Novel COB process vehicle-mounted camera module

Abstract

The utility model provides a novel COB (Chip On Board) process vehicle-mounted camera module, which comprises a PCB (Printed Circuit Board) substrate and a chip attached to the PCB substrate, a concentric-square-shaped box dam is formed at the periphery of the chip, and a glue lens which completely covers the chip and a gold thread and is made of high-permeability glue is arranged in the box dam; compared with the prior art, a traditional lens is replaced by the glue lens made of the high-transparency glue, the COB process difficulty can be greatly reduced, the overall production efficiency is improved, the structure is simple, the manufacturing cost is low, meanwhile, the gold thread, the chip, the box dam, the glue lens and the PCB are connected into a whole, the module reliability is improved, and the cost is reduced. And at the moment, the glue lens can perform glue sealing on the chip, so that the whole body can be highly integrated together, and the chip is further protected.

Description

Technical Field

[0001] This invention relates to the field of vehicle-mounted camera module technology, and in particular to a novel COB process vehicle-mounted camera module. Background Technology

[0002] With the rise of the "new four modernizations" of automobiles and the concept of intelligent driving, the market for automotive sensing sensors is developing rapidly. Automotive cameras, often referred to as the "eyes" of autonomous driving, are poised to become a new blue ocean industry. As a core sensing device in the field of autonomous driving, the image quality of automotive cameras directly impacts the intelligent driving experience. Therefore, only through continuous technological optimization and exploration can we meet the ever-increasing demands of our customers.

[0003] Traditional COB process vehicle camera modules have complex structures, which leads to complex COB processes and low overall production efficiency. Therefore, a new COB process vehicle camera module is proposed. Summary of the Invention

[0004] To address at least one of the aforementioned technical shortcomings, this invention provides a novel COB process vehicle camera module, comprising a PCB substrate, a chip attached to the PCB substrate, a U-shaped enclosure forming around the chip, and an adhesive lens made of high-transparency adhesive that completely covers the chip and gold wires within the enclosure.

[0005] Furthermore, the glued lenses are made of UV glue with a light transmittance of more than 90%.

[0006] Furthermore, the height of the dam is greater than the height of the gold line.

[0007] Furthermore, the dam was constructed using a U-shaped support frame.

[0008] Furthermore, the imaging area of ​​the chip is parallel to the upper surface of the glue lens. Beneficial effects

[0009] Using adhesive lenses made with high-transparency adhesive to replace traditional lenses can greatly reduce the difficulty of COB process, improve overall production efficiency, and has a simple structure and low cost. At the same time, gold wires, chips, dams, adhesive lenses and PCB are connected as one, improving module reliability. In addition, the adhesive lenses can encapsulate the chips, so that the whole can be highly integrated and further protect the chips.

[0010] This technology allows UV-coated lenses to have the same light transmittance as traditional transparent lenses. Furthermore, by simply changing the UV adhesive, new COB process automotive camera modules with varying light transmittance can be produced to meet different imaging requirements. By increasing light transmittance, the amount of light captured by the chip is increased, thereby improving image quality.

[0011] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Attached Figure Description

[0012] Figure 1 This is a cross-sectional view of the entire invention.

[0013] Figure 2 This is an isometric view of the entire invention.

[0014] exist Figures 1 to 2 The correspondence between component names or lines and the attached drawing numbers is as follows: PCB substrate 1, chip 2, gold wire 3, dam 4, glue lens 5. Detailed Implementation

[0015] Please refer to Figures 1 to 2 ;

[0016] This embodiment provides a novel COB process vehicle-mounted camera module, referencing... Figure 1 and Figure 2 It includes a PCB substrate 1, a chip 2 attached to the PCB substrate 1, a U-shaped dam 4 formed around the chip 2, and an adhesive lens 5 made of high-transparency adhesive that completely covers the chip 2 and the gold wire 3 inside the dam 4.

[0017] In practical implementation, the glue lens 5 made of high-transparency glue replaces the traditional lens, which can greatly reduce the difficulty of COB process, improve the overall production efficiency, and has a simple structure and low cost. At the same time, the gold wire 3, chip 2, dam 4, glue lens and PCB are connected as one, which improves the reliability of the module. At this time, the glue lens can encapsulate the chip 2, so that the whole can be highly integrated and further protect the chip 2.

[0018] Furthermore, the glued lens 5 is made of UV glue with a light transmittance of greater than 90%;

[0019] In practical implementation, the glue lens 5 made by UV glue can have the same light transmittance as traditional transparent lenses. Moreover, according to different light transmittance requirements, the UV glue can be directly replaced to directly produce new COB process vehicle camera modules with different light transmittance, thereby meeting different imaging needs.

[0020] By increasing the light transmittance, the amount of light acquired by chip 2 is increased, thereby improving the image quality.

[0021] Furthermore, the height of the dam 4 is greater than the height of the gold line 3;

[0022] In practice, when UV glue is injected into the interior of the dam 4 to form the glue lens 5, the UV glue can completely cover the gold wire 3 and the chip 2.

[0023] Furthermore, the dam 4 is made of a U-shaped bracket.

[0024] In practice, the U-shaped bracket uses existing technology and can be directly pasted onto the PCB substrate 1. The manufacturing process is simple and can improve production efficiency.

[0025] Furthermore, the imaging area of ​​chip 2 is parallel to the upper surface of adhesive lens 5;

[0026] In practice, a smooth plane made of polytetrafluoroethylene is pressed onto the dam 4, so that the upper surface of the adhesive lens 5 is pressed into an upper surface parallel to the imaging area of ​​the chip 2.

Claims

1. A novel COB process vehicle-mounted camera module, comprising a PCB substrate (1) and a chip (2) attached to the PCB substrate (1), characterized in that: A circular dam (4) is formed on the periphery of the chip (2), and a glue lens (5) made of high-transmittance glue that completely covers the chip (2) and the gold wire (3) is provided inside the dam (4).

2. According to claim 1, a novel COB process vehicle-mounted camera module is characterized in that: The glue lens (5) is made of UV glue with a light transmittance greater than 90%.

3. According to claim 2, a novel COB process vehicle-mounted camera module is characterized in that: The height of the dam (4) is greater than the height of the gold wire (3).

4. According to claim 3, a novel COB process vehicle-mounted camera module is characterized in that: The dam (4) is made of circular brackets.

5. According to claim 4, a novel COB process vehicle-mounted camera module is characterized in that: The imaging area of ​​the chip (2) is parallel to the upper surface of the glue lens (5).

Images