Thermoelectric separation copper substrate of new energy automobile

The copper substrate design for new energy vehicles addresses inefficient heat transfer and thickness issues by utilizing direct heat transfer and adjustable cooling through a contact portion, capillary heat pipes, and a heat-conducting filling layer, improving thermal conductivity and installation convenience.

CN222283554UActive Publication Date: 2024-12-31ZHEJIANG DEJIA ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202420039664.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-01-08
Publication Date
2024-12-31
Estimated Expiration
2034-01-08

AI Technical Summary

Technical Problem

Existing copper substrates for high-power electronic components in new energy vehicles suffer from inefficient heat transfer and increased thickness due to multiple layers, affecting installation and heat dissipation performance.

Method used

A copper substrate design with an upward protruding contact portion, semi-cured sheet thermal conductive adhesive film, capillary heat pipes, and a heat dissipation fan, along with a heat-conducting filling layer and fastening bolts, allowing direct heat transfer and adjustable cooling plate positioning.

Benefits of technology

Enhances thermal conductivity, improves heat dissipation efficiency, and simplifies installation by reducing the number of transfer layers and allowing flexible cooling plate positioning, thus extending product life and enhancing adaptability to installation spaces.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of copper substrates, in particular to a thermoelectric separation copper substrate for a new energy automobile, which comprises a copper substrate main body, the middle part of the upper surface of the copper substrate main body is provided with a contact part protruding upwards, and the upper surface of the copper substrate main body is sequentially provided with a prepreg heat-conducting adhesive film and an epoxy plate for wiring from bottom to top corresponding to the contact part; according to the utility model, through a mode of separating the thermal layer from the circuit layer, thermogravimetric heat generated by components can be directly conducted out through the heat dissipation area, the heat conduction efficiency is greatly improved, so that the service life of the product is prolonged, and under the action of the capillary heat pipe, the position of the refrigeration sheet can be adjusted, and the product quality is improved. The copper substrate has good adaptability to the installation space when being used, and under the arrangement of the pressing piece, personnel only need to rotate the two bolts when installing the copper substrate, so that the convenience of installing the copper substrate is improved.
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