Multilayer probe ceramic ring for probe card processing

Abstract

The utility model relates to the technical field of probe cards, and discloses a multilayer probe ceramic ring for probe card processing, which comprises a PCB (printed circuit board), a connecting block is fixedly arranged in the middle of the front end face of the PCB, a stepped ceramic ring is arranged at the bottom of the front end face of the connecting block, and stepped epoxy resin is arranged at the bottom of the stepped ceramic ring. According to the utility model, by utilizing the advantages of machining and forming of the ceramic ring, especially the effect which cannot be achieved by filling epoxy resin in stepped application, the structure and the performance of the appearance are joined, the cost and the stability of the product are optimized, the assembly efficiency of the product is improved, and the effect of optimizing and stabilizing the structure is obvious; by changing the structure of the stepped ceramic ring, the assembly process and the structural performance are optimized, and the cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of probe cards, in particular to a multi-layer probe ceramic ring for processing probe cards. Background Art

[0002] The probe card is the interface between the chip under test and the tester in wafer testing. It is mainly used to make preliminary measurements of the chip's electrical performance before chip segmentation and packaging, and to screen out defective chips before proceeding with the subsequent packaging process. Ceramic rings are important components of probe cards. The amount used directly affects the production cost and structural performance of the product. Ceramic rings are the connecting component between epoxy resin and PCB board. The precise size determines the height, stability and finished product control of the product.

[0003] The original ceramic ring is designed to be bonded with epoxy resin on a flat surface. For probe cards with large layer differences, too much epoxy resin is required. Since epoxy resin is in a sol state, it is not conducive to shape forming. During the coating process, it cannot be accumulated into the required size at one time, and multiple coatings are required to ensure consistent layer differences.

[0004] Therefore, those skilled in the art provide a multi-layer probe ceramic ring for probe card processing to solve the problems raised in the above background technology. Utility Model Content

[0005] The purpose of the utility model is to solve the shortcomings existing in the prior art, and a multi-layer probe ceramic ring for probe card processing is proposed, which utilizes the advantages of ceramic ring machining and molding, especially in stepped applications to fill the effect that epoxy resin cannot achieve, and plays a connecting role in appearance, structure and performance. At the same time, it optimizes the cost and stability of the product, improves the product assembly efficiency, and has a significant effect on optimizing the stable structure. By changing the stepped ceramic ring structure, the assembly process and structural performance are optimized and the cost is reduced.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A multilayer probe ceramic ring for probe card processing comprises a PCB board, a connection block is fixedly arranged in the middle of the front end surface of the PCB board, a stepped ceramic ring is arranged at the bottom of the front end surface of the connection block, and a stepped epoxy resin is arranged at the bottom of the stepped ceramic ring.

[0008] Through the above technical solution, the ceramic ring is a component that connects the epoxy resin and the PCB board. The connection between the ceramic ring and the stepped epoxy resin is stepped. After installation, it plays a connecting role in the appearance structure and performance, while optimizing the cost and stability of the product, improving the product assembly efficiency, and reducing the cost.

[0009] Further, a plurality of probes are arranged on the epoxy resin;

[0010] Through the above technical solution, the probe is used to detect the chip.

[0011] The utility model has the following beneficial effects:

[0012] 1. The utility model proposes a multi-layer probe ceramic ring for probe card processing, which takes advantage of the molding of ceramic ring machining, especially in stepped applications to fill the effect that epoxy resin cannot achieve, plays a connecting role in appearance, structure and performance, and optimizes product cost and stability, improves product assembly efficiency, and significantly optimizes the stable structure. By changing the stepped ceramic ring structure, the assembly process and structural performance are optimized and the cost is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is an exploded view of a multi-layer probe ceramic ring for probe card processing proposed by the utility model;

[0014] Figure 2 This is a right side isometric view of a multi-layer probe ceramic ring for probe card processing proposed by the utility model;

[0015] Figure 3 This is a left side axonometric view of a multilayer probe ceramic ring for probe card processing proposed by the utility model;

[0016] Figure 4 This is a right side view of a multi-layer probe ceramic ring for probe card processing proposed by the utility model;

[0017] Figure 5 This is a front view of a multi-layer probe ceramic ring for probe card processing proposed by the utility model.

[0018] Legend:

[0019] 1. PCB board; 2. Connecting block; 3. Stepped ceramic ring; 4. Probe; 5. Stepped epoxy resin. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. In the description of this application, it should be noted that the terms used here are only for describing specific implementations, and are not intended to limit the exemplary implementations according to the present application. For ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The techniques, methods and equipment known to ordinary technicians in the relevant fields may not be discussed in detail, but where appropriate, the techniques, methods and equipment should be regarded as part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0021] Reference Figure 1-5 , an embodiment provided by the utility model:

[0022] A multilayer probe ceramic ring for probe card processing comprises a PCB board 1, a connecting block 2 is fixedly arranged in the middle of the front end surface of the PCB board 1, a stepped ceramic ring 3 is arranged at the bottom of the front end surface of the connecting block 2, and a stepped epoxy resin 5 is arranged at the bottom of the stepped ceramic ring 3. The ceramic ring is a component connecting the epoxy resin and the PCB board 1. The connection between the ceramic ring and the stepped epoxy resin 5 is stepped. After installation, the ceramic ring plays a connecting role in the appearance structure and performance, and at the same time optimizes the cost and stability of the product, improves the product assembly efficiency, and reduces the cost.

[0023] A plurality of probes 4 are arranged on the stepped epoxy resin 5 , and the probes 4 are used to detect the chip.

[0024] Working principle: The ceramic ring is a component that connects the epoxy resin and the PCB board 1. The opposite sides of the stepped ceramic ring 3 and the stepped epoxy resin 5 are both stepped. They match each other after installation, playing a connecting role in appearance, structure and performance. At the same time, it optimizes the cost and stability of the product, improves the product assembly efficiency, and reduces the cost.

[0025] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A multilayer probe ceramic ring for probe card processing, comprising a PCB board (1), characterized in that: A connection block (2) is fixedly arranged in the middle of the front end surface of the PCB board (1), a stepped ceramic ring (3) is arranged at the bottom of the front end surface of the connection block (2), a stepped epoxy resin (5) is arranged at the bottom of the stepped ceramic ring (3), and a plurality of probes (4) are arranged on the epoxy resin (5).

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