Chip mounting jig

Abstract

The utility model discloses a chip mounting jig, and relates to the technical field of jigs. The chip mounting device comprises a mounting seat, the top of the mounting seat is fixedly connected with a supporting frame, a movable plate is movably arranged in the supporting frame, the bottom of the movable plate is fixedly provided with a chip pressing column, the supporting frame above the movable plate is rotatably connected with a rotating shaft through a bearing, and the rotating shaft is fixedly sleeved with a cam. One end of the rotating shaft extends out of the supporting frame and is fixedly sleeved with a pressurizing handle, guide columns are vertically fixed to the two sides of the supporting frame, the upper ends of the guide columns movably penetrate through the movable plate, and the guide columns are sleeved with springs. According to the utility model, the rotating rod is rotated to drive the two screw rods to rotate, so that the two limiting columns can be driven to move upwards or downwards, the position heights of the limiting columns can be adjusted, and the downward moving distance of the movable plate can be adjusted through the limiting columns, and therefore, the pressing force of the chip pressing columns on the chip can be adjusted; therefore, the requirement on the thickness of the glue solution after the chip is mounted can be met.

Description

Technical Field

[0001] The utility model belongs to the technical field of jigs, and in particular relates to a chip mounting jig. Background Art

[0002] In the chip packaging process, the chip needs to be placed on the substrate and fixed by the glue pre-treated on the substrate. When mounting the chip, for certain special application products, the glue thickness is required to be within a certain value range. However, the existing chip mounting fixture lacks a limit structure for the pressure when pressurizing the chip, and cannot control the pressure of the chip well, thus failing to meet the thickness requirement of the glue under the chip after the chip is mounted. In view of this, we propose a chip mounting fixture. Utility Model Content

[0003] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0004] The utility model discloses a chip mounting fixture, comprising a mounting seat, the top of the mounting seat is fixedly connected with a support frame, a movable plate is movably arranged inside the support frame, a chip pressing column is fixedly arranged at the bottom of the movable plate, a rotating shaft is rotatably connected to the support frame above the movable plate through a bearing, a cam is sleeved and fixed on the rotating shaft, one end of the rotating shaft extends to the outside of the support frame and is sleeved and fixed with a pressure handle, guide columns are vertically fixed on both sides of the support frame, the upper end of the guide column movably penetrates the movable plate, a spring is sleeved on the guide column, and the guide column is sleeved with a spring. A limit column is movably arranged in the support frame on the front side of the column, and a screw rod is rotatably connected to the support frame below the limit column through a bearing, the upper end of the screw rod is threaded into the limit column, and a driven gear is sleeved and fixed on the lower end of the screw rod, a rotating rod is rotatably connected to the inside of the mounting seat through a bearing, and driving gears are sleeved and fixed on both ends of the rotating rod, and the two driving gears are respectively meshed and connected with the two driven gears, one end of the rotating rod extends to the outside of the mounting seat and is fixedly provided with an adjusting handle, and a substrate placement groove is provided on the top of the mounting seat below the chip pressing column.

[0005] Preferably, an L-shaped through groove is provided on the front side of the mounting seat, and the tail of the L-shaped through groove is connected to the substrate placement groove.

[0006] Preferably, a connecting shaft is rotatably connected to the interior of the L-shaped through groove via a bearing, and a substrate lifting frame is sleeved and fixed on the connecting shaft.

[0007] Preferably, the pressing handle at the front end of the substrate lifting frame is located outside the mounting seat, the rear end of the substrate lifting frame is bent upward, and the top of the rear end of the substrate lifting frame is flush with the bottom of the substrate placement groove.

[0008] Preferably, sliding blocks are provided on both sides of the movable plate, and the sliding blocks move along sliding grooves provided on both sides of the support frame.

[0009] Preferably, the upper end of the spring abuts against the bottom of the movable plate, and the upper end of the spring abuts against the bottom of the slide grooves opened on both sides of the support frame.

[0010] The utility model has the following beneficial effects:

[0011] The utility model discloses a chip mounting jig, which can drive two limit columns to move upward or downward by rotating a rotating rod to drive two screw rods to rotate, and can adjust the position height of the limit columns, and can adjust the downward moving distance of the movable plate through the limit columns, so as to adjust the pressing force of the chip pressing column on the chip, so that it can meet the thickness requirement of the glue liquid after the chip is mounted, and is more practical. After the chip is mounted, the pressing handle at the front end of the substrate lifting frame is manually pressed downward, and the substrate can be lifted up from the substrate placement groove through the rear end of the substrate lifting frame, so that personnel can quickly take out the substrate from the substrate placement groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0013] Figure 1 This is a schematic diagram of the overall structure of a chip mounting fixture of the utility model;

[0014] Figure 2 This is a schematic diagram of the internal structure of a chip mounting fixture of the utility model;

[0015] Figure 3 The utility model is a schematic structural diagram of a substrate lifting frame in a chip mounting fixture.

[0016] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0017] 1. Mounting seat; 2. Movable plate; 21. Chip pressing column; 3. Rotating shaft; 4. Support frame; 5. Cam; 6. Pressing handle; 7. Guide column; 8. Spring; 9. Limiting column; 10. Substrate placement groove; 11. L-shaped through groove; 12. Substrate lifting frame; 13. Screw; 14. Driven gear; 15. Driving gear; 16. Rotating rod; 161. Adjusting handle; 17. Connecting shaft. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] See also Figure 1-3 As shown, the utility model provides a technical solution:

[0020] Embodiment 1: A chip mounting fixture comprises a mounting seat 1, the top of the mounting seat 1 is fixedly connected with a support frame 4, a movable plate 2 is movably arranged inside the support frame 4, sliders are arranged on both sides of the movable plate 2, and the sliders move along the slide grooves opened on both sides of the support frame 4, a chip pressing column 21 is fixedly arranged at the bottom of the movable plate 2, a rotating shaft 3 is rotatably connected to the support frame 4 above the movable plate 2 through a bearing, a cam 5 is sleeved and fixed on the rotating shaft 3, one end of the rotating shaft 3 extends to the outside of the support frame 4 and is sleeved and fixed with a pressure handle 6, guide columns 7 are vertically fixed on both sides of the support frame 4, the upper end of the guide column 7 movably passes through the movable plate 2, a spring 8 is sleeved on the guide column 7, the upper end of the spring 8 abuts against the bottom of the movable plate 2, and the upper end of the spring 8 abuts against the support frame 4. At the bottom of the slide grooves on both sides, the spring 8 is set to realize the automatic upward reset of the movable plate 2. The support frame 4 on the front side of the guide column 7 is movably provided with a limit column 9. The support frame 4 below the limit column 9 is rotatably connected with a screw rod 13 through a bearing. The upper end of the screw rod 13 is threaded into the limit column 9, and the lower end of the screw rod 13 is sleeved and fixed with a driven gear 14. The interior of the mounting seat 1 is rotatably connected with a rotating rod 16 through a bearing. Both ends of the rotating rod 16 are sleeved and fixed with a driving gear 15. The two driving gears 15 are respectively meshed and connected with the two driven gears 14. By rotating the rotating rod 16, the two screws 13 can be driven to rotate synchronously, and then the two limit columns 9 can be driven to move upward or downward synchronously, so that the position height of the limit column 9 can be adjusted. The downward movement height of the movable plate 2 can be limited by the limiting column 9, so that the pressing force of the chip can be adjusted when the chip is mounted to meet the mounting requirements of different chips. One end of the rotating rod 16 extends to the outside of the mounting seat 1 and is fixedly provided with an adjusting handle 161. A substrate placement groove 10 is provided on the top of the mounting seat 1 below the chip pressing column 21. When mounting the chip, the substrate can be placed in the substrate placement groove 10, and the glue is placed on the top of the substrate below the chip pressing column 21. Then, the chip to be mounted is placed on the top of the substrate where the glue is placed. Finally, the pressure handle 6 is held and the rotating shaft 3 is rotated downward to drive the cam 5 to rotate downward. The downward rotation of the cam 5 can drive the movable plate 2 to move downward along the guide column 7 to compress the spring 8. When the chip is mounted, the pressure handle 6 is released, and the movable plate 2 is automatically reset upward under the elastic force of the spring 8. When the pressure on the chip needs to be adjusted according to the thickness of the glue, the adjusting handle 161 can be manually turned to drive the rotating rod 16 to rotate. The rotation of the rotating rod 16 can drive the driving gear 15 to rotate. The rotation of the driving gear 15 can drive the driven gear 14 to rotate together with the screw 13. The rotation of the screw 13 can drive the limiting column 9 to move upward or downward.The height of the downward movement of the movable plate 2 can be adjusted, so that the pressing force during chip mounting can be adjusted to meet the thickness requirements of the glue after chip mounting.

[0021] Embodiment 2: The difference between this embodiment and embodiment 1 lies in that, an L-shaped through groove 11 is provided on the front side of the mounting seat 1, and the tail end of the L-shaped through groove 11 is connected to the substrate placement groove 10. The interior of the L-shaped through groove 11 is rotatably connected to a connecting shaft 17 through a bearing, and a substrate lifting frame 12 is sleeved and fixed on the connecting shaft 17. The arrangement of the substrate lifting frame 12 can lift the substrate after the chip is mounted, so that it is convenient for personnel to take the substrate out of the substrate placement groove 10. The pressing handle at the front end of the substrate lifting frame 12 is located outside the mounting seat 1, and the rear end of the substrate lifting frame 12 is bent upward, and the top of the rear end of the substrate lifting frame 12 is flush with the bottom of the substrate placement groove 10. After the chip is mounted, the pressing handle at the front end of the substrate lifting frame 12 can be manually pressed downward. At this time, the substrate lifting frame 12 rotates around the connecting shaft 17, and can lift the substrate through the rear end of the substrate lifting frame 12, so that it is convenient for personnel to quickly take the substrate out of the substrate placement groove 10.

[0022] Working principle: When using, when mounting the chip, the substrate can be placed in the substrate placement groove 10, and the glue is placed on the top of the substrate below the chip pressing column 21, and then the chip to be mounted is placed on the top of the substrate where the glue is placed, and finally the pressure handle 6 is held and the shaft 3 is rotated downward to drive the cam 5 to rotate downward. The downward rotation of the cam 5 can drive the movable plate 2 to move downward along the guide column 7 to compress the spring 8. At this time, the chip pressing column 21 can move downward with the movable plate 2 and can press the chip through the chip pressing column 21. When the movable plate 2 moves to contact with the limiting column 9, the chip pressing column 21 reaches the maximum pressing force on the chip. After the chip is mounted, the pressure handle 6 is released, and under the elastic force of the spring 8, the movable plate 2 can be driven to automatically reset upward. When it is necessary to When adjusting the pressing force on the chip according to the thickness of the glue liquid, the adjusting handle 161 can be manually turned to drive the rotating rod 16 to rotate, and the rotation of the rotating rod 16 can drive the driving gear 15 to rotate, and the rotation of the driving gear 15 can drive the driven gear 14 to rotate together with the screw 13, and the rotation of the screw 13 can drive the limit column 9 to move upward or downward, so as to adjust the height of the downward movement of the movable plate 2, so as to adjust the pressing force during chip mounting to meet the thickness requirement of the glue liquid after chip mounting. After the chip mounting is completed, the pressing handle at the front end of the substrate lifting frame 12 can be manually pressed downward. At this time, the substrate lifting frame 12 can rotate around the connecting shaft 17, and the substrate can be lifted up by the rear end of the substrate lifting frame 12, so that it is convenient for personnel to quickly remove the substrate from the substrate placement groove 10.

[0023] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0024] The above are only preferred embodiments of the present invention and do not limit the present invention. Any modification to the technical solutions described in the aforementioned embodiments and any equivalent replacement of some of the technical features therein are within the protection scope of the present invention.

Claims

1. A chip mounting fixture, comprising a mounting seat (1), characterized in that: The top of the mounting seat (1) is fixedly connected to a support frame (4), a movable plate (2) is movably arranged inside the support frame (4), a chip pressing column (21) is fixedly arranged at the bottom of the movable plate (2), a rotating shaft (3) is rotatably connected to the support frame (4) above the movable plate (2) through a bearing, a cam (5) is sleeved and fixed on the rotating shaft (3), one end of the rotating shaft (3) extends to the outside of the support frame (4) and is sleeved and fixed with a pressure handle (6), guide columns (7) are vertically fixed on both sides of the support frame (4), the upper end of the guide column (7) movably passes through the movable plate (2), a spring (8) is sleeved on the guide column (7), and a chip pressing column (21) is movably arranged in the support frame (4) in front of the guide column (7) A limit column (9), a screw rod (13) is rotatably connected in the support frame (4) below the limit column (9) through a bearing, the upper end of the screw rod (13) is threaded into the limit column (9), and the lower end of the screw rod (13) is sleeved and fixed with a driven gear (14), the interior of the mounting seat (1) is rotatably connected with a rotating rod (16) through a bearing, both ends of the rotating rod (16) are sleeved and fixed with a driving gear (15), the two driving gears (15) are respectively meshed and connected with the two driven gears (14), one end of the rotating rod (16) extends to the outside of the mounting seat (1) and is fixedly provided with an adjusting handle (161), and a substrate placement groove (10) is opened on the top of the mounting seat (1) below the chip pressing column (21).

2. A chip mounting fixture according to claim 1, characterized in that: An L-shaped through slot (11) is provided on the front side of the mounting seat (1), and the rear end of the L-shaped through slot (11) is connected to the substrate placement slot (10).

3. A chip mounting fixture according to claim 2, characterized in that: The interior of the L-shaped through groove (11) is rotatably connected to a connecting shaft (17) via a bearing, and a base plate lifting frame (12) is sleeved and fixed on the connecting shaft (17).

4. The chip mounting fixture according to claim 3, characterized in that: The pressing handle at the front end of the substrate lifting frame (12) is located outside the mounting seat (1), the rear end of the substrate lifting frame (12) is bent upward, and the top of the rear end of the substrate lifting frame (12) is flush with the bottom of the substrate placement groove (10).

5. The chip mounting fixture according to claim 1, characterized in that: Slide blocks are provided on both sides of the movable plate (2), and the slide blocks move along slide grooves provided on both sides of the support frame (4).

6. The chip mounting fixture according to claim 5, characterized in that: The upper end of the spring (8) abuts against the bottom of the movable plate (2), and the upper end of the spring (8) abuts against the bottom of the slide grooves opened on both sides of the support frame (4).

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