Multi-cavity chemical vapor deposition equipment

Abstract

The utility model discloses multi-cavity chemical vapor deposition equipment, which comprises a conveying chain belt, lifting feeding components and vapor deposition chambers, a plurality of groups of lifting feeding components are in driving connection with the conveying chain belt, and a plurality of groups of vapor deposition chambers are vertically arranged at the top of the lifting feeding components. The lifting feeding assembly comprises a bottom plate, a sliding shaft, a positioning plate, a base table, a machining table top, an ejector rod and a sliding block, the multiple independent vapor deposition chambers are distributed in parallel, product pollution caused by the fact that the same chamber is filled with multiple chemical reaction reagents can be avoided, and the product quality is guaranteed; the multiple sets of lifting feeding assemblies are matched with the conveying chain belt to conduct cavity switching conveying on materials, the switching efficiency is improved, the materials rapidly enter the next-stage reaction cavity, the product machining quality is guaranteed, and meanwhile the overturning closing plate is hinged to the interior of the vapor deposition chamber and can be matched with the lifting feeding assemblies to be automatically opened and closed.

Description

Technical Field

[0001] The utility model relates to the field of chemical vapor deposition equipment, in particular to a multi-cavity chemical vapor deposition equipment. Background Art

[0002] Chemical vapor deposition equipment is generally composed of a reaction chamber, a heating system, a gas supply system, etc. Chemical vapor deposition equipment can be customized and configured according to specific needs and application fields. It is widely used in semiconductors, optoelectronics, materials science and other fields to prepare thin film materials, coatings, nanostructures, etc.

[0003] Vapor deposition equipment has a wide range of applications, but there are still some problems: 1) Some traditional multi-chamber chemical vapor deposition equipment usually adopts a single processing chamber with multiple gas chambers. This design will lead to the presence of different chemical materials in the processing chamber, which can easily affect the quality of the finished product and cause product contamination; 2) Some traditional multi-chamber chemical vapor deposition equipment cannot quickly switch the material to the next chamber. During the transfer process, there is a large dispersion of the workpiece temperature and the chamber temperature. When transferred to the next chamber, it is impossible to quickly enter the next level reaction sequence, thereby delaying work efficiency and even affecting product processing quality. Therefore, in view of the above situation, there is an urgent need to develop a multi-chamber chemical vapor deposition equipment to overcome the shortcomings in current practical applications and meet current needs. Utility Model Content

[0004] The purpose of the utility model is to provide a multi-chamber chemical vapor deposition device to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A multi-chamber chemical vapor deposition device comprises a conveyor chain, a lifting feed assembly and a vapor deposition chamber. Several groups of lifting feed assemblies are drivingly connected to the conveyor chain, and several groups of vapor deposition chambers are vertically arranged on the top of the lifting feed assembly.

[0007] As a further solution of the utility model: the lifting and feeding assembly includes a bottom plate, a sliding shaft, a positioning plate, a base, a processing table, a push rod and a slider. The four sliding shafts are vertically welded at the four corners of the top of the bottom plate. The base is horizontally installed at the top of the sliding shaft. The positioning plate is nested in the middle position of the sliding shaft and is slidably connected to the sliding shaft. The processing table is horizontally installed in the middle position of the top of the base. The two push rods are relatively distributed at the top edge positions of the base and are fixedly connected to the base. The two groups of sliders are relatively installed on the sides of the positioning plate. The lifting and feeding assembly can quickly switch the material to the next group of vapor deposition chambers.

[0008] As a further solution of the utility model: two relatively distributed flip closing plates are embedded in the inner bottom of the vapor deposition chamber, the bottom edges of the flip closing plates are hinged to the inner wall of the vapor deposition chamber, and the inner bottom of the vapor deposition chamber is provided with a chamfer. The bottom of the vapor deposition chamber can be automatically closed by the arranged flip closing plates, and can also be automatically opened in cooperation with the top rod to reduce the escape of heat and chemical components in the chamber.

[0009] As a further solution of the utility model: the spacing between several groups of lifting and feeding assemblies is consistent with the spacing between several groups of vapor deposition chambers, and can be aligned vertically, so as to facilitate the switching of multiple groups of lifting and feeding assemblies to the next group of vapor deposition chambers.

[0010] As a further solution of the utility model: the base is matched with the inner bottom of the vapor deposition chamber, and the base can be embedded in the inner bottom of the vapor deposition chamber, so as to quickly switch between multiple vapor deposition chambers.

[0011] As a further solution of the utility model: the push rod is longitudinally aligned with the edge of the flip closing plate, and the flip closing plate can be pushed open by the arranged push rod, so that the base can be embedded into the inner bottom of the vapor deposition chamber from the bottom end.

[0012] Beneficial effects: This multi-chamber chemical vapor deposition equipment adopts multiple separate vapor deposition chambers distributed in parallel, which can avoid multiple chemical reaction reagents filling the same chamber to cause product contamination and ensure product quality. It adopts multiple sets of lifting and feeding components to cooperate with conveyor chains to switch the chambers for material transportation, improve the switching efficiency, and enable the material to quickly enter the next-level reaction chamber to ensure product processing quality. At the same time, a flip closing plate is hinged in the vapor deposition chamber, which can be automatically opened and closed in conjunction with the lifting and feeding components to avoid large-scale dissipation of heat and chemical reagents. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a front structural schematic diagram of the utility model.

[0014] Figure 2 It is an overall side longitudinal sectional view of the utility model.

[0015] Figure 3 It is a schematic structural diagram of the vapor deposition chamber of the utility model.

[0016] Figure 4 It is a schematic diagram of the structure of the lifting and feeding assembly of the utility model.

[0017] Figure 5 It is a side longitudinal sectional view of the vapor deposition chamber of the utility model.

[0018] Figure 6 It is a side view of the vapor deposition chamber of the utility model.

[0019] In the figure: 1, conveyor chain; 2, lifting feed assembly; 21, bottom plate; 22, slide shaft; 23, positioning plate; 24, base; 25, processing table; 26, ejector rod; 27, slider; 3, vapor deposition chamber; 31, flip closing plate; 32, chamfer; DETAILED DESCRIPTION

[0020] Example

[0021] See also Figures 1 to 6 In an embodiment of the utility model, a multi-chamber chemical vapor deposition device includes a conveyor chain 1, a lifting and feeding assembly 2 and a vapor deposition chamber 3, several groups of lifting and feeding assemblies 2 are drivingly connected to the conveyor chain 1, and several groups of vapor deposition chambers 3 are vertically arranged on the top of the lifting and feeding assembly 2.

[0022] As a further solution of the utility model: the lifting and feeding assembly 2 includes a bottom plate 21, a sliding shaft 22, a positioning plate 23, a base 24, a processing table 25, a push rod 26 and a slider 27. The four sliding shafts 22 are vertically welded at the four corners of the top of the bottom plate 21, the base 24 is horizontally installed at the top of the sliding shaft 22, the positioning plate 23 is nested in the middle position of the sliding shaft 22 and is slidably connected to the sliding shaft 22, the processing table 25 is horizontally installed in the middle position of the top of the base 24, the two push rods 26 are relatively distributed at the top edge positions of the base 24, and are fixedly connected to the base 24, and the two groups of sliders 27 are relatively installed on the sides of the positioning plate 23. The lifting and feeding assembly 2 can quickly switch the material to the next group of vapor deposition chambers 3.

[0023] As a further solution of the utility model: two relatively distributed flip closing plates 31 are embedded and installed on the inner bottom of the vapor deposition chamber 3, the bottom edge of the flip closing plate 31 is hinged to the inner wall of the vapor deposition chamber 3, and a chamfer 32 is provided on the inner bottom of the vapor deposition chamber 3. The bottom end of the vapor deposition chamber 3 can be automatically closed by the set flip closing plate 31, and can also be automatically opened in cooperation with the top rod 26 to reduce the escape of heat and chemical components in the chamber.

[0024] As a further solution of the utility model: the spacing between several groups of lifting and feeding assemblies 2 is consistent with the spacing between several groups of vapor deposition chambers 3, and can be aligned vertically, so as to facilitate the switching of multiple groups of lifting and feeding assemblies 2 to the next group of vapor deposition chambers 3.

[0025] As a further solution of the present invention: the base 24 matches the inner bottom of the vapor deposition chamber 3 , and the base 24 can be embedded in the inner bottom of the vapor deposition chamber 3 , so as to quickly switch between multiple vapor deposition chambers 3 .

[0026] As a further solution of the utility model: the top rod 26 is longitudinally aligned with the edge of the flip closing plate 31, and the flip closing plate 31 can be pushed open by the set top rod 26, so that the base 24 can be embedded into the inner bottom of the vapor deposition chamber 3 from the bottom end.

[0027] The working principle of the utility model is as follows: when the multi-chamber chemical vapor deposition equipment is in use, the workpiece to be processed is placed on the processing table 25 of the lifting and feeding assembly 2, and the lifting and feeding assembly 2 with the workpiece to be processed is driven by the conveyor chain 1 to be quickly transported to the bottom of the vapor deposition chamber 3, and a lifting device is pre-installed under each vapor deposition chamber 3. When the lifting and feeding assembly 2 arrives under the designated vapor deposition chamber 3, it is lifted by the external lifting device into the vapor deposition chamber 3 for vapor deposition reaction. When it is necessary to switch to the next reaction chamber, , it will be lowered by the jacking equipment, and continued to be conveyed to the bottom of the next-level vapor deposition chamber 3 by the conveyor chain 1, and then the above operation can be continued. It should be noted here that the external jacking equipment can adopt components such as cylinders. The external jacking equipment contacts the bottom plate 21 of the lifting feed assembly 2 and drives it to rise. The bottom plate 21 cooperates with the sliding shaft 22 to drive the base 24 to rise. In this process, the most difficult push rod 26 will also rise and then contact and push the flip closing plate 31, so that the base 24 is smoothly embedded in the bottom of the vapor deposition chamber 3.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-chamber chemical vapor deposition device, characterized in that: The invention comprises a conveyor chain (1), a lifting feed assembly (2) and a vapor deposition chamber (3), wherein a plurality of groups of the lifting feed assembly (2) are drivingly connected to the conveyor chain (1), and a plurality of groups of the vapor deposition chambers (3) are vertically arranged on the top of the lifting feed assembly (2), and the lifting feed assembly (2) comprises a bottom plate (21), a sliding shaft (22), a positioning plate (23), a base (24), a processing table (25), a top rod (26) and a sliding block (27), and four sliding shafts (22) are vertically welded to the bottom plate (21). The base (24) is horizontally mounted at the top four corners of the sliding shaft (22), the positioning plate (23) is nested in the middle of the sliding shaft (22) and is slidably connected to the sliding shaft (22), the processing table (25) is horizontally mounted at the top middle of the base (24), the two push rods (26) are relatively distributed at the top edge of the base (24) and are fixedly connected to the base (24), and the two groups of sliders (27) are relatively mounted on the sides of the positioning plate (23).

2. The multi-chamber chemical vapor deposition apparatus according to claim 1, characterized in that: Two flip sealing plates (31) arranged opposite to each other are embedded in the inner bottom of the vapor deposition chamber (3), the bottom edge of the flip sealing plate (31) is hinged to the inner wall of the vapor deposition chamber (3), and the inner bottom of the vapor deposition chamber (3) is provided with a chamfer (32).

3. The multi-chamber chemical vapor deposition apparatus according to claim 1, characterized in that: The spacing between the plurality of groups of lifting and feeding assemblies (2) is consistent with the spacing between the plurality of groups of vapor deposition chambers (3), and they can be aligned longitudinally.

4. The multi-chamber chemical vapor deposition apparatus according to claim 2, characterized in that: The base (24) matches the inner bottom of the vapor deposition chamber (3).

5. The multi-chamber chemical vapor deposition apparatus according to claim 2, characterized in that: The push rod (26) is longitudinally aligned with the edge of the flip closing plate (31).

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