Electronic paper display module structure
A three-layer structure for electronic paper modules with the VcomITO layer on the PS film addresses edge damage issues by avoiding organic solvent cleaning of the Eink paper film, improving reliability under high-temperature conditions.
Patent Information
- Application Number
- CN202420290471.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-09
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-02-09
AI Technical Summary
Existing electronic paper modules suffer from edge damage of silver paste holes due to organic solvent diffusion during high-temperature testing, which affects display reliability.
A new structural design for the electronic paper module with a three-layer structure, where the VcomITO layer is placed on the PS film instead of the Eink paper film, and silver paste holes are created through laser half-cutting and cleaning on the PS film followed by full-cutting of the Eink paper film, eliminating the need for organic solvent cleaning of the Eink paper film.
This design significantly reduces edge damage during high-temperature verification, enhancing the reliability of the electronic paper module without increasing production costs.
Smart Images
Figure CN222281010U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic paper display module technology, and in particular to a new structural design scheme for an electronic paper display module. Background Art
[0002] Displays are ubiquitous in our lives, and different application areas have different requirements for display modules. For example, the mobile phone industry requires LCD / OLED modules to have high resolution and color saturation, while the electronic price tag industry requires electronic paper display modules to have a long service life and high reliability. Under the reliability test conditions of ≥60℃ high temperature for 1080 hours, silver paste edge damage can easily enter the display area, affecting the reliability quality of the electronic paper module.
[0003] The function of the silver paste holes in an electronic paper module is to conduct the Vcom voltage of the TFT backplane to the VcomITO electrode of the Eink paper film, creating a voltage difference between the TFT backplane pixel ITO layer and the Eink paper film VcomITO layer, thus driving the electronic paper display. Traditional electronic paper modules fabricate the VcomITO layer on the Eink paper film. The Eink paper film needs to undergo a laser half-cutting process followed by cleaning with organic solvents (70% alcohol + 30% pure water) to create the silver paste holes. During the organic solvent cleaning process, the organic solvent easily seeps into the microcup of the Eink paper film, resulting in poor edge damage of the silver paste holes. Under long-term high-temperature reliability testing conditions, the organic solvent further diffuses into the display area, and the edge damage accelerates at high temperatures, causing the edge damage of the silver paste holes to easily enter the display area, significantly affecting the display effect of the electronic paper module. Therefore, it is necessary to improve the edge damage resistance of the silver paste holes to enhance the reliability of the electronic paper module. Utility Model Content
[0004] (a) Technical problems to be solved
[0005] To address the shortcomings of existing technologies, this utility model provides a new structural design scheme for electronic paper display modules, which solves the problem that under long-term high-temperature testing conditions, organic solvents further diffuse into the display area and edge damage accelerates at high temperatures, leading to silver paste hole edge damage easily entering the display area and significantly affecting the display effect of the electronic paper module.
[0006] (2) Technical solution
[0007] To achieve the above objectives, this utility model is implemented through the following technical solution: a new design scheme for an electronic paper display module structure, wherein the electronic paper display module includes a three-layer structure of a TFT backplane, an Eink paper film, and a PS film. A VcomITO layer is disposed inside the PS film, and an electronic ink layer is disposed inside the Eink paper film. The VcomITO layer is located on the upper surface of the PS film. The silver paste holes are produced by a process of laser half-cutting of the PS film, organic solvent cleaning of the silver paste holes of the PS film, and laser full-cutting of the Eink paper film.
[0008] As a preferred embodiment of this utility model, the TFT backplate mainly provides the driving voltage, and the TFT backplate is provided with TFTVcom electrodes.
[0009] As a preferred technical solution of this utility model, the PS film is attached to the surface of the Eink paper film and is located on the top layer of the electronic paper module. The PS film mainly serves to block water vapor and shield ultraviolet rays.
[0010] As a preferred technical solution of this utility model, the Eink paper film is an electronic paper display carrier, and the PS film is used to protect the Eink paper film.
[0011] As a preferred embodiment of this invention, the Eink paper membrane does not require cleaning with organic solvents, and the Eink paper membrane microcup can avoid direct corrosion by organic solvents.
[0012] (3) Beneficial effects
[0013] 1. The traditional process of creating silver paste holes using a laser half-cut on the Eink paper membrane followed by organic solvent cleaning of the silver paste holes is changed to a process of creating silver paste holes using a laser half-cut on the PS membrane followed by organic solvent cleaning of the silver paste holes on the PS membrane followed by a full laser cut on the Eink paper membrane. This eliminates the need for organic solvent cleaning of the Eink paper membrane, thus avoiding direct corrosion of the Eink paper membrane microcup by organic solvents.
[0014] 2. The entire production process can be completed simply by adjusting the cutting methods and process steps of the Eink paper film and PS film. Without increasing the cost of the process equipment, the degree of edge damage of the silver paste hole during high-temperature verification of electronic paper module reliability can be significantly reduced, which can effectively improve the reliability quality of electronic paper display module. Attached Figure Description
[0015] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings.
[0016] Figure 1 This is an overall structural diagram of the present invention;
[0017] Legend: 1. PS film; 2. Eink paper film; 3. TFT backplane; 4. Vcom ITO layer; 5. Electronic ink layer; 6. TFT Vcom electrode. DETAILED DESCRIPTION
[0018] This application provides a novel structural design for an electronic paper display module, effectively solving the problem that under prolonged high-temperature testing conditions, organic solvents further diffuse into the display area, and edge damage accelerates at high temperatures, leading to easy entry of silver paste hole edge damage into the display area and significantly affecting the display effect of the electronic paper module. The VcomITO layer 4 is changed from being traditionally placed on the Eink paper film 2 to being placed on the PS film 1. The traditional process of creating silver paste holes by laser half-cutting of the Eink paper film 2 followed by organic solvent cleaning of the silver paste holes is changed to a process of laser half-cutting of the PS film 1 followed by organic solvent cleaning of the silver paste holes of the PS film 1 followed by full-cutting of the Eink paper film 2.
[0019] Example
[0020] like Figure 1 As shown, the technical solution in this application embodiment effectively solves the problem that under long-term high-temperature test conditions, organic solvents further diffuse into the display area and edge damage accelerates failure at high temperatures, causing silver paste hole edge damage to easily enter the display area, thus significantly affecting the display effect of the electronic paper module. The overall idea is as follows:
[0021] To address the problems existing in the prior art, this utility model provides a new structural design scheme for an electronic paper display module. The electronic paper display module includes a three-layer structure of a TFT backplate 3, an Eink paper film 2, and a PS film 1. A VcomITO layer 4 is disposed within the PS film 1, and an electronic ink layer 5 is disposed within the Eink paper film 2. The VcomITO layer 4 is located on the upper surface of the PS film 1. The silver paste holes are created by a process of laser half-cutting of the PS film 1, organic solvent cleaning of the silver paste holes of the PS film 1, and laser full-cutting of the Eink paper film 2. The VcomITO layer 4, which was traditionally made on the Eink paper membrane 2, has been changed to be made on the PS membrane 1. The traditional process of creating silver paste holes by laser half-cutting of Eink paper membrane 2 and organic solvent cleaning of silver paste holes in Eink paper membrane 2 has been changed to creating silver paste holes by laser half-cutting of PS membrane 1, organic solvent cleaning of silver paste holes in PS membrane 1, and laser full-cutting of Eink paper membrane 2. Eink paper membrane 2 no longer needs to be cleaned with organic solvents, thus avoiding direct corrosion of the microcup of Eink paper membrane 2 by organic solvents.
[0022] The TFT backplate 3 mainly provides the driving voltage. The TFT backplate 3 is equipped with TFTVcom electrodes 6. The PS film 1 is attached to the surface of the Eink paper film 2 and is located on the top layer of the electronic paper module. Based on the existing process, the entire production process can be completed by simply adjusting the cutting method and process steps of the Eink paper film 2 and the PS film 1. The PS film 1 mainly serves to block moisture and shield ultraviolet rays.
[0023] Eink film 2 is the carrier of electronic paper display. PS film 1 is used to protect Eink film 2. Eink film 2 does not need to be cleaned with organic solvents. The microcup of Eink film 2 can avoid direct corrosion by organic solvents. Without increasing the cost of the process equipment, it can significantly reduce the edge damage of silver paste holes in the high-temperature verification of electronic paper module reliability, and effectively improve the reliability quality of electronic paper display module.
[0024] Working principle:
[0025] By changing the traditional placement of the VcomITO layer 4 on the Eink paper film 2 to its placement on the PS film 1, the traditional process of creating silver paste holes by laser half-cutting of the Eink paper film 2 followed by organic solvent cleaning of the silver paste holes is replaced with a process of laser half-cutting of the PS film 1 followed by organic solvent cleaning of the silver paste holes, and then laser full-cutting of the Eink paper film 2. This eliminates the need for organic solvent cleaning of the Eink paper film 2, thus avoiding direct corrosion of the microcup by organic solvents. Based on existing processes, only the cutting methods and process steps of the Eink paper film 2 and PS film 1 need to be adjusted to complete the entire production process. Without increasing the cost of the process equipment, the edge damage of the silver paste holes during high-temperature verification of electronic paper module reliability can be significantly reduced, effectively improving the reliability quality of electronic paper display modules.
[0026] Finally, it should be noted that the above embodiments are merely examples for clearly illustrating the present invention and are not intended to limit the implementation. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.
Claims
1. An electronic paper display module structure, characterized in that: The electronic paper display module comprises a three-layer structure of a TFT back panel (3), an Eink paper film (2) and a PS film (1); Wherein, a VcomITO layer (4) is arranged in the PS film (1), and an electronic ink layer (5) is arranged in the Eink paper film (2).
2. An electronic paper display module structure as claimed in claim 1, characterized in that: The VcomITO layer (4) is located on the upper surface of the PS film (1); The silver paste holes are manufactured by laser half-cutting the silver paste holes of the PS film (1) + cleaning the silver paste holes of the PS film (1) with an organic solvent + laser full-cutting the silver paste holes of the Eink paper film (2).
3. An electronic paper display module structure as claimed in claim 2, characterized in that: The TFT backplane (3) mainly provides a driving voltage; Wherein, a TFT Vcom electrode (6) is arranged in the TFT back plate (3).
4. The electronic paper display module structure according to claim 1, characterized in that: The PS film (1) is attached to the surface of the Eink paper film (2) and is located at the top layer of the electronic paper module; The PS film (1) mainly blocks water vapor and shields ultraviolet rays.
5. The electronic paper display module structure according to claim 1, characterized in that: The Eink paper film (2) is an electronic paper display carrier; Wherein, the PS film (1) is used to protect the Eink paper film (2).
6. The electronic paper display module structure according to claim 1, characterized in that: The Eink paper film (2) does not need to be cleaned with an organic solvent; The Eink paper film (2) microcup can avoid direct erosion by organic solvents.