High-temperature-resistant membrane switch panel

Abstract

The utility model discloses a high temperature resistant membrane switch panel, which comprises a panel body, the panel body further comprises a circuit board substrate, a protective layer, a heat insulation layer, a heat resistant layer, a connecting layer, a waterproof layer, a heat absorption layer and a heat discharge layer, and has the beneficial effects that the high temperature resistant membrane switch panel is novel in structure and low in manufacturing cost; the membrane switch panel has high-efficiency high-temperature resistance, when the membrane switch panel works in a high-temperature environment for a long time, the membrane switch panel does not break down due to the fact that the membrane switch panel is in a high-temperature state frequently, the service life of the membrane switch panel is guaranteed, and the overall quality of the membrane switch panel is improved.

Description

Technical Field

[0001] The utility model relates to the technical field related to the production of membrane switch panels, in particular to a high-temperature resistant membrane switch panel. Background Art

[0002] The membrane switch is an operating system that integrates key functions, indicating elements, and instrument panels. It consists of four parts: panel, upper circuit, isolation layer, and lower circuit. When the membrane switch is pressed, the contacts of the upper circuit deform downward and contact and conduct with the plates of the lower circuit. After the finger is released, the contacts of the upper circuit bounce back, the circuit is disconnected, and the loop triggers a signal. The membrane switch has a rigorous structure, beautiful appearance, good sealing, moisture resistance, and long service life. It is widely used in electronic communications, electronic measurement instruments, industrial control, medical equipment, automotive industry, smart toys, household appliances and other fields.

[0003] The traditional membrane switch panel is relatively simple in structure and does not have specific performance. In actual use, the membrane switch panel does not have the ability to withstand high temperatures. When the membrane switch panel works in a high temperature environment for a long time, frequent high temperatures inside the panel will cause the panel to malfunction, resulting in the membrane switch panel being unable to continue to be used, affecting the service life of the membrane switch panel and resulting in the overall low quality of the membrane switch panel. Utility Model Content

[0004] 1. Technical issues to be solved

[0005] The technical problem to be solved by the utility model is: since the traditional membrane switch panel is relatively simple in structure and does not have specific performance, in actual use, the membrane switch panel does not have the ability to withstand high temperatures. When the membrane switch panel works in a high temperature environment for a long time, the frequent high temperature inside the panel will cause the panel to malfunction, thereby causing the membrane switch panel to be unable to continue to be used, affecting the service life of the membrane switch panel and resulting in the problem of low overall quality of the membrane switch panel.

[0006] (II) Technical solution

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high temperature resistant membrane switch panel, comprising a panel body, wherein the panel body also comprises a circuit board substrate, a protective layer, a heat insulation layer, a heat resistant layer, a connecting layer, a waterproof layer, a heat absorption layer and a heat discharge layer, wherein the protective layer is arranged on the upper part of the circuit board substrate, the heat insulation layer is arranged on the upper part of the protective layer, the heat resistant layer is arranged on the upper part of the heat insulation layer, the connecting layer is arranged on the lower layer of the circuit board substrate, the waterproof layer is arranged on the lower part of the connecting layer, the heat absorption layer is arranged on the lower part of the waterproof layer, and the heat discharge layer is arranged on the lower part of the heat absorption layer.

[0008] Furthermore, the material used for the protective layer is silicone material.

[0009] Furthermore, the thickness of the thermal insulation layer is 0.07-0.08 mm.

[0010] Furthermore, the material used for the heat-resistant layer is silicon carbide.

[0011] Furthermore, the thickness of the waterproof layer is 0.04-0.06 mm.

[0012] Furthermore, the thickness of the heat absorption layer is 0.05-0.07 mm.

[0013] Furthermore, the surface of the heat dissipation layer is coated with thermal conductive silicone grease.

[0014] (III) Beneficial effects

[0015] The utility model provides a high-temperature resistant membrane switch panel, which has the following beneficial effects: novel structure and low production cost, so that the membrane switch panel has efficient high-temperature resistance. When the membrane switch panel works in a high-temperature environment for a long time, the membrane switch panel will not malfunction due to its frequent high-temperature state, thereby ensuring the service life of the membrane switch panel and improving the overall quality of the membrane switch panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the panel body structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the cross-sectional structure of the panel body of the utility model;

[0018] In the figure: 1-panel body, 1a-circuit board substrate, 1b-protective layer, 1c-insulating layer, 1d-heat-resistant layer, 1e-connecting layer, 1f-waterproof layer, 1g-heat absorption layer, 1h-heat dissipation layer. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only some embodiments of the utility model, rather than all embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the utility model. In the description of the utility model, it should be understood that the terms "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model.

[0020] See also Figure 1 to Figure 2 The utility model provides a technical solution: a high temperature resistant membrane switch panel, comprising a panel body 1, the panel body 1 also comprising a circuit board substrate 1a, a protective layer 1b, a heat insulating layer 1c, a heat resistant layer 1d, a connecting layer 1e, a waterproof layer 1f, a heat absorbing layer 1g and a heat dissipating layer 1h, the protective layer 1b is arranged on the upper part of the circuit board substrate 1a, the heat insulating layer 1c is arranged on the upper part of the protective layer 1b, the heat resistant layer 1d is arranged on the upper part of the heat insulating layer 1c, the connecting layer 1e is arranged on the lower layer of the circuit board substrate 1a, the waterproof layer 1f is arranged on the lower part of the connecting layer 1e, the heat absorbing layer 1g is arranged on the lower part of the waterproof layer 1f, and the heat dissipating layer 1h is arranged on the lower part of the heat absorbing layer 1g.

[0021] The material used for the protective layer 1b is silicone, the thickness of the heat insulation layer 1c is 0.07-0.08mm, the material used for the heat-resistant layer 1d is silicon carbide, the thickness of the waterproof layer 1f is 0.04-0.06mm, the thickness of the heat absorption layer 1g is 0.05-0.07mm, and the surface of the heat dissipation layer 1h is coated with thermal conductive silicone grease.

[0022] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0023] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A high temperature resistant membrane switch panel, characterized in that: The panel body (1) comprises a circuit board substrate (1a), a protective layer (1b), a heat insulating layer (1c), a heat resistant layer (1d), a connecting layer (1e), a waterproof layer (1f), a heat absorbing layer (1g) and a heat dissipating layer (1h), wherein the protective layer (1b) is arranged on the upper part of the circuit board substrate (1a), the heat insulating layer (1c) is arranged on the upper part of the protective layer (1b), the heat resistant layer (1d) is arranged on the upper part of the heat insulating layer (1c), the connecting layer (1e) is arranged on the lower layer of the circuit board substrate (1a), the waterproof layer (1f) is arranged on the lower part of the connecting layer (1e), the heat absorbing layer (1g) is arranged on the lower part of the waterproof layer (1f), and the heat dissipating layer (1h) is arranged on the lower part of the heat absorbing layer (1g).

2. A high temperature resistant membrane switch panel according to claim 1, characterized in that: The material used for the protective layer (1b) is silicone material.

3. The high temperature resistant membrane switch panel according to claim 1, characterized in that: The thickness of the heat insulation layer (1c) is 0.07-0.08 mm.

4. The high temperature resistant membrane switch panel according to claim 1, characterized in that: The material used for the heat-resistant layer (1d) is silicon carbide.

5. The high temperature resistant membrane switch panel according to claim 1, characterized in that: The thickness of the waterproof layer (1f) is 0.04-0.06 mm.

6. The high temperature resistant membrane switch panel according to claim 1, characterized in that: The thickness of the heat absorption layer (1g) is 0.05-0.07mm.

7. The high temperature resistant membrane switch panel according to claim 1, characterized in that: The surface of the heat dissipation layer (1h) is coated with thermal conductive silicone grease.

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