LGA module device

Abstract

There is provided an LGA module apparatus including: an SoC device having a first pin pitch in a first direction; the power supply and the memory device are connected with the SoC device, and the power supply and the memory device are enclosed in a packaging shell together with the SoC device; the plurality of output pins are located on the bottom surface of the packaging shell, the plurality of output pins are divided into a first section and a second section, the first section is located at the center of the bottom surface of the packaging shell and has a second pin pitch along the first direction, and the second section is located at the center of the bottom surface of the packaging shell and has a second pin pitch along the second direction. The second section surrounds the first section and has a third pin pitch along the first direction, and the second pin pitch and the third pin pitch are both larger than the first pin pitch.

Description

Technical Field

[0001] The present disclosure relates generally to integrated circuit packaging technology, and more particularly, to an LGA module device. Background Art

[0002] SoC (System-on-Chip) is a highly integrated chip product with different functional circuits in the chip. SoC has been widely used due to its high integration, low power consumption and excellent performance. SoC devices have a certain degree of complexity. They provide many interfaces in a small form factor, such as clock, signal, protocol and power interfaces. As the integration of SoC devices continues to increase, the device size continues to decrease, and the density of interfaces continues to increase. Therefore, when installing SoC devices on PCB boards, more challenges are encountered. Utility Model Content

[0003] In view of the above problems, the present disclosure provides an LGA module device, comprising: a SoC device having a first pin spacing along a first direction; a power supply and memory device, which is connected to the SoC device and is enclosed in a packaging shell together with the SoC device; and a plurality of output pins located on the bottom surface of the packaging shell, wherein the plurality of output pins are divided into a first section and a second section, the first section is located at the center of the bottom surface of the packaging shell and has a second pin spacing along the first direction, and the second section surrounds the first section and has a third pin spacing along the first direction, wherein the second pin spacing and the third pin spacing are both greater than the first pin spacing.

[0004] In an embodiment, the first section is configured to be grounded.

[0005] In an embodiment, the second section is configured to lead out pins of the SoC device within the packaging shell.

[0006] In an embodiment, the first pin spacing is 0.354 mm.

[0007] In an embodiment, the second pin pitch is 1.6 mm.

[0008] In an embodiment, the third pin spacing is 1.5 mm.

[0009] In an embodiment, the first section is configured as a square.

[0010] In an embodiment, the second section is configured to arrange three columns of pins along each side of the package housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate embodiments of the present disclosure and, together with the description, further serve to explain the principles of the present disclosure and enable those skilled in the relevant art to make and use the present disclosure.

[0012] Figure 1 FIG. 4 shows the packaging of the HKR SoC device.

[0013] Figure 2 A schematic diagram showing repackaging of a HKR SoC device into an LGA module device according to an embodiment is shown.

[0014] Figure 3 FIG. 4 is a schematic diagram showing package pins of an LGA module device according to an embodiment.

[0015] Various embodiments will be described with reference to the accompanying drawings. DETAILED DESCRIPTION

[0016] The subject matter described herein will now be discussed with reference to example embodiments. It should be understood that the discussion of these embodiments is only to enable those skilled in the art to better understand and implement the subject matter described herein, and is not a limitation of the scope of protection, applicability or examples set forth in the claims. The function and arrangement of the elements discussed can be changed without departing from the scope of protection of the present disclosure. Various examples can omit, replace or add various processes or components as needed. For example, the described method can be performed in an order different from the described order, and various steps can be added, omitted or combined. In addition, the features described relative to some examples can also be combined in other examples.

[0017] It should be noted that the references to "one embodiment", "embodiment", "some embodiments" and the like in the specification indicate that the described embodiments may include specific features, structures or characteristics, but not every embodiment may include the specific features, structures or characteristics. In addition, such expressions do not necessarily refer to the same embodiment. In addition, when specific features, structures or characteristics are described in conjunction with an embodiment, it should be within the knowledge of technicians in the relevant field to implement such features, structures or characteristics in conjunction with other embodiments that are explicitly or not explicitly described.

[0018] With the continuous development of technology in the SoC field, the integration of some SoC products has been continuously improved, and the product size has been continuously reduced. Hawk River (HKR SoC) is a new SoC device product that integrates more camera inputs and can process more camera input data, simplifying complex multi-camera systems. HKR SoC has lower power consumption and smaller form factor, so its output pins / external interfaces are denser and smaller in pitch.

[0019] However, due to the very small pin pitch of HKR SoC products, the entire circuit system based on HKR SoC products must be designed using T4 printed circuit boards (T4-PCBs), because T4-PCBs are compatible with output pins with smaller pitches. At the same time, other devices in the circuit system, such as memory, power supply, etc., must be redesigned in order to be installed on the T4-PCB. This is complicated for users and has a high design difficulty. In addition, the cost of T4-PCB itself is relatively high, resulting in a high cost for the entire circuit system based on HKR SoC products and T4-PCBs.

[0020] Therefore, in order to enable the HKR SoC product to be designed using the T3-PCB commonly used today, the present disclosure proposes to repackage the HKR SoC product into an LGA module device, so that the spacing between the output pins / external interfaces of the LGA module device is larger and compatible with the T3-PCB. In addition, in the LGA module device, the HKR SoC product is packaged together with the necessary memory and power supply, so that the output pins of the LGA module device only include the functional pins required by the user, which also reduces the number of exposed pins, thereby simplifying the installation process.

[0021] Figure 1 The package of the HKR SoC device is shown in top and bottom views respectively. Figure 1 As shown in the top view, the maximum dimensions of the front side of the HKR SoC device are D=11.5 mm and E=12.5 mm. As shown in the bottom view, the back side of the HKR SoC device is densely populated with output pins / external interfaces. Each output pin is in the form of a solder ball. In an embodiment, the maximum diameter of the solder ball is b=0.26 mm, and the spacing between the solder balls is s=0.354 mm.

[0022] In actual application, due to the very small solder ball pitch and extremely dense solder ball distribution, the HKR SoC device must be designed using a T4-PCB circuit board. Furthermore, necessary power supplies and memory devices must also be redesigned in order to be installed on the T4-PCB circuit board. As you can imagine, this complex design work is challenging for users and makes it inconvenient to use.

[0023] Figure 2 A schematic diagram of repackaging a HKR SoC device into an LGA module device according to an embodiment is shown. In an embodiment, the HKR SoC mentioned in the present disclosure is marked as HKR1E.

[0024] In the embodiment of the present disclosure, the HKR SoC is connected with a memory device and a power device and placed in a package shell to form an LGA module device. Figure 2 As shown, the HKR SoC is connected to the LPDDR4x memory and the QSPI flash memory, respectively. In one embodiment, the LPDDR4x can be selected as a capacity of 4GB, and the QSPI flash memory can be selected as a capacity of 512MB. In other embodiments, the LPDDR4x memory and the QSPI flash memory can adopt other capacities according to the needs of use. It can be understood that according to the scheme provided by the present disclosure, the LPDDR4x memory and the QSPI flash memory can be easily replaced. In this way, by arranging the HKR SoC device together with the necessary devices such as memory, flash memory and power supply device in a packaging shell to form a complete LGA packaging module, the subsequent installation of the HKR SoC can be simplified. In other words, when using the HKR SoC device, the user does not need to design the connection and layout of the power supply and memory, etc., but directly applies the packaged LGA module device.

[0025] exist Figure 2 In the figure, the connection between the output pins of the HKR SoC and the output pins of the LGA module device is also shown. As shown in the figure, the PCIe output pins, CSI TX pins, CSI RX pins, GPIO pins, USB pins, SPI pins, SDIO pins and other functional pins of the HKR SoC can be connected to the output pins of the LGA module device respectively. In some embodiments, only some of the above-mentioned functional pins can be led out to the outside of the package shell of the LGA module device. In other embodiments, other required functional pins can also be led out. In an embodiment, the functional pins of the HKR SoC to be led out can be selected so that only the functional pins that the user needs to use are led out to the outside of the package shell of the LGA module device, thereby reducing the number of pins of the LGA module device, thereby simplifying the installation of the LGA module.

[0026] Figure 3 FIG. 1 shows a schematic diagram of package pins of an LGA module device according to an embodiment. Figure 2 The method shown will Figure 1 The HKR SoC device shown in the figure is repackaged as Figure 3 The LGA module device is shown. Figure 3 A schematic diagram of the pin layout of the formed LGA module device is shown.

[0027] like Figure 3 As shown, relative to Figure 1 The pinout of the HKR SoC device is described in Figure 3The pin density of the LGA module device is shown to be improved. In an embodiment, the outer dimensions of the repackaged module device are 50 mm x 50 mm.

[0028] like Figure 3 As shown, the pin layout of the LGA module device can be divided into a first section and a second section. In this embodiment, the first section is an area located at the center of the bottom surface of the package shell, which is designed to be a square with a size of 24mm x 24mm. In other embodiments, the first section can be designed to have other shapes or sizes. In this embodiment, the second section is arranged along the perimeter of the bottom surface of the entire LGA module device and surrounds the first section. In the embodiment of the present disclosure, the first section is configured to be grounded to stabilize the electrical performance of the device. The second section is configured to be connected to various required functional pins of the HKR SoC device to lead these functional pins to the outside of the package shell, thereby connecting through a PCB circuit board. In some embodiments, the second section is designed to arrange three columns of pins along each edge of the package shell. In other embodiments, the second section may have other arrangements.

[0029] In this embodiment, if Figure 3 As shown, in the first section, along the first direction ( Figure 3 In the horizontal direction of the first section, the spacing between adjacent metal contacts or pins is 1.6 mm. In the second section, the spacing between adjacent metal contacts or pins along the first direction is 1.5 mm. In other embodiments, the pin spacing can be designed to be other suitable sizes according to the use requirements. It can be understood that compared with Figure 1 The HKR SoC device has a solder ball pitch of 0.354 mm. The larger pitch of this LGA module device can better adapt to the T3-PCB circuit board, thereby reducing the process cost.

[0030] It should be understood that in the embodiments of the present disclosure, the SoC device is not limited to the above-mentioned HKR SoC device. In fact, the packaging method of the present disclosure is applicable to any SoC device with a small size and a small pad pitch. For example, the packaging method of the present disclosure for forming an LGA module can be applied to subsequent generations of HKR SoC devices, or other SoC devices that must be redesigned using a more expensive PCB board due to a small pad pitch.

[0031] According to the above embodiments, the present disclosure provides a novel LGA module device based on HKR SoC, which is configured with SoC devices such as HKR SoC, and memory devices and power devices connected thereto, so that while a module device that can be installed and adapted to T3-PCB is obtained, the design of memory and power devices can be omitted, thereby saving costs by avoiding the use of T4-PCB for design, and reducing the design difficulty of SoC products using HKR SoC and the like for users.

[0032] The above description of the present disclosure is provided to enable any person of ordinary skill in the art to implement or use the present disclosure. Various modifications to the present disclosure will be apparent to those of ordinary skill in the art, and the general principles defined herein may be applied to other variations without departing from the scope of protection of the present disclosure. Therefore, the present disclosure is not limited to the examples and designs described herein, but is consistent with the widest range of principles and novel features disclosed herein.

Claims

1. An LGA module device, comprising: A SoC device having a first pin pitch along a first direction; A power supply and memory device connected to the SoC device and enclosed in a packaging shell together with the SoC device; as well as a plurality of output pins located on the bottom surface of the package housing, wherein the plurality of output pins are divided into a first section and a second section, the first section is located at the center of the bottom surface of the package shell and has a second pin spacing along the first direction, and the second section surrounds the first section and has a third pin spacing along the first direction, Wherein, the second pin spacing and the third pin spacing are both greater than the first pin spacing.

2. The LGA module device according to claim 1, wherein: The first section is configured to be grounded.

3. The LGA module device according to claim 1, wherein: The second section is configured to lead out pins of the SoC device in the packaging shell.

4. The LGA module device according to claim 1, wherein: The first pin spacing is 0.354 mm.

5. The LGA module device according to claim 1, wherein: The second pin spacing is 1.6 mm.

6. The LGA module device according to claim 1, wherein: The third pin spacing is 1.5 mm.

7. The LGA module device according to claim 1, wherein: The first section is configured in a square shape.

8. The LGA module device according to claim 1, wherein: The second section is configured to arrange three columns of pins along each side of the package housing.

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