Chip mounting heating protection device

Abstract

The utility model relates to the technical field of chip mounting, and discloses a chip mounting heating protection device, which comprises a protection mechanism, a fixing mechanism and a mounting mechanism, the protection mechanism is positioned outside the mounting mechanism, the fixing mechanism is positioned below the mounting mechanism, the protection mechanism comprises a chip body and a heating block, and the chip body is positioned below the fixing mechanism. The chip body is adsorbed at the bottom end of the mounting mechanism, the heating blocks are fixedly mounted at the outer end of the mounting mechanism, and the heating blocks are symmetrically distributed. According to the chip mounting heating protection device, the protection mechanism is installed, the position of the chip body is limited through the heat insulation suction head, the position of the heating block is limited through the heat insulation suction head, the heat insulation suction head can conveniently suck the chip body to press and position the chip body on the circuit board, and the heating block is used for heating pins of the chip body to fix the pins on the circuit board; in the mounting process, the heat insulation suction head can isolate heat of the heating block to protect the chip body, the chip body can be accurately positioned, and influence on use caused by mounting deviation is prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of chip mounting, in particular to a chip mounting heating protection device. Background Art

[0002] Chip mounting refers to fixing the chip pins firmly on the circuit board by heating. During the chip mounting process, the chip usually needs to be protected to prevent it from being damaged by high temperature.

[0003] The existing publication number CN219628257U discloses a chip mounting heating protection device, including: a bracket, on which a protection component is installed; the protection component includes a protection cover, on which a connection block is embedded, the right side of the connection block is fixedly connected to one end of a spring, and the other end of the spring is fixedly connected to an auxiliary groove, the left end face of the auxiliary groove is provided with a triangular cross-section notch, in which a non-return shaft is installed, and a non-return block is installed on the non-return shaft. In the utility model, the protection cover in the protection component is provided with a spacing adjustment slot, and the spacing of the spacing adjustment slot is equal to the spacing of the chip pins, which can be adjusted according to the size of the chip to be protected, and then used for protection, and the protection cover has strong universality; the protection cover is provided with heat insulation cotton adapted to the pins, which has good tightness, compact overall structure, and good heat insulation effect, thereby solving the protection problem of chip mounting heating;

[0004] However, the existing chip mounting heating protection device places the chip on the required position of the circuit board, then manually covers the chip with a protective cover, and then heats the pins of the chip to fix it. During the chip mounting process, the circuit board and the chip cannot be positioned, resulting in the chip being easily offset during mounting. The mounting accuracy is low, which can easily cause product quality problems and affect use. In addition, the entire mounting process needs to be manual, and the mounting efficiency is low. Utility Model Content

[0005] 1. Technical issues to be solved

[0006] The purpose of the utility model is to provide a chip mounting heating protection device to solve the problem that the existing chip mounting heating protection device proposed in the above background technology places the chip on the required position of the circuit board, then manually covers the chip with a protective cover, and then heats the pins of the chip to fix it. During the chip mounting process, the circuit board and the chip cannot be positioned, resulting in the chip being easily offset during mounting, the mounting accuracy is low, and it is easy to cause product quality problems, affecting use, and the mounting process requires manual operation, resulting in low mounting efficiency.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a chip mounting heating protection device, comprising a protection mechanism, a fixing mechanism and a mounting mechanism, wherein the protection mechanism is located outside the mounting mechanism, the fixing mechanism is located below the mounting mechanism, the protection mechanism comprises a chip body and a heating block, the chip body is adsorbed on the bottom end of the mounting mechanism, the heating block is fixedly installed on the outer end of the mounting mechanism, and the heating blocks are symmetrically distributed.

[0009] Preferably, the fixing mechanism includes a mounting seat, an XY-axis movable slide, a mounting plate 1, a bidirectional screw, a limit block, a mounting plate 2, a slide rod and a clamping plate. The XY-axis movable slide is fixedly mounted on the top of the mounting seat. The position of the XY-axis movable slide is limited by the mounting seat, which facilitates fixing the XY-axis movable slide to enable the circuit board to move forward, backward, left and right, thereby enabling the chip to be mounted at all positions on the circuit board.

[0010] Preferably, the mounting plate 1 is fixedly mounted on the left end of the XY axis moving slide, the bidirectional screw rod is movably mounted on the inner end of the mounting plate 1 and passes through the mounting plate 1, the limit block is fixedly mounted on the outer end of the bidirectional screw rod, the position of the mounting plate 1 is limited by the XY axis moving slide, the mounting plate 1 limits the position of the bidirectional screw rod, and the bidirectional screw rod limits the position of the limit block, so that the mounting plate 1 is fixedly mounted to perform the installation function, thereby facilitating the limit block to position the bidirectional screw rod on the mounting plate 1, and the limit block can be rotated to rotate the bidirectional screw rod.

[0011] Preferably, the mounting plate 2 is fixedly mounted on the right end of the XY axis moving slide, and the slide rod is fixedly mounted on the inner end of the mounting plate 2. The position of the mounting plate 2 is limited by the XY axis moving slide, and the mounting plate 2 limits the position of the slide rod, so that the mounting plate 2 is fixed to fix the slide rod, thereby facilitating the limiting and sliding functions.

[0012] Preferably, the clamping plates are threadedly connected to the outside of the bidirectional screw and are movably connected to the sliding rod. The clamping plates are symmetrically distributed, and the positions of the clamping plates are limited by the bidirectional screw and the sliding rod, so that the bidirectional screw can be rotated to drive the two clamping plates to slide on the sliding rod for loosening and tightening, thereby clamping the circuit board and positioning it on the XY-axis moving slide, so that circuit boards of different specifications can be used conveniently.

[0013] Preferably, the mounting mechanism includes a mounting frame, a cylinder, a heat-insulating suction head, an air connection head and a laser marking light. The mounting frame is fixedly mounted on the top of the XY-axis movable slide. The cylinder is fixedly mounted on the top of the mounting frame and passes through the mounting frame. The position of the mounting frame is limited by the XY-axis movable slide. The mounting frame limits the position of the cylinder, so that the mounting frame is fixed to fix the cylinder, thereby facilitating the operation of the cylinder.

[0014] Preferably, the thermal insulation suction head is fixedly mounted on the transmission end of the cylinder and is located at the top of the chip body, and the air connecting head is fixedly arranged on the outer end of the thermal insulation suction head. The position of the thermal insulation suction head is limited by the cylinder, and the thermal insulation suction head limits the position of the air connecting head, so that the pneumatic device is connected to the air connecting head to control the thermal insulation suction head for suction and release, so that the chip can be sucked, and the electric cylinder is used to drive the thermal insulation suction head to descend for mounting.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. The chip mounting heating protection device is equipped with a protection mechanism, which defines the position of the chip body by a heat-insulating suction head, and defines the position of the heating block by a heat-insulating suction head, so that the heat-insulating suction head can suck the chip body and press it to position it on the circuit board, and use the heating block to heat the pins of the chip body to fix it on the circuit board. During the mounting process, the heat-insulating suction head can isolate the heat of the heating block to protect the chip body, and can accurately position the chip body to prevent the chip body from being offset and affecting its use;

[0017] 2. The chip mounting heating protection device is equipped with a fixing mechanism, and the position of the XY axis moving slide is limited by the mounting seat, so that the circuit board can be moved forward, backward, left and right by fixing the XY axis moving slide, so that the chip can be mounted at all positions on the circuit board. The position of the mounting plate one is limited by the XY axis moving slide, and the mounting plate one limits the position of the bidirectional screw rod, and the bidirectional screw rod limits the position of the limit block, so that the mounting plate one can be fixed for installation, so that the limit block can position the bidirectional screw rod on the mounting plate one, and the limit block can be rotated to rotate the bidirectional screw rod, and the position of the mounting plate two is limited by the XY axis moving slide, and the mounting plate two limits the position of the slide rod, so that the mounting plate two can be fixed to fix the slide rod, so as to facilitate the limiting and sliding functions, and the position of the clamping plate is limited by the bidirectional screw rod and the slide rod, so that the bidirectional screw rod can be rotated to drive the two clamping plates to slide on the slide rod for loosening and tightening activities, so that the circuit board can be clamped and positioned on the XY axis moving slide, so that circuit boards of different specifications can be used;

[0018] 3. The chip mounting heating protection device is installed with a mounting mechanism, which limits the position of the mounting frame through the XY axis moving slide, and the mounting frame limits the position of the cylinder, so that it is convenient to fix the mounting frame to fix the cylinder, thereby facilitating the operation of the cylinder, and the position of the heat-insulating suction head is limited by the cylinder, and the heat-insulating suction head limits the position of the air connection head, so that the pneumatic device is connected to the air connection head to control the heat-insulating suction head for suction and release, so that the chip can be sucked, and the heat-insulating suction head is driven down by the electric cylinder to perform mounting work, and the position of the laser marking light is limited by the mounting frame, so that the laser marking light is fixed to always mark the position of the mounting point, so that the chip can be accurately mounted at the required position of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the fixing mechanism structure of the utility model;

[0021] Figure 3 This is a schematic diagram of the mounting mechanism structure of the utility model;

[0022] Figure 4 This is a schematic diagram of the protection mechanism structure of the utility model;

[0023] Figure 5 It is a schematic diagram of the cross-sectional structure of the protection mechanism of the utility model.

[0024] In the figure: 1. protection mechanism; 101. chip body; 102. heating block; 2. fixing mechanism; 201. mounting seat; 202. XY axis moving slide; 203. mounting plate 1; 204. bidirectional screw rod; 205. limit block; 206. mounting plate 2; 207. slide rod; 208. clamping plate; 3. mounting mechanism; 301. mounting frame; 302. cylinder; 303. heat insulation suction head; 304. air connection head; 305. laser marking light. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figure 1-Figure 5 The utility model provides a technical solution: a chip mounting heating protection device, comprising a protection mechanism 1, a fixing mechanism 2 and a mounting mechanism 3, wherein the protection mechanism 1 is located outside the mounting mechanism 3, the fixing mechanism 2 is located below the mounting mechanism 3, the protection mechanism 1 comprises a chip body 101 and a heating block 102, the chip body 101 is adsorbed on the bottom end of the mounting mechanism 3, the heating block 102 is fixedly installed on the outer end of the mounting mechanism 3, and the heating blocks 102 are symmetrically distributed;

[0027] The fixing mechanism 2 includes a mounting seat 201, an XY axis moving slide 202, a mounting plate 1 203, a bidirectional screw 204, a limit block 205, a mounting plate 206, a slide bar 207 and a clamping plate 208. The XY axis moving slide 202 is fixedly mounted on the top of the mounting seat 201. The position of the XY axis moving slide 202 is limited by the mounting seat 201, so that the XY axis moving slide 202 can be fixed to enable the circuit board to move forward, backward, left and right, so that the chip can be mounted on the circuit board. There is a position, the mounting plate 203 is fixedly installed on the left end of the XY axis moving slide 202, the bidirectional screw rod 204 is movably installed on the inner end of the mounting plate 203 and penetrates the mounting plate 203, and the limit block 205 is fixedly installed on the outer end of the bidirectional screw rod 204. The position of the mounting plate 203 is limited by the XY axis moving slide 202, the mounting plate 203 limits the position of the bidirectional screw rod 204, and the bidirectional screw rod 204 limits the position of the limit block 205, so as to facilitate the fixing of the mounting plate 203 to carry out The installation function facilitates the positioning block 205 to position the bidirectional screw rod 204 on the mounting plate 1 203, and the positioning block 205 can be rotated to rotate the bidirectional screw rod 204. The mounting plate 206 is fixedly mounted on the right end of the XY axis moving slide 202, and the slide bar 207 is fixedly mounted on the inner end of the mounting plate 206. The position of the mounting plate 206 is limited by the XY axis moving slide 202, and the mounting plate 206 limits the position of the slide bar 207, which is convenient for fixing the mounting plate 206 to fix the slide bar 207, so as to facilitate the limiting and sliding action, the clamping plate 208 is threadedly connected to the outer side of the bidirectional screw rod 204 and is movably connected to the slide rod 207, the clamping plates 208 are symmetrically distributed, and the positions of the clamping plates 208 are limited by the bidirectional screw rod 204 and the slide rod 207, so that the bidirectional screw rod 204 is rotated to drive the two clamping plates 208 to slide on the slide rod 207 for loosening and tightening activities, thereby clamping and positioning the circuit board on the XY axis moving slide 202, so that circuit boards of different specifications can be used;

[0028] The mounting mechanism 3 includes a mounting frame 301, a cylinder 302, a heat-insulating suction head 303, an air connection head 304 and a laser marking lamp 305. The mounting frame 301 is fixedly mounted on the top of the XY-axis movable slide 202. The cylinder 302 is fixedly mounted on the top of the mounting frame 301 and penetrates the mounting frame 301. The position of the mounting frame 301 is limited by the XY-axis movable slide 202. The mounting frame 301 limits the position of the cylinder 302, so that the mounting frame 301 is fixed to fix the cylinder 302, thereby facilitating the operation of the cylinder 302. The heat-insulating suction head 303 is fixedly mounted on the transmission end of the cylinder 302 and is located at the top of the chip body 101. The air connection head 304 It is fixedly arranged on the outer end of the heat-insulating suction head 303, and the position of the heat-insulating suction head 303 is limited by the cylinder 302. The heat-insulating suction head 303 limits the position of the air connection head 304, so that the pneumatic device can be connected to the air connection head 304 to control the heat-insulating suction head 303 to suck and release, so that the chip can be sucked, and the heat-insulating suction head 303 can be driven down by the electric cylinder to perform mounting work. The laser marking light 305 is fixedly installed on the inner side of the mounting frame 301, and the position of the laser marking light 305 is limited by the mounting frame 301, so that the laser marking light 305 can be fixed to always mark the position of the mounting point, so that the chip can be accurately mounted at the required position of the circuit board.

[0029] Working principle: The mounting seat 201 limits the position of the XY axis moving slide 202, which is convenient for fixing the XY axis moving slide 202 to enable the circuit board to move forward, backward, left and right, so that the chip can be mounted at all positions on the circuit board. The XY axis moving slide 202 limits the position of the mounting plate 203, the mounting plate 203 limits the position of the bidirectional screw rod 204, and the bidirectional screw rod 204 limits the position of the limit block 205, which is convenient for fixing the mounting plate 203 to perform the installation function, so that the limit block 205 can position the bidirectional screw rod 204 on the mounting plate 203 and can rotate the limit block 2 05 to rotate the bidirectional screw rod 204, the XY axis moving slide 202 limits the position of the second mounting plate 206, the second mounting plate 206 limits the position of the slide bar 207, it is convenient to fix the second mounting plate 206 to fix the slide bar 207, so as to facilitate the limiting and sliding effects, the bidirectional screw rod 204 and the slide bar 207 limit the position of the clamping plate 208, it is convenient to rotate the bidirectional screw rod 204 to drive the two clamping plates 208 to slide on the slide bar 207 for loosening and tightening activities, so as to clamp and position the circuit board on the XY axis moving slide 202, so that circuit boards of different specifications can be used, and the XY axis moving slide 20 2 defines the position of the mounting frame 301, and the mounting frame 301 defines the position of the cylinder 302, so that the mounting frame 301 is fixed to fix the cylinder 302, thereby facilitating the operation of the cylinder 302. The cylinder 302 defines the position of the heat-insulating suction head 303, and the heat-insulating suction head 303 defines the position of the air connection head 304, so that the pneumatic device is connected to the air connection head 304 to control the heat-insulating suction head 303 to suck and release, so that the chip can be sucked, and the heat-insulating suction head 303 is driven down by the electric cylinder to perform the mounting work. The mounting frame 301 defines the position of the laser marking light 305, so that the laser marking light 305 is fixed to start The position of the final mounting point is marked, so that the chip can be accurately mounted at the required position on the circuit board. The heat-insulating suction head 303 defines the position of the chip body 101. The heat-insulating suction head 303 defines the position of the heating block 102, so that the heat-insulating suction head 303 can suck the chip body 101 and press it to position it on the circuit board, and use the heating block 102 to heat the pins of the chip body 101 to fix it on the circuit board. During the mounting process, the heat-insulating suction head 303 can isolate the heat of the heating block 102 to protect the chip body 101, and can accurately position the chip body 101 to prevent the chip body 101 from being offset and affecting its use.

[0030] Finally, it should be noted that the above content is only used to illustrate the technical solution of the utility model, rather than to limit the protection scope of the utility model. Simple modifications or equivalent substitutions of the technical solution of the utility model by ordinary technicians in this field do not deviate from the essence and scope of the technical solution of the utility model.

Claims

1. A chip mounting heating protection device, comprising a protection mechanism (1), a fixing mechanism (2) and a mounting mechanism (3), characterized in that: The protection mechanism (1) is located outside the mounting mechanism (3), the fixing mechanism (2) is located below the mounting mechanism (3), the protection mechanism (1) comprises a chip body (101) and a heating block (102), the chip body (101) is adsorbed on the bottom end of the mounting mechanism (3), the heating block (102) is fixedly mounted on the outer end of the mounting mechanism (3), and the heating blocks (102) are symmetrically distributed.

2. A chip mounting heating protection device according to claim 1, characterized in that: The fixing mechanism (2) comprises a mounting seat (201), an XY axis movable slide (202), a first mounting plate (203), a bidirectional screw rod (204), a limit block (205), a second mounting plate (206), a slide rod (207) and a clamping plate (208); the XY axis movable slide (202) is fixedly mounted on the top of the mounting seat (201).

3. A chip mounting heating protection device according to claim 2, characterized in that: The mounting plate 1 (203) is fixedly mounted on the left end of the XY axis movable slide (202), the bidirectional screw rod (204) is movably mounted on the inner end of the mounting plate 1 (203) and passes through the mounting plate 1 (203), and the limit block (205) is fixedly mounted on the outer end of the bidirectional screw rod (204).

4. The chip mounting heating protection device according to claim 3, characterized in that: The second mounting plate (206) is fixedly mounted on the right end of the XY axis movable slide (202), and the slide bar (207) is fixedly mounted on the inner end of the second mounting plate (206).

5. The chip mounting heating protection device according to claim 4, characterized in that: The clamping plate (208) is threadedly connected to the outer side of the bidirectional screw rod (204) and is movably connected to the sliding rod (207), and the clamping plate (208) is symmetrically divided.

6. The chip mounting heating protection device according to claim 5, characterized in that: The mounting mechanism (3) comprises a mounting frame (301), a cylinder (302), a heat-insulating suction head (303), an air connection head (304) and a laser marking lamp (305); the mounting frame (301) is fixedly mounted on the top of an XY-axis movable slide (202); and the cylinder (302) is fixedly mounted on the top of the mounting frame (301) and penetrates the mounting frame (301).

7. The chip mounting heating protection device according to claim 6, characterized in that: The heat-insulating suction head (303) is fixedly mounted on the transmission end of the cylinder (302) and is located at the top end of the chip body (101), and the air connection head (304) is fixedly arranged on the outer end of the heat-insulating suction head (303).

8. The chip mounting heating protection device according to claim 7, characterized in that: The laser marking light (305) is fixedly mounted on the inner side of the mounting frame (301).

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