Network switching device

Abstract

The utility model provides network switching equipment, relates to the technical field of network equipment, and is used for solving the problem that the network switching equipment is difficult to meet application requirements of different scenarios, the network switching equipment comprises a chassis assembly and a photoelectric connection unit, the chassis assembly comprises a chassis and a control substrate, one end of the chassis is provided with an opening, the control substrate is arranged in the chassis, and the photoelectric connection unit is arranged in the chassis; the photoelectric connection unit is configured to be detachably inserted into the case through the opening, so that the case can selectively adapt to different photoelectric connection units; the photoelectric connection unit comprises a support, a plate body and a connector, the plate body is arranged on the support, the connector is arranged on the surface of the plate body and electrically connected with the plate body, the connector is provided with a port, the plugging direction of the port is matched with the extension direction of the plate body, and the port is constructed to be detachably plugged with the optical module; when the photoelectric connection unit is connected with the case in an inserted mode, the board body is electrically connected with the control substrate. The application requirements of different scenes can be met, and the hardware development cost is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of network equipment, and in particular to a network switching device. Background Art

[0002] A network switching device (referred to as a switch) is a network hardware device that receives and forwards data to the target device through message exchange, and can connect different devices on a computer network.

[0003] In the related art, a switch has a multi-port bridge and uses MAC addresses to forward data at the data link layer. In addition, routing functions can be introduced, so that some switches can also forward data at the network layer. Such switches are generally called three-layer switches or multi-layer switches.

[0004] However, with the continuous improvement of data center computing power and communication speed, the switches used in data centers in related technologies are difficult to meet the application requirements of different scenarios. Utility Model Content

[0005] The present application provides a network switching device that can meet the application requirements of different scenarios, increase the scope of application, and reduce hardware development costs.

[0006] The present application provides a network switching device, comprising: a chassis assembly and an optoelectronic connection unit, the chassis assembly comprising a chassis and a control substrate, one end of the chassis having an opening, the control substrate being arranged in the chassis, the optoelectronic connection unit being constructed to be detachably plugged into the chassis through the opening, so that the chassis can be selectively adapted to different optoelectronic connection units; the optoelectronic connection unit comprising a bracket, a board body and a connector, the board body being arranged on the bracket, the connector being arranged on the surface of the board body and being electrically connected to the board body, the connector having a port, the plugging direction of the port being adapted to the extension direction of the board body, the port being constructed to be detachably plugged into an optical module; when the optoelectronic connection unit is plugged into the chassis, the board body is electrically connected to the control substrate.

[0007] The network switching device provided by the present application is designed by modularizing a chassis component and an optoelectronic connection unit, wherein one end of the chassis has an opening, a control substrate is arranged in the chassis, the optoelectronic connection unit includes a bracket, a board and a connector, the board is arranged on the bracket, the connector is arranged on the surface of the board and is electrically connected to the board, the connector has a port, the plug-in direction of the port is adapted to the extension direction of the board, and the port is constructed to be detachably plugged with the optical module. In addition, the hardware structure specifications of the optoelectronic connection unit are designed to be compatible with the chassis accordingly, so that the optoelectronic connection unit can be detachably plugged with the chassis through the opening. When the optoelectronic connection unit is plugged with the chassis, the board is electrically connected to the control substrate. In this way, the network switching device can adapt the optoelectronic connection unit with different transmission power and other parameters to the chassis according to the application requirements of different scenarios to meet the application requirements of different scenarios, thereby improving the versatility of the network switching device, increasing the scope of application of the network switching device, and reducing the hardware development, design, production and manufacturing, testing and other costs of the chassis.

[0008] In a possible embodiment, the board body is provided with a first connector, and the control substrate has a second connector. When the optoelectronic connection unit is plugged into the chassis assembly, the first connector and the second connector are plugged into and electrically connected to electrically connect the board body and the control substrate.

[0009] By arranging a first connector on the board bodies in different optoelectronic connection units, and arranging a second connector that is compatible with the first connector on the control substrate, when the optoelectronic connection unit is plugged into a chassis, the first connector is plugged into the second connector to achieve electrical conduction, thereby achieving signal interconnection between the connector in the optoelectronic connection unit and the control substrate, so that different optoelectronic connection units can be adapted to the chassis, and the convenience of disassembly and assembly of the optoelectronic connection unit and the chassis is improved, thereby reducing costs.

[0010] In a possible implementation manner, the first connector is disposed at an end of the board body away from the port and is electrically connected to the board body.

[0011] By arranging the first connector at the end of the board body away from the port, the first connector is easily plugged with the second connector, and the plugging path between the first connector and the second connector is reduced. The structure is simple and easy to implement.

[0012] In a possible implementation, one of the first plug connector and the second plug connector includes a plug interface, and the other includes a plug connector that can be inserted into the plug interface.

[0013] In this way, the plug connector is plugged into the plug interface to realize the plugging of the first plug connector and the second plug connector, thereby realizing signal interconnection between the connector and the control substrate. The connection method is simple and easy to realize.

[0014] In a possible embodiment, the optoelectronic connection unit includes at least two plates, at least two plates are arranged on the bracket at intervals along a first direction, at least one side of each plate is provided with an installation area, and the connector is installed in the installation area, wherein the first direction is the direction perpendicular to the plate surface of the plate.

[0015] By providing at least two plates and arranging a mounting area on at least one side of each plate, the optical-electrical connection unit can be applied to an optical-electrical connection unit with more connectors.

[0016] In a possible embodiment, the optoelectronic connection unit includes a first plate body and a second plate body, the first plate body is arranged above the second plate body, and the plate surfaces on opposite sides of the first plate body both have installation areas; the plate surface of the second plate body on a side facing away from the first plate body has the installation area, and each installation area is arranged with at least two connectors along a second direction; wherein the first direction and the second direction are perpendicular to each other.

[0017] By arranging the mounting areas on the board surfaces on the two opposite sides of the first board body, the structural compactness of the optoelectronic connection unit can be improved, and the space utilization rate can be improved.

[0018] In a possible implementation, the optoelectronic connection unit includes a third plate body and a fourth plate body, one side surface of the third plate body and the fourth plate body both have the installation area, and each installation area has at least two connectors arranged along the second direction.

[0019] By only setting the mounting area on one side of the third and fourth boards and providing a connector on each mounting area, the heat of the boards can be dissipated through the board surface without the mounting area, thereby improving the heat dissipation performance of the boards.

[0020] In a possible embodiment, the optoelectronic connection unit also includes a fifth plate body, which is spaced apart on one side of the third plate body and the fourth plate body, and one side surface of the fifth plate body has the installation area, and the installation area is arranged with at least two of the connectors along the second direction.

[0021] In this way, a support base can be provided for a greater number of connectors, thereby enabling network switching equipment to provide more ports.

[0022] In a possible implementation manner, the optoelectronic connection unit includes 128 ports, and the connector includes at least one QSFP112 port.

[0023] In a possible implementation manner, the optoelectronic connection unit includes 64 ports, and the connector includes at least one OSPF port.

[0024] In a possible implementation, at least one of the at least two plates is provided with a first heat dissipation structure, and the first heat dissipation structure is configured to dissipate heat from the plate.

[0025] By arranging the first heat dissipation structure on the board body, the temperature of the board body can be lowered through the first heat dissipation structure, thereby improving the working reliability and performance stability of the board body.

[0026] In a possible implementation, the first heat dissipation structure includes a first heat sink, the first heat sink includes a plurality of heat dissipation fins, and the heat dissipation fins are connected to the plate body.

[0027] By arranging a plurality of heat dissipation fins in the first heat sink, the heat dissipation area can be increased, thereby improving the heat dissipation efficiency.

[0028] In a possible embodiment, the first heat dissipation structure includes a cooling liquid plate, which is arranged on the plate body, and a cooling channel is arranged in the cooling liquid plate. A first cooling pipeline is arranged in the chassis, and one end of the first cooling pipeline is configured to communicate with the cooling channel, and the other end of the first cooling pipeline is configured to be connected to a cooling source.

[0029] By arranging a cooling liquid plate on the plate body, when the optoelectronic connection unit is plugged into the chassis, the cooling liquid plate is connected to the first cooling pipeline so that the first cooling pipeline is connected to the cooling channel in the cooling liquid plate. In this way, the cooling liquid plate and the plate body can reduce the temperature of the plate body through heat exchange, thereby improving the heat dissipation efficiency and heat dissipation reliability, thereby improving the working reliability of the plate body and the stability of performance.

[0030] In a possible implementation, the connector has at least two ports spaced apart along the second direction, a second heat dissipation structure is disposed between the two ports, and the second heat dissipation structure is configured to dissipate heat for the connector.

[0031] The second heat dissipation structure is provided between two ports of the connector which are spaced apart in the second direction, so that the network switching device is cooled by the second heat dissipation structure, thereby improving the heat dissipation efficiency.

[0032] In a possible implementation, the second heat dissipation structure includes a heat dissipation plate, the heat dissipation plate is connected between the two ports of the connector, and a plurality of heat dissipation through holes are disposed on the heat dissipation plate.

[0033] By arranging a heat sink between the two ports of the connector and arranging a plurality of heat dissipation holes on the heat sink, the heat in the network switching device can be discharged through the heat dissipation holes, thereby improving the heat dissipation efficiency while having a simple structure and low cost.

[0034] In a possible implementation manner, the second heat dissipation structure includes a second cooling pipeline, at least a portion of the second cooling pipeline is located between the two ports of the connector, and the second cooling pipeline is configured to be connected to a cooling source.

[0035] By arranging a second cooling pipeline between the two ports of the connector, the heat dissipation efficiency of the network switching device can be improved by heat exchange, and the heat dissipation effect is good.

[0036] In a possible embodiment, the optoelectronic connection unit further includes a cover plate, which is disposed at an end of the connector away from the chassis, wherein an outline shape of the cover plate matches the opening, and a plurality of avoidance openings are disposed on the cover plate, wherein one avoidance opening is disposed corresponding to one of the ports.

[0037] By setting a cover at the end of the optoelectronic connection unit away from the chassis, and setting multiple avoidance openings on the cover, and one avoidance opening is set corresponding to one port, the cover can isolate external dust particles and the like and protect the connector, thereby extending the service life of the network switching equipment.

[0038] In a possible implementation manner, at least one handle is provided on the cover plate.

[0039] By providing a handle on the cover plate, the user can use the handle to operate when disassembling or assembling the optoelectronic connection unit, thereby improving the user's operating comfort and experience.

[0040] In addition to the technical problems solved by the embodiments of the present application, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the network switching device provided by the embodiments of the present application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0042] Figure 1 A schematic diagram of the structure of a network switching device provided in an embodiment of the present application;

[0043] Figure 2 A schematic diagram of a state of a chassis and an optoelectronic connection unit in a network switching device provided in an embodiment of the present application when being disassembled and assembled;

[0044] Figure 3 A schematic diagram of a first structure of an optoelectronic connection unit in a network switching device provided in an embodiment of the present application;

[0045] Figure 4 A schematic diagram from another perspective of the first structure of the optoelectronic connection unit in the network switching device provided in an embodiment of the present application;

[0046] Figure 5 An exploded schematic diagram of a second structure of an optoelectronic connection unit in a network switching device provided in an embodiment of the present application;

[0047] Figure 6 A third structural schematic diagram of the optoelectronic connection unit in the network switching device provided in an embodiment of the present application;

[0048] Figure 7 Another structural schematic diagram of a network switching device provided in an embodiment of the present application;

[0049] Figure 8 for Figure 7 Schematic diagram of the structure of the optoelectronic connection unit.

[0050] Description of reference numerals:

[0051] 10- Network switching equipment;

[0052] 100-chassis; 110-opening; 120-first cooling pipeline;

[0053] 140-water inlet interface; 150-water outlet interface;

[0054] 200 - photoelectric connection unit; 210 - bracket; 220 - board; 221 - first board; 222 - second board;

[0055] 223-third plate; 224-fourth plate; 225-fifth plate;

[0056] 230 - first connector; 240 - connector; 241 - port;

[0057] 250 - first radiator; 260 - cooling liquid plate; 270 - second heat dissipation structure; 280 - second cooling pipeline;

[0058] 290-cover; 291-avoidance; 292-handle. DETAILED DESCRIPTION

[0059] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application.

[0060] A network switching device (referred to as a switch) is a network hardware device that receives and forwards data to the target device through message exchange, and can connect different devices on a computer network.

[0061] In the related art, a switch has a multi-port bridge and uses MAC addresses to forward data at the data link layer. In addition, routing functions can be introduced, so that some switches can also forward data at the network layer. Such switches are generally called three-layer switches or multi-layer switches.

[0062] However, with the continuous improvement of data center computing power and communication speed, when the switches in the data center are suitable for different application scenarios, different switches are required. The switches used in data centers in related technologies are difficult to meet the application requirements of different scenarios.

[0063] In view of this, an embodiment of the present application provides a network switching device, which is modularly designed for a chassis component and an optoelectronic connection unit, wherein one end of the chassis has an opening, a control substrate is arranged in the chassis, the optoelectronic connection unit includes a bracket, a board and a connector, the board is arranged on the bracket, the connector is arranged on the surface of the board and is electrically connected to the board, the connector has a port, the plug-in direction of the port is adapted to the extension direction of the board, and the port is constructed to be detachably plugged with an optical module. In addition, the hardware structure specifications of the optoelectronic connection unit are designed to be compatible with the chassis accordingly, so that the optoelectronic connection unit can be detachably plugged with the chassis through the opening, and when the optoelectronic connection unit is plugged with the chassis, the board is electrically connected to the control substrate. In this way, the network switching device can adapt the optoelectronic connection unit with parameters such as different transmission powers to the chassis according to the application requirements of different scenarios to meet the application requirements of different scenarios, thereby improving the versatility of the network switching device, increasing the scope of application of the network switching device, and reducing the hardware development, design, production, manufacturing, testing and other costs of the chassis.

[0064] The following is a detailed description of the network switching device provided in the embodiment of the present application.

[0065] The embodiment of the present application provides a network switching device 10, which can be any type of switch, for example, an access layer switch, a convergence layer switch, or a core layer switch; illustratively, the network switch can be a switch with a height dimension of 4U, wherein U is a unit representing an external dimension, 1U is equal to 4.445 cm, and 4U is equal to 17.78 cm. In addition, the network switching device 10 provided in the embodiment of the present application can be applied to any scenario requiring a network system, for example, it can be applied to a data center. In the following description of the present application, a convergence layer switch applied to a data center is used as an example for description.

[0066] Reference Figures 1 to 3 As shown, the network switching device 10 provided in the embodiment of the present application includes a chassis component and an optoelectronic connection unit 200, the optoelectronic connection unit 200 is formed as a removable switch module (Removable Switch Module, RSM for short), and the chassis component is a removable switch chassis (Removable Switch Chassis, RSC for short) component; the chassis component includes a chassis 100 and a control substrate, one end of the chassis 100 has an opening 110, the chassis 100 has a receiving cavity, the control substrate is arranged in the receiving cavity of the chassis 100, the opening 110 is communicated with the receiving cavity, and the control substrate includes, for example, a baseboard management controller (Baseboard Management Controller, referred to as BMC); the optoelectronic connection unit 200 includes a bracket 210, a board 220 and a connector 240. Exemplarily, the board 220 is horizontally arranged on the bracket 210, the connector 240 is arranged on the surface of the board 220 and is electrically connected to the board 220, the connector 240 has a port 241, the plug-in direction of the port 241 is adapted to the extension direction of the board 220, and the port 241 is constructed to be detachably plugged with the optical module; the optoelectronic connection unit 200 is constructed to be detachably plugged with the chassis 100 through the opening 110; when the optoelectronic connection unit 200 is plugged with the chassis 100, the board 220 is electrically connected to the control substrate, so that the chassis assembly can be adapted to different types of RSM according to different application scenarios, without the need to additionally develop a chassis, thereby reducing the costs of chassis development, design, production, manufacturing, testing, etc.

[0067] It can be understood that the optical module includes optoelectronic devices, functional circuits and optical interfaces, etc. It is a device that performs photoelectric and electro-optical conversion. The optical module includes two types: sending and receiving. The sending end converts the electrical signal into an optical signal. After being transmitted through the optical fiber, the receiving end converts the optical signal into an electrical signal.

[0068] The board 220 is provided with a chip and an electrical channel (not shown), the chip is electrically connected to the electrical channel, and the connector 240 provided on the board 220 is electrically connected to the electrical channel, so that the chip can transmit signals with the connector 240 through the electrical channel, and when the optoelectronic connection unit 200 is plugged into the chassis 100, the board 220 is electrically connected to the control substrate, so that the connector 240 is interconnected with the control substrate through the signal between the board 220. The chip is not limited in type and manufacturer.

[0069] Exemplarily, the board body 220 may be, for example, a printed circuit board, in which a metal conductive layer is disposed, and the metal conductive layer may form an electrical channel connecting the connector 240 in the optoelectronic connection unit 200 and the chip.

[0070] For example, the metal conductive layer includes but is not limited to being formed of conductive materials such as copper, aluminum, copper alloy, aluminum alloy, etc., which is not limited here.

[0071] In some embodiments, the connector 240 may include an insulating shell and a port 241 located on the insulating shell, a first conductor (not shown) is disposed in the port 241, and the first conductor is connected to the board body 220. For example, the first conductor can be connected to the board body 220 by welding, a soldering pad can be disposed on the board body 220, and the first conductor and the soldering pad on the board body 220 can be welded by structures such as solder balls.

[0072] It can be understood that a second conductor (not shown) is provided on the optical module. When the optical module is plugged into the port 241, the first conductor is electrically connected to the second conductor. The first conductor and the second conductor include but are not limited to materials with good electrical conductivity such as copper, copper alloy, gold, and silver.

[0073] In addition, in the embodiment of the present application, the appearance structure of the optoelectronic connection unit 200 matches the opening 110 of the chassis 100, so that the optoelectronic connection unit 200 can be detachably connected to the chassis 100 through the opening 110 by plugging and unplugging, and when the optoelectronic connection unit 200 is plugged into the chassis 100, the connector 240 in the optoelectronic connection unit 200 is interconnected with the control substrate through the chip for signal interconnection.

[0074] That is to say, in the embodiment of the present application, as long as the optoelectronic connection units 200 with different functional parameters such as power are formed into an RSM structure that is compatible and adaptable to the chassis component, in this way, according to different application scenarios, only the corresponding optoelectronic connection units 200 in the network switching device 10 need to be replaced, that is, different types of optoelectronic connection units 200 can be adapted to the same chassis component without the need to develop additional chassis components. From the perspective of the design and manufacturing costs of the network switching device 10, the development, design, production, manufacturing, testing and online costs of the chassis components can be saved to the maximum extent.

[0075] In order to improve the reliability of the signal interconnection between the connector 240 and the control substrate when the optoelectronic connection unit 200 is plugged into the chassis 100, in the embodiment of the present application, please refer to Figure 4 As shown, the board body 220 is provided with a first connector 230. Exemplarily, the first connector 230 is arranged at an end away from the port 241. The first connector 230 is electrically connected to the board body 220. Specifically, the first connector 230 is electrically connected to the electrical channel of the board body 220. The control substrate has a second connector. The first connector 230 and the second connector can be plugged in and out to achieve signal interconnection or disconnection. In this way, the first connector 230 and the second connector can be plugged in as the optoelectronic connection unit 200 is plugged in to the chassis 100, and can be separated and disassembled from each other as the optoelectronic connection unit 200 and the chassis 100 are pulled out and disassembled, so as to adapt different optoelectronic connection units 200 to the chassis 100 according to specific needs, thereby reducing the development cost of the chassis 100.

[0076] Among them, the first connector 230 can be a universal connector. In this way, the first connector 230 is set on the optoelectronic connection unit 200 of different module structures to form an optoelectronic connection unit 200 adapted to the chassis component. In this way, when the optoelectronic connection unit 200 is plugged into the chassis 100, the signal interconnection can be achieved by plugging the first connector 230 with the second connector on the control substrate, thereby realizing the function of the switch without the need to develop additional chassis components.

[0077] In some embodiments, one of the first connector 230 and the second connector includes a plug interface, and the other includes a plug connector that can be inserted into the plug interface. Exemplarily, the first connector 230 includes a plug interface, and the second connector includes a plug connector that can be inserted into the plug interface. In this way, the plug connector and the plug interface can be detachably connected to electrically connect the board body 220 and the control substrate.

[0078] Among them, the first connector 230 may include multiple plug interfaces, and the second connector includes multiple plug connectors. In this way, when the first connector 230 and the second connector are plugged in, the plug-in reliability of the first connector 230 and the second connector can be improved, thereby improving the stability of the interconnection signal between the optoelectronic connection unit 200 and the control substrate.

[0079] It can be seen that in the embodiment of the present application, the chassis assembly and the optoelectronic connection unit 200 are modularly designed, wherein one end of the chassis 100 has an opening 110, a control substrate is arranged in the chassis 100, and the optoelectronic connection unit 200 includes a bracket 210, a board 220 and a connector 240, the board 220 is arranged on the bracket 210, the connector 240 is arranged on the surface of the board 220 and is electrically connected to the board 220, the connector 240 has a port 241, the plugging direction of the port 241 is adapted to the extension direction of the board 220, and the port 241 is constructed to be detachably plugged with the optical module. In addition, by matching the hardware structure specifications of the optoelectronic connection unit 200 with the chassis 100, The corresponding compatible design allows the optoelectronic connection unit 200 to be detachably plugged into the chassis 100 through the opening 110, so that the chassis can be adapted to different types of optoelectronic connection units 200. When the optoelectronic connection unit 200 is plugged into the chassis 100, the board 220 is electrically connected to the control substrate, and the function of the switch can be realized. In this way, the network switching device 10 can be adapted to optoelectronic connection units 200 with different transmission power and other parameters according to the application requirements of different scenarios to meet the application requirements of different scenarios, thereby improving the versatility of the network switching device 10, increasing the scope of application of the network switching device 10, and reducing the hardware development, design, production, manufacturing, testing and other costs of the network switching device 10.

[0080] In some embodiments, at least two plates 220 can be set in the optoelectronic connection unit 200 according to actual needs, and at least two plates 220 can be set on the bracket 210 at intervals along a first direction, wherein the first direction is, for example, a direction along the plate surface perpendicular to the plate 220. Exemplarily, a connecting member can be set between two adjacent plates 220 to connect the two adjacent plates 220 through the connecting member so that the two adjacent plates 220 are set at intervals in the first direction. It can be understood that the connecting member can provide a supporting basis for the two adjacent plates 220, so that the stability of the two adjacent plates 220 can be improved.

[0081] It is understandable that the number of boards 220 may be related to the number of connectors 240 to be provided by the optoelectronic connection unit 200. The more connectors 240 there are, the more boards 220 there are, and the boards 220 provide installation support for the connectors 240.

[0082] Among them, at least one side of each plate body 220 is provided with an installation area, and the connector 240 is installed in the installation area. By setting at least two plate bodies 220 and setting the installation area on at least one side of each plate body 220, it can be suitable for an optoelectronic connection unit 200 with more connectors 240.

[0083] Therefore, by setting at least two boards 220, the optoelectronic connection unit 200 can support a larger number of optical modules. Specifically, the number of boards 220 can be set according to the number of optical modules. The chip is located on one of the at least two boards 220, so that signals can be transmitted between the chip and the connector 240.

[0084] Among them, the connector 240 can be plugged into the corresponding installation area on the board body 220 by plugging. For example, the bottom of the connector 240 is provided with a fixing foot, and the installation area of ​​the board body 220 is provided with a fixing hole. In this way, the connector 240 can be fixedly connected to the installation area through the plug-in cooperation between the fixing foot and the fixing hole; in addition, the installation area can also be provided with an electrical channel electrically connected to the first conductor, so that when the connector 240 is installed on the installation area of ​​the board body 220, the electrical channel of the first conductor and the board body 220 is electrically conductive, thereby realizing the electrical connection between the connector 240 and the board body 220.

[0085] For example, please refer to Figure 3 As shown, the optoelectronic connection unit 200 includes a first plate body 221 and a second plate body 222, the first plate body 221 is arranged above the second plate body 222, and the board surfaces on opposite sides of the first plate body 221 both have installation areas; the board surface of the second plate body 222 on one side away from the first plate body 221 has an installation area, and each installation area is arranged with at least two connectors 240 along the second direction; wherein the first direction and the second direction are perpendicular to each other, the first direction is, for example, a direction perpendicular to the first plate body 221 and the second plate body 222, and the second plate body is, for example, an extension direction of the board surface.

[0086] It is understandable that by providing mounting areas on the board surfaces on opposite sides of the first board body 221 , the compactness of the structure of the optoelectronic connection unit 200 can be improved while supporting a larger number of connectors 240 , thereby improving space utilization.

[0087] In some embodiments, the optoelectronic connection unit 200 includes a third plate body 223 and a fourth plate body 224, and the third plate body 223 and the fourth plate body 224 are arranged on the bracket 210 at intervals along the first direction, wherein one side of the third plate body 223 and the fourth plate body 224 has an installation area, that is, only one side of the third plate body 223 and the fourth plate body 224 has an installation area, so that the plate surface on the other side without the installation area can dissipate heat to avoid the plate body affecting its working performance due to heat.

[0088] Exemplarily, the installation area of ​​the third plate body 223 and the installation area of ​​the fourth plate body 224 are located on the same side. For example, the installation area on the third plate body 223 is located on the upper side surface of the third plate body 223, and the installation area of ​​the fourth plate body 224 is also located on the upper side surface of the fourth plate body 224, thereby improving the rationality of the layout and the heat dissipation.

[0089] In some embodiments, the optoelectronic connection unit 200 further includes a fifth board 225 , which is spaced apart on one side of the third board 223 and the fourth board 224 , and one side of the fifth board 225 has a mounting area for mounting the connector 240 .

[0090] In an example, see Figure 5 As shown, the optoelectronic connection unit 200 includes a third board body 223, a fourth board body 224 and a fifth board body 225, and one side board surface of the third board body 223, the fourth board body 224 and the fifth board body 225 respectively has an installation area, and each installation area is arranged along the second direction. At least two connectors 240, in this way, by setting the installation area on the board surface of one side of the third board body 223, the fourth board body 224 and the fifth board body 225, and setting the connector 240 on each installation area, in this way, a large number of connectors 240 can be supported, and the heat of the board body 220 can be dissipated through the board surface without the installation area, so as to improve the heat dissipation performance of the board body 220.

[0091] Exemplarily, the connector 240 may be an SFP (Small Form-factor Pluggable, small package hot-pluggable optical module), wherein the connector 240 may be any form of SFP, for example, SFP+ or QSFP (Quad Small Form-factor Pluggable, quad-channel SFP port 241), etc.

[0092] For example, in Figure 3 and Figure 5 In the embodiment, the optoelectronic connection unit 200 includes 128 ports 241, that is, the optoelectronic connection unit 200 can provide 128 ports 241. In order to meet the interconnection requirements of the data center at a transmission rate of 400Gb / S, the connector 240 can include at least one QSFP112 port 241, that is, the port 241 in the connector 240 adopts QSFP112. It can be understood that QSFP112 can simultaneously support four-channel data transmission at a transmission rate of 112Gb / S in a single channel, thereby meeting the interconnection requirements of the data center at a transmission rate of 400Gb / S; in addition, the package size is small, which is suitable for data center applications.

[0093] Exemplarily, the ports 241 of the connector 240 may all be QSFP112 ports 241 .

[0094] In other embodiments, please refer to Figure 6As shown, the optoelectronic connection unit 200 includes a third board body 223 and a fourth board body 224, and one side surface of the third board body 223 and the fourth board body 224 has an installation area, and each installation area is arranged along the second direction. At least two connectors 240 are arranged on the second direction. By setting the installation area on one side surface of the third board body 223 and the fourth board body 224, that is, the third board body 223 and the fourth board body 224 are both provided with an installation area on one side surface, and no installation area is set on the other side surface, so that the heat of the board body 220 can be dissipated through the board surface without the installation area, so as to improve the heat dissipation performance of the board body 220.

[0095] For example, in Figure 6 In the figure, the optoelectronic connection unit 200 includes 64 ports 241, that is, the optoelectronic connection unit 200 can provide 64 ports 241, wherein the connector 240 can adopt an OSFP (Octal Small Form-factor Pluggable) port 241. It can be understood that OSFP can simultaneously support eight-channel data transmission at a single channel transmission rate of 112Gb / S, thereby meeting the interconnection requirements of a transmission rate of 800Gb / S. OSFP packaging is suitable for use in telecommunications.

[0096] In some embodiments, a first heat dissipation structure is provided on at least one of at least two plates 220. By providing the first heat dissipation structure on the plate 220, the temperature of the plate 220 can be reduced through the first heat dissipation structure, thereby improving the working reliability and performance stability of the plate 220.

[0097] In some embodiments, please refer to Figures 3 to 6 As shown, the first heat dissipation structure includes a first heat sink 250, which includes a plurality of heat dissipation fins. The heat dissipation fins are arranged on the plate body 220. The plurality of heat dissipation fins can increase the heat dissipation area and can quickly dissipate the heat on the chip and the plate body 220, thereby improving the heat dissipation efficiency.

[0098] In other embodiments, please refer to Figure 7 and Figure 8As shown, the first heat dissipation structure includes a cooling liquid plate 260, which is arranged on the plate body 220, and a circulating cooling channel is arranged in the cooling liquid plate 260. A first cooling pipeline 120 is arranged in the chassis 100, and one end of the first cooling pipeline 120 is configured to be connected to the cooling channel, and the other end of the first cooling pipeline 120 is configured to be connected to a cooling source, wherein the cooling source can be a cooling tank or a cooling container arranged outside the chassis 100, etc., for holding cooling liquid. In this way, when the optoelectronic connection unit 200 is plugged into the chassis 100, the first cooling pipeline 120 is connected to the cooling channel, and the cooling liquid circulates in the first cooling pipeline 120 and the cooling channel, and the temperature of the plate body 220 can be reduced by heat exchange, thereby improving the heat dissipation efficiency and heat dissipation reliability, thereby improving the working reliability and performance stability of the plate body 220, and the structure is simple and the heat dissipation effect is good.

[0099] Among them, the first cooling pipeline 120 may include a liquid inlet pipeline and a liquid outlet pipeline, the liquid inlet pipeline is connected to the liquid inlet of the cooling channel, the liquid outlet pipeline is connected to the liquid outlet of the cooling channel, and the liquid inlet pipeline and the liquid outlet pipeline are also connected to the cooling source respectively. In this way, a cooling circulation passage can be formed, so that the cooling liquid can dissipate heat by heat exchange with the plate body 220 when flowing in the pipeline, and the heat dissipation effect is good.

[0100] In some embodiments, the connector 240 has at least two ports 241 arranged at intervals along the second direction, and a second heat dissipation structure 270 is arranged between the two ports 241. In this way, by setting the second heat dissipation structure 270 between the two ports 241 arranged at intervals in the second direction of the connector 240, the network switching device 10 can be cooled by the second heat dissipation structure 270, thereby improving the heat dissipation efficiency.

[0101] For example, please refer to Figure 5 As shown, the second heat dissipation structure 270 includes a heat sink, which is connected between the two ports 241 of the connector 240, and a plurality of heat dissipation holes are arranged on the heat sink. By arranging the heat sink between the two ports 241 of the connector 240 and arranging a plurality of heat dissipation holes on the heat sink, part of the heat in the network switching device 10 can be discharged through the heat dissipation holes for heat dissipation, thereby improving the heat dissipation efficiency while having a simple structure and low cost.

[0102] In other embodiments, please refer to Figure 8As shown, the second heat dissipation structure 270 includes a second cooling pipeline 280, and at least a portion of the second cooling pipeline 280 is located between the two ports 241 of the connector 240, wherein the second cooling pipeline 280 is connected to the chassis 100 or an external cooling source, so that the coolant in the second cooling pipeline 280 can reduce the temperature between the two ports 241 in the connector 240 through heat exchange, thereby simplifying the heat dissipation structure and improving the heat dissipation effect.

[0103] In some embodiments, please refer to Figure 7 and Figure 8 As shown, the chassis 100 is provided with a water inlet interface 140 and a water outlet interface 150 which are respectively connected to the liquid inlet pipeline and the liquid outlet pipeline of the first cooling pipeline 120 and the second cooling pipeline 280. The water inlet interface 140 and the water outlet interface 150 are respectively connected to the cooling source, that is, the cooling source is connected to the water inlet interface 140, and the water inlet interface 140 is further connected to the liquid inlet pipelines of the first cooling pipeline 120 and the second cooling pipeline 280 respectively. Correspondingly, the liquid outlet pipelines of the first cooling pipeline 120 and the second cooling pipeline 280 are connected to the cooling source via the water outlet interface 150.

[0104] In some embodiments, please refer to Figure 4 As shown, the optoelectronic connection unit 200 also includes a cover 290, which is arranged at one end of the connector 240 away from the chassis 100 and connected to the bracket 210, and a plurality of avoidance openings 291 are arranged on the cover 290, and one avoidance opening 291 is arranged corresponding to one port 241, wherein the cover 290 matches the number of ports 241 that can be provided by the corresponding optoelectronic connection unit 200, that is, the number of avoidance openings 291 on the cover 290 is greater than or equal to the number of ports 241, so that by arranging the cover 290 at one end of the optoelectronic connection unit 200 away from the chassis 100, and arranging a plurality of avoidance openings 291 on the cover 290, and one avoidance opening 291 is arranged corresponding to one port 241, the cover 290 can isolate external dust particles and the like, and protect the connector 240, thereby extending the service life of the network switching device 10.

[0105] In addition, a plurality of heat dissipation holes may be formed at positions on the cover plate 290 where the avoidance openings 291 are not provided, thereby improving the heat dissipation efficiency of the switch.

[0106] In addition, the cover plate 290 may be made of a material having a good heat dissipation effect or a heat conduction effect, which is not limited here.

[0107] In some embodiments, please refer to Figure 4As shown, at least one handle 292 is provided on the cover plate 290. It can be understood that by providing the handle 292 on the cover plate 290, the user can operate through the handle 292 when disassembling and assembling the optoelectronic connection unit 200, thereby improving the user's operating comfort and experience.

[0108] It can be seen that the network switching device provided in the embodiment of the present application includes but is not limited to the four types of optoelectronic connection units listed in the above embodiments, as long as the various optoelectronic connection units are formed into a structure compatible with the chassis, wherein the number of ports, chip type and manufacturer of the optoelectronic connection unit are not specifically restricted, and can be adaptively designed according to the actual application scenario, so that each optoelectronic connection unit has a universal connection port interface for signal interconnection with the control substrate in the chassis. In this way, each optoelectronic connection unit is plugged into the chassis to realize the function of its switch, without the need to develop an additional chassis, saving the development, design, production, testing and other costs of the chassis, so that the network switching device can adapt different optoelectronic connection units to the chassis according to different application scenarios, thereby increasing the scope of application of the network switching device and reducing the development and other costs of the network switching device.

[0109] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0110] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products, or devices.

[0111] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents, and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A network switching device, characterized in that: include: A chassis assembly and an optoelectronic connection unit, wherein the chassis assembly includes a chassis and a control substrate, one end of the chassis has an opening, the control substrate is arranged in the chassis, and the optoelectronic connection unit is configured to be detachably plugged with the chassis through the opening, so that the chassis can be selectively adapted to different optoelectronic connection units; The optoelectronic connection unit includes a bracket, a board and a connector, wherein the board is arranged on the bracket, the connector is arranged on the surface of the board and is electrically connected to the board, the connector has a port, the plugging direction of the port is adapted to the extension direction of the board, and the port is configured to be detachably plugged with the optical module; When the optoelectronic connection unit is plugged into the chassis, the board body is electrically connected to the control substrate.

2. The network switching device according to claim 1, characterized in that: The board body is provided with a first connector, and the control substrate has a second connector. When the optoelectronic connection unit is plugged into the chassis, the first connector and the second connector are plugged into and electrically connected to electrically connect the board body and the control substrate.

3. The network switching device according to claim 2, characterized in that: The first plug connector is arranged at an end of the board body away from the port and is electrically connected to the board body.

4. The network switching device according to claim 2, characterized in that: One of the first plug connector and the second plug connector includes a plug interface, and the other includes a plug connector that can be inserted into the plug interface.

5. The network switching device according to any one of claims 1 to 4, characterized in that: The optoelectronic connection unit includes at least two plates, at least two plates are arranged on the bracket at intervals along a first direction, at least one side of each plate is provided with an installation area, and the connector is installed in the installation area, wherein the first direction is a direction perpendicular to the plate surface of the plate.

6. The network switching device according to claim 5, characterized in that: The optoelectronic connection unit includes a first plate body and a second plate body, the first plate body is arranged above the second plate body, and the plate surfaces on opposite sides of the first plate body both have the installation area; the plate surface on the side of the second plate body facing away from the first plate body has the installation area, and each installation area is arranged with at least two connectors along a second direction; wherein the second direction and the first direction are perpendicular to each other.

7. The network switching device according to claim 5, characterized in that: The optoelectronic connection unit includes a third plate body and a fourth plate body, and the third plate body and the fourth plate body are arranged on the bracket at intervals along the first direction. One side surface of the third plate body and the fourth plate body has the installation area, and each installation area is arranged with at least two connectors along the second direction.

8. The network switching device according to claim 7, characterized in that: The optoelectronic connection unit also includes a fifth plate body, which is spaced apart on one side of the third plate body and the fourth plate body, and one side surface of the fifth plate body has the installation area, and the installation area is arranged with at least two connectors along the second direction.

9. The network switching device according to claim 6, characterized in that: The optoelectronic connection unit includes 128 ports, and the connector includes at least one QSFP112 port.

10. The network switching device according to claim 7, characterized in that: The optoelectronic connection unit includes 64 ports, and the connector includes at least one OSPF port.

11. The network switching device according to claim 5, characterized in that: A first heat dissipation structure is disposed on at least one of the at least two plates, and the first heat dissipation structure is configured to dissipate heat from the plate.

12. The network switching device according to claim 11, characterized in that: The first heat dissipation structure includes a first heat sink, which includes a plurality of heat dissipation fins connected to the plate body.

13. The network switching device according to claim 11, characterized in that: The first heat dissipation structure includes a cooling liquid plate, which is arranged on the plate body. A cooling channel is arranged in the cooling liquid plate. A first cooling pipeline is arranged in the chassis. One end of the first cooling pipeline is configured to communicate with the cooling channel, and the other end of the first cooling pipeline is configured to be connected to a cooling source.

14. The network switching device according to any one of claims 1 to 4, characterized in that: The connector has at least two ports arranged at intervals along the second direction, a second heat dissipation structure is arranged between the two ports, and the second heat dissipation structure is configured to dissipate heat for the connector.

15. The network switching device according to claim 14, characterized in that: The second heat dissipation structure includes a heat dissipation plate, the heat dissipation plate is connected between the two ports of the connector, and a plurality of heat dissipation through holes are arranged on the heat dissipation plate.

16. The network switching device according to claim 14, characterized in that: The second heat dissipation structure includes a second cooling pipeline, at least a portion of the second cooling pipeline is located between the two ports of the connector, and the second cooling pipeline is configured to be connected to a cooling source.

17. The network switching device according to any one of claims 1 to 4, characterized in that: The optoelectronic connection unit also includes a cover plate, which is arranged at one end of the connector away from the chassis. The contour shape of the cover plate matches the opening. The cover plate is provided with a plurality of avoidance openings, and one avoidance opening is correspondingly arranged with one of the ports.

18. The network switching device according to claim 17, characterized in that: At least one handle is arranged on the cover plate.

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