Luminescent light source structure and backlight module

Abstract

The utility model relates to a light-emitting source structure and a backlight module. The light-emitting light source structure comprises a circuit substrate, a driving chip, a light-emitting assembly, a light-transmitting packaging layer and a light-shading packaging layer, the circuit substrate is provided with a first surface, a second surface and a peripheral side face, and the circuit substrate is further provided with a first side and a second side; the driving chip is arranged on the first surface and located on the first side. The light-emitting assembly is arranged on the first surface and located on the second side. The light-transmitting packaging layer comprises a first section and a second section, the first section is located on the first side and wraps the driving chip, the second section is located on the second side and wraps the light-emitting assembly, and the first section and the second section are separated to form an interval; the light-shading packaging layer wraps the light-transmitting packaging layer and is provided with a first side face and a second side face, a light outlet is formed in the first side face, one side face of the second section is exposed out of the light outlet, the light-shading packaging layer is provided with a check block, and the check block is located in the interval. The light-emitting source structure provided by the utility model reduces the size and can be suitable for small and thin backlight display products.

Description

Technical Field

[0001] The present application belongs to the technical field of optical elements, and more specifically, relates to a light source structure and a backlight module. Background Art

[0002] The light source structure usually has a front light emitting structure or a side light emitting structure, wherein the side light emitting structure is mostly used in backlight display screens.

[0003] At present, traditional side-emitting products mainly have a side-mounted bracket structure, that is, by pre-designing the bracket structure and changing the bracket structure, the light source can emit light in the designed direction, thereby realizing side-emitting. However, when using this side-emitting structure, the light-emitting surface of the light-emitting chip is consistent with the direction of the bracket opening, and the bracket welding foot is located on the side of the bracket opening. Since the bracket welding foot is a three-dimensional protrusion, the thickness of the overall light-emitting product after welding is relatively large, which is not suitable for use on small and thin backlight display screens. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a light source structure and a backlight module to solve the technical problem in the prior art that the side-emitting product used in the backlight display screen has a large thickness.

[0005] To achieve the above purpose, the technical solution adopted in this application is:

[0006] A first aspect provides a luminous light source structure, comprising:

[0007] A circuit substrate having a first surface, a second surface opposite to the first surface, and a peripheral side surface connecting the first surface and the second surface, wherein the circuit substrate has a first side and a second side opposite to each other;

[0008] A driving chip, disposed on the first surface and located on the first side;

[0009] a light emitting component, disposed on the first surface and located on the second side, the light emitting component being electrically connected to the driving chip through the circuit substrate;

[0010] a light-transmitting encapsulation layer disposed on the first surface, the light-transmitting encapsulation layer comprising a first section and a second section, the first section being located on the first side and covering the driving chip, the second section being located on the second side and covering the light-emitting component, the first section and the second section being separated to form a gap; and

[0011] A light-shielding packaging layer covers the light-transmitting packaging layer, wherein the light-shielding packaging layer has a first side surface and a second side surface opposite to each other, wherein the first side surface is formed with a light outlet, wherein the light outlet is adjacent to the first surface of the peripheral side surface and exposes a side surface of the second segment, and the light-shielding packaging layer has a stopper located in the interval.

[0012] In one embodiment of the first aspect, the light-shielding encapsulation layer is a light-absorbing glue solidified layer; or, the light-shielding encapsulation layer is a light-absorbing glue solidified layer containing silicone resin.

[0013] In one embodiment of the first aspect, the light-absorbing glue solidified layer is black, and the thickness of the light-absorbing glue solidified layer is 0.1 mm-0.2 mm.

[0014] In one of the embodiments of the first aspect, the light-shielding packaging layer includes a light-absorbing glue solidified layer and a reflective glue solidified layer, the reflective glue solidified layer is arranged on the first surface and covers the light-transmitting packaging layer, the light-absorbing glue solidified layer is arranged on the first surface and covers the reflective glue solidified layer, and the block is a part of the reflective glue solidified layer.

[0015] In one embodiment of the first aspect, the light-absorbing glue solidified layer is black, and the thickness of the light-absorbing glue solidified layer is 0.1 mm-0.2 mm; the reflective glue solidified layer is white, and the thickness of the reflective glue solidified layer is 0.08 mm-0.12 mm.

[0016] In one embodiment of the first aspect, the solidified reflective adhesive layer is a solidified reflective adhesive layer containing silicone resin.

[0017] In one embodiment of the first aspect, the second side surface of the light-shielding encapsulation layer is provided with an opening, the opening is adjacent to the second surface of the peripheral side surface and exposes one side surface of the first segment, and the second surface is opposite to the first surface.

[0018] In one embodiment of the first aspect, the side surface of the first segment, the second side surface of the light-shielding packaging layer, and the second surface of the peripheral side surface are flush; and the side surface of the second segment, the first side surface of the light-shielding packaging layer, and the first surface of the peripheral side surface are flush.

[0019] In one embodiment of the first aspect, the side surface of the second segment, the first side surface of the light-shielding packaging layer, and the first surface of the peripheral side surface are flush.

[0020] A second aspect provides a backlight module, comprising at least one light source structure as described above.

[0021] Compared with the prior art, the light source structure and backlight module provided by the present application have the following beneficial effects:

[0022] The light emitting light source structure provided in the first aspect of the present application arranges the driving chip and the light emitting component on both sides of the circuit substrate respectively, wherein the driving chip is covered with the first section of the light-transmitting encapsulation layer, and the light emitting component is covered with the second section of the light-transmitting encapsulation layer, which plays a protective role while not affecting the light emission of the light emitting component. On this basis, the light-transmitting encapsulation layer is covered with a light-shielding encapsulation layer, and a light outlet is arranged on the first side. The block formed by the light-shielding encapsulation layer blocks the first section and the second section, so that the light of the light emitting component can only be emitted from the light outlet, thereby realizing the side emitting effect of the light emitting light source structure. The light emitting light source structure of the present application realizes the side emitting effect by adopting the cooperation of the light-transmitting encapsulation layer and the light-shielding encapsulation layer, cancels the existing bracket structure, greatly reduces the volume of the light emitting light source structure, and can be applied to backlight display products that pursue small and thin.

[0023] The backlight module provided in the second aspect of the present application adopts the luminous light source structure provided in the present application. Since the luminous light source structure provided in the present application realizes the side-lighting effect while greatly reducing the overall volume size, especially the overall thickness, the backlight module provided in the present application can develop towards a smaller and thinner trend. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0025] Figure 1 A schematic diagram of a three-dimensional structure of a light source structure provided in an embodiment of the present application;

[0026] Figure 2 for Figure 1 An exploded structural diagram of the light emitting source structure shown;

[0027] Figure 3 A schematic diagram of a three-dimensional structure of another luminous light source structure provided in an embodiment of the present application;

[0028] Figure 4 for Figure 3 An exploded structural diagram of the light emitting source structure shown;

[0029] Figure 5 for Figure 3 A cross-sectional schematic diagram of the light source structure shown;

[0030] Figure 6 for Figure 3 The light emitting source structure shown is a cross-sectional schematic diagram with an opening.

[0031] Among them, the reference numerals in the figure are:

[0032] 1-light-emitting component; 10-first light-emitting chip; 11-second light-emitting chip; 12-third light-emitting chip;

[0033] 2-light-transmitting encapsulation layer; 20-first section; 21-second section; 22-interval;

[0034] 3-light-shielding packaging layer; 30-light outlet; 31-block; 32-light-absorbing adhesive curing layer; 33-reflective adhesive curing layer; 34-first side surface; 35-second side surface; 36-opening;

[0035] 4-Driver chip;

[0036] 5-circuit substrate; 50-first surface; 51-second surface; 53-peripheral side surface; 530-first surface; 531-second surface; 54-first side; 55-second side. DETAILED DESCRIPTION

[0037] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0039] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0040] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0041] Please also read Figure 1 and Figure 2 , the light emitting light source structure provided by the embodiment of the present application is now described. The light emitting light source structure includes a circuit substrate 5, a driving chip 4, a light emitting component 1, a light-transmitting encapsulation layer 2, and a light-shielding encapsulation layer 3. The circuit substrate 5 has a first surface 50, a second surface 51 opposite to the first surface 50, and a peripheral side surface 53 connecting the first surface 50 and the second surface 51. The circuit substrate 5 also has a first side 54 and a second side 55 opposite to each other. The driving chip 4 is arranged on the first surface 50 and is located on the first side 54. The light emitting component 1 is arranged on the first surface 50 and is located on the second side 55. The light emitting component 1 is electrically connected to the driving chip 4 through the circuit substrate 5. The light-transmitting encapsulation layer 2 is arranged on the first surface 50. The light-transmitting encapsulation layer 2 includes a first section 20 and a second section 21. The first section 20 is located on the first side 54 and covers the driving chip 4. The second section 21 is located on the second side 55 and covers the light emitting component 1. The first section 20 is separated from the second section 21 to form a gap 22. The light-shielding packaging layer 3 covers the light-transmitting packaging layer 2, and the light-shielding packaging layer 3 has a first side surface 34 and a second side surface 35 relative to each other. The first side surface 34 forms a light outlet 30, and the light outlet 30 is adjacent to the first surface 530 of the peripheral side surface 53 and exposes one side surface of the second section 21. The light-shielding packaging layer 3 has a block 31, and the block 31 is located in the interval 22.

[0042] The circuit substrate 5 is used as an assembly carrier to electrically connect the driver chip 4 with the light-emitting component 1. The light-emitting component 1 is used to emit light, and the driver chip 4 is used to control the working state of the light-emitting component 1. The driver chip 4 and the light-emitting component 1 are respectively arranged on the first side 54 and the second side 55 of the circuit substrate 5. The driver chip 4 is covered with the first section 20 of the light-transmitting encapsulation layer 2, and the light-emitting component 1 is covered with the second section 21 of the light-transmitting encapsulation layer 2, which plays a protective role while not affecting the light emission of the light-emitting component 1. On this basis, the light-transmitting encapsulation layer 2 is covered with the light-shielding encapsulation layer 3, and a light outlet 30 is provided on the first side 34. The light-shielding encapsulation layer 3 is formed with a block 31 to block between the first section 20 and the second section 21, so that the light of the light-emitting component 1 can only be emitted from the light outlet 30, thereby achieving the side light-emitting effect of the light source structure.

[0043] Compared with the prior art, the luminous light source structure provided in the present application adopts a new packaging structure, and realizes the side lighting effect through the cooperation of the light-transmitting packaging layer 2 and the light-shielding packaging layer 3, eliminates the existing bracket structure, and greatly reduces the volume of the luminous light source structure, which can be applied to backlight display products that pursue small and thin.

[0044] In addition, during signal transmission, electromagnetic interference (EMI) will affect the performance of the driver chip 4 and the light-emitting component 1. Therefore, by separating the light-transmitting encapsulation layer 2 into the first section 20 and the second section 21, the driver chip 4 and the light-emitting component 1 are respectively covered with the separated first section 20 and the second section 21, and the first section 20 and the second section 21 are separated by the block 31, the influence of electromagnetic interference on the driver chip 4 and the light-emitting component 1 can be reduced, and the performance of the light-emitting light source structure can be ensured.

[0045] The circuit substrate 5 is a flat rectangular parallelepiped. Therefore, the circuit substrate 5 has six surfaces, of which the two end surfaces are the aforementioned first surface 50 and the second surface 51, and the peripheral side surface 53 is connected to the first surface 50 and the second surface 51. Among them, in the connection direction of the first side 54 and the second side 55, a surface of the peripheral side surface 53 close to the light emitting component 1 is a first surface 530, and a surface of the peripheral side surface 53 close to the driving chip 4 is a second surface 531.

[0046] In another embodiment of the present application, the circuit substrate 5 is specifically a circuit board having conductive circuits.

[0047] In another embodiment of the present application, the circuit substrate 5 is a ceramic plate. Using a ceramic plate as the circuit substrate 5 can achieve a better heat dissipation effect, which is beneficial to ensuring the service life of the chip on the circuit substrate 5.

[0048] In another embodiment of the present application, please continue to refer to Figure 1 and Figure 2 The light emitting component 1 includes a first light emitting chip 10, a second light emitting chip 11 and a third light emitting chip 12. The first light emitting chip 10, the second light emitting chip 11 and the third light emitting chip 12 each emit a different light color. Specifically, the first light emitting chip 10, the second light emitting chip 11 and the third light emitting chip 12 respectively emit red light, green light and blue light to form three primary colors of light.

[0049] In another embodiment of the present application, the light-transmitting encapsulation layer 2 is a transparent colloid solidified layer.

[0050] The main material of the transparent colloid curing layer is transparent epoxy resin, which can be specifically coated around the driver chip and the light-emitting component by baking after injection molding. In order to take into account thinness, chip protection and light-emitting effect, after experimental testing, the optimal thickness of the transparent encapsulation layer 2 is 0.227mm-0.233mm.

[0051] In another embodiment of the present application, after experimental testing, the preferred distance of the interval 22 between the first section 20 and the second section 21 is 0.15mm-0.25mm. By controlling the distance of the interval 22 between the first section 20 and the second section 21 to be within the range of 0.15mm-0.25mm, the thickness of the block 31 can be controlled to be within the range of 0.15mm-0.25mm, which can reduce the effect of EMI on the driver chip 4 and ensure the efficiency of light emitted from the light outlet 30. Preferably, the distance of the interval 22 between the first section 20 and the second section 21 is 0.2mm.

[0052] Specifically, the light-transmitting encapsulation layer 2 is integrally molded and coated on the periphery of the driver chip 4 and the light-emitting component 1, and then cut to obtain the first section 20 and the second section 21. Further, a piece of transparent adhesive solidified body with a width of 0.15mm-0.25mm is cut and removed from the surface 0.05mm away from the driver chip 4, so as to obtain the first section 20 and the second section 21 with a spacing 22 of 0.15mm-0.25mm.

[0053] In another embodiment of the present application, please continue to refer to Figure 1 and Figure 2 , the light-shielding encapsulation layer 3 is a light-absorbing glue solidified layer 32, and the block 31 is a part of the light-absorbing glue solidified layer 32. Specifically, the light-shielding encapsulation layer 3 is a light-absorbing glue solidified layer 32 containing silicone resin. The use of this material as the light-shielding encapsulation layer 3 can absorb the light emitted by the light-emitting component 1, ensuring the light effect of the light outlet 30 on the side. At the same time, the material has good anti-EMI ability, ensuring the performance of the light source structure.

[0054] Compared with the light-transmitting encapsulation layer 2, under the same interference influence condition, the light-absorbing glue solidified layer 32 has a stronger ability to resist EMI. Therefore, the light-absorbing glue solidified layer 32 is used to block between the first section 20 and the second section 21, which can reduce the influence of EMI. This makes the light-emitting light source structure less affected by electromagnetic influence in the environment in subsequent applications, making its application environment wider and its performance more stable.

[0055] In another embodiment of the present application, the color of the light absorbing glue cured layer 32 is black.

[0056] The black light-absorbing glue solidified layer 32 has a low light transmittance and is coated on the periphery of the light-transmitting packaging layer 2, which can ensure that the light emitted by the light-emitting component 1 is concentrated from the light outlet 30, and the rest is blocked by the light-shielding packaging layer 3, thereby obtaining a light-emitting light source structure with a side-lighting effect.

[0057] In another embodiment of the present application, the color of the light-absorbing glue solidified layer 32 is white, and the white light-absorbing glue solidified layer 32 can also achieve a certain light-shielding effect. However, compared with the above-mentioned solution of using the black light-absorbing glue solidified layer 32 as the light-shielding encapsulation layer 3, the light-shielding property of the white light-absorbing glue solidified layer 32 is poor, and light leakage may occur. The use of the black light-absorbing glue solidified layer 32 can make up for the light leakage of the white light-absorbing glue solidified layer 32, reduce the surface light transmittance, and achieve a better design light effect.

[0058] In another embodiment of the present application, after experimental testing, the preferred thickness of the light-absorbing glue solidified layer 32 is 0.1 mm-0.2 mm. Further, the thickness of the light-absorbing glue solidified layer 32 is 0.15 mm. If the thickness is too small, the light-shielding effect will be affected; if the thickness is too large, the overall size will be too large and the material cost will increase.

[0059] In another embodiment of the present application, please refer to Figures 3 to 5 The light-shielding packaging layer 3 includes a light-absorbing glue solidified layer 32 and a reflective glue solidified layer 33. The reflective glue solidified layer 33 is arranged on the first surface 50 and covers the light-transmitting packaging layer 2. The light-absorbing glue solidified layer 32 is arranged on the first surface 50 and covers the reflective glue solidified layer 33. The block 31 is a part of the reflective glue solidified layer 33.

[0060] Based on the characteristics that the light-absorbing glue solidified layer 32 has high light absorption performance, but poor light reflection performance, and the reflective glue solidified layer 33 has high light reflection performance, but poor light absorption performance. Firstly, coating the reflective glue solidified layer 33 on the light-transmitting encapsulation layer 2 can effectively reflect the light of the light-emitting component 1 and emit it through the light outlet 30, thereby improving the light output brightness of the side light outlet 30. On this basis, coating the light-absorbing glue solidified layer 32 on the reflective glue solidified layer 33 can effectively block the light leakage in other parts except the light outlet 30, thereby ensuring the brightness of the side light emission of the light source structure, and can be applied to light-emitting products with high brightness requirements.

[0061] In the preparation process, after the light-transmitting packaging layer 2 is made on the driving chip 4 and the light-emitting component 1, a layer of reflective adhesive solidified layer 33 is first injection-molded on the light-transmitting packaging layer 2. At the same time, the reflective adhesive solidified layer 33 fills the gap to form a block 31, and then a layer of light-absorbing adhesive solidified layer 32 is injection-molded on the reflective adhesive solidified layer 33.

[0062] In another embodiment of the present application, the color of the reflective adhesive cured layer 33 is white.

[0063] In another embodiment of the present application, in order to take into account thinness, chip protection and light output effect, after experimental testing, the thickness of the reflective adhesive curing layer 33 is preferably 0.08mm-0.12mm. Further, the thickness of the reflective adhesive curing layer 33 is 0.1mm.

[0064] In another embodiment of the present application, the reflective adhesive curing layer 33 is a reflective adhesive curing layer 33 containing silicone resin. This material has good anti-EMI capability and ensures the performance of the light source structure.

[0065] The reflective adhesive curing layer 33 and the light-transmitting packaging layer 2 were subjected to an EMI impact test. The experimental results showed that under the same interference impact conditions, the reflective adhesive curing layer 33 only produces EMI impact at a relatively close distance, while the light-transmitting packaging layer 2 produces EMI impact at a relatively long distance, which means that the reflective adhesive curing layer 33 has a stronger ability to resist EMI.

[0066] Therefore, by using the reflective adhesive solidified layer 33 to block between the first section 20 and the second section 21, the influence of EMI on the driver chip 4 can be reduced. In subsequent applications, the light source structure is less affected by electromagnetic influence in the environment, so that its application environment is wider and its performance is more stable.

[0067] In addition, compared with the solution in which the stopper 31 is a light-absorbing adhesive solidified layer 32 , the stopper 31 is a light-reflective adhesive solidified layer 33 , which has a stronger anti-EMI effect.

[0068] In another embodiment of the present application, please refer to Figure 6 The second side surface 35 of the light-shielding encapsulation layer 3 is provided with an opening 36 . The opening 36 is adjacent to the second surface 531 of the peripheral side surface 53 and exposes one side surface of the first section 20 .

[0069] In the actual preparation process, after all components are packaged, they are divided into multiple light source structures by cutting. Therefore, in the light source structure product, a light outlet 30 is directly formed on the side close to the light emitting component 1, an opening 36 is directly formed on the side close to the driving chip 4, and a stopper 31 is provided between the first section 20 and the second section 21, so that the side light emitting effect of the light source structure is not affected, the manufacturing efficiency is improved, and the material cost is reduced.

[0070] Based on the advantages of the above manufacturing process, the side of the first section 20 close to the opening 36, the second side 35 and the second surface 531 of the peripheral side 53 are flush. Also, the side of the second section 21 close to the light outlet 30, the first side 34 and the first surface 530 of the peripheral side 53 are flush.

[0071] In another embodiment of the present application, the side surface of the second section 21 close to the light outlet 30, the first side surface 34 and the first surface 530 of the peripheral side surface 53 are flush. After the cutting process, the side surface of the second section 21 close to the light outlet 30, the first side surface 34 and the first surface 530 of the peripheral side surface 53 are flush, which can ensure the luminous effect of the luminous light source structure.

[0072] The present application also provides a backlight module, which includes a plurality of light source structures provided in the embodiments of the present application.

[0073] The backlight module provided in the present application adopts the luminous light source structure provided in the present application. Since the luminous light source structure provided in the present application realizes the side-lighting effect while greatly reducing the overall volume size, especially the overall thickness, the backlight module provided in the present application can develop towards a smaller and thinner trend.

[0074] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A light source structure, characterized in that: include: A circuit substrate having a first surface, a second surface opposite to the first surface, and a peripheral side surface connecting the first surface and the second surface, and the circuit substrate also having a first side and a second side opposite to each other; A driving chip, disposed on the first surface and located on the first side; a light emitting component, disposed on the first surface and located on the second side, the light emitting component being electrically connected to the driving chip through the circuit substrate; a light-transmitting encapsulation layer, disposed on the first surface, the light-transmitting encapsulation layer comprising a first section and a second section, the first section being located on the first side and covering the driving chip, the second section being located on the second side and covering the light-emitting component, the first section and the second section being separated to form a gap; as well as A light-shielding packaging layer covers the light-transmitting packaging layer, wherein the light-shielding packaging layer has a first side surface and a second side surface opposite to each other, wherein the first side surface is formed with a light outlet, wherein the light outlet is adjacent to the first surface of the peripheral side surface and exposes a side surface of the second segment, and the light-shielding packaging layer has a stopper located in the interval.

2. The light source structure according to claim 1, characterized in that: The light-shielding encapsulation layer is a light-absorbing glue solidified layer; or, the light-shielding encapsulation layer is a light-absorbing glue solidified layer containing silicone resin.

3. The light source structure according to claim 2, characterized in that: The light-absorbing glue solidified layer is black; the thickness of the light-absorbing glue solidified layer is 0.1mm-0.2mm.

4. The light source structure according to claim 1, characterized in that: The light-shielding packaging layer includes a light-absorbing glue solidified layer and a reflective glue solidified layer. The reflective glue solidified layer is arranged on the first surface and covers the light-transmitting packaging layer. The light-absorbing glue solidified layer is arranged on the first surface and covers the reflective glue solidified layer. The block is a part of the reflective glue solidified layer.

5. The light source structure according to claim 4, characterized in that: The light-absorbing adhesive solidified layer is black, and the thickness of the light-absorbing adhesive solidified layer is 0.1 mm-0.2 mm. The light-reflecting adhesive solidified layer is white, and the thickness of the light-reflecting adhesive solidified layer is 0.08 mm-0.12 mm.

6. The luminous light source structure according to claim 4 or 5, characterized in that: The reflective adhesive cured layer is a reflective adhesive cured layer containing silicone resin.

7. The light source structure according to claim 1, characterized in that: The second side surface of the light-shielding encapsulation layer is provided with an opening, the opening is adjacent to the second surface of the peripheral side surface and exposes one side surface of the first segment, and the second surface is opposite to the first surface.

8. The light source structure according to claim 7, characterized in that: The side surface of the first section, the second side surface of the light-shielding packaging layer, and the second surface of the peripheral side surface are flush; and the side surface of the second section, the first side surface of the light-shielding packaging layer, and the first surface of the peripheral side surface are flush.

9. The light source structure according to claim 1, characterized in that: The side surface of the second segment, the first side surface of the light-shielding encapsulation layer, and the first surface of the peripheral side surface are flush.

10. A backlight module, characterized in that: It comprises a plurality of light source structures as described in any one of claims 1 to 9.

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