Circuit board heat dissipation device

Abstract

The utility model relates to the technical field of circuit board heat dissipation devices, and discloses a circuit board heat dissipation device which comprises an upper shell, a supporting lower shell is fixedly arranged at the lower end of the upper shell, fixing mechanisms are fixedly arranged on the two sides of the front end and the rear end of the upper shell, and a circuit board body is arranged at the upper end of the upper shell in a clamped mode. Temperature control mechanisms are fixedly arranged on the two sides of the inner surface of the upper shell correspondingly, cooling fans are arranged at the front end and the rear end of the upper shell correspondingly, the two temperature control mechanisms comprise temperature sensing frames correspondingly, and limiting baffles are fixedly arranged on the upper portions of the opposite sides of the front ends of the two temperature sensing frames correspondingly; second limiting plates are fixedly arranged at the positions, close to the middles, of the front ends and the rear ends of the two temperature sensing frames, and expansion grooves are formed between every two of the four second limiting plates. According to the utility model, the temperature control mechanism is matched with the cooling fan, so that the product does not need to be continuously monitored by a worker, resources are reasonably utilized, and the service life of the product is longer.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board heat dissipation devices, in particular to a circuit board heat dissipation device. Background Art

[0002] A circuit board is a basic material used to support and connect electronic components. It plays a vital role in electronic devices. It provides a stable platform for installing and connecting various electronic components, and connects these components through circuits so that they can communicate with each other and work together. A circuit board heat sink is a device used to help dissipate heat. It is usually used on circuit boards in electronic devices. Its function is to effectively dissipate the heat generated on the circuit board by absorbing and transferring heat, so as to maintain a stable operating temperature of the electronic equipment and increase the service life of the electronic equipment. This involves a circuit board heat sink.

[0003] Existing circuit board heat dissipation devices are usually systems consisting of a circuit board body, a circuit board fixer and a heat dissipation fan. However, during use, when the circuit board starts working, the heat dissipation fan will continue to run regardless of the power of the circuit board. In the case of low power, the heat dissipation effect of this method is not obvious, which may cause a decrease in resource utilization. Therefore, the utility model provides a circuit board heat dissipation device to solve the problems raised in the above background technology. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a circuit board heat dissipation device, which controls the push switch by a temperature control mechanism to appropriately turn on the heat dissipation fan for heat dissipation. It is more convenient to use and does not require staff to monitor for a long time, and has a longer service life.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A circuit board heat dissipation device comprises an upper shell, a supporting lower shell is fixedly arranged at the lower end of the upper shell, fixing mechanisms are fixedly arranged at both sides of the front and rear ends of the upper shell, a circuit board body is clamped at the upper end of the upper shell, temperature control mechanisms are fixedly arranged at both sides of the inner surface of the upper shell, and cooling fans are arranged at the front and rear ends of the upper shell;

[0007] The two temperature control mechanisms each include a temperature sensing frame, a limit baffle is fixedly provided on the upper side of the opposite front ends of the two temperature sensing frames, a second limit plate is fixedly provided in the middle of the front and rear ends of the two temperature sensing frames, an expansion slot is provided between each of the four second limit plates, a sliding plate is slidably provided inside the two temperature sensing frames, the upper housing includes a heat pipe, and the supporting lower housing includes a plurality of heat dissipation ports;

[0008] Through the above technical scheme, the lower shell is supported to support the upper shell, and then the circuit board body is clamped on the upper end of the upper shell through four fixing mechanisms. After that, the push switch can be turned on through the temperature control mechanism when the internal temperature rises, so that the cooling fan circulates the hot air inside to dissipate heat, thereby improving the working efficiency of the circuit board body. A material that can expand when heated is placed inside the expansion groove. When the temperature of the circuit board body is too high, the heat will be transferred to the material that expands when heated through the temperature sensor frame to make it expand, which will push the sliding plate upward, and then the sliding plate will operate the push switch to turn on the cooling fan to rotate and dissipate heat in the space at the lower end of the circuit board body.

[0009] Furthermore, the upper housing includes an upper outer frame, a heat sink is fixedly arranged inside the upper outer frame, and heat pipes are fixedly arranged around the upper end of the heat sink;

[0010] Through the above technical solution, through the cooperation of the heat sink and the heat pipe, when the heat pipe transfers the heat on the circuit board body to the heat sink, efficient heat dissipation can be performed, so that the heat sink has a better use effect and a higher working effect.

[0011] Furthermore, three heat dissipation fins are fixedly arranged at the lower ends of the four heat-conducting pipes, and push switches are arranged on both sides of the inner surface of the upper outer frame near the front end;

[0012] Through the above technical solution, the heat dissipation fins are used in conjunction with the heat pipes to dissipate heat from the circuit board body, thereby achieving a better heat dissipation effect.

[0013] Furthermore, the supporting lower housing includes a lower outer frame, and the plurality of heat dissipation openings are all opened at the front and rear ends of the lower outer frame;

[0014] Through the above technical solution, the upper shell is supported so that the upper shell is at a certain distance from the lower end, which is more convenient for heat dissipation.

[0015] Furthermore, the four fixing mechanisms each include two first limit plates and a screw rod, and the four screw rod shafts are each provided with a moving sleeve;

[0016] Through the above technical solution, the screw rod is rotated, so that the movable sleeve and the screw rod thread engage and move, and the circuit board body is fixed more stably.

[0017] Furthermore, the four movable sleeve bodies are all fixedly provided with L-shaped cardboards, and the four L-shaped cardboards are all fixedly provided with abutment plates at the lower ends on the opposite sides of each other;

[0018] Through the above technical solution, the circuit board body is opened outwards through the L-shaped card plate as a column, and then collides inwards through the opposing plate, so that the circuit board body is more stable.

[0019] The utility model has the following beneficial effects:

[0020] 1. The utility model proposes a circuit board heat dissipation device, in which a material that can expand due to heat is placed inside the expansion groove of the temperature control mechanism. When the temperature of the circuit board body is too high, the heat will be transferred to the material that expands due to heat through the temperature sensor frame to make it expand, which will push the sliding plate upward, and then the sliding plate will operate the press switch to turn on the cooling fan, so that it rotates to dissipate heat from the space at the lower end of the circuit board body. The cooling fan is automatically controlled to be turned on, and there is no need for staff to continuously monitor and check. The cooling fan can be used reasonably, which increases resource utilization and has a longer service life.

[0021] 2. The utility model proposes a circuit board heat dissipation device, which dissipates heat through the structure between the upper shell and the supporting lower shell, wherein the supporting lower shell mainly relies on the heat dissipation port to dissipate heat, and assists the structure of the upper shell to achieve better heat dissipation effect and a larger circulation space, while the upper shell mainly relies on the heat pipe to transfer heat, and the two cooperate with each other to achieve better heat dissipation effect, higher power and longer service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the axial side of the utility model;

[0023] Figure 2 This is a schematic diagram of the shaft side of the utility model when the upper housing is not fully installed;

[0024] Figure 3 It is a schematic diagram of the utility model when the upper housing is not completely installed and is close to the axial side of the heat dissipation fins;

[0025] Figure 4 This is a schematic diagram of the utility model near the axial side of the heat dissipation port;

[0026] Figure 5 It is a partial structural schematic diagram of the temperature control mechanism of the utility model;

[0027] Figure 6 It is an enlarged schematic diagram of point A of the present utility model.

[0028] Legend:

[0029] 1. Upper shell; 2. Support lower shell; 3. Cooling fan; 4. Fixing mechanism; 5. Circuit board body; 6. Temperature control mechanism; 101. Upper outer frame; 102. Heat sink; 103. Heat pipe; 104. Heat sink fin; 105. Push switch; 201. Lower outer frame; 202. Heat dissipation port; 401. First limit plate; 402. Screw rod; 403. Moving sleeve; 404. L-shaped card plate; 405. Counter plate; 601. Temperature sensing frame; 602. Limit baffle; 603. Sliding plate; 604. Expansion slot; 605. Second limit. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] Reference Figure 1-6 The utility model provides an embodiment: a circuit board heat dissipation device, including an upper shell 1, a supporting lower shell 2 is fixedly arranged at the lower end of the upper shell 1, a fixing mechanism 4 is fixedly arranged on both sides of the front and rear ends of the upper shell 1, a circuit board body 5 is clamped and arranged at the upper end of the upper shell 1, a temperature control mechanism 6 is fixedly arranged on both sides of the inner surface of the upper shell 1, and a heat dissipation fan 3 is arranged on the front and rear ends of the upper shell 1;

[0032] The lower shell 2 is supported to support the upper shell 1, and then the circuit board body 5 is clamped on the upper end of the upper shell 1 through four fixing mechanisms 4. After that, the push switch 105 can be turned on through the temperature control mechanism 6 when the internal temperature rises, so that the cooling fan 3 circulates the hot air inside to dissipate heat, thereby improving the working efficiency of the circuit board body 5.

[0033] The two temperature control mechanisms 6 each include a temperature sensing frame 601, a limit baffle 602 is fixedly provided on the upper side of the opposite front end of the two temperature sensing frames 601, a second limit plate 605 is fixedly provided in the middle of the front and rear ends of the two temperature sensing frames 601, an expansion groove 604 is provided between each of the four second limit plates 605, and a sliding plate 603 is slidably provided inside the two temperature sensing frames 601;

[0034] A material that expands when heated is placed inside the expansion groove 604. When the temperature of the circuit board body 5 is too high, the heat will be transferred to the material that expands when heated through the temperature sensing frame 601, causing it to expand, which will push the sliding plate 603 upward, and then the sliding plate 603 will control the push switch 105 to turn on the cooling fan 3, causing it to rotate to dissipate heat in the space at the lower end of the circuit board body 5.

[0035] The upper housing 1 includes an upper outer frame 101 and four heat pipes 103. A heat sink 102 is fixedly arranged inside the upper outer frame 101. Three heat sink fins 104 are fixedly arranged at the lower ends of the four heat pipes 103. Push switches 105 are arranged on both sides of the inner surface of the upper outer frame 101 near the front end.

[0036] Through the cooperation of the heat sink 102 and the heat pipe 103, when the heat pipe 103 transfers the heat on the circuit board body 5 to the heat sink 102, efficient heat dissipation can be performed, so that the use effect of the heat sink 102 is better and the working effect is higher. The heat sink fins 104 are used to cooperate with the heat pipe 103 to dissipate the heat of the circuit board body 5, so that the heat dissipation effect is better;

[0037] The supporting lower housing 2 comprises a lower outer frame 201 and a plurality of heat dissipation openings (202), wherein the plurality of heat dissipation openings 202 are all provided at the front and rear ends of the lower outer frame 201;

[0038] The lower outer frame 201 supports the upper housing 1 so that the upper housing 1 is at a certain distance from the lower end, which is more convenient for heat dissipation.

[0039] The four fixing mechanisms 4 each include two first limit plates 401 and a screw rod 402, the shafts of the four screw rods 402 are each provided with a movable sleeve 403, the sleeves of the four movable sleeves 403 are each fixedly provided with an L-shaped clamping plate 404, and the four L-shaped clamping plates 404 are each fixedly provided with abutting plates 405 at the lower ends on one side opposite to the other;

[0040] By rotating the screw rod 402, the movable sleeve 403 can be threadedly engaged with the screw rod 402 to move, thereby fixing the circuit board body 5 more stably. The L-shaped clamping plate 404 blocks the circuit board body 5 from collapsing outward, and then the abutting plate 405 collides inward, making the circuit board body 5 more stable.

[0041] Working principle: A material that can expand due to heat is placed inside the expansion groove 604 of the temperature control mechanism 6. When the temperature of the circuit board body 5 is too high, the heat will be transferred to the material that expands due to heat through the temperature sensing frame 601, causing it to expand, which will push the sliding plate 603 upward, and then the sliding plate 603 will control the press switch 105, turn on the cooling fan 3, and make it rotate to dissipate heat from the space at the lower end of the circuit board body 5. The cooling fan 3 cooperates with the heat pipe 103 and the cooling fins 104 to achieve a better heat dissipation effect.

[0042] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A circuit board heat dissipation device, comprising an upper housing (1), characterized in that: The lower end of the upper shell (1) is fixedly provided with a supporting lower shell (2), the front and rear ends of the upper shell (1) are fixedly provided with fixing mechanisms (4), the upper end of the upper shell (1) is clamped with a circuit board body (5), the inner surfaces of the upper shell (1) are fixedly provided with temperature control mechanisms (6), and the front and rear ends of the upper shell (1) are provided with cooling fans (3); The two temperature control mechanisms (6) each comprise a temperature sensing frame (601), a limiting baffle (602) is fixedly arranged on the upper side of the opposite front ends of the two temperature sensing frames (601), a second limiting plate (605) is fixedly arranged in the middle between the front and rear ends of the two temperature sensing frames (601), expansion grooves (604) are provided between each of the four second limiting plates (605), a sliding plate (603) is slidably arranged inside the two temperature sensing frames (601), the upper shell (1) comprises a heat conducting pipe (103), and the supporting lower shell (2) comprises a plurality of heat dissipation ports (202).

2. A circuit board heat dissipation device according to claim 1, characterized in that: The upper housing (1) comprises an upper outer frame (101), and a heat dissipation plate (102) is fixedly arranged inside the upper outer frame (101).

3. A circuit board heat dissipation device according to claim 2, characterized in that: Three heat dissipation fins (104) are fixedly arranged at the lower ends of the four heat-conducting pipes (103), and push switches (105) are arranged on both sides of the inner surface of the upper outer frame (101) near the front end.

4. A circuit board heat dissipation device according to claim 1, characterized in that: The supporting lower housing (2) comprises a lower outer frame (201), and the plurality of heat dissipation openings (202) are all arranged at the front and rear ends of the lower outer frame (201).

5. A circuit board heat dissipation device according to claim 1, characterized in that: The four fixing mechanisms (4) each comprise two first limit plates (401) and a screw rod (402), and the shafts of the four screw rods (402) are each provided with a moving sleeve (403).

6. A circuit board heat dissipation device according to claim 5, characterized in that: The four movable sleeves (403) are all fixedly provided with L-shaped clamping plates (404), and the four L-shaped clamping plates (404) are all fixedly provided with abutting plates (405) at the lower ends of the opposite sides.

Images