present utility model. In the above embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.

[0050] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A double-sided heat dissipation packaging structure, characterized in that: include: The plastic package body has a first end and a second end which are arranged opposite to each other in a first direction; A base island is located in the plastic package body, the base island has a chip placement area, and a plurality of insertion holes penetrating the base island are arranged on the periphery of the chip placement area; A chip is located in the plastic package, and the chip is arranged on a side of the base island away from the first end of the plastic package and located in the chip placement area; A first heat sink is located in the plastic package body, and includes a heat sink and a plurality of heat sink columns arranged at intervals. In the first direction, the heat sink is located above the chip and contacts a portion of the top surface of the chip. The top surface of the heat sink is exposed to the second end of the plastic package body. The heat sink column extends along the first direction, one end of the heat sink is connected to the heat sink, and the other end passes through the plug hole and is exposed.

2. The double-sided heat dissipation packaging structure according to claim 1, characterized in that: The surface of the heat sink facing the chip has a protrusion, and the protrusion is in direct or indirect contact with a partial area of ​​the top surface of the chip.

3. The double-sided heat dissipation packaging structure according to claim 1, characterized in that: The bottom surface of the base island is exposed to the first end of the plastic package body, the bottom surface of the base island has a groove, the insertion hole is located in the groove area, and the heat dissipation column passes through the insertion hole and protrudes from the bottom of the groove.

4. The double-sided heat dissipation packaging structure according to claim 3, characterized in that: The end surface of the heat dissipation column is flush with the first end of the plastic package body or the end surface of the heat dissipation column is located in the groove.

5. The double-sided heat dissipation packaging structure according to claim 1, characterized in that: The heat dissipation column is connected to the edge of the heat dissipation fin, or the edge of the heat dissipation fin is bent to form the heat dissipation column.

6. The double-sided heat dissipation packaging structure according to claim 1, characterized in that: The packaging structure further includes a second heat sink, which is disposed at the second end of the plastic package body and contacts the surface of the heat sink.

7. The double-sided heat dissipation packaging structure according to claim 6, characterized in that: The orthographic projection of the second heat dissipation element on the base island covers the orthographic projection of the heat dissipation fin on the base island.

8. The double-sided heat dissipation packaging structure according to claim 6, characterized in that: A surface of the second heat dissipation element facing away from the second end of the plastic package body has a plurality of protrusions.

9. The double-sided heat dissipation packaging structure according to claim 6, characterized in that: The second heat sink is integrally formed with the heat sink.

10. The double-sided heat dissipation packaging structure according to claim 1, characterized in that: The packaging structure further includes: Pins are located in the plastic package and arranged on the periphery of the base island; The lead is located in the plastic package, and passes through the gap between two adjacent heat dissipation columns to respectively connect the chip and the pin.

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