Bundling type temperature measurement sensor structure

Abstract

The utility model relates to a strapping type temperature measurement sensor structure. A cap of the temperature measurement sensor structure is provided with an accommodating inner cylinder, a helical antenna is arranged in the accommodating inner cylinder, one end of the helical antenna is welded and attached to a temperature measurement circuit board and is electrically connected with the temperature measurement circuit board, and the other end of the helical antenna is tightly attached to the bottom surface of the accommodating inner cylinder; a square groove is formed in an opening of the containing inner cylinder, the temperature measuring circuit board and the copper plate base are fixed in the square groove, and the temperature measuring circuit board is arranged between the copper plate base and the spiral antenna. The back surface of the copper plate seat is attached to the temperature measuring circuit board, and the front surface of the copper plate seat faces outwards; the cap is provided with two arc-shaped channels used for allowing binding belts to penetrate through, and the two arc-shaped channels are parallel to each other and arranged on the two sides of the containing inner cylinder. When the technical scheme of the utility model is used, the whole temperature measurement sensor is bound on the surface of the cable by adopting the binding belt, and the temperature change of the cable can be detected by the temperature measurement circuit board, so that the corresponding temperature monitoring on each cable can be realized, and the requirement of temperature measurement is met.

Description

Technical Field

[0001] The present application relates to a temperature measuring sensor, and more specifically to a bundled temperature measuring sensor structure. Background Art

[0002] As the reliability requirements for equipment in power, metallurgy and other systems are getting higher and higher, the intelligent temperature detection system plays a vital role in ensuring the normal operation of equipment. When an abnormal situation occurs in electrical equipment, the increase in current will cause the temperature of the power cable to rise. Once this temperature rise trend is too fast, causing the cable temperature to exceed the heat resistance standard of the insulation layer, the damage to the current insulation layer will cause a short circuit and lead to power supply system failure. This requires a device that can monitor the cable temperature at any time. Traditional temperature monitoring methods are mainly based on infrared temperature measurement, but infrared temperature measurement technology is easily affected by the environment and cannot monitor the temperature of each power cable in the low-voltage electrical cabinet, which needs to be improved. Utility Model Content

[0003] The purpose of the present application is to overcome the above-mentioned deficiencies in the prior art and to provide a bundled temperature sensor structure to achieve temperature monitoring of each cable.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical solutions: a bundled temperature measuring sensor structure, which includes a cap, a helical antenna, a temperature measuring circuit board and a copper plate seat, the cap is provided with a containing inner tube, the helical antenna is placed in the containing inner tube, one end of the helical antenna is welded to the temperature measuring circuit board and is electrically connected to the temperature measuring circuit board, and the other end of the helical antenna is tightly attached to the bottom surface of the containing inner tube; a square groove is provided at the opening of the containing inner tube, the temperature measuring circuit board and the copper plate seat are fixed in the square groove, and the temperature measuring circuit board is placed between the copper plate seat and the helical antenna; the back side of the copper plate seat is attached to the temperature measuring circuit board, and the front side of the copper plate seat faces outward; the cap is provided with two arc channels for inserting the binding belt, the two arc channels are parallel to each other and are placed on both sides of the containing inner tube.

[0005] The technical solution of the present application transfers heat to the temperature measuring circuit board through the copper plate seat. The temperature changes measured by the temperature measuring circuit board emit corresponding signals outwardly through the spiral antenna. The cap is provided with two arc channels for inserting the binding belt. When in use, the binding belt is used to bind the entire temperature measuring sensor to the cable surface. The temperature changes of the cable can be detected by the temperature measuring circuit board. Therefore, corresponding temperature monitoring of each cable can be achieved, meeting the temperature measurement needs.

[0006] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 This is the structural breakdown diagram of the temperature sensor.

[0008] Figure 2 A three-dimensional diagram of the cap of the temperature sensor structure.

[0009] Figure 3 This is a three-dimensional diagram of the copper plate base of the temperature sensor structure.

[0010] Figure 4 A three-dimensional diagram of the spiral antenna of the temperature sensor structure.

[0011] It should be noted that the products shown in the above views have been appropriately reduced / enlarged to suit the size of the drawings and for clarity of the views, and there is no restriction on the size of the products shown in the views. DETAILED DESCRIPTION

[0012] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0013] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0014] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0015] The embodiment of the present application is a bundled temperature sensor structure, and its specific structure is as follows: Figure 1-4 shown.

[0016] like Figure 1 As shown, the temperature sensor structure includes a cap 10, a helical antenna 20, a temperature measuring circuit board 30 and a copper plate seat 40. The temperature measuring circuit board 30 can be made of a FR-4 double-layer substrate. Figure 1 and Figure 2As shown, the cap 10 is provided with a receiving inner cylinder 11, the helical antenna 20 is placed in the receiving inner cylinder 11, one end of the helical antenna 20 is welded to the temperature measuring circuit board 30 and is electrically connected to the temperature measuring circuit board 30, and the other end of the helical antenna 20 is closely attached to the bottom surface 111 of the receiving inner cylinder 11. The helical antenna 20 and the temperature measuring circuit board 30 can be fixed and electrically connected by reflow soldering with solder paste.

[0017] Combination Figure 1 and Figure 2 As shown, a square groove 12 is provided at the opening of the accommodating inner cylinder 11, and the temperature measuring circuit board 30 and the copper plate seat 40 are fixed in the square groove 12. The temperature measuring circuit board 30 is placed between the copper plate seat 40 and the helical antenna 20. The front 41 of the copper plate seat 40 faces outward to fit the surface of the cable to be measured, and the back 42 of the copper plate seat 40 fits with the temperature measuring circuit board 30 to transfer heat. The cap 10 is provided with two arc channels 14 for inserting the binding belt, and the two arc channels 14 are parallel to each other and are placed on both sides of the accommodating inner cylinder 11. In the embodiment, the copper plate seat 40 can be made of brass material with excellent thermal conductivity, so that the change of temperature rise can be quickly detected by the temperature measuring circuit board 30. In addition, when making the copper plate seat 40, it should be ensured that the surface of the copper plate seat 40 has good flatness and surface finish, so as to ensure better transmission of the temperature of the cable to the temperature measuring circuit board 30.

[0018] When in use, two binding belts are used to pass through the arc channel 14 respectively, and the entire temperature sensor is bound to the cable surface with the binding belt. The front of the copper plate seat 40 is in contact with the cable. The temperature change of the cable will be transmitted from the copper plate seat 40 to the temperature measuring circuit board 30. The temperature change information measured by the temperature measuring circuit board 30 is emitted outwardly through the spiral antenna 20. Therefore, the corresponding temperature collection and monitoring of each cable can be realized, meeting the temperature measurement requirements.

[0019] In some embodiments, Figure 2 As shown, the four inner corners of the square groove 12 at the opening of the inner tube 11 are respectively provided with internal threaded tubes 13, and the four corners of the temperature measuring circuit board 30 and the copper plate seat 40 are respectively penetrated by screws, and the screws are then screwed into each internal threaded tube 13 to form a fixed connection.

[0020] In some embodiments, in combination Figure 1 and Figure 2 As shown, the outer sides of the two ends of the arc-shaped channel 14 are respectively provided with slopes 15 for guiding the binding belt, and both sides of the slope 15 are provided with blocking bars 151 to reduce the loosening of the binding belt.

[0021] In some embodiments, Figure 3 As shown, the front side of the copper plate seat 40 is provided with an arc surface 411 for fitting the surface of the cable to be measured, so as to increase the contact area with the cable, which is beneficial to improve the accuracy of temperature measurement. Figure 2As shown, a circular arc groove surface 16 coaxial with the circular arc surface 411 is provided on the surface corresponding to the front side 41 of the copper plate seat 40 and the cap 10. The inner diameter of the circular arc groove surface 16 is equal to the inner diameter of the circular arc surface 411. When the temperature sensor is bundled on the cable, the cable extends along the central axis of the circular arc surface 411 and the circular arc groove surface 16 plays a role of avoidance.

[0022] In some embodiments, Figure 4 As shown, an annular plane 21 is provided at one end of the helical antenna 20 which is in contact with the temperature measuring circuit board 30, and the ratio of the circumference of the annular plane 21 to the cross-sectional circumference of the helical antenna 20 is not less than three quarters. The annular plane 21 is in contact with the temperature measuring circuit board 30 to ensure sufficient contact area between the helical antenna 20 and the temperature measuring circuit board 30, thereby ensuring stable signal transmission.

[0023] like Figure 1 As shown, a surface acoustic wave resonator chip 31 for temperature measurement is provided on the temperature measurement circuit board 30. The surface acoustic wave resonator chip 31 is made of piezoelectric material. When the temperature changes, the frequency of the output signal of the surface acoustic wave resonator chip 31 will change accordingly. The output signal is transmitted to the external collector through the spiral antenna 20. The collector then converts the collected output frequency into a temperature value, and the temperature of the corresponding cable detection point can be obtained.

[0024] In the embodiment, the cap 10 is made of PPO material, which is polyphenylene ether, has excellent physical and mechanical properties, heat resistance and electrical insulation, and is non-toxic, transparent, has a low relative density, low water absorption, and is resistant to stress relaxation, creep, water, and water vapor. The load deformation temperature of the PPO material can reach more than 190°C, the brittle temperature is -170°C, the dimensional stability is high, and it can maintain good electrical properties in a wide range of temperature and frequency changes, and it is flame retardant and self-extinguishing.

[0025] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0026] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0027] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms should not be understood as necessarily being directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0028] The above examples are only used to further illustrate the technical content of this application so that readers can understand it more easily, but they do not mean that the implementation methods of this application are limited to these. Any technical extension or re-creation made based on this application is protected by this application. The scope of protection of this application shall be subject to the claims.

Claims

1. A bundled temperature sensor structure, characterized in that: It includes a cap, a helical antenna, a temperature measuring circuit board and a copper plate seat. The cap is provided with an accommodating inner cylinder, the helical antenna is placed in the accommodating inner cylinder, one end of the helical antenna is welded to the temperature measuring circuit board and is electrically connected to the temperature measuring circuit board, and the other end of the helical antenna is tightly attached to the bottom surface of the accommodating inner cylinder; a square groove is provided at the opening of the accommodating inner cylinder, the temperature measuring circuit board and the copper plate seat are fixed in the square groove, and the temperature measuring circuit board is placed between the copper plate seat and the helical antenna; the back side of the copper plate seat is attached to the temperature measuring circuit board, and the front side of the copper plate seat faces outward; the cap is provided with two arc channels for inserting the binding belt, and the two arc channels are parallel to each other and are placed on both sides of the accommodating inner cylinder.

2. The bundled temperature sensor structure according to claim 1, characterized in that: The front side of the copper plate seat is configured to fit the arc surface of the cable surface to be measured in temperature.

3. The bundled temperature sensor structure according to claim 2, characterized in that: A circular arc groove surface coaxial with the circular arc surface is provided on the surface of the cap corresponding to the front side of the copper plate seat, and the inner diameter of the circular arc groove surface is equal to the inner diameter of the circular arc surface.

4. The bundled temperature sensor structure according to claim 1, characterized in that: The four inner corners of the square groove at the opening of the accommodating inner cylinder are respectively provided with inner threaded cylinders, and the four corners of the temperature measuring circuit board and the copper plate seat are respectively screwed into the inner threaded cylinders by screws to form a fixed connection.

5. The bundled temperature sensor structure according to claim 1, characterized in that: The outer sides of the two ports of the arc-shaped channel are respectively provided with slopes for guiding the binding belts, and blocking bars are arranged on both sides of the slopes.

6. The bundled temperature sensor structure according to claim 1, characterized in that: An annular plane is arranged at one end of the helical antenna which is in contact with the temperature measuring circuit board, the ratio of the circumference of the annular plane to the cross-sectional circumference of the helical antenna is not less than three quarters, and the annular plane is in contact with the temperature measuring circuit board.

7. The bundled temperature sensor structure according to any one of claims 1 to 6, characterized in that: The temperature measurement circuit board is provided with a surface acoustic wave resonator chip for temperature measurement.

8. The bundled temperature sensor structure according to any one of claims 1 to 6, characterized in that: The cap is made of PPO material.

9. The bundled temperature sensor structure according to any one of claims 1 to 6, characterized in that: The temperature measuring circuit board is made of a FR-4 double-layer substrate.

10. The bundled temperature sensor structure according to any one of claims 1 to 6, characterized in that: The copper plate seat is made of brass material.

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