Silicon wafer material frame

Abstract

The utility model discloses a silicon wafer material frame, which is used for containing and transferring a silicon wafer unit, the silicon wafer unit comprises a wafer support and a plurality of silicon wafers to be separated adhered on the wafer support, the plurality of silicon wafers are divided into a plurality of silicon wafer groups, a clamping assembly is arranged on a frame of the material frame, the clamping assembly comprises a plurality of clamping parts which are sequentially arranged along the length direction of a containing space, and the clamping parts are arranged on the wafer support. The plurality of clamping parts are in one-to-one correspondence with the plurality of silicon wafer groups so as to clamp the corresponding silicon wafer groups, and each clamping part moves towards the direction far away from the silicon wafer unit under the action of external force so as to release the clamping of the corresponding silicon wafer group. According to the material frame, independent clamping and clamping releasing of each silicon wafer group can be achieved, manual intervention is reduced, the operation efficiency is improved, and silicon wafers are prevented from being damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaics, in particular to a silicon slice material frame. Background Art

[0002] In the production process of silicon wafers, the silicon rod is first cut into silicon wafers by a wire cutting machine. At this time, the silicon wafers are glued to the wafer tray with a resin plate. In order to achieve automatic debonding of the silicon wafers after wire cutting, the wafer tray and the silicon wafers on the wafer tray need to be transported to the debonding machine for debonding, so as to separate the silicon wafers from the wafer tray. Subsequently, the separated silicon wafers are transported to the wafer inserting machine for slicing and inserting.

[0003] During the transfer process of silicon wafers, a material frame is used to carry the wafer tray and silicon wafers between different workstations. In the prior art, the material frame clamps and limits the silicon wafer as a whole. When inserting the wafer, the silicon wafer limit needs to be released as a whole, and it is impossible to unlock and load each unit silicon wafer separately. Since all silicon wafers are released when inserting the wafer, the silicon wafers that are not inserted are prone to tilting and squeezing, resulting in silicon wafer fragmentation or hidden cracks, which seriously damages the quality of the silicon wafer.

[0004] The above information disclosed in the background technology is only used to increase the understanding of the background technology of the present application, and therefore, it may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0005] In view of the problems pointed out in the background technology, the utility model proposes a silicon wafer material frame, which can realize independent clamping and unclamping of each unit silicon wafer, reduce manual intervention, improve operation efficiency, and avoid damage to the silicon wafer.

[0006] In order to achieve the above-mentioned utility model purpose, the utility model adopts the following technical solutions:

[0007] The utility model provides a silicon wafer material frame for containing and transporting a silicon wafer unit, wherein the silicon wafer unit comprises a wafer tray and a plurality of silicon wafers to be separated and pasted on the wafer tray, wherein the plurality of silicon wafers are divided into a plurality of silicon wafer groups, and the material frame comprises:

[0008] A frame, in which a containing space for placing the silicon wafer unit is formed, the top of the containing space is open, and one end of the frame is provided with a discharge port connected to the containing space;

[0009] A clamping assembly, which is arranged on the frame, and includes a plurality of clamping parts arranged in sequence along the length direction of the containing space, and the plurality of clamping parts correspond to the plurality of silicon wafer groups one by one to clamp the corresponding silicon wafer groups;

[0010] Wherein, each of the clamping parts moves in a direction away from the silicon wafer unit under the action of an external force to release the clamping of the corresponding silicon wafer group.

[0011] In some embodiments, the clamping assembly has two groups, and the two groups of the clamping assemblies are arranged oppositely on two sides of the containing space to clamp two sides of the silicon wafer unit.

[0012] In some embodiments, the clamping portion includes a second pin shaft, the second pin shaft passes through the frame, an unlocking block is provided on the first end of the second pin shaft, a clamping block is provided on the second end of the second pin shaft, a spring is sleeved on the second pin shaft, and the spring is located between the clamping block and the frame;

[0013] Each of the unlocking blocks moves in a direction away from the silicon wafer unit under the action of an external force, driving the corresponding clamping block away from the corresponding silicon wafer group;

[0014] The clamping block moves toward the direction approaching the silicon wafer unit under the action of the restoring force of the spring to clamp the corresponding silicon wafer group.

[0015] In some embodiments, the clamping assembly further comprises a movable plate, the movable plate extends along the length direction of the containing space, and the plurality of clamping parts are sequentially arranged along the length direction of the movable plate;

[0016] When the movable plate moves in a direction away from the containing space under the action of an external force, the movable plate drives all the clamping parts arranged thereon to move synchronously in a direction away from the containing space.

[0017] In some embodiments, the movable plate is located outside the frame, and the second pin passes through the frame and the movable plate;

[0018] When the movable plate moves in a direction away from the containing space, the movable plate pushes all the unlocking blocks to move synchronously in a direction away from the containing space, so that all the clamping blocks move synchronously in a direction away from the containing space.

[0019] In some embodiments, the material frame also includes an unlocking trigger portion, which includes a first pin shaft, which passes through the frame, and the first end of the first pin shaft is fixedly connected to the movable plate, and the second end of the first pin shaft is used to receive external force to make the first pin shaft move along its passing direction in the frame, so as to drive the movable plate to move synchronously in a direction away from the containing space.

[0020] In some embodiments, each of the movable panels is configured with two unlocking triggering portions, and the two unlocking triggering portions are spaced apart along the length direction of the movable panel.

[0021] In some embodiments, the material frame further includes an anti-dumping component, which is disposed at an end away from the material outlet, and the anti-dumping component is used to support the silicon wafer.

[0022] In some embodiments, the anti-dumping assembly includes a second mounting frame and a second roller disposed on the second mounting frame, the second mounting frame is disposed on the frame, and the second roller is used to abut against the silicon wafer.

[0023] In some embodiments, the frame includes an upper frame and a lower frame, the upper frame is detachably connected to the lower frame, the clamping assembly is disposed on the lower frame, and a limiting structure for limiting the crystal holder is disposed on the upper frame;

[0024] The upper frame is moved away from the lower frame to separate the wafer support from the silicon wafer, and the silicon wafer remains in the lower frame.

[0025] Compared with the prior art, the advantages and positive effects of the utility model are:

[0026] The material frame disclosed in the present application clamps the corresponding silicon wafer groups simultaneously through multiple clamping parts on the clamping assembly to achieve clamping of all silicon wafers. On the one hand, it ensures the reliability of the placement of the silicon wafers in the material frame, and on the other hand, it also facilitates the subsequent smooth debonding and separation of the crystal tray and the silicon wafers; at the same time, each clamping part unlocks the silicon wafer group independently of each other, and each clamping part is unlocked in turn by an unlocking device, that is, the unlocking of each silicon wafer group is independent of each other. In this way, when it is necessary to load the silicon wafer units in units of silicon wafer groups, the clamping part releases the clamping of the corresponding silicon wafer group. When the unlocked silicon wafer group is loaded in pieces, the remaining silicon wafer groups are still clamped by the corresponding clamping parts. In this way, the placement stability of the remaining silicon wafer groups that have not been loaded in the material frame can be ensured, the silicon wafers can be prevented from tipping over or squeezing each other, the silicon wafers can be avoided from being damaged, and the quality of the silicon wafers can be guaranteed.

[0027] After reading the specific embodiments of the present invention in conjunction with the accompanying drawings, other features and advantages of the present invention will become more clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0029] Figure 1 This is one of the structural schematic diagrams of the material frame and the transfer trolley according to the embodiment;

[0030] Figure 2 This is a second structural schematic diagram of a material frame and a transfer trolley according to an embodiment;

[0031] Figure 3 for Figure 2 Enlarged view of part A in the middle;

[0032] Figure 4 is a schematic structural diagram of a material frame and a silicon wafer unit according to an embodiment;

[0033] Figure 5 is a schematic structural diagram of an upper frame according to an embodiment;

[0034] Figure 6 is a schematic structural diagram of a lower frame according to an embodiment;

[0035] Figure 7 is a schematic structural diagram of a clamping assembly and a lower frame according to an embodiment;

[0036] Figure 8 is a schematic structural diagram of a clamping assembly according to an embodiment;

[0037] Fig. 9 for Figure 8 Middle AA section view;

[0038] Fig.10 for Figure 8 Middle BB section view;

[0039] Fig.11 is a schematic structural diagram of a clamping portion according to an embodiment;

[0040] Fig.12 for Figure 4 Enlarged view of middle part B;

[0041] Fig.13 is a schematic structural diagram of an unlocking device according to an embodiment;

[0042] Fig.14 is a schematic structural diagram of an anti-dumping assembly according to an embodiment;

[0043] Fig.15 is a schematic structural diagram of a transfer vehicle according to an embodiment;

[0044] Fig.16 is a cross-sectional view of a transfer vehicle according to an embodiment;

[0045] Fig.17 is a schematic structural diagram of a silicon wafer unit according to an embodiment;

[0046] Reference numerals:

[0047] 100, silicon wafer unit; 110, wafer support; 111, extension portion; 120, silicon wafer; 121, silicon wafer group;

[0048] 200, material frame;

[0049] 210, frame; 211, upper frame; 2111, first bracket of upper frame; 2112, second bracket of upper frame; 2113, opening; 2114, support frame; 2115, raised portion; 2116, upper limit block; 2117, upper grabbing portion; 212, lower frame; 2121, first bracket of lower frame; 2122, second bracket of lower frame; 2123, horizontal frame of lower frame; 2124, vertical frame of lower frame; 2125, horizontal frame; 2126, lower limit block; 2127, lower grabbing portion; 213, containing space; 214, discharge port; 215, support roller;

[0050] 220, clamping assembly; 221, movable plate; 222, clamping portion; 2221, second pin shaft; 2222, clamping block; 2223, unlocking block; 2224, second long through hole; 2225, horizontal portion; 2226, vertical portion; 2227, inclined surface; 2228, step portion; 2229, spring; 223, second limit axis;

[0051] 230, unlocking trigger part; 231, first pin shaft; 232, third roller; 233, first limit shaft; 234, first long through hole;

[0052] 240, anti-dumping assembly; 241, second mounting frame; 2411, fixed frame; 2412, movable frame; 2413, torsion spring; 242, second roller;

[0053] 300, unlocking device; 310, first mounting frame; 320, first roller;

[0054] 400, transfer trolley; 410, unlocking part; 411, guide contact surface; 4111, contact surface section 1; 4112, contact surface section 2; 4113, contact surface section 3; 420, limit part; 430, liquid collecting tank; 440, liquid discharge port; 450, liquid discharge valve; 460, positioning part;

[0055] L, length direction of the material frame;

[0056] W: Width direction of the material frame. DETAILED DESCRIPTION

[0057] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0058] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0059] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0060] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0061] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0062] The disclosure below provides many different embodiments or examples for realizing different structures of the utility model. In order to simplify the disclosure of the utility model, the components and settings of specific examples are described below. Of course, they are merely examples, and the purpose is not to limit the utility model. In addition, the utility model may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the utility model provides various specific examples of processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0063] The present embodiment discloses a silicon wafer material frame 200, which is used to contain and transport silicon wafer units 100, and to transport the silicon wafer units 100 between different work stations.

[0064] The silicon wafer unit 100 is as follows Fig.17 As shown, it includes a wafer tray 110 and a plurality of silicon wafers 120 to be separated and adhered to the wafer tray 110 . The plurality of silicon wafers 120 are divided into a plurality of silicon wafer groups 121 . Fig.17 In the figure, two adjacent silicon wafer groups 121 are separated by a dotted line.

[0065] During the production and processing of silicon wafers, the silicon rod is first cut into silicon wafers 120 by a cutting device. At this time, the silicon wafer 120 is adhered to the crystal tray 110 through a resin plate. After the cutting is completed, the crystal tray 110 and the silicon wafer 120 are loaded into the material frame 200. The material frame 200 transfers the silicon wafer unit 100 to the degumming station, separates the crystal tray 110 from the silicon wafer 120, and then transfers the separated silicon wafer 120 to the insertion station through the material frame 200 for insertion. After the insertion, the silicon wafer 120 is cleaned.

[0066] Reference Figures 4 to 8 The material frame 200 in this embodiment includes a frame 210, a clamping assembly 220, an unlocking device 300, etc. The material frame 200 has the functions of storing, clamping, unlocking and clamping, and protecting the silicon wafer 120, etc. for the silicon wafer unit 100.

[0067] A containing space 213 for containing the silicon wafer unit 100 is formed in the frame 210. The top of the containing space 213 is open so that the silicon wafer unit 100 can be loaded into the containing space 213 from top to bottom. One end of the frame 210 is provided with a discharge port 214 connected to the containing space 213. In subsequent operation steps, the debonded silicon wafer 120 is discharged from the discharge port 214.

[0068] The frame 210 serves as a mounting carrier for the clamping assembly 220 , and the frame 210 encloses a containing space 213 for containing the silicon wafer unit 100 .

[0069] The clamping assembly 220 is used to clamp the silicon wafer unit 100 . On the one hand, the clamping assembly 220 can clamp the entire silicon wafer unit 100 at the same time; on the other hand, the clamping assembly 220 can independently unlock each silicon wafer group 121 .

[0070] There are two clamping assemblies 220 located at opposite sides of the containing space 213 to clamp opposite sides of the silicon wafer unit 100 .

[0071] The clamping assembly 220 includes a plurality of clamping parts 222 arranged in sequence along the length direction of the containing space 213 (i.e., the length direction L of the material frame 200), and the plurality of clamping parts 222 correspond to the plurality of silicon wafer groups 121 one by one to clamp the corresponding silicon wafer groups 121. Each clamping part 222 moves in a direction away from the silicon wafer 120 to release the clamping of the corresponding silicon wafer group 121.

[0072] That is to say, each silicon wafer group 121 is clamped by the corresponding clamping part 222. When all the clamping parts 222 clamp the corresponding silicon wafer group 121, the entire silicon wafer unit 100 is clamped. When it is necessary to load the silicon wafer unit 100 in pieces by silicon wafer group 121, the clamping part 222 releases the clamping of the corresponding silicon wafer group 121. When the unlocked silicon wafer group 121 is loaded in pieces, the remaining silicon wafer groups 121 are still clamped by the corresponding clamping parts 222. In this way, the placement stability of the remaining silicon wafer groups 121 that have not been loaded in the material frame 200 can be ensured, and the silicon wafers 120 are prevented from tipping over or squeezing each other, and the silicon wafers 120 are avoided from being damaged, thereby ensuring the quality of the silicon wafers 120.

[0073] The clamping part 222 unlocks the silicon wafer group 121 through the action between the unlocking device 300 and the clamping part 222. Specifically, the unlocking device 300 is arranged beside the clamping part 222, and the plurality of clamping parts 222 contact the unlocking device 300 in sequence with the relative movement between the material frame 200 and the unlocking device 300. The unlocking device 300 is used to apply external force to the clamping part 222 to make the clamping part 222 move away from the corresponding silicon wafer group 121, that is, to release the clamping of the silicon wafer group 121.

[0074] The material frame 200 in this embodiment simultaneously clamps the corresponding silicon wafer group 121 through the multiple clamping parts 222 on the clamping assembly 220 to achieve the clamping of all silicon wafers. On the one hand, the placement reliability of the silicon wafer 120 in the material frame 200 is ensured, and on the other hand, it is also convenient for the subsequent smooth debonding and separation of the wafer tray 110 and the silicon wafer 120; at the same time, each clamping part 222 unlocks the silicon wafer group 121 independently, and the unlocking device 300 is used to unlock each clamping part 222 in turn, that is, each silicon wafer group 121 is unlocked. 1 are unlocked independently of each other. Thus, when the silicon wafer unit 100 needs to be loaded in slices by the silicon wafer group 121, the clamping part 222 releases the clamping of the corresponding silicon wafer group 121. When the unlocked silicon wafer group 121 is loaded in slices, the remaining silicon wafer groups 121 are still clamped by the corresponding clamping parts 222. In this way, the placement stability of the remaining silicon wafer groups 121 that have not been loaded in the material frame 200 can be ensured, the silicon wafers 120 can be prevented from tipping over or squeezing each other, the silicon wafers 120 can be avoided from being damaged, and the quality of the silicon wafers 120 can be ensured.

[0075] In some embodiments, reference Fig. 9 The clamping portion 222 includes a second pin shaft 2221, the second pin shaft 2221 passes through the frame 210, and the second pin shaft 2221 can move along the direction of passing through the frame 210. An unlocking block 2223 is provided on the first end of the second pin shaft 2221, and a clamping block 2222 is provided on the second end of the second pin shaft 2221. A spring 2229 is sleeved on the second pin shaft 2221, and the spring 2229 is located between the clamping block 2222 and the frame 210.

[0076] Under the action of the unlocking device 300 , each unlocking block 2223 moves in a direction away from the silicon wafer unit 100 , driving the corresponding clamping block 2222 away from the corresponding silicon wafer group 121 , so as to unlock the corresponding silicon wafer group 121 .

[0077] The clamping block 2222 moves toward the direction approaching the silicon wafer unit 100 under the restoring force of the spring 2229 to clamp the corresponding silicon wafer group 121 .

[0078] In some embodiments, the cooperation structure between the unlocking device 300 and the clamping portion 222 is as follows, Figures 10 to 13 :

[0079] The unlocking block 2223 includes a transverse portion 2225 and a vertical portion 2226 of an integrated structure, wherein the transverse portion 2225 is used to abut against the movable plate 221, and the vertical portion 2226 is used to act with the unlocking device 300. Specifically, one end of the transverse portion 2225 is connected to the second pin shaft 2221, a step portion 2228 is formed between the transverse portion 2225 and the second pin shaft 2221, and the other end of the transverse portion 2225 is connected to the vertical portion 2226.

[0080] There is a certain distance between the vertical portion 2226 and the movable plate 221 . The vertical portion 2226 is provided with an inclined surface 2227 on the side facing the frame 210 . Along the discharge direction of the silicon wafer 120 , the distance between the inclined surface 2227 and the movable plate 221 first decreases and then increases.

[0081] The unlocking device 300 includes a first roller 320. When relative movement occurs between the material frame 200 and the unlocking device 300, the first roller 320 moves to between the inclined surface 2227 and the frame 210 and contacts the inclined surface 2227. Through the relative displacement between the first roller 320 and the inclined surface 2227, the second pin shaft 2221 moves in a direction away from the silicon wafer 120.

[0082] Specifically, the unlocking device 300 is fixedly installed on the side of the material frame 200. There is no connection between the unlocking device 300 and the material frame 200. The unlocking device 300 can be fixedly installed on other installation carriers other than the material frame 200. If two clamping assemblies 220 are set on the corresponding material frame 200, then two unlocking devices 300 are also set, and each unlocking device 300 is used to interact with the clamping assembly 220 on the corresponding side. When it is necessary to slice the silicon wafers 120 in the material frame 200 into units of silicon wafer groups 121, the material frame 200 moves in a horizontal direction under the action of an external force, and a relative movement occurs between the material frame 200 and the unlocking device 300. Along the movement direction of the material frame 200, each clamping part 222 contacts the unlocking device 300 one by one, and the first roller 320 moves to between the inclined surface 2227 and the frame 210 and contacts the inclined surface 2227. Through the relative displacement between the first roller 320 and the inclined surface 2227, the second pin shaft 2221 moves in a direction away from the silicon wafer 120, driving the clamping block 2222 away from the silicon wafer 120, that is, releasing the clamping of the corresponding silicon wafer group 121, thereby facilitating the device on the subsequent workstation to slice the unlocked silicon wafer group 121.

[0083] Furthermore, two inclined surfaces 2227 are provided on the vertical portion 2226, one of which is located above the horizontal portion 2225, and the other is located below the horizontal portion 2225. The unlocking device 300 further includes a first mounting frame 310 of a U-shaped structure, and first rollers 320 are provided on the upper and lower walls of the first mounting frame 310, respectively, and the first rollers 320 are in contact with the inclined surfaces 2227 on the corresponding sides. In this way, the unlocking effect of the unlocking device 300 on the clamping portion 222 is improved, and the unlocking reliability is improved.

[0084] In some embodiments, the clamping assembly 220 further includes a movable plate 221 , which extends along the length direction of the containing space 213 , and a plurality of clamping portions 222 are sequentially arranged along the length direction of the movable plate 221 .

[0085] When the movable plate 221 moves in a direction away from the containing space 213 under the action of external force, the movable plate 221 drives all the clamping parts 222 arranged thereon to move synchronously in a direction away from the containing space 213, thereby increasing the distance between the two relative clamping components 220, making it easier for the silicon wafer to be loaded into the containing space 213 from top to bottom.

[0086] Further, the movable plate 221 is located outside the frame 210. For details, refer to Figure 6 and Fig. 9 The material frame 200 includes two oppositely arranged transverse frames 2125, the transverse frames 2125 extend along the length direction of the containing space 213, the movable plate 221 is located outside the transverse frames 2125, and the second pin shaft 2221 passes through the transverse frames 2125 and the movable plate 221. When the movable plate 221 moves in a direction away from the containing space 213 under the action of an external force, the movable plate 221 pushes all the unlocking blocks 2223 to move in a direction away from the containing space 213 synchronously, so that all the clamping blocks 2222 are away from the containing space 213. Specifically, a step portion 2228 is formed between the unlocking block 2223 and the second pin shaft 2221. When the movable plate 221 moves in a direction away from the containing space 213, the movable plate 221 abuts against the step portion 2228 to push the unlocking block 2223 to move synchronously. The unlocking block 2223 drives the second pin shaft 2221 and the clamping block 2222 to move synchronously in a direction away from the containing space 213, and the spring 2229 is compressed.

[0087] After the external force acting on the movable plate 221 disappears, the clamping block 2222 moves toward the direction approaching the silicon wafer 120 under the action of the restoring force of the spring 2229 to clamp the corresponding silicon wafer group 121 .

[0088] Furthermore, a second limiting shaft 223 is provided on the transverse frame 2125 , a second elongated through hole 2224 is provided on the second pin shaft 2221 , and the second limiting shaft 223 penetrates into the second elongated through hole 2224 to prevent the second pin shaft 2221 from rotating.

[0089] In some embodiments, reference Figure 4 and Fig.14 The material frame 200 further includes an anti-dumping assembly 240, which is used to support the silicon wafer 120. The anti-dumping assembly 240 is disposed at one end away from the material outlet 214. When the transfer trolley 400 pushes the material frame 200 to move forward, the silicon wafer 120 has a tendency to dump backward (i.e., in the direction opposite to the movement direction of the material frame 200). The anti-dumping assembly 240 abuts against the silicon wafer 120, thereby preventing the silicon wafer 120 from dumping.

[0090] The anti-dumping assembly 240 includes a second mounting frame 241 and a second roller 242 disposed on the second mounting frame 241. The second mounting frame 241 is disposed on the frame 210, and the second roller 242 is used to abut against the silicon wafer 120. A plurality of second rollers 242 are arranged at intervals in the vertical direction, for example, two, so as to have multiple contacts with the silicon wafer 120 in the vertical direction, thereby improving the reliability of the anti-dumping.

[0091] Furthermore, the second mounting frame 241 includes a fixed frame 2411 and a movable frame 2412. The fixed frame 2411 is fixedly mounted on the frame 210. The movable frame 2412 is rotatably connected to the fixed frame 2411. A torsion spring 2413 is disposed between the movable frame 2412 and the fixed frame 2411. The second roller 242 is disposed on the movable frame 2412. The movable frame 2412 rotates relative to the fixed frame 2411 to adapt to the bumps generated during the transportation of the material frame 200, thereby preventing the second roller 242 from rigidly squeezing the silicon wafer 120.

[0092] In some embodiments, reference Figures 4 to 7 The frame 210 includes an upper frame 211 and a lower frame 212 , and the upper frame 211 and the lower frame 212 are detachably connected. Figure 5 Shown is the upper frame 211, Figure 6 Shown is the lower frame 212, Figure 7 The structure shown is that the clamping assembly 220 and the anti-dumping assembly 240 are arranged on the lower frame 212.

[0093] A containing space 213 for containing the silicon wafers 120 is formed in the lower frame 212 . The top of the containing space 213 is open, and a discharge port 214 communicating with the containing space 213 is provided at one end of the lower frame 212 .

[0094] The upper frame 211 is detachably mounted on the top of the lower frame 212. An opening 2113 is provided on the upper frame 211 and is connected to the containing space 213 vertically. The silicon wafer unit 100 is loaded into the containing space 213 below through the opening 2113. A limiting structure for limiting the crystal tray 110 is provided on the upper frame 211 to ensure the stability of the placement of the silicon wafer unit 100 in the material frame 200.

[0095] The upper frame 211 is moved away from the lower frame 212 to separate the crystal tray 110 from the silicon wafer 120, and the silicon wafer 120 remains in the lower frame 212. Specifically, the upper frame 211 is moved away from the lower frame 212 by a robot or other device. Since there is a limit connection relationship between the upper frame 211 and the crystal tray 110, and the silicon wafer 120 below is clamped by the clamping assembly 220, when the upper frame 211 is moved away from the lower frame 212, the upper frame 211 and the crystal tray 110 are separated from the silicon wafer 120, so that the crystal tray 110 and the silicon wafer 120 are debonded and separated.

[0096] In this embodiment, the material frame 200 has an upper and lower split structure, and the clamping assembly 220 in the lower frame 212 clamps the silicon wafer 120, and the upper frame 211 limits and fixes the crystal tray 110. By separating the upper frame 211 from the lower frame 212, the crystal tray 110 and the silicon wafer 120 can be separated without the need for special debonding equipment.

[0097] Further, refer to Figure 4 , Figure 5 as well as Fig.17 The front and rear ends of the crystal tray 110 unit are respectively provided with extension parts 111, and the upper frame 211 is provided with two spaced protrusions 2115 on the corresponding sides. The extension part 111 is clamped between the two protrusions 2115 to achieve the limiting fixation of the crystal tray 110.

[0098] Further, the upper frame 211 includes two upper frame first brackets 2111 and two upper frame second brackets 2112, the upper frame first brackets 2111 extend along the length direction L of the material frame 200, and the upper frame second brackets 2112 extend along the width direction W of the material frame 200. Two spaced support frames 2114 are provided between the two upper frame first brackets 2111, and there is a certain distance between the support frame 2114 and the upper frame second bracket 2112 on the corresponding side. A protrusion 2115 is provided on the support frame 2114.

[0099] Further, the lower frame 212 includes two relatively arranged lower frame first brackets 2121 and two relatively arranged lower frame second brackets 2122, the lower frame second bracket 2122 includes a lower frame transverse frame 2123, and lower frame vertical frames 2124 are respectively provided at opposite ends of the lower frame transverse frame 2123, the lower frame first bracket 2121 extends along the length direction K of the material frame 200, the lower frame transverse frame 2123 extends along the width direction W of the material frame 200, and the lower frame vertical frame 2124 extends along the height direction of the material frame 200.

[0100] The bottom of the upper frame 211 is detachably connected to the top of the lower frame vertical frame 2124 to achieve a detachable connection between the upper frame 211 and the lower frame 212 .

[0101] Further, refer to Figures 4 to 6 The upper frame 211 is provided with an upper limit block 2116 at the bottom, and the lower frame vertical frame 2124 is provided with a lower limit block 2126 at the top. The upper limit block 2116 and the lower limit block 2126 are adapted through a concave-convex structure to achieve the cooperation between the upper frame 211 and the lower frame 212. For example, the upper limit block 2116 is provided with a concave shape, and the lower limit block 2126 is provided with a convex shape, and the concave shape is adapted to the convex shape.

[0102] In some other embodiments, the upper frame 211 and the lower frame 212 may be detachably connected by means of bolts, pins, etc.

[0103] Further, refer to Figure 5 An upper grabbing portion 2117 is provided on the outer side of the upper frame 211 , and the upper grabbing portion 2117 is used for grabbing by external force to separate the upper frame 211 from the lower frame 212 .

[0104] Reference Figure 6 A lower grabbing portion 2127 is provided on the outer side of the lower frame 212 , and the lower grabbing portion 2127 is used for grabbing by external force to transfer the material frame 200 .

[0105] Furthermore, support rollers 215 are provided at the bottom of the lower frame 212 . The support rollers 215 are arranged at intervals along the width direction W of the material frame 200 . The support rollers 215 are in contact with the bottom of the silicon wafer 120 .

[0106] The gap between two adjacent support rollers 215 facilitates water on the silicon wafer 120 to fall into the transfer cart 400 below.

[0107] In some embodiments, the material frame 200 also includes an unlocking trigger part 230, which includes a first pin shaft 231. The first pin shaft 231 passes through the transverse frame 2125. The first end of the first pin shaft 231 is fixedly connected to the movable plate 221. The second end of the first pin shaft 231 is used to receive external force so that the first pin shaft 231 moves along its passing direction in the transverse frame 2125, so as to drive the movable plate 221 to move synchronously in a direction away from the containing space 213. The movable plate 221 then drives all the clamping parts 222 to move synchronously in a direction away from the containing space 213. In this way, the distance between the two relatively arranged clamping assemblies 220 is increased, which facilitates the silicon wafer unit 100 to be placed into the material frame 200 from top to bottom.

[0108] In some embodiments, the material frame 200 is transported between the cutting station and the debonding station by a transport vehicle 400. Figure 1 and Figure 2 First, place the material frame 200 on the transfer cart 400, then place the cut silicon wafer unit 100 into the material frame 200, and the transfer cart 400 transfers the material frame 200 to the next station.

[0109] Structural reference of transfer trolley 400 Fig.15 and Fig.16 The transfer trolley 400 has the functions of storage, limiting, and transportation for the material frame 200.

[0110] The transfer cart 400 is provided with an unlocking portion 410, which is used to interact with the unlocking triggering portion 230 on the material frame 200 to provide external force to the unlocking triggering portion 230. Specifically, after the material frame 200 is placed on the transfer cart 400, the unlocking portion 410 contacts the unlocking triggering portion 230, and the unlocking portion 410 triggers the unlocking triggering portion 230 to move, and the movable plate 221 moves in a direction away from the filling space 213 under the action of the unlocking triggering portion 230, and the movable plate 221 drives the multiple clamping portions 222 provided thereon to move synchronously in a direction away from the filling space 213.

[0111] When in use, before placing the silicon wafer unit 100 into the material frame 200, the material frame 200 is first placed on the transfer cart 400. At this time, the unlocking portion 410 is in contact with the unlocking trigger portion 230, and the effect achieved is that the movable plate 221 moves in a direction away from the containing space 213 under the action of the unlocking trigger portion 230, and the movable plate 221 drives the multiple clamping portions 222 arranged thereon to move synchronously in a direction away from the containing space 213, that is, the distance between the two relative clamping components 220 is increased, which makes it easier for the silicon wafer unit 100 to be loaded into the containing space 213 from top to bottom.

[0112] The material frame 200 is provided with a limiting structure for limiting the wafer tray 110 . By limiting the wafer tray 110 by the material frame 200 , the stability of the placement of the silicon wafer unit 100 in the material frame 200 is ensured, and the silicon wafer 120 is prevented from tipping over or shifting.

[0113] After the silicon wafer unit 100 is placed in the material frame 200, the material frame 200 is transferred to the next work station, specifically the degumming station, by the transfer cart 400. After arriving at the degumming station, the material frame 200 is taken off the transfer cart 400 by a manipulator or other equipment. At this time, the unlocking part 410 is separated from the unlocking trigger part 230, and the clamping assembly 220 automatically moves toward the direction close to the silicon wafer unit 100 under the reset force of the reset member to clamp the silicon wafer unit 100. After the silicon wafer unit 100 is clamped, it is convenient for the silicon wafer unit 100 to be degummed at the degumming station. At this time, the silicon wafer 120 is clamped by the clamping assembly 220, which facilitates the smooth separation of the crystal support 110 and the silicon wafer 120.

[0114] After the silicon wafer unit 100 is debonded, it is transferred by the material frame 200 to the next work station, specifically the slicing and loading station, that is, the silicon wafer 120 is sliced ​​into units of silicon wafer groups 121, and the sliced ​​silicon wafers 120 are convenient for subsequent wafer insertion operations. When the silicon wafer 120 is sliced ​​into units of silicon wafer groups 121, the clamping part 222 releases the clamping of the corresponding silicon wafer group 121. When the unlocked silicon wafer group 121 is sliced ​​and loaded, the remaining silicon wafer groups 121 are still clamped by the corresponding clamping part 222. In this process, the unlocking device 300 and the clamping part 222 are used to unlock the silicon wafer group 121.

[0115] According to the silicon wafer production process, the use method of the silicon wafer transfer device composed of a material frame and a transfer trolley is as follows:

[0116] When the cut silicon wafer unit 100 is transported, the material frame 200 is first placed on the transport trolley 400, the unlocking portion 410 contacts the unlocking trigger portion 230, and the unlocking portion 410 triggers the unlocking trigger portion 230 to move, and all the clamping portions 222 are driven by the movable plate 221 to move synchronously in a direction away from the containing space 213, so that the silicon wafer unit 100 can be loaded into the containing space 213 from top to bottom. At this time, the clamping assembly 220 does not clamp the silicon wafer 120;

[0117] The material frame 200 is provided with a limiting structure for limiting the wafer support 110, so as to ensure the stability of the placement of the silicon wafer unit 100 in the material frame 200;

[0118] After the transfer trolley 400 transfers the material frame 200 to the next work station, the material frame 200 is removed from the transfer trolley 400, the unlocking portion 410 is disengaged from the unlocking trigger portion 230, and all the clamping portions 222 move toward the direction close to the silicon wafer unit 100 under the action of the reset member to clamp the silicon wafer 120, so as to facilitate the debonding and separation of the wafer support 110 and the silicon wafer 120;

[0119] The material frame 200 transfers the silicon wafer 120 to the next work station, and slices the silicon wafer 120 in the material frame 200 into units of silicon wafer groups 121. At this time, relative movement occurs between the material frame 200 and the unlocking device 300, and multiple clamping parts 222 contact the unlocking device 300 in sequence with the relative movement between the material frame 200 and the unlocking device 300. The unlocking device 300 applies external force to the clamping parts 222 to move the clamping parts 222 away from the corresponding silicon wafer groups 121, thereby releasing the clamping of the silicon wafer groups 121.

[0120] In this embodiment, the clamping mechanism on the material frame 200 is triggered by the matching structure between the transfer trolley 400 and the material frame 200. On the one hand, when the material frame 200 cooperates with the transfer trolley 400, the clamping mechanism is in an unlocked state to facilitate the placement of the silicon wafer 120 into the material frame 200. On the other hand, when the material frame 200 is separated from the transfer trolley 400, the clamping mechanism automatically clamps the silicon wafer 120 as a whole, thereby improving the placement reliability of the silicon wafer 120 during the transportation process and facilitating the subsequent debonding and separation of the crystal tray 110 and the silicon wafer 120. When the silicon wafer 120 is loaded in pieces, the material frame 200 can independently release the clamping of each silicon wafer group 121 through the unlocking device 300, thereby avoiding damage to the silicon wafer 120, reducing manual intervention, and improving work efficiency.

[0121] In some embodiments, a roller (referred to as the third roller 232) is disposed at the second end of the first pin shaft 231. Figure 3, Fig.15 and Fig.16 The unlocking portion 410 is a column arranged on the transfer trolley 400. The column is provided with a guide contact surface 411 at the upper end on the side facing the third roller 232. When the material frame 200 is placed on the transfer trolley 400 from top to bottom, the third roller 232 moves from top to bottom along the guide contact surface 411 to drive the first pin shaft 231 to move in a direction away from the loading space 213. Since the first pin shaft 231 is fixedly connected to the movable plate 221, the movable plate 221 is driven to move synchronously in a direction away from the loading space 213.

[0122] Further, refer to Fig.16 The guide contact surface 411 includes, from top to bottom, a first contact surface section 4111, a second contact surface section 4112, and a third contact surface section 4113. The second contact surface section 4112 extends in a vertical direction. The first contact surface section 4111 extends obliquely from the top of the second contact surface section 4112 toward a direction away from the third roller 232. The third contact surface section 4113 extends obliquely from the bottom of the second contact surface section 4112 toward a direction close to the third roller 232.

[0123] When the material frame 200 is placed on the transfer cart 400 from top to bottom, the third roller 232 first contacts the first contact surface section 4111, and the inclined first contact surface section 4111 plays a preliminary positioning role in the placement of the material frame 200. As the material frame 200 continues to be lowered, the third roller 232 moves along the inclined first contact surface section 4111, gradually pushing the first pin shaft 231 away from the loading space 213. After the third roller 232 moves to the second contact surface section 4112, the outward movement of the first pin shaft 231 stops. As the material frame 200 continues to be lowered, after the third roller 232 moves to the lower end of the second contact surface section 4112, the third contact surface section 4113 stops the movement of the third roller 232, and the material frame 200 is placed in place.

[0124] Further, each movable plate 221 is equipped with two unlocking trigger parts 230, and the two unlocking trigger parts 230 are arranged at opposite ends of the movable plate 221, that is, each material frame 200 is equipped with four unlocking trigger parts 230, and correspondingly, four unlocking parts 410 are arranged on the transfer trolley 400, such as Fig.15 The four unlocking parts 410 are used, on the one hand, to contact the corresponding unlocking triggering parts 230 , and on the other hand, to guide the placement of the material frame 200 .

[0125] Furthermore, a first limiting shaft 233 is provided on the transverse frame 2125 , a first long through hole 234 is provided on the first pin shaft 231 , and the first limiting shaft 233 passes through the first long through hole 234 to prevent the first pin shaft 231 from rotating.

[0126] In some embodiments, reference Fig.15 and Fig.16 A limiting portion 420 is provided on the body of the transfer trolley 400 . The limiting portion 420 is a limiting protrusion arranged on the side of the material frame 200 . The limiting portion 420 is used to limit the material frame 200 to ensure the stability of the material frame 200 placed on the transfer trolley 400 .

[0127] Furthermore, the transfer cart 400 is provided with a liquid collecting tank 430, which is located below the material frame 200 and is used to collect the liquid dripping from the silicon wafer 120. The lower part of the liquid collecting tank 430 is provided with a drain port 440 and a drain valve 450 for draining the liquid.

[0128] Furthermore, a positioning portion 460 is provided at the moving front end of the transfer cart 400, and the positioning portion 460 is used for positioning the transfer cart 400 when it moves to a designated position.

[0129] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0130] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited to this. Any changes or substitutions that can be easily thought of by technicians familiar with the technical field within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A silicon wafer material frame for containing and transporting a silicon wafer unit, wherein the silicon wafer unit comprises a wafer tray and a plurality of silicon wafers to be separated and attached to the wafer tray, wherein the plurality of silicon wafers are divided into a plurality of silicon wafer groups, characterized in that: The material frame comprises: A frame, in which a containing space for placing the silicon wafer unit is formed, the top of the containing space is open, and one end of the frame is provided with a discharge port connected to the containing space; A clamping assembly, which is arranged on the frame, and includes a plurality of clamping parts arranged in sequence along the length direction of the containing space, and the plurality of clamping parts correspond to the plurality of silicon wafer groups one by one to clamp the corresponding silicon wafer groups; Wherein, each of the clamping parts moves in a direction away from the silicon wafer unit under the action of an external force to release the clamping of the corresponding silicon wafer group.

2. The silicon wafer frame according to claim 1, characterized in that: The clamping components have two groups, and the two groups of clamping components are arranged oppositely at two sides of the containing space to clamp two sides of the silicon wafer unit.

3. The silicon wafer frame according to claim 1, characterized in that: The clamping part comprises a second pin shaft, the second pin shaft passes through the frame, an unlocking block is provided on the first end of the second pin shaft, a clamping block is provided on the second end of the second pin shaft, a spring is sleeved on the second pin shaft, and the spring is located between the clamping block and the frame; Each of the unlocking blocks moves in a direction away from the silicon wafer unit under the action of an external force, driving the corresponding clamping block away from the corresponding silicon wafer group; The clamping block moves toward the direction approaching the silicon wafer unit under the action of the restoring force of the spring to clamp the corresponding silicon wafer group.

4. The silicon wafer frame according to claim 3, characterized in that: The clamping assembly further comprises a movable plate, the movable plate extending along the length direction of the containing space, and the plurality of clamping parts are sequentially arranged along the length direction of the movable plate; When the movable plate moves in a direction away from the containing space under the action of an external force, the movable plate drives all the clamping parts arranged thereon to move synchronously in a direction away from the containing space.

5. The silicon wafer frame according to claim 4, characterized in that: The movable plate is located outside the frame, and the second pin passes through the frame and the movable plate; When the movable plate moves in a direction away from the containing space, the movable plate pushes all the unlocking blocks to move synchronously in a direction away from the containing space, so that all the clamping blocks move synchronously in a direction away from the containing space.

6. The silicon wafer frame according to claim 5, characterized in that: The material frame also includes an unlocking trigger part, which includes a first pin shaft, which passes through the frame, and a first end of the first pin shaft is fixedly connected to the movable plate, and a second end of the first pin shaft is used to receive an external force to make the first pin shaft move along its passing direction in the frame, so as to drive the movable plate to move synchronously in a direction away from the containing space.

7. The silicon wafer frame according to claim 6, characterized in that: Each movable plate is configured with two unlocking triggering parts, and the two unlocking triggering parts are arranged at intervals along the length direction of the movable plate.

8. The silicon wafer frame according to any one of claims 1 to 7, characterized in that: The material frame further comprises an anti-dumping component, which is arranged at one end away from the material outlet, and the anti-dumping component is used for supporting the silicon wafer.

9. The silicon wafer frame according to claim 8, characterized in that: The anti-dumping assembly includes a second mounting frame and a second roller arranged on the second mounting frame, the second mounting frame is arranged on the frame, and the second roller is used to abut against the silicon wafer.

10. The silicon wafer frame according to any one of claims 1 to 7, characterized in that: The frame comprises an upper frame and a lower frame, the upper frame is detachably connected to the lower frame, the clamping assembly is arranged on the lower frame, and a limiting structure for limiting the crystal holder is arranged on the upper frame; The upper frame is moved away from the lower frame to separate the wafer support from the silicon wafer, and the silicon wafer remains in the lower frame.

Images