Network storage device

Abstract

The utility model relates to the technical field of network storage, in particular to a network storage device. The network storage device comprises a shell, a main control circuit board, a first hard disk, a first heat dissipation assembly and a second heat dissipation assembly. A main control assembly space and a hard disk assembly space are formed in the shell at intervals; the main control circuit board and the first heat dissipation assembly are assembled in the main control assembly space, a first chip is arranged on the main control circuit board, and the first heat dissipation assembly is arranged corresponding to the first chip; the first hard disk and the second heat dissipation assembly are assembled in the hard disk assembly space, and the second heat dissipation assembly corresponds to the first hard disk. The first heat dissipation assembly and the second heat dissipation assembly are arranged in the main control assembly space and the hard disk assembly space respectively for heat dissipation, heat dissipation is independent and does not interfere with each other, the size of the heat dissipation space in which the first heat dissipation assembly and the second heat dissipation assembly are responsible is reduced, the heat dissipation efficiency is high, and the heat dissipation effect is good.

Description

Technical Field

[0001] The utility model relates to the technical field of network storage, in particular to a network storage device. Background Art

[0002] Network Attached Storage (NAS) is a special hard disk storage device. Network storage devices run operating systems and can provide file systems and related file services. Network storage devices are easily connected to existing networks using common network protocols (such as TCP / IP and NFS, SMB / CIFS), providing users with a centralized and convenient way to access data.

[0003] Network storage devices have many heat generating components, such as SSD hard disks, memory sticks, CPUs, etc., which are components that generate large amounts of heat and require high heat dissipation requirements. However, the current network storage device ventilation and heat dissipation system has low heat dissipation efficiency and poor heat dissipation effect. Utility Model Content

[0004] The embodiment of the utility model provides a network storage device to solve the problem of low heat dissipation efficiency and poor heat dissipation effect of the ventilation and heat dissipation system of the network storage device in the prior art.

[0005] The utility model discloses a network storage device, comprising a shell, a main control circuit board, a first hard disk, a first heat dissipation component and a second heat dissipation component; a main control assembly space and a hard disk assembly space are formed by intervals in the shell; the main control circuit board and the first heat dissipation component are assembled in the main control assembly space, a first chip is arranged on the main control circuit board, and the first heat dissipation component is arranged corresponding to the first chip; the first hard disk and the second heat dissipation component are assembled in the hard disk assembly space, and the second heat dissipation component is arranged corresponding to the first hard disk.

[0006] Optionally, the main control assembly space includes a memory assembly space, and the memory assembly space and the hard disk assembly space are arranged side by side; a memory bar is arranged on the main control circuit board, and the memory bar is located in the memory assembly space.

[0007] Optionally, the first chip is arranged on a side of the main control circuit board away from the memory assembly space, and the first heat dissipation component is located on a side of the main control assembly space on the side where the first chip is located.

[0008] Optionally, a gap is formed between the edge of the main control circuit board and the shell, and the memory assembly space and a side of the main control assembly space where the first chip is located are connected through the gap.

[0009] Optionally, a first air outlet is arranged on one side of the main control assembly space corresponding to the side where the first chip is located on at least two sides of the shell, and a second air outlet is arranged on the bottom side of the shell corresponding to the memory stick. The first heat dissipation component includes a first turbofan, and an air inlet of the turbofan is arranged corresponding to the first chip; the air outlet of the first turbofan is connected to the first air outlet thereof.

[0010] Optionally, the first heat dissipation assembly further includes a thermally conductive copper bar, and the thermally conductive copper bar is disposed between the first turbofan and the first chip.

[0011] Optionally, a first heat sink is installed on the inner side of the second air outlet, the first heat sink is located in the memory assembly space and corresponds to the memory stick; a shielding cover is provided on the memory stick, and heat is conducted between the shielding cover and the first heat sink through a heat-conducting medium.

[0012] Optionally, a partition is provided in the shell, and the main control assembly space and the hard disk assembly space are separated by the partition.

[0013] Optionally, the shell includes a cover plate, which is detachably covered on the hard disk assembly space; the second heat dissipation assembly includes a second turbofan and a second heat sink, and the second heat sink is arranged corresponding to the first hard disk; a first air inlet is arranged on the cover plate corresponding to the air inlet of the second turbofan, and a first air outlet is arranged corresponding to the second heat sink; the air outlet of the second turbofan blows through the second heat sink.

[0014] Optionally, the second turbofan and the second heat sink are mounted on the inner side of the cover plate; and or

[0015] The second heat sink includes a mounting plate and heat sink fins connected to each other. The second turbofan is mounted on the mounting plate. The air outlet of the second turbofan is arranged corresponding to the heat sink fins. The heat sink fins are arranged corresponding to the first air outlet.

[0016] Compared with the prior art, the network storage device provided by the embodiment of the utility model has the following beneficial effects: the network storage device of the utility model divides the interior of the shell into a main control assembly space and a hard disk assembly space, installs the main control circuit board with a first chip with high heat generation in the main control assembly space, and installs the first hard disk with high heat generation in the hard disk assembly space, and at the same time, respectively arranges a first heat dissipation component and a second heat dissipation component in the main control assembly space and the hard disk assembly space for heat dissipation, and the heat dissipation is independent and does not interfere with each other, and also reduces the size of the heat dissipation space each of which is responsible for the first heat dissipation component and the second heat dissipation component, with high heat dissipation efficiency and good heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The technical solution of the utility model will be further described in detail below with reference to the accompanying drawings and embodiments, in which:

[0018] Figure 1It is a schematic diagram of a network storage device according to an embodiment of the utility model;

[0019] Figure 2 is a top view of a network storage device according to an embodiment of the utility model;

[0020] Figure 3 yes Figure 2 Sectional view in the AA direction;

[0021] Figure 4 is another schematic diagram of the network storage device according to an embodiment of the utility model;

[0022] Figure 5 This is a bottom schematic diagram of a network storage device according to an embodiment of the utility model;

[0023] Figure 6 It is a schematic diagram of the hard disk assembly space of the embodiment of the utility model;

[0024] Figure 7 is a schematic diagram of a first heat dissipation assembly according to an embodiment of the utility model;

[0025] Figure 8 This is another schematic diagram of the hard disk assembly space of the embodiment of the utility model;

[0026] Fig. 9 is a schematic diagram of a first heat sink of an embodiment of the utility model;

[0027] Fig.10 It is a schematic diagram of the assembly of the cover plate and the second heat dissipation component of the embodiment of the utility model.

[0028] The reference numerals in the figures are:

[0029] 1. Shell; 11. Main control assembly space; 111. Memory assembly space; 12. Hard disk assembly space; 13. First air outlet; 14. Second air outlet; 15. Partition; 151. Opening; 16. Cover; 161. First air inlet; 162. First air outlet; 2. Main control circuit board; 21. First chip; 22. Memory stick; 23. Insertion port; 3. First hard disk; 4. First heat dissipation component; 41. First turbo fan; 42. Thermal conductive copper strip; 5. Second heat dissipation component; 51. Second turbo fan; 52. Second heat sink; 521. Mounting plate; 522. Heat sink fins; 6. Gap; 7. First heat sink; 8. Shielding cover; 9. Connecting circuit board; 91. Connecting terminal. DETAILED DESCRIPTION

[0030] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. Now, in conjunction with the accompanying drawings, a preferred embodiment of the present utility model is described in detail.

[0031] The utility model embodiment provides a network storage device, such as Figures 1 to 3 As shown, the network storage device includes a housing 1, a main control circuit board 2, a first hard disk 3, a first heat dissipation component 4 and a second heat dissipation component 5. The housing 1 is spaced to form a main control assembly space 11 and a hard disk assembly space 12, and the main control circuit board 2 and the first heat dissipation component 4 are assembled in the main control assembly space 11. A first chip 21 is arranged on the main control circuit board 2, and the first heat dissipation component 4 is arranged corresponding to the first chip 21. The first hard disk 3 and the second heat dissipation component 5 are assembled in the hard disk assembly space 12, and the second heat dissipation component 5 is arranged corresponding to the first hard disk 3.

[0032] The applicant has found that the current network storage device integrates a set of ventilation and heat dissipation systems, and the network storage device has low heat dissipation efficiency and poor heat dissipation effect. In response to this, the network storage device of the utility model divides the interior of the housing 1 into a main control assembly space 11 and a hard disk assembly space 12, installs the main control circuit board 2 with a first chip 21 with high heat generation in the main control assembly space 11, and assembles the first hard disk 3 with high heat generation in the hard disk assembly space 12, and at the same time, respectively sets a first heat dissipation component 4 and a second heat dissipation component 5 in the main control assembly space 11 and the hard disk assembly space 12 for heat dissipation, and the heat dissipation is independent and does not interfere with each other, and also reduces the size of the heat dissipation space that the first heat dissipation component 4 and the second heat dissipation component 5 are responsible for, and has high heat dissipation efficiency and good heat dissipation effect.

[0033] Specifically, Figure 8 As shown, the first hard disk 3 can be a solid-state drive (SSD), and multiple first hard disks 3 can be provided and installed side by side in the hard disk assembly space 12, for example, four first hard disks 3 are arranged side by side. The first chip 21 is a central processing unit (CPU) of the network storage device, and its specific model can be selected according to actual needs, which will not be described in detail here.

[0034] Specifically, Figure 3As shown, the main control assembly space 11 includes a memory assembly space 111, and the memory assembly space 111 is arranged side by side with the hard disk assembly space 12. A memory bar 22 is arranged on the main control circuit board 2, and the memory bar 22 is in the memory assembly space 111. In this solution, the memory assembly space 111 is arranged on the side side of the hard disk assembly space 12, and a relatively independent space is arranged in the main control assembly space 11 for the memory bar 22 which also generates a large amount of heat, which is conducive to the heat dissipation of the memory bar 22 and the corresponding heat dissipation device, such as the first heat dissipation member 7 described below. Specifically, the memory bar 22 can be DDR, DDR2, DDR3, DDR4 or DDR5. A memory slot is arranged on the main control circuit board 2, and the memory bar 22 is inserted into the memory slot. More specifically, the first chip 21 is arranged on the side of the main control circuit board 2 away from the memory assembly space 111, and the first heat dissipation component 4 is located on the side of the main control assembly space 11 where the first chip 21 is located. In this solution, according to the actual situation of the main control assembly space 11, the first heat dissipation component 4 and the first chip 21 are reasonably allocated in the main control assembly space 11, which is convenient for the layout and heat dissipation of the first chip 21, the first heat dissipation component 4, the memory bar 22, etc. Specifically, most of the main control assembly space 11 is located in the upper part of the space inside the network storage device, close to the top of the network storage device. The hard disk assembly space 12 and the memory assembly space 111 are located in the lower part of the space inside the network storage device, close to the bottom of the network storage device.

[0035] Still like Figure 3 As shown, a gap 6 is formed between the edge of the main control circuit board 2 and the housing 1, and the memory assembly space 111 and the main control assembly space 11 side where the first chip 21 is located are connected through the gap 6. The setting of the gap 6 can facilitate the mutual flow of airflow in the space on the side of the main control assembly space 11 where the first chip 21 is located and the airflow in the memory assembly space 111, and the heat dissipation effect of the memory bar 22 is ensured while the main control circuit board 2 is set. The main control circuit board 2 can be installed and fixed by the studs set in the main control assembly space 11.

[0036] Specifically, Figure 1 , Figure 3 and Figure 5As shown, at least two sides of the housing 1 are provided with a first air outlet 13 on one side of the main control assembly space 11 corresponding to the side where the first chip 21 is located, and a second air outlet 14 is provided on the bottom surface of the housing 1 corresponding to the memory bar 22. The first heat dissipation component 4 includes a first turbofan 41, and the air inlet of the first turbofan 41 is provided corresponding to the first chip 21; the air outlet of the first turbofan 41 is connected with one of the first air outlets 13. The air inlet of the second turbofan 51 can quickly take away the heat generated by the first chip 21. At the same time, since the air outlet of the second turbofan 51 is connected with one of the first air outlets 13, the second air outlet 14 and the remaining first air outlets 13 serve as air inlets, and the air intake is sufficient, and all the air intake will eventually converge at the first chip 21 and then be blown out through the first turbofan 41, so that the heat dissipation effect of the first chip 21 is good. At the same time, the second air outlet 14 is provided corresponding to the memory bar 22, and can quickly take away the heat generated by the memory bar 22 while taking in air.

[0037] Specifically, Figure 3 and Figure 7 As shown, the first heat dissipation component 4 also includes a heat-conducting copper strip 42, which is arranged between the first turbofan 41 and the first chip 21. The heat-conducting copper strip 42 can improve the heat conduction of the first chip 21. Thermal conductive silicone grease can be further coated between the heat-conducting copper strip 42 and the first chip 21 to improve heat conduction. The heat-conducting copper strip 42 can be arranged in a bent direction to improve the heat conduction effect.

[0038] like Figure 3 , Figure 5 , Figure 7 and Fig. 9 As shown, a first heat sink 7 is installed on the inner side of the second air outlet 14. The first heat sink 7 is located in the memory assembly space 111 and corresponds to the memory bar 22. A shielding cover 8 is provided on the memory bar 22, and heat is conducted between the shielding cover 8 and the first heat sink 7 through a heat-conducting medium. The shielding cover 8 can protect the memory bar 22. The heat of the memory bar 22 can be quickly transferred to the first heat sink 7 through the shielding cover 8 and the heat-conducting medium, and then quickly taken away by the airflow of the second air outlet 14, with high heat dissipation efficiency. It should be noted that the heat-conducting medium here can be air or thermal grease, etc. The first heat sink 7 can be a fin heat sink.

[0039] On the other hand, Figure 5 , Figure 6 and Figure 8 As shown, a partition 15 is provided in the housing 1, and the main control assembly space 11 and the hard disk assembly space 12 are separated by the partition 15. An opening 151 may be provided on the partition 15, and the first hard disk 3 installed in the hard disk assembly space 12 is plugged into the plug-in port 23 on the main control circuit board through the opening 151, and the plug-in port 23 is, for example, an M.2 interface.

[0040] Furthermore, the housing 1 includes a cover plate 16, which is detachably covered on the hard disk assembly space 12; the second heat dissipation assembly 5 includes a second turbo fan 51 and a second heat dissipation member 52, and the second heat dissipation member 52 is arranged corresponding to the first hard disk 3. Figure 5 As shown, the cover plate 16 is provided with a first air inlet 161 corresponding to the air inlet of the second turbofan 51, and a first air outlet 162 corresponding to the second heat sink 52; the air outlet of the second turbofan 51 blows through the second heat sink 52. The detachable cover plate 16 is provided so that the hard disk assembly space 12 can be inspected and disassembled at any time for the first heat sink assembly 4 and the first hard disk 3. The second heat sink 52 is provided corresponding to the first hard disk 3 to quickly take away the heat of the first hard disk 3. The air outlet of the second turbofan 51 blows through the second heat sink 52, which can quickly take away the heat on the second heat sink 52 and improve the heat dissipation effect.

[0041] Specifically, Figure 6 As shown, the second heat sink 52 includes a mounting plate 521 and heat sink fins 522 connected to each other, the second turbofan 51 is mounted on the mounting plate 521, the air outlet of the second turbofan 51 is arranged corresponding to the heat sink fins 522, and the heat sink fins 522 are arranged corresponding to the first air outlet 162. In addition to being a heat dissipation component, the second heat sink 52 also provides an installation position for the second turbofan 51. The air outlet of the second turbofan 51 is arranged corresponding to the heat sink fins 522, and the heat sink fins 522 are arranged corresponding to the first air outlet 162, so that the heat of the heat sink fins 522 can be quickly taken away from the first air outlet 162.

[0042] Specifically, Fig.10 As shown, the second turbofan 51 and the second heat sink 52 are mounted on the inner side of the cover plate 16. The second turbofan 51 and the second heat sink 52 form a modular structure with the cover plate 16. The second turbofan 51 and the second heat sink 52 can be removed while opening the cover plate 16 to expose the first hard disk 3, which is convenient for disassembly and maintenance of the first hard disk 3. A connecting pin can be provided on the main control circuit board 2, and the connecting pin is inserted into the through hole in the hard disk assembly space 12. A connecting circuit board 9 connected to the second turbofan 51 through a socket and a plug is installed on the inner side of the cover plate 16, and a connecting terminal 91 is provided on the connecting circuit board 9 corresponding to the connecting pin. When the cover plate 16 is closed on the hard disk assembly space 12, the connecting pin is connected to the connecting terminal 91 to realize the power supply and control of the turbofan.

[0043] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present utility model rather than to limit it. For those skilled in the art, the technical solutions described in the above embodiments can be modified, or some of the technical features therein can be replaced by equivalents; and all these modifications and replacements should fall within the scope of protection of the claims attached to the present utility model.

Claims

1. A network storage device, characterized in that: It includes a shell, a main control circuit board, a first hard disk, a first heat dissipation component and a second heat dissipation component; the shell is spaced to form a main control assembly space and a hard disk assembly space; the main control circuit board and the first heat dissipation component are assembled in the main control assembly space, a first chip is arranged on the main control circuit board, and the first heat dissipation component is arranged corresponding to the first chip; the first hard disk and the second heat dissipation component are assembled in the hard disk assembly space, and the second heat dissipation component is arranged corresponding to the first hard disk.

2. The network storage device according to claim 1, characterized in that: The main control assembly space includes a memory assembly space, and the memory assembly space is arranged side by side with the hard disk assembly space; a memory bar is arranged on the main control circuit board, and the memory bar is located in the memory assembly space.

3. The network storage device according to claim 2, characterized in that: The first chip is arranged on a side of the main control circuit board away from the memory assembly space, and the first heat dissipation component is located on a side of the main control assembly space where the first chip is located.

4. The network storage device according to claim 3, characterized in that: A gap is formed between the edge of the main control circuit board and the housing, and the memory assembly space and a side of the main control assembly space where the first chip is located are communicated through the gap.

5. The network storage device according to claim 3, characterized in that: A first air outlet is arranged on one side of the main control assembly space corresponding to the first chip on at least two sides of the shell, and a second air outlet is arranged on the bottom surface of the shell corresponding to the memory stick. The first heat dissipation component includes a first turbofan, and an air inlet of the turbofan is arranged corresponding to the first chip; an air outlet of the first turbofan is connected to the first air outlet.

6. The network storage device according to claim 5, characterized in that: The first heat dissipation assembly further includes a thermally conductive copper bar, and the thermally conductive copper bar is disposed between the first turbo fan and the first chip.

7. The network storage device according to claim 5, characterized in that: A first heat sink is installed on the inner side of the second air outlet. The first heat sink is located in the memory assembly space and corresponds to the memory bar. A shielding cover is provided on the memory bar. Heat is conducted between the shielding cover and the first heat sink through a heat-conducting medium.

8. The network storage device according to any one of claims 1 to 7, characterized in that: A partition is arranged in the shell, and the main control assembly space and the hard disk assembly space are separated by the partition.

9. The network storage device according to claim 8, characterized in that: The shell includes a cover plate, which is detachably covered on the hard disk assembly space; the second heat dissipation assembly includes a second turbofan and a second heat sink, and the second heat sink is arranged corresponding to the first hard disk; a first air inlet is arranged on the cover plate corresponding to the air inlet of the second turbofan, and a first air outlet is arranged corresponding to the second heat sink; the air outlet of the second turbofan blows through the second heat sink.

10. The network storage device according to claim 9, characterized in that: The second turbofan and the second heat sink are mounted on the inner side of the cover plate; and or The second heat sink includes a mounting plate and heat sink fins connected to each other, the second turbofan is mounted on the mounting plate, the air outlet of the second turbofan is arranged corresponding to the heat sink fins, and the heat sink fins are arranged corresponding to the first air outlet.

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