Welding device for high-thermal-conductivity copper-clad ceramic substrate

Abstract

The utility model discloses a welding device for a high-thermal-conductivity copper-clad ceramic substrate, which relates to the technical field of welding of the high-thermal-conductivity copper-clad ceramic substrate and comprises a base, a pressing plate mechanism is fixedly mounted at the top of the base, and a cutting mechanism is fixedly mounted at the bottom of the center of the pressing plate mechanism. According to the multi-layer plate cutting machine, plates of multi-layer materials are stacked and placed in the limiting groove of the cutting mechanism, then the hydraulic oil cylinder pushes the pressing plate and the cutting head to descend to cut the plates in the limiting groove in order, the sizes and specifications of the plates are the same, and follow-up welding is facilitated; through the arrangement of the limiting groove, the cut plates can be welded from the side faces through the welding grooves formed in the periphery of the limiting groove, the push plate is pushed through the electric push rod, the plates in the limiting groove are jacked up through the push plate, and therefore discharging is convenient; according to the welding device for the high-thermal-conductivity copper-clad ceramic substrate, the positions of multiple layers of raw material plates can be tidied, cutting is carried out in a uniform size mode, and welding is more tidy and stable.

Description

Technical Field

[0001] The utility model relates to the technical field of welding and packaging of copper-clad ceramic substrates, in particular to a welding and packaging device for high-thermal-conductivity copper-clad ceramic substrates. Background Art

[0002] Copper-clad ceramic substrate is a special electronic substrate, which mainly consists of two parts: copper-clad layer and ceramic substrate layer. Copper-clad layer: Located on the top of the substrate, it is composed of copper film. The copper layer has excellent electrical conductivity and is often used as the conductive layer and connection layer of electronic devices. In high thermal conductivity copper-clad ceramic substrates, the thickness of the copper layer is usually thicker than that of traditional substrates to provide better thermal conductivity. Ceramic substrate layer: Located at the bottom of the substrate, it usually uses high thermal conductivity ceramic materials such as alumina ceramic (Al2O3) or aluminum nitride ceramic (AlN). These ceramic materials have excellent thermal conductivity and mechanical strength, can effectively conduct and disperse heat, and provide good heat dissipation effect.

[0003] When welding high thermal conductivity copper-clad ceramic substrates, the positions of the multiple layers of raw material plates may be offset from each other, so they need to be aligned for welding, which can easily lead to inconsistent specifications after welding.

[0004] A welding device for a high thermal conductivity copper-clad ceramic substrate is now proposed. Utility Model Content

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0006] A welding device for a high thermal conductivity copper-clad ceramic substrate comprises a base, a pressing plate mechanism is fixedly installed on the top of the base, a cutting mechanism is fixedly installed on the bottom of the center of the pressing plate mechanism, a plate is clamped at the center of the cutting mechanism, a discharging mechanism is fixedly installed at the center of the base, the pressing plate mechanism comprises a sliding rod; the cutting mechanism comprises a pressing plate; the discharging mechanism comprises an electric push rod.

[0007] A further improvement of the technical solution of the utility model is that the top of the discharging mechanism passes through the cutting mechanism.

[0008] A further improvement of the technical solution of the utility model is that a top plate is fixedly installed on the top of the sliding rod, a hydraulic cylinder is fixedly installed at the bottom center of the top plate, a pressure plate is slidably installed on the sliding rod, and a cutting mechanism is fixedly installed at the bottom center of the pressure plate.

[0009] A further improvement of the technical solution of the utility model is that the bottom of the hydraulic cylinder is fixedly connected to the top center of the pressure plate.

[0010] A further improvement of the technical solution of the utility model is that a cutting head is fixedly installed around the pressing plate, a limiting groove is engaged at the bottom of the pressing plate, and welding grooves are opened around the limiting groove.

[0011] A further improvement of the technical solution of the utility model is that the plate is placed in a welding groove.

[0012] A further improvement of the technical solution of the utility model is that a push plate is fixedly installed on the top of the electric push rod.

[0013] A further improvement of the technical solution of the utility model is that the push plate is clamped in the bottom of the cutting mechanism, and the electric push rod is fixedly installed in the base.

[0014] Due to the adoption of the above technical solution, the utility model has achieved the following technical progress compared with the prior art:

[0015] 1. The utility model provides a welding device for a high thermal conductivity copper-clad ceramic substrate. The multi-layer material plates are stacked and placed in the limit groove of the cutting mechanism. Then the hydraulic cylinder pushes the pressing plate to slide down along the slide rod, pushing the pressing plate and the cutting head down, and neatly cutting the plates in the limit groove so that the multi-layer plates have the same size specifications. After cutting, you can choose to continue to apply pressure to the plates, or you can lift the pressing plate through the hydraulic cylinder, so that the welding operation space of the cut plates is larger, which is also convenient for subsequent welding.

[0016] 2. The utility model provides a welding device for a high thermal conductivity copper-clad ceramic substrate. The limiting groove provides a stable working platform for placing various raw material plates of the copper-clad ceramic substrate. The hydraulic cylinder pushes the pressing plate to slide down along the slide rod, pushing the pressing plate and the cutting head to descend. When the pressing plate intersects with the top of the limiting groove, the excess part of the plate is cut. At the same time, the cutting head descends and is inserted into the welding groove to cut the part that the limiting groove cannot cut. Moreover, through the setting of the welding groove, when the pressing plate is lifted by the hydraulic cylinder, the plate will be stuck in the limiting groove due to pressure, and because of the opening of the welding groove, the cut plate can be welded from the side through the welding grooves opened around the limiting groove.

[0017] 3. The utility model provides a welding device for a high thermal conductivity copper-clad ceramic substrate. After the plate of the high thermal conductivity copper-clad ceramic substrate is welded in the limit groove, the plate will be stuck in the bottom of the limit groove due to the extrusion and cutting by the pressing plate mechanism in advance, making it difficult to discharge the material. At this time, the push plate is pushed by the electric push rod to lift the plate inside the limit groove, thereby facilitating the discharge of the material. The welding device for the high thermal conductivity copper-clad ceramic substrate can regularize the positions of the multi-layer raw material plates and cut them in uniform sizes, making the welding more neat and stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of a welding device for a high thermal conductivity copper-clad ceramic substrate of the utility model;

[0019] Figure 2 It is a structural schematic diagram of the pressing plate mechanism of the utility model;

[0020] Figure 3 It is a structural schematic diagram of the cutting mechanism of the utility model;

[0021] Figure 4 It is a partial structural schematic diagram of a welding device for a high thermal conductivity copper-clad ceramic substrate of the utility model;

[0022] Figure 5 It is a structural schematic diagram of the discharging mechanism of the utility model.

[0023] In the figure: 1. base; 2. pressing plate mechanism; 3. cutting mechanism; 4. plate; 5. discharging mechanism; 21. hydraulic cylinder; 22. top plate; 23. slide bar; 24. pressing plate; 31. cutting head; 32. pressing plate; 33. limiting groove; 34. welding groove; 51. push plate; 52. electric push rod. DETAILED DESCRIPTION

[0024] The present invention is further described in detail below in conjunction with the embodiments:

[0025] like Figure 1-5 As shown, the utility model provides a welding device for a high thermal conductivity copper-clad ceramic substrate, comprising a base 1, a pressing plate mechanism 2 is fixedly installed on the top of the base 1, a cutting mechanism 3 is fixedly installed at the bottom of the center of the pressing plate mechanism 2, a plate 4 is clamped at the center of the cutting mechanism 3, a discharging mechanism 5 is fixedly installed at the center of the base 1, and the top of the discharging mechanism 5 passes through the cutting mechanism 3.

[0026] like Figure 2 As shown, the utility model provides a technical solution: preferably, the pressure plate mechanism 2 includes a sliding rod 23, a top plate 22 is fixedly installed on the top of the sliding rod 23, a hydraulic cylinder 21 is fixedly installed at the bottom center of the top plate 22, a pressure plate 24 is slidably installed on the sliding rod 23, a cutting mechanism 3 is fixedly installed at the bottom center of the pressure plate 24, and the bottom of the hydraulic cylinder 21 is fixedly connected to the top center of the pressure plate 24.

[0027] In this embodiment, the multi-layer material sheets 4 are stacked and placed in the limiting groove 33 of the cutting mechanism 3, and then the hydraulic cylinder 21 pushes the pressing plate 24 to slide down along the slide rod 23, pushing the pressing plate 32 and the cutting head 31 down, and neatly cutting the sheets 4 in the limiting groove 33, so that the multi-layer sheets have the same size specifications. After cutting, you can choose to continue to apply pressure to the sheets 4, or you can lift the pressing plate 24 through the hydraulic cylinder 21, so that the welding operation space of the cut sheets 4 is larger, which is also convenient for subsequent welding.

[0028] like Figure 3-4 As shown, the utility model provides a technical solution: preferably, the cutting mechanism 3 includes a pressing plate 32, a cutting head 31 is fixedly installed around the pressing plate 32, a limiting groove 33 is engaged at the bottom of the pressing plate 32, a welding groove 34 is opened around the limiting groove 33, and the plate 4 is placed in the welding groove 34.

[0029] In this embodiment, the limiting groove 33 provides a stable working platform for placing various raw material plates 4 of the copper-clad ceramic substrate. The hydraulic cylinder 21 pushes the pressing plate 24 to slide down along the slide rod 23, pushing the pressing plate 32 and the cutting head 31 to descend. When the pressing plate 32 intersects with the top of the limiting groove 33, the excess part of the plate 4 is cut. At the same time, the cutting head 31 descends and inserts into the welding groove 34 to cut the place that the limiting groove 33 cannot cut. Through the setting of the welding groove 34, when the pressing plate 32 is lifted by the hydraulic cylinder 21, the plate 4 will be stuck in the limiting groove 33 due to pressure, and because of the opening of the welding groove 34, the cut plate 4 can be welded from the side through the welding grooves 34 opened around the limiting groove 33.

[0030] like Figure 5 As shown, the utility model provides a technical solution: preferably, the discharging mechanism 5 includes an electric push rod 52, a push plate 51 is fixedly installed on the top of the electric push rod 52, the push plate 51 is clamped in the bottom of the cutting mechanism 3, and the electric push rod 52 is fixedly installed in the base 1.

[0031] In this embodiment, after the plate 4 of the high thermal conductivity copper-clad ceramic substrate is welded in the limiting groove 33, the plate 4 will be stuck in the bottom of the limiting groove 33 due to the extrusion and cutting by the pressing plate mechanism 2 in advance, making it difficult to discharge the material. At this time, the push plate 51 is pushed by the electric push rod 52, and the plate 4 inside the limiting groove 33 is lifted up by the push plate 51, thereby facilitating the discharge of the material. The welding device of the high thermal conductivity copper-clad ceramic substrate can regularize the positions of the multi-layer raw material plates and cut them into uniform sizes, so that the welding is more neat and stable.

[0032] The working principle of the welding device for the high thermal conductivity copper-clad ceramic substrate is described in detail below.

[0033] like Figure 1-5As shown, the multi-layer material sheets 4 are stacked and placed in the limiting groove 33 of the cutting mechanism 3, and then the hydraulic cylinder 21 pushes the pressing plate 24 to slide down along the slide bar 23, pushes the pressing plate 32 and the cutting head 31 to descend, and neatly cuts the sheets 4 in the limiting groove 33 so that the multi-layer sheets have the same size specifications. After cutting, you can choose to continue to apply pressure to the sheets 4, or you can lift the pressing plate 24 through the hydraulic cylinder 21, so that the welding operation space of the cut sheets 4 is larger, and it is also convenient for subsequent welding. The limiting groove 33 provides a stable working platform for placing various raw material sheets 4 of copper-clad ceramic substrates. The hydraulic cylinder 21 pushes the pressing plate 24 to slide down along the slide bar 23, pushes the pressing plate 32 and the cutting head 31 to descend, and when the pressing plate 32 intersects with the top of the limiting groove 33, the excess part of the sheet 4 is cut, and at the same time the cutting head 31 descends and inserts into the welding groove The plate 4 is then pushed up and out of the way so that the plate 4 can be easily disassembled.

[0034] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not deviate from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A welding device for a high thermal conductivity copper-clad ceramic substrate, comprising a base (1), characterized in that: A pressing plate mechanism (2) is fixedly mounted on the top of the base (1); a cutting mechanism (3) is fixedly mounted on the bottom of the center of the pressing plate mechanism (2); a plate (4) is clamped at the center of the cutting mechanism (3); a discharging mechanism (5) is fixedly mounted at the center of the base (1); the pressing plate mechanism (2) includes a sliding rod (23); the cutting mechanism (3) includes a pressing plate (32); and the discharging mechanism (5) includes an electric push rod (52).

2. The welding device for a high thermal conductivity copper-clad ceramic substrate according to claim 1, characterized in that: The top of the discharging mechanism (5) passes through the cutting mechanism (3).

3. The welding device for a high thermal conductivity copper-clad ceramic substrate according to claim 1, characterized in that: A top plate (22) is fixedly mounted on the top of the slide bar (23), a hydraulic cylinder (21) is fixedly mounted at the bottom center of the top plate (22), a pressing plate (24) is slidably mounted on the slide bar (23), and a cutting mechanism (3) is fixedly mounted at the bottom center of the pressing plate (24).

4. The welding device for a high thermal conductivity copper-clad ceramic substrate according to claim 3, characterized in that: The bottom of the hydraulic cylinder (21) is fixedly connected to the top center of the pressure plate (24).

5. The welding device for a high thermal conductivity copper-clad ceramic substrate according to claim 1, characterized in that: A cutting head (31) is fixedly installed around the pressing plate (32), a limiting groove (33) is engaged at the bottom of the pressing plate (32), and welding grooves (34) are provided around the limiting groove (33).

6. The welding device for a high thermal conductivity copper-clad ceramic substrate according to claim 5, characterized in that: The plate (4) is placed in the welding groove (34).

7. The welding device for a high thermal conductivity copper-clad ceramic substrate according to claim 1, characterized in that: A push plate (51) is fixedly mounted on the top of the electric push rod (52).

8. The welding device for a high thermal conductivity copper-clad ceramic substrate according to claim 7, characterized in that: The push plate (51) is clamped in the bottom of the cutting mechanism (3), and the electric push rod (52) is fixedly installed in the base (1).

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