Microelectronic heat dissipation device

Abstract

The utility model relates to a microelectronic heat dissipation device which comprises heat conduction silica gel and a semispherical shell, cooling liquid is injected into an inner cavity of the semispherical shell, the semispherical shell is fixedly connected to the top of the heat conduction silica gel, and a spraying assembly used for spraying the cooling liquid to the top of the inner side of the semispherical shell is arranged in the inner cavity of the semispherical shell. An outer arc piece is arranged on the outer side of the hemispherical shell, a ventilation cavity with two ends is formed between the outer arc piece and the hemispherical shell, an air outlet hole is formed in one end of the ventilation cavity, an air inlet hole is formed in one end of the ventilation cavity, and a ventilation assembly is arranged in the ventilation cavity. And air outside the outer arc piece is introduced into the ventilation cavity through the ventilation assembly shell. According to the utility model, effective heat dissipation can be carried out on the microelectronic component, and the heat dissipation effect is prevented from being influenced by over-high temperature of the cooling liquid due to over-high temperature of the semispherical shell.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic heat dissipation, in particular to a microelectronic heat dissipation device. Background Art

[0002] A microelectronic heat sink is a small heat dissipation device used to dissipate heat. It is mainly used to solve the heat problem generated by microelectronic devices (such as integrated circuits, electronic components, etc.) during operation.

[0003] The patent with application number CN201810261313.0 discloses a microelectronic heat dissipation device, which relates to the field of microelectronic technology, and includes a base, the base is provided with an inner cavity, and liquid is stored in the inner cavity. A fin cooling device and an arc-shaped sheet are also provided on the top of the base.

[0004] However, in the above-mentioned microelectronic heat dissipation device, when the coolant is transferred to the arc-shaped sheet, the heat absorbed on the outside of the arc-shaped sheet is only dissipated through spontaneous heat dissipation, and the heat cannot be dissipated well. When the microelectronic heat dissipation device works for a long time, its own surface temperature is relatively high and is absorbed by the coolant, so that the temperature of the coolant stored in the inner cavity is relatively high, making it difficult to maintain the heat dissipation effect on the microelectronics. Utility Model Content

[0005] The utility model aims to provide a microelectronic heat dissipation device to address the deficiencies of the prior art. The specific technical solution is as follows:

[0006] A microelectronic heat dissipation device comprises a thermally conductive silica gel and a hemispherical shell with a coolant injected into its inner cavity, the hemispherical shell being fixedly connected to the top of the thermally conductive silica gel, the inner cavity of the hemispherical shell being provided with a spray assembly for spraying the coolant onto the inner top of the hemispherical shell, an outer arc sheet being provided on the outer side of the hemispherical shell, a ventilation cavity with two ends being formed between the outer arc sheet and the hemispherical shell, an air outlet being provided at one end of the ventilation cavity, an air inlet being provided at one end of the ventilation cavity, a ventilation assembly being provided inside the ventilation cavity, and air outside the outer arc sheet being passed into the ventilation cavity through the ventilation assembly shell.

[0007] As an improvement of the above technical solution: the spray assembly includes a liquid spray main pipe fixedly connected to the inner cavity of the hemispherical shell, a plurality of liquid spray branch pipes are fixedly installed on the outer surface of the liquid spray main pipe, a circulating pump body is fixedly installed on the inner side of the liquid spray main pipe through a bracket, the output end of the circulating pump body is connected to the interior of the liquid spray main pipe through a pipeline, and the input end of the circulating pump body is fixedly connected to a liquid extraction pipe extending to the bottom side of the inner cavity of the hemispherical shell.

[0008] As an improvement of the above technical solution: the liquid spraying main pipe is arranged in an arc shape, and the liquid spraying branch pipes extend in the radial direction of the liquid spraying main pipe.

[0009] As an improvement of the above technical solution: an air inlet is provided at one end of the outer arc piece, an air outlet is provided at the other end of the outer arc piece, one end of the air inlet is connected with one end of the ventilation cavity, one end of the air outlet is connected with the other end of the ventilation cavity, and a plurality of intermediate holes are provided on the outer arc piece between the air outlet and the air inlet.

[0010] As an improvement of the above technical solution: the ventilation assembly includes a motor fixedly installed in the ventilation cavity near the air inlet, the output end of the motor is connected to an exhaust fan blade, and a filter plate is installed in the air inlet.

[0011] As an improvement of the above technical solution: it also includes a controller, the circulation pump body and the motor are electrically connected to the controller, and the circulation pump body can be driven to work intermittently through the controller.

[0012] Beneficial effects of the utility model:

[0013] The heat on the microelectronic components is transferred to the bottom surface of the hemispherical shell, and at the same time, the controller intermittently controls the circulation pump body to work, so that the circulation pump body draws coolant inside the ventilation cavity to the inner wall of the top of the hemispherical shell, so that the heat is transferred to the top side of the hemispherical shell, and at the same time, the motor is started to drive the exhaust fan blades to draw air outside the outer arc sheet into the ventilation cavity, and then dissipate it through the middle hole and the air outlet, thereby transferring and dissipating the heat on the surface of the hemispherical shell, so that the heat absorbed by the hemispherical shell is quickly dissipated, avoiding the temperature on the side wall of the hemispherical shell from being too high, thereby effectively dissipating the heat of the microelectronic components, and avoiding the coolant from being affected by the excessive temperature of the hemispherical shell, which causes the temperature of the coolant to be too high and affect the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 for Figure 1 Schematic diagram of the enlarged structure at point A in the middle.

[0016] Figure numerals: 1. thermal conductive silicone; 2. hemispherical shell; 3. circulating pump body; 31. liquid extraction pipe; 4. outer arc sheet; 401. filter screen; 40. air inlet hole; 41. middle hole; 42. air outlet hole; 5. liquid spray main pipe; 51. liquid spray branch pipe; 6. ventilation chamber; 7. controller; 8. motor; 81. exhaust fan blades. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0018] Example

[0019] Please refer to Figure 1-Figure 2 A microelectronic heat dissipation device comprises a thermally conductive silica gel 1 and a hemispherical shell 2 with a coolant injected into its inner cavity, the hemispherical shell 2 is fixedly connected to the top of the thermally conductive silica gel 1, the inner cavity of the hemispherical shell 2 is provided with a spraying assembly for spraying the coolant onto the inner top of the hemispherical shell 2, an outer arc sheet 4 is provided on the outer side of the hemispherical shell 2, a ventilation cavity 6 with two ends is formed between the outer arc sheet 4 and the hemispherical shell 2, an air outlet 42 is provided at one end of the ventilation cavity 6, an air inlet 40 is provided at one end of the ventilation cavity 6, a ventilation assembly is provided inside the ventilation cavity 6, and the air outside the outer arc sheet 4 is passed into the ventilation cavity 6 through the ventilation assembly shell.

[0020] In an optional embodiment: the spray assembly includes a liquid spray main pipe 5 fixedly connected to the inner cavity of the hemispherical shell 2, a plurality of liquid spray branch pipes 51 are fixedly installed on the outer surface of the liquid spray main pipe 5, a circulation pump body 3 is fixedly installed on the inner side of the liquid spray main pipe 5 through a bracket, the output end of the circulation pump body 3 is connected to the interior of the liquid spray main pipe 5 through a pipeline, and the input end of the circulation pump body 3 is fixedly connected to a liquid extraction pipe 31 extending to the bottom side of the inner cavity of the hemispherical shell 2.

[0021] In an optional embodiment: the liquid spray main pipe 5 is arranged in an arc shape, and the liquid spray branch pipe 51 extends in the radial direction of the liquid spray main pipe 5, so that the spray range of the coolant can be improved by the shape of the liquid spray main pipe 5, so that the coolant is evenly sprayed onto the inner surface of the hemispherical shell 2, and the heat absorbed by the side wall of the hemispherical shell 2 is evenly dissipated, thereby effectively dissipating the heat of the microelectronic components. Compared with the existing microelectronic heat dissipation device, the coolant can be continuously sprayed on the hemispherical shell 2 instead of being transferred to the hemispherical shell 2 in the form of boiling point evaporation, so that the coolant can continuously achieve the heat dissipation effect.

[0022] In an optional embodiment: an air inlet 40 is provided at one end of the outer arc piece 4, and an air outlet 42 is provided at the other end of the outer arc piece 4. One end of the air inlet 40 is connected to one end of the ventilation cavity 6, and one end of the air outlet 42 is connected to the other end of the ventilation cavity 6. A plurality of intermediate holes 41 are provided on the outer arc piece 4 between the air outlet 42 and the air inlet 40. The through hole diameter of the intermediate hole 41 is smaller than the through hole diameter of the air outlet 42, so that heat can be evenly dissipated from the outside of the hemispherical shell 2 through the intermediate holes 41 and the air outlet 42, thereby improving the heat dissipation effect.

[0023] In an optional embodiment: the ventilation assembly includes a motor 8 fixedly installed in the ventilation cavity 6 near the air inlet 40, the output end of the motor 8 is connected to the exhaust fan blade 81, and a filter plate 401 is installed in the air inlet 40. The filter plate 401 prevents impurities outside the outer arc sheet 4 from entering the ventilation cavity 6 and affecting the exhaust fan blade 81 when the motor 8 drives the exhaust fan blade 81 to operate.

[0024] In an optional embodiment: it also includes a controller 7, which is installed on one side of the outer wall of the hemispherical shell 2 through a protective shell, and the circulating pump body 3 and the motor 8 are electrically connected to the controller 7. The circulating pump body 3 can be driven to work intermittently through the controller 7, and the intermittent time is 5s-60s. Through the intermittent work, the coolant in the ventilation cavity 6 has sufficient time to be placed at the bottom end of the hemispherical shell 2, so that the circulating pump body 3 can fully extract the coolant in the ventilation cavity 6 and spray it onto the top inner wall of the hemispherical shell 2. Specifically, the outer arc piece 4 and the hemispherical shell 2 are both made of materials with good thermal conductivity, such as copper, aluminum, etc. The circulating pump body 3 and the motor 8 use miniature pump bodies and motors on the market to meet installation requirements.

[0025] Specifically, when using the present application, the heat-conducting silicone 1 is fixedly adhered to the microelectronic components. When the microelectronic components are working, the heat on the microelectronic components is transferred to the bottom surface of the hemispherical shell 2. At the same time, the controller 7 intermittently controls the circulation pump body 3 to work, so that the circulation pump body 3 draws the coolant inside the ventilation cavity 6 to the inner wall of the top of the hemispherical shell 2, so that the heat is transferred to the top side of the hemispherical shell 2, and at the same time, the motor 8 is started to drive the exhaust fan blades 81 to draw the air outside the outer arc sheet 4 into the ventilation cavity 6, and then dissipate it through the middle hole 41 and the air outlet 42, so that the heat on the surface of the hemispherical shell 2 is transferred and dissipated, so that the heat absorbed by the hemispherical shell 2 is quickly dissipated, avoiding the temperature on the side wall of the hemispherical shell 2 to be too high, thereby effectively dissipating the heat of the microelectronic components, and avoiding the cooling liquid being affected by the excessive temperature of the hemispherical shell 2, which causes the temperature of the cooling liquid to be too high and affect the heat dissipation effect.

[0026] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A microelectronic heat dissipation device, characterized in that: It comprises a heat-conducting silica gel (1) and a hemispherical shell (2) with a coolant injected into its inner cavity, the hemispherical shell (2) being fixedly connected to the top of the heat-conducting silica gel (1), the inner cavity of the hemispherical shell (2) being provided with a spraying assembly for spraying the coolant onto the inner top of the hemispherical shell (2), an outer arc sheet (4) being provided on the outer side of the hemispherical shell (2), a ventilation cavity (6) with two ends being formed between the outer arc sheet (4) and the hemispherical shell (2), one end of the ventilation cavity (6) being provided with an air outlet (42), one end of the ventilation cavity (6) being provided with an air inlet (40), a ventilation assembly being provided inside the ventilation cavity (6), and air outside the outer arc sheet (4) being passed into the ventilation cavity (6) through the ventilation assembly shell; The spray assembly comprises a liquid spraying main pipe (5) fixedly connected to the inner cavity of the hemispherical shell (2), a plurality of liquid spraying branch pipes (51) being fixedly mounted on the outer surface of the liquid spraying main pipe (5), a circulating pump body (3) being fixedly mounted on the inner side of the liquid spraying main pipe (5) via a bracket, an output end of the circulating pump body (3) being connected to the interior of the liquid spraying main pipe (5) via a pipeline, and an input end of the circulating pump body (3) being fixedly connected to a liquid extraction pipe (31) extending to the bottom side of the inner cavity of the hemispherical shell (2); The ventilation assembly comprises a motor (8) fixedly mounted in the ventilation cavity (6) near the air inlet hole (40), the output end of the motor (8) being connected to an exhaust fan blade (81), and a filter screen (401) being mounted in the air inlet hole (40).

2. A microelectronic heat dissipation device according to claim 1, characterized in that: The liquid spraying main pipe (5) is arranged in an arc shape, and the liquid spraying branch pipes (51) extend in the radial direction of the liquid spraying main pipe (5).

3. A microelectronic heat dissipation device according to claim 2, characterized in that: An air inlet hole (40) is provided at one end of the outer arc sheet (4), and an air outlet hole (42) is provided at the other end of the outer arc sheet (4); one end of the air inlet hole (40) is connected to one end of the ventilation cavity (6), and one end of the air outlet hole (42) is connected to the other end of the ventilation cavity (6); and a plurality of intermediate holes (41) are provided on the outer arc sheet (4) between the air outlet hole (42) and the air inlet hole (40).

4. A microelectronic heat dissipation device according to claim 3, characterized in that: It also includes a controller (7), the circulation pump body (3) and the motor (8) are both electrically connected to the controller (7), and the circulation pump body (3) can be driven to work intermittently through the controller (7).

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