Wafer carrying disc compatible with multiple sizes

Abstract

The utility model discloses a multi-size compatible wafer loading disc, which comprises a bearing disc, a plurality of supporting mechanisms capable of adjusting the balance of the bearing disc are installed at the lower end of the bearing disc at equal angles, and a sensor fixing piece is installed on one side of the bearing disc. A plurality of limiting guide nails for guiding and limiting wafers are detachably mounted on the upper surface of the bearing disc; according to the utility model, the limiting guide nails are matched with the guide nail grooves in the coarse positioning scribed lines, so that the limiting guide nails can be mounted in the guide nail grooves in the corresponding coarse positioning scribed lines according to the bearing requirements of wafers with different sizes, and the multi-size compatibility is realized by arranging the limiting guide nails at different positions of the guide nail grooves; according to the method, whether the position of the wafer has large deviation or not is confirmed through routing inspection of the coarse positioning scribed line, the process switching time is effectively shortened, the risk in the compatible switching and dismounting process is effectively reduced, and better guarantee is provided for the stability in the wafer bearing field.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing equipment, in particular to a wafer carrier that is compatible with multiple sizes. Background Art

[0002] During the wafer processing process, plasma equipment is required to remove glue or other residues remaining on the wafer surface to ensure the quality of subsequent processing of the wafer. During plasma degumming, a carrier is required to carry and support the wafer to facilitate plasma cleaning of the wafer.

[0003] However, the wafer carrier used in the current wafer plasma stripping process is usually only compatible with a single size of wafer carrier. If wafers of different sizes are to be processed, it is necessary to process carriers of each size. Due to the relationship between wafer structure, size and hardware cost, it is inevitable that the carrier switching is inconvenient, the switching time is long, re-debugging is required after switching, and the switching cost is high, which also increases the risk of compatible switching and disassembly process;

[0004] For example, the patent document application number is 202211709254.1, which discloses a plasma degumming device for semiconductor wafer manufacturing. The device is provided with an upper supporting boss and a lower supporting boss on a movable carrier. The lower supporting boss or the upper supporting boss is used to support the wafer for degumming, but the upper supporting boss and the lower supporting boss can only support wafers of one size.

[0005] Therefore, we need to propose a wafer carrier that is compatible with multiple sizes to solve the above-mentioned problems, so that the carrier can be compatible with wafers of various sizes, shorten the process switching time, effectively reduce the risk during the compatible switching and disassembly process, and provide better protection for the stability in the wafer carrying field. Utility Model Content

[0006] The purpose of the utility model is to provide a wafer carrier that is compatible with multiple sizes. Multi-size compatibility is achieved by placing limiting guide pins in different positions of guide pin grooves, and inspection is performed through coarse positioning lines to confirm whether there is a large deviation in the wafer position, thereby effectively shortening the process switching time and effectively reducing the risks in the compatible switching and disassembly process, so as to solve the problems raised in the background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer carrier that is compatible with multiple sizes, comprising a carrier plate, a plurality of support mechanisms for adjusting the balance of the carrier plate are installed at equal angles on the lower end of the carrier plate, a sensor fixing part is installed on one side of the carrier plate, a photoelectric sensor for detecting whether a wafer is placed is installed on the sensor fixing part, a plurality of limit guide pins for guiding and limiting the wafer are detachably installed on the upper surface of the carrier plate, a plurality of annular coarse positioning lines are engraved on the upper surface of the carrier plate, a plurality of guide pin grooves for installing the limit guide pins are arranged in an annular array on the carrier plate, a plurality of the guide pin grooves are equidistantly distributed in an annular manner on each coarse positioning line, and the guide pin grooves on the plurality of the coarse positioning lines are flush.

[0008] Preferably, the support mechanism includes a support sleeve and a positioning stud, the upper end of the support sleeve is fixed to the lower surface of the supporting plate, the upper end of the positioning stud is threadedly connected to the inside of the support sleeve, and the lower end of the support sleeve is provided with a threaded through hole for the positioning stud to be threaded.

[0009] Preferably, a robot arm clearance groove for a robot arm to take and place wafers is opened at the upper end of the carrying plate, and one side of the robot arm clearance groove is connected to the side wall of the carrying plate.

[0010] Preferably, two photoelectric avoidance holes for the photoelectric sensor to make way are provided at the center of the carrier plate, and the two photoelectric avoidance holes are located on both sides of the manipulator's make way slot.

[0011] Preferably, the sensor fixing part is an L-shaped plate formed by bending a metal sheet, one end of the sensor fixing part is fixed to the side wall of the supporting plate by bolts, the photoelectric sensor is installed at the other end of the sensor fixing part, and the photoelectric sensor is located directly below the photoelectric avoidance hole.

[0012] Preferably, a notch is provided on the cap body of the position-limiting guide pin, an outer wall of the cylinder of the position-limiting guide pin is provided with an external thread, and an inner wall of the guide pin groove is provided with an internal thread matching the external thread.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The utility model cooperates the limit guide pin with the guide pin groove on the coarse positioning scale line, so that the limit guide pin can be installed in the guide pin groove at the corresponding coarse positioning scale line according to the carrying requirements of wafers of different sizes. Multi-size compatibility is achieved by placing the limit guide pin in different positions of the guide pin groove. The coarse positioning scale line is used to inspect and confirm whether there is a large deviation in the wafer position, which effectively shortens the process switching time, effectively reduces the risk in the compatible switching and disassembly process, and provides better protection for the stability in the wafer carrying field.

[0015] 2. The utility model provides a supporting mechanism to facilitate horizontal adjustment of the carrier plate according to the installation requirements of the carrier plate, so that the wafers carried on the carrier plate can be kept level. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the explosion structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the structure of the utility model when the load-bearing plate is not equipped with limiting guide pins;

[0018] Figure 3 This is a side view of the structure of the utility model;

[0019] Figure 4 It is a schematic diagram of the cross-sectional structure of the side limiting guide pin and the guide pin groove of the utility model when they are installed.

[0020] In the figure: 1. Limit guide pin; 101. Guide pin groove; 102. Coarse positioning scale line; 103. Photoelectric avoidance hole; 104. Robot arm clearance groove; 2. Carrying plate; 3. Sensor fixing part; 4. Photoelectric sensor; 5. Support sleeve; 6. Positioning stud. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4 The utility model provides a technical solution: a wafer carrier compatible with multiple sizes, including a carrier plate 2, a plurality of support mechanisms for balancing the carrier plate 2 are installed at equal angles on the lower end of the carrier plate 2, a sensor fixture 3 is installed on one side of the carrier plate 2, a photoelectric sensor 4 for detecting whether a wafer is placed is installed on the sensor fixture 3, a plurality of limit guide pins 1 for guiding and limiting the wafer are detachably installed on the upper surface of the carrier plate 2, a plurality of annular coarse positioning scale lines 102 are engraved on the upper surface of the carrier plate 2, a plurality of guide pin grooves 101 for installing the limit guide pins 1 are arranged in an annular array on the carrier plate 2, the plurality of guide pin grooves 101 are equidistantly distributed in an annular manner on each coarse positioning scale line 102, and the guide pin grooves 101 on the plurality of coarse positioning scale lines 102 are flush.

[0023] When in use, according to the requirements of wafer carrying of different sizes, the limiting guide pin 1 is installed in the guide pin groove 101 at the corresponding coarse positioning mark 102, and multi-size compatibility is achieved by placing the limiting guide pin 1 at different positions of the guide pin groove 101. The coarse positioning mark 102 is used to inspect and confirm whether there is a large deviation in the wafer position, thereby effectively shortening the process switching time, effectively reducing the risk in the compatible switching and disassembly process, and providing better protection for stability in the wafer carrying field.

[0024] The supporting mechanism includes a supporting sleeve 5 and a positioning stud 6. The upper end of the supporting sleeve 5 is fixed to the lower surface of the carrying plate 2. The upper end of the positioning stud 6 is threadedly connected to the inside of the supporting sleeve 5, and a threaded through hole for the positioning stud 6 to be threaded is opened at the lower end of the supporting sleeve 5. It is convenient to rotate the positioning stud 6 from the lower end of the positioning stud 6 to adjust the length of the positioning stud 6 under the supporting sleeve 5, thereby extending or shortening the height of the supporting mechanism, which is convenient for horizontal adjustment of the carrying plate 2 according to the installation requirements of the carrying plate 2, so that the wafer carried on the carrying plate 2 can remain horizontal.

[0025] A robot clearance groove 104 is provided at the upper end of the carrier plate 2 for the robot to pick up and place wafers. One side of the robot clearance groove 104 is connected to the side wall of the carrier plate 2. The robot's wafer picking path passes through the position, providing an avoidance space for the robot's picking and placing actions.

[0026] Two photoelectric avoidance holes 103 are provided in the center of the carrier plate 2 for the photoelectric sensor 4 to make way for. The two photoelectric avoidance holes 103 are located on both sides of the robot arm make way slot 104 so that the photoelectric sensor 4 can sense whether there is a wafer on the carrier plate 2 through the photoelectric avoidance holes 103 .

[0027] The sensor fixing part 3 is an L-shaped plate formed by bending a metal sheet. One end of the sensor fixing part 3 is fixed to the side wall of the supporting plate 2 by bolts. The photoelectric sensor 4 is installed on the other end of the sensor fixing part 3, and the photoelectric sensor 4 is located directly below the photoelectric avoidance hole 103. The sensor fixing part 3 is used to provide support force for the photoelectric sensor 4. The photoelectric avoidance hole 103 is a machined hole, which provides an avoidance effect for the photoelectric sensor 4 to detect the position.

[0028] A notch is provided on the cap body of the limiting guide pin 1, an outer wall of the cylinder of the limiting guide pin 1 is provided with an external thread, and an inner wall of the guide pin groove 101 is provided with an internal thread matching the external thread, so as to facilitate the installation of the limiting guide pin 1 in the guide pin groove 101 at different positions, and utilize the thread cooperation between the guide pin groove 101 and the limiting guide pin 1 to improve the firmness of the fixing of the limiting guide pin 1.

[0029] In summary, the supporting carrier and the sensor fixture 3 are installed in sequence based on the plane reference formed by the connection between the positioning stud 6 and the base plate. The photoelectric sensor 4 is installed on the sensor fixture 3 and fixed on the supporting carrier as a whole. The photoelectric avoidance hole 103 is used to detect whether the wafer is placed on the supporting carrier. Then the limiting guide pin 1 is combined with the guide pin groove 101 through a threaded connection. The size compatibility is achieved by placing the limiting guide pin 1 at different positions of the guide pin groove 101. The coarse positioning scale line 102 is used to inspect and confirm whether there is a large deviation in the wafer position. The robot arm's clearance groove 104 is used to allow the robot arm to pass through this position to perform wafer pick-up and placement operations.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer carrier compatible with multiple sizes, comprising a carrier plate (2), characterized in that: A plurality of support mechanisms capable of adjusting the balance of the carrier plate (2) are mounted at equal angles on the lower end of the carrier plate (2); a sensor fixing part (3) is mounted on one side of the carrier plate (2); a photoelectric sensor (4) for detecting whether a wafer is placed is mounted on the sensor fixing part (3); a plurality of limiting guide pins (1) for guiding and limiting the wafer are detachably mounted on the upper surface of the carrier plate (2); a plurality of annular coarse positioning scale lines (102) are engraved on the upper surface of the carrier plate (2); a plurality of guide pin grooves (101) for installing the limiting guide pins (1) are arranged in an annular array on the carrier plate (2); the plurality of guide pin grooves (101) are equidistantly distributed in an annular manner on each coarse positioning scale line (102), and the plurality of guide pin grooves (101) on the coarse positioning scale lines (102) are flush.

2. The wafer carrier compatible with multiple sizes according to claim 1, characterized in that: The support mechanism comprises a support sleeve (5) and a positioning stud (6), the upper end of the support sleeve (5) is fixed to the lower surface of the carrier plate (2), the upper end of the positioning stud (6) is threadedly connected to the inside of the support sleeve (5), and the lower end of the support sleeve (5) is provided with a threaded through hole for the positioning stud (6) to be threaded.

3. The wafer carrier compatible with multiple sizes according to claim 2, characterized in that: The upper end of the carrier plate (2) is provided with a robot clearance groove (104) for the robot to take and place wafers, and one side of the robot clearance groove (104) is connected to the side wall of the carrier plate (2).

4. The wafer carrier compatible with multiple sizes according to claim 3, characterized in that: Two photoelectric avoidance holes (103) for the photoelectric sensor (4) to make way are provided at the center of the carrier plate (2), and the two photoelectric avoidance holes (103) are located on both sides of the robot hand making way slot (104).

5. The wafer carrier compatible with multiple sizes according to claim 4, characterized in that: The sensor fixing member (3) is an L-shaped plate formed by bending a metal sheet, one end of the sensor fixing member (3) is fixed to the side wall of the carrier plate (2) by means of bolts, the photoelectric sensor (4) is mounted on the other end of the sensor fixing member (3), and the photoelectric sensor (4) is located directly below the photoelectric avoidance hole (103).

6. The wafer carrier compatible with multiple sizes according to claim 5, characterized in that: A notch is provided on the cap body of the position-limiting guide pin (1), an outer wall of the column of the position-limiting guide pin (1) is provided with an external thread, and an inner wall of the guide pin groove (101) is provided with an internal thread matching the external thread.

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