Automatic silicon wafer cleaning device

Abstract

The utility model discloses an automatic silicon wafer cleaning device, which comprises a supporting mechanism, a cleaning mechanism and a silicon wafer collecting mechanism, and is characterized in that the supporting mechanism is arranged at the bottom of a silicon wafer production machine table; the cleaning mechanism comprises a scraping assembly and a driving assembly, wherein the scraping assembly is installed at the bottom of the silicon wafer production machine table and scrapes broken silicon wafers on the ground at the bottom of the silicon wafer production machine table and on the two sides of the supporting mechanism in the working process, and the driving assembly is installed on the supporting mechanism and drives the scraping assembly to reciprocate at the bottom of the silicon wafer production machine table in the working process. The silicon wafer collecting mechanism is located at the bottom of the silicon wafer production machine table and located at the two ends of the supporting mechanism, and when the driving assembly works to drive the scraping assembly to reciprocate at the bottom of the silicon wafer production machine table, scraped broken silicon wafers are automatically guided into the silicon wafer collecting mechanism to be collected. The problems that the workload of workers is large and broken silicon wafers are difficult to clean after being scattered randomly due to untimely cleaning are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaics, in particular to an automatic silicon wafer cleaning device. Background Art

[0002] With the rise of the new energy industry, the demand for silicon wafers is also increasing day by day. At present, in the process of large-scale production of silicon wafers, as the machine keeps working, the silicon wafers on the machine are prone to pile up and break. The broken silicon wafers will fall to the ground at the bottom of the machine, causing the ground to be unclean, so the bottom of the machine needs to be cleaned regularly.

[0003] At present, the method of cleaning the broken silicon wafers on the bottom of the silicon wafer production machine is mainly for workers to regularly clean the bottom of the machine. However, this method increases the workload of workers and is prone to cause silicon wafer fragments to be scattered randomly due to untimely cleaning, thereby increasing the difficulty of subsequent cleaning. Utility Model Content

[0004] The purpose of this section is to summarize some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract of the specification and the name of the utility model of this application to avoid blurring the purpose of this section, the abstract of the specification and the name of the utility model, and such simplifications or omissions cannot be used to limit the scope of the utility model.

[0005] Therefore, the purpose of the utility model is to provide an automatic silicon wafer cleaning device to replace the traditional method of cleaning broken silicon wafers on the ground at the bottom of the machine during silicon wafer production, thereby avoiding the problem of heavy workload for workers and the difficulty in cleaning up broken silicon wafers that are easily scattered due to untimely cleaning.

[0006] In order to solve the above technical problems, according to one aspect of the present invention, the present invention provides the following technical solutions:

[0007] A silicon wafer automatic cleaning device, comprising:

[0008] A support mechanism, which is installed at the bottom of the silicon wafer production machine;

[0009] A cleaning mechanism, comprising a scraper assembly installed at the bottom of the silicon wafer production machine and used to scrape off broken silicon wafers on the bottom of the silicon wafer production machine and the ground on both sides of the support mechanism when in operation, and a drive assembly installed on the support mechanism and used to drive the scraper assembly to reciprocate at the bottom of the silicon wafer production machine when in operation;

[0010] The silicon wafer collecting mechanism is located at the bottom of the silicon wafer production machine and at both ends of the supporting mechanism, wherein when the driving component drives the scraping component to reciprocate at the bottom of the silicon wafer production machine, the scraped broken silicon wafers are automatically guided to the silicon wafer collecting mechanism for collection.

[0011] As a preferred solution of the automatic silicon wafer cleaning device described in the utility model, the supporting mechanism includes fixed plates located at both ends of the bottom of the silicon wafer production machine and a horizontal plate located between the two fixed plates.

[0012] As a preferred solution of the automatic silicon wafer cleaning device described in the utility model, the driving assembly includes a reciprocating screw located between the two fixed plates and one end of which extends out of the side wall of the fixed plate and is connected to a reduction motor, and a limiting sliding rod located between the two fixed plates.

[0013] As a preferred solution of the automatic silicon wafer cleaning device described in the utility model, the scraper assembly includes a mounting box with a scraper at the bottom, one end of which is threadedly connected to the reciprocating screw and the other end is slidably sleeved on the limiting slide rod, and extension plates located on both sides of the mounting box, wherein when the mounting box moves along the reciprocating screw and the limiting slide rod, the extension plates on both sides of the mounting box are automatically driven to reciprocate and fan toward the adjacent sides.

[0014] As a preferred solution of the automatic silicon wafer cleaning device described in the utility model, a sawtooth plate is provided at the bottom of the horizontal plate;

[0015] The top of the installation box is provided with a driving gear having half gears on both sides and meshing with the sawtooth plate, the top of the installation box is provided with a driven gear meshing with the half gears, the side wall of the driven gear is connected to a bevel gear set having a first pulley at the other end, and two groups of connecting holes are respectively provided on both sides of the installation box;

[0016] A connecting column extending into the connecting hole and having a torsion spring connected to the side wall is disposed on the top of the extension plate, and a second pulley connected to the first pulley via a belt is disposed on the top of the connecting column.

[0017] As a preferred solution of the automatic silicon wafer cleaning device described in the utility model, wherein the extension plates are respectively provided with two groups on both sides of the installation box;

[0018] The connecting columns at the top of the two extension plates on one side of the installation box are respectively connected to the bottom of the second pulley through connecting pieces, and the connecting pieces include a ratchet connecting seat with a ratchet groove on the side wall and a ratchet with an elastic pawl on the outer side wall and located in the ratchet groove.

[0019] As a preferred solution of the automatic silicon wafer cleaning device described in the utility model, the silicon wafer collection mechanism includes two connecting seats fixedly sleeved on both ends of the reciprocating screw rod and the limiting slide rod, and a collection box with a collection groove opened on one side located at the bottom of the connecting seat and adjacent to each other.

[0020] Compared with the prior art, the utility model has the beneficial effect that the automatic silicon wafer cleaning device drives the scraper component to reciprocate at the bottom of the silicon wafer production machine through the operation of the driving component, and the scraper component cleans a large area of ​​the bottom of the silicon wafer production machine and the ground on both sides of the supporting mechanism, and then guides the cleaned broken silicon wafers into the silicon wafer collecting mechanism, and then automatically cleans the broken silicon wafers at the bottom of the machine, replacing the traditional method of cleaning the broken silicon wafers on the ground at the bottom of the machine during silicon wafer production, avoiding the problem of heavy workload for workers and easy scattering of broken silicon wafers due to untimely cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solution of the implementation of the utility model, the utility model will be described in detail below in combination with the drawings and detailed implementation. Obviously, the drawings described below are only some implementations of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0022] Figure 1 This is a schematic diagram of the structure of an automatic silicon wafer cleaning device of the utility model;

[0023] Figure 2 This is a structural disassembly diagram of an automatic silicon wafer cleaning device of the utility model;

[0024] Figure 3 This is a structural disassembled diagram of a scraper assembly of an automatic silicon wafer cleaning device of the utility model;

[0025] Figure 4 This is a structural schematic diagram of a driving component of an automatic silicon wafer cleaning device of the utility model driving a scraper component to move to one side;

[0026] Figure 5 It is a structural schematic diagram of a driving component of an automatic silicon wafer cleaning device of the utility model driving a scraper component to move to the other side.

[0027] In the figure: 100, supporting mechanism; 110, fixing plate; 120, horizontal plate; 120a, serrated plate; 200, cleaning mechanism; 210, scraper assembly; 210a, mounting box; 210a-1, scraper; 210a-2, driving gear; 210a-21, half gear; 210a-3, driven gear; 210a-4, bevel gear set; 210a-41, first pulley; 210a-5, connecting hole; 210b, extension plate; 210b-1, connecting column; 210b-11, second pulley; 220, driving assembly; 220a, reciprocating screw; 220a-1, reduction motor; 220b, limiting slide; 300, silicon wafer collecting mechanism; 310, connecting seat; 320, collecting box; 320a, collecting trough. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0029] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the implementation of the present invention, for the sake of convenience, the cross-sectional diagram showing the device structure will not be partially enlarged according to the general proportion, and the schematic diagram is only an example, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0030] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0031] The utility model provides an automatic silicon wafer cleaning device, which replaces the traditional method of cleaning broken silicon wafers on the ground at the bottom of a machine during silicon wafer production, thereby avoiding the problem of heavy workload for workers and easy scattering of broken silicon wafers due to untimely cleaning.

[0032] Figure 1-Figure 5 The following is a schematic diagram of the structure of a silicon wafer automatic cleaning device of the utility model. Figure 1-Figure 5 A detailed introduction is given to this kind of automatic silicon wafer cleaning device. Example 1

[0033] refer to Figure 1-Figure 5 The utility model discloses an automatic silicon wafer cleaning device, the main body of which includes a supporting mechanism 100, a cleaning mechanism 200 and a silicon wafer collecting mechanism 300.

[0034] The support mechanism 100 is used to facilitate the fixing and installation of the entire device. The support mechanism 100 is installed at the bottom of the silicon wafer production machine, so as to facilitate the cleaning mechanism 200 to clean the broken silicon wafers that fall on the ground at the bottom of the silicon wafer production machine when working;

[0035] The cleaning mechanism 200 is used to perform a large-scale cleaning of broken silicon wafers on the ground at the bottom and on both sides of the silicon wafer production machine. The cleaning mechanism 200 includes a scraper assembly 210 installed at the bottom of the silicon wafer production machine and scraping off the broken silicon wafers on the ground at the bottom of the silicon wafer production machine and on both sides of the support mechanism 100 when working, and a drive assembly 220 installed on the support mechanism 100 and driving the scraper assembly 210 to reciprocate at the bottom of the silicon wafer production machine when working. The scraper assembly 210 is used to scrape off the broken silicon wafers that fall on the bottom and on both sides of the silicon wafer production machine when working, and the drive assembly 220 is used to drive the scraper assembly 210 to reciprocate along the bottom of the silicon wafer production machine when working, thereby completing the continuous cleaning of the bottom of the silicon wafer production machine;

[0036] The silicon wafer collecting mechanism 300 is used to collect the broken silicon wafers scraped off by the cleaning mechanism 200 when it is working. The silicon wafer collecting mechanism 300 is located at the bottom of the silicon wafer production machine and at both ends of the supporting mechanism 100. When the driving component 220 drives the scraping component 210 to move back and forth at the bottom of the silicon wafer production machine, the scraped broken silicon wafers are automatically guided into the silicon wafer collecting mechanism 300 for collection. The mechanism is used to push the broken silicon wafers scraped off from the bottom of the silicon wafer production machine and the ground on both sides when the cleaning mechanism 200 is working into the silicon wafer collecting mechanism 300 for collection, thereby avoiding the broken silicon wafers from being scattered randomly and difficult to clean up.

[0037] In this embodiment, the specific usage process is as follows: the device is installed at the bottom of the silicon wafer production machine, and the driving component 220 drives the scraper component 210 to move back and forth along the bottom of the silicon wafer production machine, and then during the movement of the scraper component 210, the broken silicon wafers dropped on the bottom of the silicon wafer production machine and the ground on both sides are scraped off and pushed into the silicon wafer collection mechanism 300 for collection, thereby completing automatic large-scale cleaning of the bottom of the silicon wafer production machine and the ground on both sides. Example 2

[0038] Based on Example 1, the support mechanism 100 includes fixed plates 110 located at both ends of the bottom of the silicon wafer production machine and a horizontal plate 120 located between the two fixed plates 110. The fixed plates 110 are used to facilitate the installation of the cleaning mechanism 200 and fix the entire device. The horizontal plate 120 is used to facilitate the fixed connection of the two fixed plates 110 and to facilitate the installation of the serrated plate 120a.

[0039] In this embodiment, the driving assembly 220 includes a reciprocating screw 220a located between the two fixed plates 110 and one end of which extends out of the side wall of the fixed plate 110 and is connected to a reduction motor 220a-1, and a limiting slide bar 220b located between the two fixed plates 110. The reciprocating screw 220a is used to drive the installation box 210a to move back and forth along the reciprocating screw 220a when rotating. The limiting slide bar 220b is used to limit the installation box 210a, thereby preventing the installation box 210a from rotating synchronously with the reciprocating screw 220a when the reciprocating screw 220a rotates. The reduction motor 220a-1 is used to drive the reciprocating screw 220a to rotate during operation.

[0040] In this embodiment, the scraper assembly 210 includes a mounting box 210a with a scraper 210a-1 at the bottom, one end of which is threadedly connected to the reciprocating screw 220a and the other end of which is slidably sleeved on the limit slide 220b, and an extension plate 210b located on both sides of the mounting box 210a. The mounting box 210a is used to facilitate the installation of the scraper 210a-1, and the scraper 210a-1 is used to scrape away the broken silicon wafers that fall on the ground when moving. When the mounting box 210a moves along the reciprocating screw 220a, the scraper 210a-1 moves along the reciprocating screw 220a. When the screw rod 220a and the limiting slide bar 220b move, the extension plates 210b on both sides of the installation box 210a are automatically driven to fan back and forth toward the adjacent side, so as to gather the broken silicon wafers on the ground on both sides of the bottom of the silicon wafer production machine to the middle through the reciprocating fanning of the extension plates 210b, and then make it easier for the scraper 210a-1 to scrape them away, thereby completing a large-scale cleaning and preventing the scattered broken silicon wafers that have fallen on the ground on both sides of the bottom of the silicon wafer production machine from being cleaned up.

[0041] In this embodiment, a sawtooth plate 120a is provided at the bottom of the horizontal plate 120, which is used to drive the driving gear 210a-2 to rotate when the installation box 210a moves along the reciprocating screw rod 220a and the limiting slide rod 220b;

[0042] The top of the installation box 210a is provided with a driving gear 210a-2 with half gears 210a-21 on both sides and meshing with the sawtooth plate 120a. The driving gear 210a-2 is used to drive the half gear 210a-21 to rotate when rotating, and the half gear 210a-21 is used to intermittently drive the driven gear 210a-3 to rotate when rotating. The top of the installation box 210a is provided with a driven gear 210a-3 meshing with the half gear 210a-21, which is used to drive the bevel gear set 210a-3 to rotate when rotating. 10a-4 rotates, the side wall of the driven gear 210a-3 is connected with a bevel gear set 210a-4 having a first pulley 210a-41 at the other end, the bevel gear set 210a-4 is used to drive the first pulley 210a-41 to rotate when rotating, and the first pulley 210a-41 is used to drive the second pulley 210b-11 to rotate when rotating, and two groups of connecting holes 210a-5 are respectively provided on both sides of the installation box 210a for facilitating the movable connection of the connecting column 210b-1;

[0043] The top of the extension plate 210b is provided with a connecting column 210b-1 extending into the connecting hole 210a-5 and connected to the side wall with a torsion spring, which is used to realize the movable connection between the extension plate 210b and the mounting box 210a. The torsion spring is used to drive the connecting column 210b-1 to reverse under its own torque when the saw teeth of the half gear 210a-21 are separated from the saw teeth of the driven gear 210a-3, thereby driving the extension plate 210b to return to its original state, thereby facilitating the next time the saw teeth of the half gear 210a-21 are meshed with the saw teeth of the driven gear 210a-3, driving the extension plate 210b to flip again. The top of the connecting column 210b-1 is provided with a second pulley 210b-11 connected to the first pulley 210a-41 by a belt, which is used to drive the second pulley 210b-11 to rotate when the first pulley 210a-41 rotates, thereby driving the extension plate 210b to flip.

[0044] In this embodiment, the silicon wafer collection mechanism 300 includes two connecting seats 310 fixedly sleeved on both ends of the reciprocating screw 220a and the limiting slide rod 220b, and a collection box 320 located at the bottom of the connecting seat 310 and adjacent to each other and provided with a collection groove 320a. The connecting seat 310 is used to facilitate the installation of the collection box 320. The collection box 320 is used to collect the broken silicon wafers scraped off when the scraper 210a-1 moves, and the collection groove 320a is used to facilitate the collection of silicon wafers into the collection box 320.

[0045] In this embodiment, the specific working process is as follows: when the reduction motor 220a-1 is working, it drives the reciprocating screw 220a to rotate, and then drives the installation box 210a and the scraper 210a-1 to move back and forth along the reciprocating screw 220a. At the same time, the scraper 210a-1 scrapes away the broken silicon wafers on the ground at the bottom of the silicon wafer production machine. In this process, by driving the gear 210a-2 to rotate, it indirectly drives the two extension plates 210b on the left and right sides of the installation box 210a to intermittently flip inward, and then gathers the scattered broken silicon wafers on the ground on both sides of the silicon wafer production machine to the middle and is scraped away by the scraper 210a-1. Then the scraped broken silicon wafers are pushed into the collection box 320 through the collection groove 320a to be collected. Example 3

[0046] Based on Example 2, Figure 4-Figure 5 Two groups of extension plates 210b are respectively provided on both sides of the installation box 210a, so as to facilitate the operation of the two groups of extension plates 210b to turn inwards and gather the broken silicon wafers when the scraper assembly 210 moves back and forth;

[0047] The connecting columns 210b-1 on the top of the two extension plates 210b on one side of the installation box 210a are respectively connected to the bottom of the second pulley 210b-11 through connecting pieces, and the connecting pieces include a ratchet connecting seat 310 with a ratchet groove on the side wall and a ratchet with an elastic pawl on the outer side wall and located in the ratchet groove. The ratchet connecting seats 310 of the two connecting pieces on one side of the installation box 210a are opposite to the ratchet in the upper and lower positions. Therefore, when the scraper assembly 210 moves toward one of the fixed plates 110, the two extension plates 210b on one side adjacent to the fixed plate 110 perform an inward flipping movement, and the two extension plates 210b on the other side remain unchanged. Similarly, When the scraper assembly 210 moves toward another fixed plate 110, the two extension plates 210b on one side adjacent to the fixed plate 110 flip inward, while the two extension plates 210b on the other side remain unchanged, thereby preventing the two extension plates 210b on the opposite side of the installation box 210a from flipping inward at the same time when the scraper assembly 210 moves in one direction to scrape the material, causing broken silicon wafers that just fall between the extension plates 210b on both sides of the installation box 210a to pop out. As a result, when the scraper assembly 210 comes back, the extension plates 210b cannot gather the popped-out broken silicon wafers, resulting in incomplete cleaning and collection of the broken silicon wafers.

[0048] Although the present invention has been described above with reference to the embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention may be used in combination with each other in any manner, and the fact that these combinations are not exhaustively described in this specification is only for the sake of omitting space and saving resources. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A silicon wafer automatic cleaning device, characterized in that: include: A support mechanism (100) is installed at the bottom of a silicon wafer production machine; A cleaning mechanism (200) comprising a scraper assembly (210) mounted on the bottom of a silicon wafer production machine and configured to scrape away broken silicon wafers on the bottom of the silicon wafer production machine and the ground on both sides of the support mechanism (100) when in operation, and a drive assembly (220) mounted on the support mechanism (100) and configured to drive the scraper assembly (210) to reciprocate on the bottom of the silicon wafer production machine when in operation; A silicon wafer collection mechanism (300) is located at the bottom of the silicon wafer production machine and at both ends of the support mechanism (100), wherein when the drive component (220) drives the scraper component (210) to reciprocate at the bottom of the silicon wafer production machine, the scraped broken silicon wafers are automatically guided into the silicon wafer collection mechanism (300) for collection.

2. The automatic silicon wafer cleaning device according to claim 1, characterized in that: The support mechanism (100) comprises fixed plates (110) located at two ends of the bottom of the silicon wafer production machine and a transverse plate (120) located between the two fixed plates (110).

3. The automatic silicon wafer cleaning device according to claim 2, characterized in that: The driving assembly (220) comprises a reciprocating screw (220a) located between the two fixing plates (110) and one end of which extends out of the side wall of the fixing plate (110) and is connected to a reduction motor (220a-1), and a limiting sliding rod (220b) located between the two fixing plates (110).

4. The automatic silicon wafer cleaning device according to claim 3, characterized in that: The scraper assembly (210) comprises a mounting box (210a) having a scraper plate (210a-1) at the bottom, one end of which is threadedly connected to the reciprocating screw (220a) and the other end of which is slidably sleeved on the limiting slide bar (220b), and extension plates (210b) located on both sides of the mounting box (210a), wherein when the mounting box (210a) moves along the reciprocating screw (220a) and the limiting slide bar (220b), the extension plates (210b) on both sides of the mounting box (210a) are automatically driven to reciprocate and fan toward the adjacent sides.

5. The automatic silicon wafer cleaning device according to claim 4, characterized in that: A sawtooth plate (120a) is provided at the bottom of the transverse plate (120); A driving gear (210a-2) having half gears (210a-21) on both sides and meshing with the sawtooth plate (120a) is arranged on the top of the installation box (210a); a driven gear (210a-3) meshing with the half gears (210a-21) is arranged on the top of the installation box (210a); a bevel gear set (210a-4) having a first pulley (210a-41) at the other end is connected to the side wall of the driven gear (210a-3); and two groups of connection holes (210a-5) are respectively arranged on both sides of the installation box (210a); A connecting column (210b-1) extending into the connecting hole (210a-5) and having a side wall connected to a torsion spring is provided at the top of the extension plate (210b), and a second pulley (210b-11) connected to the first pulley (210a-41) via a belt is provided at the top of the connecting column (210b-1).

6. The automatic silicon wafer cleaning device according to claim 5, characterized in that: Two groups of the extension plates (210b) are respectively arranged on both sides of the installation box (210a); The connecting columns (210b-1) located at the top of the two extension plates (210b) on one side of the installation box (210a) are respectively connected to the bottom of the second pulley (210b-11) through connecting pieces, and the connecting pieces include a ratchet connecting seat (310) having a ratchet groove on the side wall and a ratchet having an elastic pawl on the outer side wall and located in the ratchet groove.

7. The automatic silicon wafer cleaning device according to claim 3, characterized in that: The silicon wafer collection mechanism (300) comprises two connection seats (310) fixedly sleeved on both ends of the reciprocating screw rod (220a) and the limiting sliding rod (220b), and a collection box (320) provided with a collection groove (320a) on one side located at the bottom of the connection seat (310) and adjacent to each other.

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