Connection terminal, power module, and semiconductor
The connection terminal with deformable side walls addresses the issue of pin breakage in power modules by enhancing stability and durability through elastic deformation, improving the welding connection and extending the terminal's lifespan.
Patent Information
- Application Number
- CN202323503585.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-20
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2033-12-20
AI Technical Summary
Power module pins in semiconductor components are prone to breakage and deformation due to stress issues during welding to a DBC substrate, leading to detachment and failure under impact and vibration.
A connection terminal design featuring a columnar main body with a buffer portion and welding portion, where side walls include bending portions that allow deformation along the axial direction, providing elasticity and stability to withstand vibrations and impacts.
Enhances the stability and durability of the welding connection, reducing the risk of damage and extending the service life of the connection terminal.
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Figure CN222300890U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and in particular to a connection terminal, a power module and a semiconductor. Background Art
[0002] Power modules are semiconductor components used in power electronic circuits, typically in automotive, solar and industrial applications such as inverters and rectifiers.
[0003] In the commonly used power module packaging structure, the pins are long and are prone to breakage due to stress problems after being welded to the DBC substrate (Direct Bonding Copper) during actual use. When the pins are subjected to impact and vibration, the pins and the base are prone to fall off or deform. Utility Model Content
[0004] The embodiments of the present application provide a connection terminal, a power module and a semiconductor, aiming to improve the vibration reduction effect of the connection terminal.
[0005] An embodiment of the first aspect of the present application provides a connecting terminal, which includes: a main body, which is columnar; a buffer portion, which is located at one end of the main body and fixedly connected to the main body, the buffer portion including a bottom wall and two or more side walls, one end of the side wall is connected to the bottom wall, and the other end of the side wall is connected to the main body, and the side wall and the bottom wall are enclosed to form a clearance space; a welding portion, which is connected to one end of the main body and located in the clearance space, and the welding portion is spaced apart from the bottom wall; wherein a bending portion is provided on each side wall so that the side wall can be deformed along the axial direction of the main body.
[0006] According to an implementation of the first aspect of the present application, on the side of the bending portion facing the main body and in a direction approaching the main body, the distance between the two or more side walls gradually decreases.
[0007] According to the implementation of the first aspect of the present application, the two bending portions are located on a side of the side wall close to the bottom wall.
[0008] According to the implementation of the first aspect of the present application, the two side walls are bent toward the main body to form two bent portions.
[0009] According to an implementation of the first aspect of the present application, the bottom wall includes an opening that is arranged through, and the projection of the welding portion along the axial direction of the main body is located within the projection of the opening along the axial direction.
[0010] According to the implementation of the first aspect of the present application, the side walls include two, the two side walls are arranged opposite to each other, and the maximum distance between the two bending portions along the first direction is 1mm-3mm.
[0011] According to an implementation of the first aspect of the present application, the two side walls are symmetrically arranged about the axis of the main body.
[0012] According to an implementation of the first aspect of the present application, a plurality of side walls are spaced apart and distributed around the axis of the main body.
[0013] An embodiment of the second aspect of the present application further provides a power module, comprising a connecting terminal as described in any one of the above.
[0014] An embodiment of the third aspect of the present application further provides a semiconductor, comprising the connection terminal as described above.
[0015] The embodiment of the present application provides a connecting terminal, which includes a columnar main body, one end of which is fixedly connected to the buffer part, and the other end of the main body is crimped into the hole of the circuit board. The buffer part includes a bottom wall and two or more side walls, one end of the side wall is connected to the bottom wall, and the other end of the side wall is connected to the main body, and the side wall and the bottom wall are enclosed to form a clearance space. The welding part is connected to one end of the main body and is located in the clearance space, the welding part is spaced apart from the bottom wall, and the welding part is welded to the bottom wall, and the side of the bottom wall facing away from the welding part is welded to the copper-clad ceramic substrate. Wherein, a bending part is provided on each side wall so that the side wall can be deformed along the axial direction of the main body. In the embodiment provided by the present application, the vibration impact to which the connecting terminal is subjected during use can be mitigated by providing the bending part, so that the welding of the welding part is more stable and firm, not easy to be damaged, and the service life of the connecting terminal is increased. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features.
[0017] Figure 1 This is one of the structural schematic diagrams of a connection terminal provided in an embodiment of the present application;
[0018] Figure 2 for Figure 1 A magnified image from another perspective in the middle;
[0019] Figure 3 for Figure 1 Enlarged view of point B in the middle.
[0020] Description of reference numerals:
[0021] 100-main body;
[0022] 200-buffer; 201-bottom wall; 202-side wall; 203-allowance space;
[0023] 204-bending portion; 205-opening; 206-press-fit pin;
[0024] 300-welding part; 400-DCB substrate; L-maximum distance. DETAILED DESCRIPTION
[0025] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the known structures and technologies are not shown to avoid unnecessary ambiguity in the present application; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.
[0026] In the description of the present application, it should be noted that, unless otherwise specified, "multiple" means more than two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating directions or positional relationships, are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.
[0027] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.
[0028] In order to better understand this application, Figures 1 to 3 The connection terminal of the embodiment of the present application is described in detail.
[0029] Figure 1 One of the structural schematic diagrams of a connection terminal provided in an embodiment of the present application; Figure 2 for Figure 1 A magnified image from another perspective. Figure 3 for Figure 1 Enlarged view of point B in the middle.
[0030] Please also read Figures 1 to 3 The embodiment of the first aspect of the present application provides a connection terminal, which includes: a main body 100, which is columnar. A buffer portion 200, which is located at one end of the main body 100 and fixedly connected to the main body 100, and the buffer portion 200 includes a bottom wall 201 and two or more side walls 202, one end of the side wall 202 is connected to the bottom wall 201, and the other end of the side wall 202 is connected to the main body 100, and the side wall 202 and the bottom wall 201 are enclosed to form a clearance space 203. A welding portion 300 is connected to one end of the main body 100 and is located in the clearance space 203, and the welding portion 300 is spaced apart from the bottom wall 201. Among them, a bending portion 204 is provided on each side wall 202, so that the side wall 202 can be deformed along the axial direction of the main body 100.
[0031] In the embodiments provided in this application, Figure 1 As shown, the connection terminal includes: a columnar main body 100, one end of the main body 100 is fixedly connected to the buffer part 200, and the other end of the main body 100 is crimped into the hole of the circuit board. The buffer part 200 includes a bottom wall 201 and two or more side walls 202, one end of the side wall 202 is connected to the bottom wall 201, and the other end of the side wall 202 is connected to the main body 100, and the side wall 202 and the bottom wall 201 are enclosed to form a clearance space 203. The welding part 300 is connected to one end of the main body 100 and is located in the clearance space 203. The welding part 300 is spaced from the bottom wall 201, and the welding part 300 is welded to the bottom wall 201, and the side of the bottom wall 201 away from the welding part 300 is welded to the copper-clad ceramic substrate. Among them, each side wall 202 is provided with a bending part 204, so that the side wall 202 can be deformed along the axial direction of the main body 100. In the embodiment provided in the present application, the bending portion 204 is provided to mitigate the vibration impact on the connecting terminal during use, and provide elasticity to compensate for the external force applied to the press-fit pin 206, so that the welding of the welding portion 300 is more stable and firm, not easy to be damaged, and the service life of the connecting terminal is increased.
[0032] Optionally, the connection terminal is a pin in the power module, that is, a PIN pin, which is used to be welded to the DBC board, thereby forming an electrical connection with the internal conductive parts of the semiconductor power device to transmit control signals and power signals. Figure 1 and Figure 2As shown, one end of the main body 100 away from the welding portion 300 is a press-fit pin 206 for connecting to the hole of the circuit board. The buffer portion 200 can be an elastic component, which can be a metal material, a thermosetting material containing a continuous conductive medium, or a spring structure made of other materials containing soft metal wires. Those skilled in the art can choose according to actual needs. The DCB board is a copper-clad ceramic substrate. The ultra-thin composite substrate has excellent electrical insulation properties, high thermal conductivity, excellent soft solderability and high adhesion strength. It can also be etched with various patterns like a PCB board and has a large current carrying capacity. Therefore, DCB boards are widely used in semiconductor power modules.
[0033] Optionally, the minimum distance between the welding portion 300 and the bottom wall 201 may be 0.3 mm, which can ensure the stability of welding between the welding portion 300 and the bottom wall 201 .
[0034] In some optional embodiments, on the side of the bent portion 204 facing the main body 100 and in a direction close to the main body 100 , the distance between the two or more side walls 202 gradually decreases.
[0035] In these optional embodiments, on the side of the bending portion 204 facing the main body 100 and in the direction close to the main body 100 , the distance between the two or more side walls 202 gradually decreases, so as to form a more stable structure with the bottom wall 201 .
[0036] In some optional embodiments, the two bending portions 204 are located on a side of the side wall 202 close to the bottom wall 201 .
[0037] In these optional embodiments, since the distance between two or more side walls 202 gradually decreases, the two bending portions 204 are arranged on the side of the side wall 202 close to the bottom wall 201. While the vibration reduction effect is better, the bending portion 204 will not interfere with the welding portion 300.
[0038] In some optional embodiments, the two side walls 202 are bent toward the main body 100 to form two bent portions 204 .
[0039] In these optional embodiments, the two side walls 202 are bent toward the main body 100 to form two bent portions 204, which can alleviate the vibration and impact of the welding portion 300 and the bottom wall 201 during use after welding, thereby extending the service life of the connection terminal.
[0040] In some optional embodiments, the bottom wall 201 includes an opening 205 that is arranged through, and a projection of the welding portion 300 along the axial direction of the main body 100 is located within a projection of the opening 205 along the axial direction.
[0041] In these optional embodiments, the bottom wall 201 includes an opening 205 that is arranged through, the projection of the welding portion 300 along the axis direction of the main body 100 is located within the projection of the opening 205 along the axis direction, and the side of the bottom wall 201 that is away from the welding portion 300 is welded to the DCB substrate. When the welding portion 300 is welded, the solder can be accumulated in the opening, thereby enhancing the welding strength between the welding portion 300 and the DCB substrate.
[0042] Optionally, the bottom wall 201 may include a groove that is recessed away from the welding portion 300, and the projection of the welding portion 300 along the axis direction of the main body 100 is located within the positive projection of the groove along the axis direction. The welding portion 300 is welded in the groove of the bottom wall 201, and the solder is accumulated in the groove, which can further increase the welding strength, improve the stability of the connection terminal, and increase the service life of the connection terminal.
[0043] In some optional embodiments, such as Figure 1 and Figure 3 As shown, the side walls 202 include two, the two side walls 202 are arranged opposite to each other, and the maximum distance L between the two bending portions 204 along the first direction X is 1 mm-3 mm.
[0044] In these optional embodiments, the two side walls 202 are arranged opposite to each other, and the first direction X is perpendicular to the axis of the main body 100 and parallel to the plane where the two side walls 202 are located. The maximum distance L between the two bending portions 204 along the first direction X is 1 mm-3 mm, which can improve the problem that the stamping die cannot be formed due to the maximum distance L being too small, and can also improve the problem that the space utilization rate of the internal layout of the product is too low due to the maximum distance L being too narrow.
[0045] Optionally, the maximum distance L between the two bending portions 204 along the first direction X is 2 mm, which satisfies the performance of the connecting terminal itself while the stamping die can be formed, and the product space utilization rate is also high.
[0046] In some optional embodiments, the two side walls 202 are symmetrically arranged about the axis of the main body 100 .
[0047] In these optional embodiments, when the connecting terminal is subjected to vibration impact, the two side walls 202 are symmetrically arranged about the axis of the main body 100, so that the impact force on the two side walls 202 can be closer, so that the two side walls 202 can more evenly alleviate the impact force on the welding part 300, thereby reducing the possibility of the welding part 300 falling off from the DCB substrate when impacted, and further improving the welding strength and stability of the connecting terminal.
[0048] In some optional embodiments, the plurality of side walls 202 are spaced apart and distributed around the axis of the main body 100 .
[0049] In these optional embodiments, there may be multiple side walls 202 , and the multiple side walls 202 spaced apart around the axis of the main body 100 may further improve the welding strength and stability of the connection terminal.
[0050] Optionally, the plurality of side walls 202 are equally spaced around the axis of the main body 100, that is, the angles formed between two adjacent side walls 202 and the main body 100 may be equal. The plurality of side walls 202 can mitigate the impact force generated by vibrations in multiple directions, thereby further reducing the possibility of the welding portion 300 falling off from the DCB substrate when impacted, and improving the welding strength and stability of the connection terminal.
[0051] An embodiment of the second aspect of the present application further provides a power module, comprising the connection terminal as described above.
[0052] In the embodiment provided in the present application, the power module includes a connection terminal, and the connection terminal includes: In the embodiment provided in the present application, as Figure 1 As shown, the connection terminal includes: a columnar main body 100, one end of the main body 100 is fixedly connected to the buffer part 200, and the other end of the main body 100 is crimped into the hole of the circuit board. The buffer part 200 includes a bottom wall 201 and two or more side walls 202, one end of the side wall 202 is connected to the bottom wall 201, and the other end of the side wall 202 is connected to the main body 100, and the side wall 202 and the bottom wall 201 are enclosed to form a clearance space 203. The welding part 300 is connected to one end of the main body 100 and is located in the clearance space 203. The welding part 300 is spaced from the bottom wall 201, and the welding part 300 is welded to the bottom wall 201, and the side of the bottom wall 201 away from the welding part 300 is welded to the copper-clad ceramic substrate. Among them, each side wall 202 is provided with a bending part 204, so that the side wall 202 can be deformed along the axial direction of the main body 100. In the embodiment provided in the present application, the bending portion 204 is provided to mitigate the vibration impact on the connecting terminal during use, and provide elasticity to compensate for the external force applied to the press-fit pin 206, so that the welding of the welding portion 300 is more stable and firm, not easy to be damaged, and the service life of the connecting terminal is increased.
[0053] Optional, such as Figure 1 As shown, on the DCB substrate of the power module, a plurality of connection terminals are distributed at intervals, wherein the axis of the main body can be perpendicular to the DCB substrate, and the bottom walls of the plurality of connection terminals are connected to the DCB substrate.
[0054] An embodiment of the third aspect of the present application further provides a semiconductor, comprising the connection terminal as described above.
[0055] In the embodiments provided in the present application, the semiconductor includes a power module, the power module includes a connection terminal, and the connection terminal includes: In the embodiments provided in the present application, as Figure 1As shown, the connection terminal includes: a columnar main body 100, one end of the main body 100 is fixedly connected to the buffer part 200, and the other end of the main body 100 is crimped into the hole of the circuit board. The buffer part 200 includes a bottom wall 201 and two or more side walls 202, one end of the side wall 202 is connected to the bottom wall 201, and the other end of the side wall 202 is connected to the main body 100, and the side wall 202 and the bottom wall 201 are enclosed to form a clearance space 203. The welding part 300 is connected to one end of the main body 100 and is located in the clearance space 203. The welding part 300 is spaced from the bottom wall 201, and the welding part 300 is welded to the bottom wall 201, and the side of the bottom wall 201 away from the welding part 300 is welded to the copper-clad ceramic substrate. Among them, each side wall 202 is provided with a bending part 204, so that the side wall 202 can be deformed along the axial direction of the main body 100. In the embodiment provided in the present application, the bending portion 204 is provided to mitigate the vibration impact on the connecting terminal during use, and provide elasticity to compensate for the external force applied to the press-fit pin 206, so that the welding of the welding portion 300 is more stable and firm, not easy to be damaged, and the service life of the connecting terminal is increased.
[0056] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
Claims
1. A connecting terminal, characterized in that: The connecting terminal comprises: The main body is columnar; A buffer portion, located at one end of the main body and fixedly connected to the main body, the buffer portion comprises a bottom wall and two or more side walls, one end of the side wall is connected to the bottom wall, the other end of the side wall is connected to the main body, and the side wall and the bottom wall enclose a clearance space; A welding portion connected to one end of the main body and located in the clearance space, wherein the welding portion is spaced apart from the bottom wall; Wherein, each of the side walls is provided with a bending portion so that the side wall can be deformed along the axial direction of the main body.
2. The connecting terminal according to claim 1, characterized in that: On a side of the bent portion facing the main body and in a direction close to the main body, the spacing between the two or more side walls gradually decreases.
3. The connecting terminal according to claim 2, characterized in that: The two bending portions are located on a side of the side wall close to the bottom wall.
4. The connecting terminal according to claim 1, characterized in that: The two side walls are bent toward the main body to form more than two bent portions.
5. The connecting terminal according to claim 1, characterized in that: The bottom wall includes an opening that is arranged through, and a projection of the welding portion along the axis direction of the main body is located within a projection of the opening along the axis direction.
6. The connecting terminal according to claim 1, characterized in that: The side walls include two, the two side walls are arranged opposite to each other, and the maximum distance between the two bending portions along the first direction is 1mm-3mm.
7. The connecting terminal according to claim 6, characterized in that: The two side walls are symmetrically arranged about the axis of the main body.
8. The connecting terminal according to claim 1, characterized in that: The plurality of side walls are spaced apart and distributed around the axis of the main body.
9. A power module, characterized in that: Comprising the connecting terminal according to any one of claims 1 to 8.
10. A semiconductor, characterized in that: Comprising the connecting terminal as claimed in claim 9.
