Impact test device

Abstract

The utility model relates to an impact test device. The impact test device includes: a support member; the impact part is arranged on one side of the supporting part and is rotationally connected with the supporting part; the base is used for supporting a to-be-tested sample, and the base is arranged on the same side as the impact part and located below the impact part, so that the to-be-tested sample is located on the rotating path of the impact part; and the temperature control module comprises a semiconductor chilling plate and is used for adjusting the temperature of the base through the semiconductor chilling plate. Through the impact test device, the pretreatment step of the to-be-tested sample is reduced, a plurality of devices such as a drying oven are omitted, meanwhile, the use of a cooling agent is reduced, energy conservation and environmental protection can be achieved, and the cost is reduced. Meanwhile, the temperature of the sample to be tested is controlled on the base, so that the temperature change caused by transferring the sample is avoided, and the obtained impact test result is more accurate.

Description

Technical Field

[0001] The utility model relates to the technical field of product testing, in particular to an impact testing device. Background Art

[0002] The single pendulum impact test is a commonly used material mechanics test method used to evaluate the impact resistance of materials. This test usually uses a heavy pendulum to release its potential energy and impact the material to be tested at a certain speed.

[0003] The current single-body impact test device cannot directly test the impact toughness of samples at different temperatures and requires pretreatment before testing at different temperatures.

[0004] However, the thermal insulation treatment is not carried out well from pretreatment to the test process, resulting in a certain deviation between the test temperature and the estimated temperature, resulting in inaccurate test data. Utility Model Content

[0005] Based on this, it is necessary to provide an impact test device to address the problem that a sample at a specific temperature cannot be impact tested in a pendulum impact test.

[0006] The present application provides an impact test device, which includes: a support member; an impact member, which is arranged on one side of the support member and is rotatably connected to the support member; a base, which is used to support a sample to be tested, and the base is arranged on the same side as the impact member and is located below the impact member so that the sample to be tested is located in the rotation path of the impact member; and a temperature control module, which includes a semiconductor refrigeration plate, which is used to adjust the temperature of the base through the semiconductor refrigeration plate.

[0007] In one embodiment, the temperature control module includes a temperature control unit, the semiconductor refrigeration sheet is adjacent to the base, and the temperature control unit is electrically connected to the semiconductor refrigeration sheet for controlling the direction of the current input to the semiconductor refrigeration sheet. The semiconductor refrigeration sheet has two functions, cooling and heating, and its working principle is based on the thermoelectric effect. When a direct current passes through the two semiconductor materials, the joint where the current flows from the N-type element to the P-type element absorbs heat and becomes a cold end; the joint where the current flows from the P-type element to the N-type element releases heat and becomes a hot end. By changing the polarity of the direct current, it can be determined whether cooling or heating is achieved on the same refrigeration sheet. In this way, the temperature of the base can be adjusted by the semiconductor refrigeration sheet to adjust the temperature of the sample to be tested.

[0008] In one embodiment, a heat-conducting material is filled between the semiconductor cooling sheet and the base. Using the heat-conducting material as a filler can improve the temperature transmission utilization rate, so that the semiconductor cooling sheet can control the temperature of the base in real time.

[0009] In one embodiment, the impact member includes a swing arm and a pendulum, the first end of the swing arm is rotatably connected to the support member, and the pendulum is connected to the second end of the swing arm. When the swing arm rotates to a preset position, the pendulum impacts the sample to be tested. A control system is added to form a pendulum impact tester through the swing arm and the pendulum, and the test parameters such as the pendulum mass, the falling height, the impact speed, etc. are set according to the test requirements. Then, the pendulum is released through the control system to make it fall freely and hit the sample to be tested. After the impact, the deformation of the material, such as cracks, ruptures, etc., can be observed and recorded.

[0010] In one embodiment, the impact test device further includes an indicator for displaying the impact test information of the sample to be tested. The indicator can visualize the impact test information, and by equipping corresponding measurement, control and data processing systems, parameters such as impact force, residual deformation, fracture mode, etc. can be measured, and the test data can be analyzed and processed. According to actual needs, the pendulum impact tester may have different working principles and designs to adapt to different materials and test requirements.

[0011] In one embodiment, the impact test device further includes a temperature detection module and a display module, wherein the temperature detection module is used to detect the temperature of the sample to be tested, and the display module is used to display the temperature detected by the temperature detection module. In this way, after the semiconductor refrigeration sheet adjusts the temperature of the sample to be tested, the temperature of the sample to be tested can be visualized, which is convenient for the user to observe the temperature of the sample, so as to ensure accurate test results.

[0012] In one embodiment, the temperature detection module includes an infrared temperature measuring probe, which faces the sample to be tested and is used to detect the temperature of the sample to be tested. The infrared temperature measuring probe is a device for non-contact measurement of the surface temperature of an object. It uses the principle of infrared radiation to receive infrared radiation emitted by the sample to be tested through the probe and convert it into a temperature value. The infrared temperature measuring probe is used to achieve non-contact temperature measurement to avoid affecting the sample temperature.

[0013] In one embodiment, the impact test device further comprises a heat preservation cover, which is detachably connected to the base and can accommodate the sample to be tested in the cover. The heat preservation cover can reduce the heat exchange between the sample to be tested and the environment, so that the sample to be tested can quickly reach the specified temperature.

[0014] In one embodiment, the impact test device further includes a cooling mechanism, which is used to cool the end of the semiconductor refrigeration plate away from the sample to be tested. When the semiconductor refrigeration plate is used to cool the sample to be tested, the direction of the current is controlled so that the end of the semiconductor refrigeration plate close to the sample to be tested is cooling, and the end away from the sample to be tested is heating. The heating end is cooled by the cooling mechanism to take away the heat from the lower side of the semiconductor refrigeration plate, thereby improving the cooling efficiency and limit.

[0015] In one embodiment, the cooling mechanism includes an air-cooled radiator or a liquid-cooled radiator, which can cool the semiconductor refrigeration chip by blowing cold air through the air-cooled radiator or cool it by using a coolant medium through the liquid-cooled radiator.

[0016] In the above-mentioned impact test device, the sample to be tested is first placed on the base, and the temperature of the base is controlled by the temperature control module to adjust the temperature of the sample to be tested. When the temperature of the sample to be tested reaches the temperature requirement, the impact piece is released to make it swing. Since the sample to be tested is located on the rotation path of the impact piece, the impact piece will hit the sample to be tested to generate an impact force on it, and then the impact test data of the sample to be tested at a specified temperature is obtained. Through the above-mentioned impact test device, the pretreatment steps of the sample to be tested are reduced, a plurality of equipment (such as ovens, etc.) are omitted, and the use of coolants is also reduced, which can save energy and protect the environment and reduce costs. At the same time, the impact test device provided by the utility model is easy to use, and the sample is temperature-controlled on the base, which avoids temperature changes caused by transferring the sample, so that the obtained impact toughness value is more accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] FIG1 is a schematic structural diagram of an impact test device in one embodiment;

[0018] FIG. 2 is a schematic diagram of the structure of a base in one embodiment.

[0019] Explanation of the reference numerals: 100, supporting member; 200, impact member; 210, swing arm; 220, pendulum; 300, base; 400, temperature control module; 410, semiconductor cooling plate; 420, temperature control unit; 500, supporting platform; 600, indicator; 700, temperature detection module; 710, display module; 800, cooling pipe. DETAILED DESCRIPTION

[0020] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0021] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0022] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0023] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0025] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0026] Refer to FIG1 , which shows a schematic diagram of the structure of an impact test device in one embodiment of the utility model. An impact test device provided in one embodiment of the utility model includes a support 100, an impact member 200, a base 300 and a temperature control module 400. The base 300 is used to place the sample to be tested, the impact member 200 is arranged on the support 100 and is rotatably connected to the support 100, and the impact member 200 can rotate to generate an impact force on the sample to be tested. The temperature control module 400 is used to adjust the temperature of the base 300. When the temperature of the base 300 changes, since the sample to be tested is placed on the base 300, the temperature of the sample to be tested follows the temperature change of the base 300, so that the temperature of the sample to be tested is adjusted by the temperature control module 400.

[0027] Specifically, the impact member 200 is disposed on one side of the support member 100, and is rotatably connected to the support member 100, and can be rotated with a certain structure of the support member 100 as the center of rotation. Optionally, the support member 100 can be a column. Optionally, the rotation mode can be swinging, such as rotating the impact member 200 to a higher position, at which time the impact member 200 has gravitational potential energy. After the impact member 200 is released, its gravitational potential energy is converted into kinetic energy and swings downward. In addition, the mass of the impact member 200 can be set according to requirements, or the initial speed of the swing can be provided to increase its impact force.

[0028] In addition, the support member 100 can also be placed on the support platform 500. In a feasible implementation, the support member 100 is provided with a groove, and the impact member 200 has a protruding structure, and the protruding structure extends into the groove to achieve rotational connection. In another feasible implementation, the support member 100 has a protruding structure, and one end of the impact member 200 has a hole, and the hole is sleeved on the protruding structure to achieve rotational connection.

[0029] With respect to the support member 100, the base 300 is arranged on the same side as the impact member 200 and is located below the impact member 200, and the sample to be tested is located in the rotation path of the impact member 200. In this arrangement, the impact member 200 will hit the sample to be tested during the rotation process, generating an impact force on the sample to be tested, so that test data of the sample to be tested under the impact force can be obtained.

[0030] The temperature control module 400 is used to adjust the temperature of the base 300 and thus adjust the temperature of the sample to be tested. The temperature control module 400 may be provided with a heating element and a cooling element, the heating element may be a thermocouple, etc., and the cooling element may be a fan, etc. The temperature control module 400 may also set a target temperature. After determining the target temperature, if it is detected that the temperature of the sample to be tested is lower than the target temperature, the base 300 is heated by the thermocouple, and the sample to be tested is heated based on the heat exchange base 300; if it is detected that the temperature of the sample to be tested is higher than the target temperature, the base 300 is cooled by the cooling element, thereby cooling the sample to be tested. Further, the temperature control module 400 may have a built-in temperature sensor for detecting the temperature of the base 300. Further, the temperature control module 400 includes a semiconductor cooling sheet 410, and the temperature of the base 300 is adjusted by the semiconductor cooling sheet 410.

[0031] The semiconductor cooling sheet 410 has both cooling and heating functions, and its working principle is based on the thermoelectric effect. The semiconductor cooling sheet is composed of two ceramic sheets with N-type and P-type semiconductor materials (such as bismuth telluride) in the middle. When a direct current passes through the two semiconductor materials, the joint where the current flows from the N-type element to the P-type element absorbs heat and becomes the cold end; the joint where the current flows from the P-type element to the N-type element releases heat and becomes the hot end. By changing the polarity of the direct current, it can be determined whether cooling or heating is achieved on the same cooling sheet.

[0032] The advantages of semiconductor refrigeration chips include: they can be used for cooling or heating. The thermal inertia of semiconductor refrigeration chips is very small, and the cooling and heating time is very fast. When the heat dissipation at the hot end is good and the cold end is unloaded, the refrigeration chip can reach the maximum temperature difference within less than one minute after power-on; high-precision temperature control can be achieved by controlling the input current; reverse use is temperature difference power generation; suitable for power generation in medium and low temperature areas; the temperature difference range can be achieved from positive temperature 90℃ to negative temperature 130℃; no refrigerant is required, it can work continuously, there is no pollution source, no rotating parts, no rotation effect, no sliding parts, it is a solid piece, there is no vibration or noise during operation, long life, and easy installation.

[0033] When the impact test device is used to perform an impact test, the sample to be tested is first placed on the base 300, and the temperature control module 400 controls the temperature of the base 300, thereby adjusting the temperature of the sample to be tested. When the temperature of the sample to be tested reaches the temperature requirement, the impact member 200 is released to make it swing. Since the sample to be tested is located on the rotation path of the impact member 200, the impact member 200 will hit the sample to be tested to generate an impact force thereon, thereby obtaining the impact test data of the sample to be tested at a specified temperature. Through the impact test device, the pretreatment steps for the sample to be tested are reduced, a plurality of equipment (such as ovens, etc.) are omitted, and the use of coolants is also reduced, which can save energy and protect the environment, and reduce costs. At the same time, the impact test device provided by the utility model is easy to use, and the sample is temperature-controlled on the base 300, which avoids temperature changes caused by transferring the sample, so that the obtained impact test results are more accurate.

[0034] Meanwhile, referring to Fig. 2, Fig. 2 shows a schematic diagram of the structure of the base 300 in one embodiment. In an exemplary embodiment, the temperature control module 400 includes a temperature control unit 420, the semiconductor cooling sheet 410 is adjacent to the base 300, and the temperature control unit 420 is electrically connected to the semiconductor cooling sheet 410 to control the direction of the current input to the semiconductor cooling sheet 410 and control the temperature of the semiconductor cooling sheet 410.

[0035] Optionally, the semiconductor cooling sheet 410 can be installed in the area below the base 300, and the area can be determined according to the bottom area of ​​the base 300. In one implementation, the semiconductor cooling sheet 410 can be provided with a plurality of sub-cooling sheets, and the plurality of sub-cooling sheets are distributed below the base 300 to make the temperature change of the base 300 uniform. In an exemplary embodiment, a thermally conductive material is filled between the semiconductor cooling sheet 410 and the base 300. Optionally, the thermally conductive material can be silicone grease or liquid gold. Using a thermally conductive material as a filler can improve the temperature transfer rate, so that the semiconductor cooling sheet 410 can control the temperature of the base 300 in real time.

[0036] In this embodiment, a semiconductor cooling sheet 410 is installed under the base 300 of the sample, and the temperature and the positive and negative poles of the input current are adjusted by the temperature control unit 420, so that the base 300 can be cooled or heated, thereby changing the ambient temperature of the test. Before the test begins, the sample is placed on the base 300, and then the temperature control unit 420 is used to set the temperature to the test temperature, and then a period of time is waited to allow the sample and the base 300 to preheat or cool to the set temperature before the impact test is performed. The temperature of the sample during the impact test is controlled by the semiconductor cooling sheet 410. During the impact test, the sample can be heated or cooled to a preset temperature, and then the sample is impacted by a pendulum impact tester, and the impact toughness value of the sample is recorded. Studying the impact toughness performance of the sample material at different temperatures can provide a reliable basis for the safe application of the material in different environments.

[0037] Continuing to refer to FIG. 1 , in an exemplary embodiment, the impact member 200 includes a swing arm 210 and a pendulum 220, wherein the first end of the swing arm 210 is rotatably connected to the support member 100, and the pendulum 220 is connected to the second end of the swing arm 210, and when the swing arm 210 rotates to a preset position, the pendulum 220 impacts the sample to be tested. A control system is added to form a pendulum impact tester by means of the swing arm 210, the pendulum 220 and the support member 100, and test parameters such as the pendulum mass, the drop height, the impact speed, etc. are set according to the test requirements. Then, the pendulum is released by the control system, so that it falls freely and impacts the sample to be tested. After the impact, the deformation of the material, such as cracks, ruptures, etc., can be observed and recorded.

[0038] In addition, referring to FIG1 , the pendulum impact tester may also be provided with an indicator 600, which is used to display the impact test information of the sample to be tested. The indicator can be used to visualize the impact test information. By equipping with corresponding measurement, control and data processing systems, parameters such as impact force, residual deformation, fracture mode, etc. can be measured, and the test data can be analyzed and processed, and the analysis and processing results can be displayed through the indicator 600. According to actual needs, the pendulum impact tester may have different working principles and designs to adapt to different materials and test requirements.

[0039] In an exemplary high temperature shock test, the power is turned on, the temperature is set to 45°C through the temperature control unit 420, the semiconductor cooling sheet 410 starts to work and transfers heat to the base 300, the test sample is placed on the base 300, and a period of time is waited for the sample to heat up to the predetermined temperature before the shock test is carried out.

[0040] In an exemplary low-temperature impact test, the power is turned on and the temperature is set to -20°C through the temperature control unit 420. The temperature control unit 420 adjusts the positive and negative poles of the current input to the semiconductor cooling chip 410 to be reversed. The semiconductor cooling chip cools the base 300 and performs an impact test after the temperature is cooled to a predetermined temperature.

[0041] In an exemplary embodiment, the impact test device also includes a temperature detection module 700 and a display module 710, the temperature detection module 700 and the display module 710 are electrically connected, the temperature detection module 700 is used to detect the temperature of the sample to be tested, and transmit the temperature signal to the display module 710, and the display module 710 is used to display the temperature detected by the temperature detection module 700. The temperature detection module 700 may include a temperature sensor and related circuits. The temperature sensor may be a thermistor (such as an NTC thermistor), a thermocouple, a thermistor, an infrared sensor, etc. These sensors can sense the surrounding temperature and convert it into an electrical signal. The working principle of the temperature detection module is to convert the temperature into a voltage or current signal by connecting the temperature sensor to the corresponding circuit. Then, the signal can be read and processed by a microprocessor, a single-chip microcomputer or other controller.

[0042] Optionally, the temperature detection module 700 includes an infrared temperature measuring probe, which faces the sample to be tested and is used to detect the temperature of the sample to be tested. An infrared temperature measuring probe, also known as an infrared thermometer or an infrared thermal imager, is a device used to non-contactly measure the surface temperature of an object. It uses the principle of infrared radiation to receive infrared radiation emitted by the sample to be tested through the probe and convert it into a temperature value.

[0043] The infrared temperature probe consists of an infrared sensor and corresponding electronic components. The infrared sensor can sense the infrared radiation emitted by the sample to be tested and convert it into an electrical signal. The electronic components amplify, filter and process the received signal and finally convert it into a temperature value.

[0044] In this way, after the temperature of the sample to be tested is adjusted by the semiconductor refrigeration sheet, the temperature of the sample to be tested can be visualized, which is convenient for the user to observe the temperature of the sample to ensure accurate test results.

[0045] In another embodiment, the impact test device further includes a heat preservation cover, which is detachably connected to the base 300 and can accommodate the sample to be tested in the cover of the heat preservation cover. After the temperature of the base 300 is adjusted to the specified temperature, the sample can be covered by the heat preservation cover to reduce the heat exchange between the sample and the external environment, and the temperature displayed by the display module can be observed after a period of time, and then the heat preservation cover can be removed to perform the impact test. Optionally, the heat preservation cover can be a square cover.

[0046] In one embodiment, the impact test device also includes a cooling mechanism, which is used to cool the end of the semiconductor refrigeration plate away from the sample to be tested. When the semiconductor refrigeration plate 410 is used to cool the sample to be tested, the direction of the current is controlled so that the end of the semiconductor refrigeration plate 410 close to the sample to be tested is for cooling, and the end away from the sample to be tested is for heating. The heating end is cooled by the cooling mechanism to take away the heat from the lower side of the semiconductor refrigeration plate, that is, the heat away from the end of the sample to be tested, thereby improving the cooling efficiency and limit. Optionally, the cooling mechanism includes an air-cooled radiator or a liquid-cooled radiator. Among them, the air-cooled radiator can be a fan, etc., and the liquid-cooled radiator can be water-cooled, etc.

[0047] Air cooling is a method of reducing the temperature of a device by air flow, using a fan or air duct to blow the surrounding air over the heat source, thereby taking away the heat. Air cooling usually uses a combination of a heat sink, a radiator and a fan, where the heat sink or radiator transfers heat to the air, and the fan provides air flow. Water cooling is a method of reducing the temperature of a device by circulating water, using a water-cooled head or a cooling block in contact with the heat source to transfer the generated heat to the water. The water then circulates through the pipe and dissipates the heat into the surrounding air through the radiator. When the cooling mechanism is liquid cooling, as shown in Figure 1, the semiconductor refrigeration sheet 410 is adjacent to the cooling tube 800, and the semiconductor refrigeration sheet 410 can be cooled by passing a coolant into the cooling tube 800. Optionally, the coolant can be water.

[0048] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0049] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An impact test device, characterized in that: The impact test device comprises: Supporting parts; An impact member, disposed on one side of the support member and rotatably connected to the support member; a base, used for supporting the sample to be tested, the base being arranged on the same side as the impact member and below the impact member so that the sample to be tested is located in the rotation path of the impact member; and The temperature control module comprises a semiconductor cooling sheet and is used for adjusting the temperature of the base through the semiconductor cooling sheet.

2. The impact test device according to claim 1, characterized in that: The temperature control module includes a temperature control unit. The semiconductor refrigeration chip is adjacent to the base. The temperature control unit is electrically connected to the semiconductor refrigeration chip and is used to control the direction of the current input to the semiconductor refrigeration chip.

3. The impact test device according to claim 2, characterized in that: The space between the semiconductor cooling sheet and the base is filled with heat-conducting material.

4. The impact test device according to claim 1, characterized in that: The impact member includes a swing arm and a pendulum, wherein a first end of the swing arm is rotatably connected to the support member, and the pendulum is connected to a second end of the swing arm. When the swing arm rotates to a preset position, the pendulum impacts the sample to be tested.

5. The impact test device according to claim 1 or 4, characterized in that: The impact test device further comprises an indicator, and the indicator is used to display the impact test information of the sample to be tested.

6. The impact test device according to claim 1, characterized in that: The impact test device further comprises a temperature detection module and a display module. The temperature detection module is used to detect the temperature of the sample to be tested, and the display module is used to display the temperature detected by the temperature detection module.

7. The impact test device according to claim 6, characterized in that: The temperature detection module comprises an infrared temperature measuring probe, which faces the sample to be tested and is used to detect the temperature of the sample to be tested.

8. The impact test device according to claim 1 or 7, characterized in that: The impact test device further comprises a heat-insulating cover, which is detachably connected to the base and can accommodate the sample to be tested in the cover.

9. The impact test device according to claim 1, characterized in that: The impact test device further comprises a cooling mechanism, which is used to cool an end of the semiconductor refrigeration plate away from the sample to be tested.

10. The impact test device according to claim 9, characterized in that: The cooling mechanism includes an air-cooled radiator or a liquid-cooled radiator.

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