Carrying table device and machining equipment

Abstract

The utility model discloses a carrying table device and machining equipment, the carrying table device comprises a bearing seat, a sealing assembly, an adsorption assembly and a driving mechanism, the bearing seat is provided with a bearing surface, the sealing assembly comprises a first sealing ring and a second sealing ring which are arranged on the bearing surface, and the area, located between the first sealing ring and the second sealing ring, of the bearing surface forms a first adsorption area; the area in the second sealing ring forms a second adsorption area; the two sealing rings can absorb workpieces of two sizes in a compatible mode. The driving mechanism can drive the adsorption assembly to stretch out and draw back so as to grab the workpiece and place the workpiece on the bearing face, and it is guaranteed that the center area of the workpiece is attached to the bearing face. After negative pressure is applied to internal components of the first adsorption area and the second adsorption area, the first sealing ring and the second sealing ring are attached to the workpiece and can generate pulling force towards the bearing face on the workpiece, so that the warped area of the workpiece is corrected and attached to the bearing face.

Description

Technical Field

[0001] The present application relates to the field of wafer processing, and in particular to a stage device and processing equipment. Background Art

[0002] With the emergence of new energy automotive electronics, 5G and other technologies, integrated circuit manufacturing technology has developed rapidly. As the structure of integrated circuits becomes increasingly complex, the requirements for wafers are also constantly increasing. At present, in the semiconductor industry, many wafer products are warped to a certain extent during the back-end packaging process due to the inherent stress and tensile deformation of the substrate material, and the warped wafers still need to undergo subsequent process technology. In related technologies, a carrier is used to adsorb and fix the wafer. However, for warped wafers, since the bottom surface is a curved surface, it is difficult for the carrier to adsorb and fix them well, which can easily cause the wafer to fall off and be damaged. Utility Model Content

[0003] The present application proposes a carrier device and processing equipment, aiming to solve the current problem that the warped wafer cannot be completely adsorbed by the carrier.

[0004] The present application proposes a stage device, comprising:

[0005] A bearing seat having a bearing surface;

[0006] The sealing assembly comprises a first sealing ring and a second sealing ring which are arranged on the bearing surface and arranged in sequence from the outside to the inside; the area of ​​the bearing surface between the first sealing ring and the second sealing ring constitutes a first adsorption area, and the area of ​​the bearing surface inside the second sealing ring constitutes a second adsorption area;

[0007] An adsorption assembly includes a first adsorption member disposed in the second adsorption area, the first adsorption member is slidably connected to the bearing seat, and the sliding direction intersects with the bearing surface, and the end of the first adsorption member on the same side as the bearing surface is provided with a first suction nozzle for adsorbing the workpiece; and

[0008] The driving mechanism is drivingly connected to the first adsorption member and is used to drive the first adsorption member to slide along the sliding direction.

[0009] In some embodiments, the first adsorption component includes an air duct, and the first suction nozzle is arranged at the end of the air duct; the second adsorption area is provided with a guide hole adapted to the air duct, and the inner wall of the guide hole is sealed and connected to the air duct.

[0010] In some embodiments, the driving mechanism comprises:

[0011] A first mounting frame, disposed on a side of the bearing seat away from the bearing surface;

[0012] a second mounting frame, slidably connected to the first mounting frame along the sliding direction and spaced apart from the bearing seat, the second mounting frame being used to mount the air guide tube;

[0013] A driving assembly is drivingly connected to the second mounting frame and is used to drive the second mounting frame to slide.

[0014] In some embodiments, the bearing surface is provided with a first mounting groove for installing the first sealing ring, and the carrier device also includes a first fixing member arranged in the first mounting groove; an inner or outer side edge of the first sealing ring is arranged between the first mounting groove and the first fixing member, and the other side edge is higher than the bearing surface.

[0015] In some embodiments, the bearing surface is provided with a second mounting groove for installing the second sealing ring, and the carrier device also includes a second fixing member arranged in the second mounting groove; an inner or outer side edge of the second sealing ring is arranged between the second mounting groove and the second fixing member, and the other side edge is higher than the bearing surface.

[0016] In some embodiments, the side edge of the first sealing ring and the second sealing ring higher than the bearing surface is set as a contact portion, and the contact portion can be deformed when attached to the workpiece, and an escape space for accommodating the contact portion is provided on the bearing seat.

[0017] In some embodiments, the adsorption assembly also includes a second suction nozzle arranged in the first adsorption area, the second suction nozzle includes an elastic suction nozzle, and the adsorption end of the second suction nozzle is higher than the supporting surface; when adsorbing the workpiece, the second suction nozzle can be deformed along the sliding direction.

[0018] In some embodiments, the support seat is provided with a first air path connected to the first adsorption area, and a second air path connected to the second adsorption area; a third air path is provided inside the first adsorption member, and a fourth air path is provided inside the second suction nozzle; the carrier device also includes a negative pressure generating component respectively connected to the first air path, the second air path, the third air path and the fourth air path.

[0019] In some embodiments, the negative pressure generating component is used to independently construct negative pressure in the first gas circuit, the second gas circuit, the third gas circuit, and the fourth gas circuit.

[0020] The present application also proposes a processing equipment, including the above-mentioned carrier device, and the processing equipment also includes a machine platform for installing the carrier device.

[0021] The stage device in the present application includes a bearing seat, a sealing component, an adsorption component and a driving mechanism. The bearing seat has a bearing surface. The sealing component includes a first sealing ring and a second sealing ring arranged on the bearing surface. The area of ​​the bearing surface between the first sealing ring and the second sealing ring constitutes a first adsorption area, and the area inside the second sealing ring constitutes a second adsorption area; the two sealing rings are compatible with adsorbing workpieces of two sizes. The driving mechanism can drive the adsorption component to extend and retract to grab the workpiece and place the workpiece on the bearing surface to ensure that the central area of ​​the workpiece is in contact with the bearing surface. After the internal components of the first adsorption area and the second adsorption area are negatively pressurized, the first sealing ring and the second sealing ring are in contact with the workpiece and will generate a pulling force toward the bearing surface on the workpiece, so that the warped area of ​​the workpiece is corrected and in contact with the bearing surface. Both the first adsorption area and the second adsorption area are located on the bearing surface, which can also prevent the workpiece from generating greater internal stress due to the uneven surface of the bearing seat when being adsorbed. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the structure of a stage device in one embodiment of the present application;

[0023] Figure 2 for Figure 1 A schematic structural diagram of the stage device from another perspective in the embodiment;

[0024] Figure 3 for Figure 1 A schematic diagram of the structure of the driving mechanism in the embodiment;

[0025] Figure 4 for Figure 1 A schematic structural diagram of a bearing seat in an embodiment;

[0026] Figure 5 It is a cross-sectional view of the unloading platform device in an embodiment of the present application when the workpiece is not laid flat;

[0027] Figure 6 It is a cross-sectional view of the unloading platform device in a flat state in one embodiment of the present application;

[0028] Figure 7 It is a schematic diagram of the structure of a stage device in another embodiment of the present application.

[0029] Description of labels:

[0030] 10. Bearing seat; 101. Bearing surface; 11. First adsorption area; 12. Second adsorption area; 13. Guide hole; 14. Base plate; 16. First air hole; 17. Second air hole; 21. First sealing ring; 211. First flange; 22. Second sealing ring; 221. Second flange; 23. First fixing member; 24. Second fixing member; 31. First suction member; 311. Air guide tube; 312. First suction nozzle; 32. Second suction nozzle; 40. Driving mechanism; 41. First mounting bracket; 42. Second mounting bracket; 43. Motor; 44. Transmission assembly; 45. Air path connector; 5. Workpiece;

[0031] The purpose, features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the scheme in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments in the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0033] It should be noted that all directional indications such as up, down, left, right, front, back... in the embodiments of the present application are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indication will also change accordingly.

[0034] It should also be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0035] In addition, the descriptions of "first", "second", etc. in this application are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0036] This application proposes a stage device, referring to Figures 1 to 7The carrier device includes: a bearing seat 10, having a bearing surface 101; a sealing component, including a first sealing ring 21 and a second sealing ring 22, which are arranged on the bearing surface 101 and arranged in sequence from the outside to the inside; the area of ​​the bearing surface 101 between the first sealing ring 21 and the second sealing ring 22 constitutes a first adsorption area 11, and the area of ​​the bearing surface 101 inside the second sealing ring 22 constitutes a second adsorption area 12; an adsorption component, including a first adsorption member arranged in the second adsorption area 12, the first adsorption member is slidably connected to the bearing seat 10, and the sliding direction intersects with the bearing surface 101, and the end of the first adsorption member on the same side as the bearing surface 101 is provided with a first suction nozzle 312 for adsorbing the workpiece 5; and a driving mechanism 40, which is drivingly connected to the first adsorption member and is used to drive the first adsorption member to slide along the sliding direction.

[0037] In this embodiment, the inner and outer sealing rings are compatible with adsorbing workpieces 5 of two sizes, specifically, 8-inch wafers and 12-inch wafers. The driving mechanism 40 can drive the adsorption component to extend and retract to grab the workpiece 5 and place the workpiece 5 on the carrying surface 101. Even if the edge of the workpiece 5 has a certain warping, it can ensure that the central area of ​​the workpiece 5 and the area of ​​the carrying surface 101 located in the second adsorption area 12 remain in contact. Of course, the first sealing ring 21 and the second sealing ring 22 can be set higher than the carrying surface 101 so as to contact the warped edge area of ​​the workpiece 5. After the internal components of the first adsorption area 11 and the second adsorption area 12 are negatively pressurized, the first sealing ring 21 and the second sealing ring 22 are in contact with the workpiece 5 and will generate a pulling force toward the carrying surface 101 on the workpiece 5, so that the warped area of ​​the workpiece 5 is corrected and in contact with the carrying surface 101. In addition, the bearing surface 101 can be a plane, and the first adsorption area 11 and the second adsorption area 12 are both located on the bearing surface 101, which can also make the workpiece 5 located on the same plane when being adsorbed, avoiding greater internal stress caused by the unevenness of the bearing surface 101. The nozzle and the sealing ring material can be made of silicone rubber, which can be softly deformed to form vacuum adsorption.

[0038] It is worth noting that the above-mentioned 8-inch and 12-inch are only examples of wafer specifications. The stage device in the embodiment of the present application is not limited to the above-mentioned sizes, and can also be applied to two other wafers of different sizes. In addition, the stage device in the embodiment of the present application can be used for wafer processing, such as laser debonding process. Of course, it is not limited to wafer processing, but can also be used for processes such as fixing, correcting and processing other thin-sheet workpieces, such as glass plates, ceramic plates, metal plates, polymer plates, etc. are all suitable for the above-mentioned stage device.

[0039] In some embodiments, reference Figures 1 to 7, the first adsorption member includes an air guide tube 311, and the first suction nozzle 312 is arranged at the end of the air guide tube 311; the second adsorption area 12 is provided with a guide hole 13 adapted to the air guide tube 311, and the inner wall of the guide hole 13 is sealed and connected to the air guide tube 311. In this embodiment, the air guide tube 311 is disposed with the bearing surface 101, and an annular groove can be provided on the inner wall of the guide hole 13, and a sealing ring is provided in the annular groove. The sealing ring forms a clamp for the air guide tube 311, which plays a role of sealing connection. The sealed connection between the two can prevent the external air from entering the second adsorption area 12 from the gap between the guide hole 13 and the air guide tube 311 when the second adsorption area 12 is constructed with negative pressure. It is worth noting that one first adsorption member can be provided in the second adsorption area 12, and multiple first adsorption members can also be provided. The parallel arrangement of multiple air guide tubes 311 can further improve the verticality of the air guide tube 311 and the bearing surface 101, and reduce the radial displacement of the first adsorption member when the workpiece 5 is placed. The first suction nozzle 312 may be made of an elastic material, so that the workpiece 5 has a certain amount of movement margin in the vertical direction (the length direction of the air guide tube 311 ), so that the workpiece 5 has a certain buffering effect when placed on the carrying surface 101 .

[0040] In some embodiments, reference Figures 1 to 7 The driving mechanism 40 includes: a first mounting frame 41, which is arranged on the side of the bearing seat 10 away from the bearing surface 101; a second mounting frame 42, which is slidably connected to the first mounting frame 41 along the sliding direction and is spaced from the bearing seat 10, and the second mounting frame 42 is used to install the air guide tube 311; a driving component, which is drivingly connected to the second mounting frame and is used to drive the second mounting frame 42 to slide. In this embodiment, the bearing seat 10 can be arranged on a substrate 14, and the first mounting frame 41 is arranged on the side surface of the substrate 14 away from the bearing seat 10. The second mounting frame 42 includes a mounting plate, and the mounting plate can be arranged parallel to the bearing surface 101. One end of the air guide tube 311 is arranged on the mounting plate, and the other end can pass through the above-mentioned guide hole 13. An air flow channel is arranged inside the mounting plate, and the air flow channel is connected to the air guide tube 311. The side of the mounting plate is also provided with an air path joint 45 connected to the air flow channel, thereby constructing a negative pressure for the first suction nozzle 312. The side of the mounting plate facing the first mounting frame 41 is slidably connected with the slider through a slide rail. The driving assembly includes a motor 43 arranged on the first mounting frame 41 and a transmission assembly 44 connecting the motor 43 and the mounting plate. The transmission assembly 44 can specifically adopt a screw transmission method to ensure that the workpiece 5 has higher movement accuracy when moving with the first suction member 31. At the same time, the position and movement speed of the moving speed can also be adjusted by controlling the rotation speed and number of rotations of the motor 43 to achieve higher precision adjustment, thereby avoiding a large-impact collision between the workpiece 5 and the bearing surface 101, and also avoiding the first suction member 31 from over-pulling the workpiece 5 after the workpiece 5 is in contact with the bearing surface 101, thereby preventing the workpiece 5 from being damaged.

[0041] In some embodiments, reference Figures 1 to 7 , the bearing surface 101 is provided with a first mounting groove for mounting the first sealing ring 21, and the stage device further includes a first fixing member 23 disposed in the first mounting groove; one side edge of the first sealing ring 21, which is closer to the inside or outside, is disposed between the first mounting groove and the first fixing member 23, and the other side edge is higher than the bearing surface 101. The bearing surface 101 is provided with a second mounting groove for mounting the second sealing ring 22, and the stage device further includes a second fixing member 24 disposed in the second mounting groove; one side edge of the second sealing ring 22, which is closer to the inside or outside, is disposed between the second mounting groove and the second fixing member 24, and the other side edge is higher than the bearing surface 101. In this embodiment, the inner edge of the first sealing ring 21 can be protruded and disposed with the bearing surface 101, and the outer edge can be fixed in the first mounting groove accordingly. Specifically, the annular first fixing member 23 can be fixed in the first mounting groove, so that the first fixing member 23 and the groove bottom of the first mounting groove clamp the outer edge of the first sealing ring 21. The outer edge of the first sealing ring 21 can also be protruded and arranged on the bearing surface 101, and the inner edge can be fixed in the first installation groove accordingly, so that the first fixing member 23 and the bottom of the first installation groove clamp the inner edge of the first sealing ring 21. Of course, the second sealing ring 22 can also be fixed and installed in the above two ways.

[0042] Further references Figure 5 and Figure 6 , the edge of one side of the first sealing ring 21 and the second sealing ring 22 that is higher than the bearing surface 101 is set as a contact portion, and the contact portion can be deformed when it fits the workpiece 5, and an escape space for accommodating the contact portion is provided on the bearing seat 10. The contact portion of the first sealing ring 21 is specifically the first flange 211, and the contact portion of the second sealing ring 22 is specifically the second flange 221. The above-mentioned escape space can be an annular groove or annular step provided on the side of the first mounting groove corresponding to the above-mentioned first flange 211, and an annular groove or annular step provided on the side of the second mounting groove corresponding to the above-mentioned second flange 221. By setting the escape space, the first flange 211 and the second flange 221 can have a certain deformation space, ensuring that the warped area of ​​the workpiece 5 can be corrected and fit the bearing surface 101.

[0043] In some embodiments, reference Figures 1 to 7, the adsorption component also includes a second suction nozzle 32 arranged in the first adsorption area, the second suction nozzle 32 includes an elastic suction nozzle, and the adsorption end of the second suction nozzle 32 is higher than the bearing surface 101; when the workpiece 5 is adsorbed, the second suction nozzle 32 can be deformed along the sliding direction. A mounting hole is provided in the first adsorption area, and the second suction nozzle 32 is provided in the mounting hole. When the workpiece 5 is placed, the central area of ​​the workpiece 5 first fits with the second adsorption area 12, and finally, under the suction action of the second suction nozzle 32, the warped area of ​​the workpiece 5 is pulled to fit with the first adsorption area 11. The second suction nozzle 32 can adopt a double-layer accordion nozzle structure, which has a large deformation amount. It is convenient for the second suction nozzle 32 to contact and absorb the workpiece 5. As the workpiece 5 fits the first adsorption area 11, the second suction nozzle 32 itself will also undergo elastic deformation, and be compressed and accommodated in the above-mentioned mounting hole. When the workpiece 5 contacts the first adsorption area 11, a negative pressure will also be constructed inside the first adsorption area 11, so that the first sealing ring 21 fits with the workpiece 5 to achieve complete sealing.

[0044] In some embodiments, reference Figures 1 to 7 , the support base 10 is provided with a first air path connected to the first adsorption area 11, and a second air path connected to the second adsorption area 12; a third air path is provided inside the first adsorption member, and a fourth air path is provided inside the second suction nozzle 32; the stage device also includes a negative pressure generating component connected to the first air path, the second air path, the third air path and the fourth air path respectively. In this embodiment, a plurality of first air holes 16 can be provided in the first adsorption area 11, and a plurality of second air holes 17 can be provided in the second adsorption area 12, and each first air hole is connected to each other, thereby forming a first air path, and each second air hole 17 is connected to each other to form a second air path. The above-mentioned air guide tube 311 and the air flow channel in the mounting plate constitute the third air path. The negative pressure generating component can be a vacuum generator provided on one side of the support base 10, and the vacuum generator is respectively connected to the above-mentioned four air paths to construct negative pressure in the four air paths. A negative pressure partition plate is provided on the side of the support base 10 away from the bearing surface 101, and two negative pressure channels are provided inside, one of which is connected to the fourth air path. Another negative pressure channel is communicated with the first gas path.

[0045] In some embodiments, reference Figures 1 to 7 The negative pressure generating assembly is used to independently build negative pressure in the first gas circuit, the second gas circuit, the third gas circuit, and the fourth gas circuit. Specifically, four vacuum generators can be set to control each gas circuit individually, or one vacuum generator can be set to connect two to four gas circuits, and the connection state between the vacuum generator and each gas circuit can be controlled by an electromagnetic reversing valve to achieve control of the four gas circuits.

[0046] The working process of the stage device in the embodiment of the present application is as follows:

[0047] The suction sequence of the 8-inch wafer is as follows: the first suction nozzle 312 first sucks the wafer, and then the second suction area 12 opens the negative pressure for suction, and cooperates with the soft wrapping of the second circular sealing ring of the 8-inch wafer to achieve flat suction of the wafer.

[0048] The adsorption sequence of 12-inch wafers is as follows: the first suction nozzle 312 first adsorbs the wafer, and then the second adsorption area 12 is opened for negative pressure adsorption; then the second suction nozzle 32 is opened for adsorption, and then the first adsorption area 11 is opened for negative pressure adsorption, and the soft wrapping of the first sealing ring 21 and the second sealing ring 22 is cooperated to achieve flat adsorption of the wafer.

[0049] The technical features of this application are as follows:

[0050] 1. The soft contact wrapping and edging characteristics of the soft silicone sealing ring and the suction cup characteristics of the double-layer accordion nozzle can be compatible with warped wafers, achieve good wrapping adsorption, and achieve vacuum sealing;

[0051] 2. This stage device can be compatible with the adsorption of 8-inch wafers and 12-inch wafers at the same time;

[0052] 3. The first suction nozzle 312 is lifted and lowered by a screw rod to accurately achieve the wafer placement height, so that the wafer avoids the risk of fragmentation;

[0053] 4. The air guide tube 311 is sealed with the guide hole 13 to avoid vacuum leakage of the carrier.

[0054] The present application also proposes a processing device, referring to Figures 1 to 7 The processing equipment includes the above-mentioned stage device, and the processing equipment also includes a machine platform for installing the stage device. The stage device is arranged on the machine platform and can be used to carry and fix the external workpiece 5. In addition, the processing equipment also includes a manipulator arranged on one side of the machine platform, and the manipulator is used to transfer the workpiece 5 and dock the workpiece 5 with the above-mentioned first suction member 31.

[0055] Taking 12-inch wafer as an example, the specific operation steps of this processing equipment are as follows:

[0056] The motor 43 starts to drive the first suction nozzle 312 to rise to the material position to be received, and the robot lifts the wafer to the material position to be received. Subsequently, the first suction nozzle 312 starts to vacuum and adsorbs the wafer, and at the same time, the wafer robot suction cup releases the vacuum and exits the material position to be received. When the motor 43 starts to drive the first suction nozzle 312 to adsorb the wafer and descend to the carrying surface 101, the second adsorption area 12 is started first, and then the second suction nozzle 32 is started for vacuum adsorption, and finally the first adsorption area 11 is started for adsorption, and the wafer is completely sucked flat on the carrying surface 101.

[0057] It is worth noting that the above-mentioned 8-inch and 12-inch are only examples of wafer specifications. The stage device in the embodiment of the present application is not limited to the above-mentioned sizes, and can also be applied to two other wafers of different sizes. In addition, the processing equipment in the embodiment of the present application can be used for wafer processing, such as laser debonding process. Of course, it is not limited to wafer processing, and can also be used for other thin-sheet workpiece fixation, correction and processing processes, such as glass plates, ceramic plates, metal plates, polymer plates, etc. are all suitable for the above-mentioned processing equipment.

[0058] The above are only partial or preferred embodiments of the present application. Neither the text nor the drawings can limit the scope of protection of the present application. All equivalent structural changes made using the contents of the present application specification and drawings under the overall concept of the present application, or direct / indirect application in other related technical fields are included in the scope of protection of the present application.

Claims

1. A stage device, characterized in that: include: A bearing seat having a bearing surface; The sealing assembly comprises a first sealing ring and a second sealing ring which are arranged on the bearing surface and arranged in sequence from the outside to the inside; the area of ​​the bearing surface between the first sealing ring and the second sealing ring constitutes a first adsorption area, and the area of ​​the bearing surface inside the second sealing ring constitutes a second adsorption area; The adsorption assembly comprises a first adsorption member disposed in the second adsorption area, the first adsorption member is slidably connected to the bearing seat, and the sliding direction intersects with the bearing surface, and the end of the first adsorption member on the same side as the bearing surface is provided with a first suction nozzle for adsorbing the workpiece; as well as, The driving mechanism is drivingly connected to the first adsorption member and is used to drive the first adsorption member to slide along the sliding direction.

2. The stage device according to claim 1, characterized in that: The first adsorption component includes an air guide tube, and the first suction nozzle is arranged at the end of the air guide tube; the second adsorption area is provided with a guide hole adapted to the air guide tube, and the inner wall of the guide hole is sealed and connected to the air guide tube.

3. The stage device according to claim 2, characterized in that: The driving mechanism comprises: A first mounting frame, disposed on a side of the bearing seat away from the bearing surface; a second mounting frame, slidably connected to the first mounting frame along the sliding direction and spaced apart from the bearing seat, the second mounting frame being used to mount the air guide tube; A driving assembly is drivingly connected to the second mounting frame and is used to drive the second mounting frame to slide.

4. The stage device according to claim 1, characterized in that: The bearing surface is provided with a first mounting groove for installing the first sealing ring, and the carrier device also includes a first fixing member arranged in the first mounting groove; an inner or outer side edge of the first sealing ring is arranged between the first mounting groove and the first fixing member, and the other side edge is higher than the bearing surface.

5. The stage device according to claim 4, characterized in that: The bearing surface is provided with a second mounting groove for installing the second sealing ring, and the carrier device also includes a second fixing member arranged in the second mounting groove; an inner or outer side edge of the second sealing ring is arranged between the second mounting groove and the second fixing member, and the other side edge is higher than the bearing surface.

6. The stage device according to claim 5, characterized in that: The side edge of the first sealing ring and the second sealing ring higher than the bearing surface is set as a contact portion, and the contact portion can be deformed when it is in contact with the workpiece, and an escape space for accommodating the contact portion is provided on the bearing seat.

7. The stage device according to claim 1, characterized in that: The adsorption component also includes a second suction nozzle arranged in the first adsorption area, the second suction nozzle includes an elastic suction nozzle, and the adsorption end of the second suction nozzle is higher than the bearing surface; when adsorbing the workpiece, the second suction nozzle can be deformed along the sliding direction.

8. The stage device according to claim 7, characterized in that: The supporting seat is provided with a first air path connected to the first adsorption area, and a second air path connected to the second adsorption area; a third air path is provided inside the first adsorption member, and a fourth air path is provided inside the second suction nozzle; the carrier device also includes a negative pressure generating component respectively connected to the first air path, the second air path, the third air path and the fourth air path.

9. The stage device according to claim 8, characterized in that: The negative pressure generating component is used to independently construct negative pressure in the first gas circuit, the second gas circuit, the third gas circuit and the fourth gas circuit.

10. A processing equipment, characterized in that: The processing equipment comprises the stage device according to any one of claims 1 to 9, and the processing equipment further comprises a machine platform for installing the stage device.

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