Wafer ring feeding device

Abstract

The utility model discloses a wafer ring feeding device, and relates to the technical field of semiconductor processing equipment, the wafer ring feeding device comprises a pedestal, a material storage module, a carrying module and a wafer taking module, the pedestal is provided with a material storage position and a wafer taking position; the material storage module is arranged at the material storage position and comprises a material box used for storing the wafer rings; the carrying module is arranged on the base and is used for carrying the wafer ring in the material box to a wafer taking position; the wafer taking module is arranged at the wafer taking position, the wafer taking module comprises a wafer seat and an ejector pin mechanism arranged below the wafer seat, the wafer seat is used for placing a wafer ring, the ejector pin mechanism comprises an ejector pin assembly, and the ejector pin assembly can move towards the wafer seat; and the base, the material storage module, the carrying module and the crystal taking module are assembled into a whole. According to the technical scheme of the utility model, the base, the storage module, the carrying module and the wafer taking module are assembled into a whole, so that the disassembly and assembly convenience of the wafer ring feeding device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, in particular to a wafer ring feeding device. Background Art

[0002] The wafer is attached to the blue film, which is encapsulated on the wafer ring. In the automated bonding process of the die bonder, the wafer ring loading device needs to be used for loading first, and the wafer needs to be peeled off from the blue film before the bonding operation can begin. However, in the prior art, the wafer ring loading device has multiple components, which are bulked on the table of the die bonder. When the wafer ring loading device needs to be installed or removed, these components need to be disassembled one by one, which increases the difficulty of disassembling the wafer ring loading device. Utility Model Content

[0003] The main purpose of the utility model is to provide a wafer ring loading device, aiming to improve the convenience of disassembly and assembly of the wafer ring loading device.

[0004] In order to achieve the above-mentioned purpose, the wafer ring loading device proposed by the utility model comprises:

[0005] The base has a material storage position and a crystal extraction position;

[0006] A material storage module is arranged at the material storage position, and the material storage module includes a material box for storing wafer rings;

[0007] A transport module, disposed on the base, and used for transporting the wafer ring in the material box to the wafer retrieval position;

[0008] A wafer retrieval module is arranged at the wafer retrieval position, the wafer retrieval module comprises a wafer seat and an ejector mechanism arranged below the wafer seat, the wafer seat is used to place the wafer ring, the ejector mechanism comprises an ejector assembly, and the ejector assembly can move toward the wafer seat;

[0009] The base, the material storage module, the transport module and the crystal retrieval module are assembled into one.

[0010] In one embodiment, the base also has a transfer position, and the handling module includes a grabbing mechanism and a transfer mechanism. The grabbing mechanism can grab the wafer ring in the material box and move the wafer ring to the transfer position, and the transfer mechanism is used to transfer the wafer ring located at the transfer position to the wafer seat.

[0011] In one embodiment, the material grabbing mechanism includes a first mounting frame, a first movable module and a material grabbing clamp, wherein the first movable module is disposed on the first mounting frame and is driven to connect the material grabbing clamp so that the material grabbing clamp can move the wafer ring to the intermediate transfer position.

[0012] In one embodiment, the transfer mechanism includes a second mounting frame, a second movable module, a supporting cantilever and a transfer clamp, wherein the second movable module is disposed on the second mounting frame and is driven and connected to the supporting cantilever, and the transfer clamp is disposed on the supporting cantilever to move the wafer ring to the wafer seat.

[0013] In one embodiment, the second movable module includes a transverse movement component and a first lifting component, the transverse movement component is arranged on the second mounting frame, the first lifting component is arranged on the transverse movement component and can move between the transfer position and the crystal retrieval position, the supporting cantilever is arranged on the first lifting component, and the first lifting component can drive the supporting cantilever to move in the vertical direction.

[0014] In one embodiment, two transport jaws are provided, and the two transport jaws are arranged opposite to each other; the transport mechanism also includes a first driving member, and the first driving member can drive the two transport jaws to move toward or away from each other.

[0015] In one embodiment, a positioning piece is provided on the edge of the upper surface of the wafer seat, and the wafer ring loading device also includes a limiting module, the limiting module includes a limiting pressure block and a second driving member driving and connecting the limiting pressure block, and the second driving member can drive the limiting pressure block to move toward the wafer seat and push the wafer ring to abut against the positioning piece.

[0016] In one embodiment, the wafer ring loading device also includes a rotating module arranged on the base, the rotating module includes a third mounting frame, a rotating assembly and a third driving member, the third driving member is arranged on the third mounting frame and is driven to be connected to the rotating assembly, and the rotating assembly is connected to the wafer seat to drive the wafer seat to rotate.

[0017] In one embodiment, the rotating module further comprises a supporting member, the supporting member is arranged at the wafer taking position and connected to the third mounting frame, the wafer seat is arranged at the supporting member, and the ejector pin assembly can pass through the supporting member to approach the wafer seat;

[0018] The rotating assembly includes a synchronous ring assembly and a belt. The synchronous ring assembly is arranged on the supporting member and connected to the wafer seat. The belt is sleeved on the outer circumference of the synchronous ring assembly. The third driving member drives and connects to the belt to drive the synchronous ring assembly to rotate, so that the wafer seat rotates.

[0019] In one embodiment, the material storage module includes a second lifting assembly, which is connected to the material box and can drive the material box to move in a vertical direction; an opening is provided on the side of the material box close to the conveying module, and two side walls of the material box connected to the opening are provided with a plurality of accommodating grooves in a vertical direction, and the accommodating grooves formed on the two side walls correspond to each other one by one and are connected to the opening.

[0020] The technical solution of the utility model is to assemble the base, the material storage module, the transport module and the crystal retrieval module into one body, so there is no need to separately add or remove the material storage module, the transport module and the crystal retrieval module one by one on the machine platform of the crystal bonding machine. The material storage module, the transport module and the crystal retrieval module can be directly added to the machine platform of the crystal bonding machine, or can be directly removed from the machine platform of the crystal bonding machine, thereby reducing the difficulty of disassembly and assembly of the wafer ring loading device. The material storage module, the transport module and the crystal retrieval module can be added or removed at any time, thereby improving the convenience of disassembly and assembly of the wafer ring loading device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0022] Figure 1 A schematic structural diagram of an embodiment of a wafer ring loading device provided by the utility model;

[0023] Figure 2 for Figure 1 Schematic diagram of the structure of the middle material grabbing mechanism and the limit module;

[0024] Figure 3 for Figure 1 Schematic diagram of the structure of the intermediate transfer mechanism;

[0025] Figure 4 for Figure 1 Schematic diagram of the structure of the rotating module and wafer holder;

[0026] Figure 5 for Figure 1 Structural diagram of the ejector mechanism;

[0027] Figure 6 for Figure 1 Schematic diagram of the structure of the medium storage module.

[0028] Description of Figure Numbers:

[0029] 10. Wafer ring loading device; 100. Base; 200. Storage module; 300. Handling module; 400. Wafer extraction module; 500. Rotation module; 600. Position limiting module; 210. Material box; 220. Second lifting assembly; 310. Material grabbing mechanism; 311. First mounting frame; 312. First moving module; 313. Material grabbing claw; 320. Transfer mechanism; 321. Second mounting frame; 322. Second Mobile module; 3221, transverse movement assembly; 3222, first lifting assembly; 323, supporting cantilever; 324, transfer clamp; 325, first driving member; 410, wafer seat; 411, positioning member; 420, ejector mechanism; 421, ejector assembly; 510, third mounting frame; 520, rotating assembly; 530, third driving member; 540, supporting member; 610, second driving member; 620, limiting pressure block.

[0030] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0033] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0034] The utility model provides a wafer ring loading device 10 .

[0035] See also Figure 1 In one embodiment of the utility model, the wafer ring loading device 10 includes a base 100, a material storage module 200, a transport module 300 and a crystal retrieval module 400. The base 100 has a material storage position and a crystal retrieval position; the material storage module 200 is arranged at the material storage position, and the material storage module 200 includes a material box 210 for storing wafer rings; the transport module 300 is arranged on the base 100, and the transport module 300 is used to transport the wafer ring in the material box 210 to the crystal retrieval position; the crystal retrieval module 400 is arranged at the crystal retrieval position, and the crystal retrieval module 400 includes a wafer seat 410 and a pin mechanism 420 arranged below the wafer seat 410, the wafer seat 410 is used to place the wafer ring, and the pin mechanism 420 includes a pin assembly 421, and the pin assembly 421 can move toward the wafer seat 410; the base 100, the material storage module 200, the transport module 300 and the crystal retrieval module 400 are assembled as a whole.

[0036] Specifically, the wafer ring loading device 10 is used to load the wafer ring and peel the wafer from the blue film so that the die bonder can perform a die bonding operation on the wafer. The wafer ring loading device 10 includes a base 100, and a storage module 200, a transport module 300 and a crystal retrieval module 400 arranged on the base 100, and the base 100, the storage module 200, the transport module 300 and the crystal retrieval module 400 are assembled as a whole. The storage module 200, the transport module 300 and the crystal retrieval module 400 can be fixedly installed on the base 100, or can be detachably installed on the base 100.

[0037] The base 100 has a material storage position and a crystal retrieval position. The material storage module 200 is located at the material storage position. The material storage module 200 includes a material box 210 for storing wafer rings. The material box 210 can store multiple wafer rings to ensure the safe storage and convenient access of the wafer rings. The transport module 300 is set on the base 100, and is used to accurately transport the wafer rings in the material box 210 to the crystal retrieval position to achieve the removal and transfer of the wafer rings, and to ensure the accuracy and stability of the process of transporting the wafer rings. The transport module 300 can transport the wafer rings to the position at one time each time, or it can be transported to the position after multiple transfers. The crystal retrieval module 400 is located at the crystal retrieval position, and includes a wafer seat 410 and a ejector mechanism 420. The wafer seat 410 is used to stably place the wafer ring. The ejector mechanism 420 includes an ejector assembly 421. The ejector mechanism 420 is located below the wafer seat 410. The ejector assembly 421 can flexibly move toward the wafer seat 410. The ejector cap of the ejector assembly 421 tightly absorbs the blue film of the wafer ring. The ejector assembly 421 is lifted to peel the wafer off the blue film, thereby achieving accurate removal of the wafer ring.

[0038] As a whole assembled as a whole, the wafer ring loading device 10 does not need to separately add or remove the storage module 200, the transport module 300 and the crystal retrieval module 400 one by one on the machine platform of the crystal bonding machine. It can be directly installed on the machine platform of the crystal bonding machine, or directly removed from the machine platform of the crystal bonding machine, thereby reducing the difficulty of disassembly and assembly of the wafer ring loading device 10. It can be installed or removed at any time, which improves the convenience of disassembly and assembly of the wafer ring loading device 10. Moreover, the traditional wafer ring loading device 10 needs to be bulked on the table of the machine platform of the crystal bonding machine, which makes the overall machine footprint large, while the wafer ring loading device 10 of the utility model has a compact structure, and because the wafer ring loading device 10 is a whole assembled as a whole, the wafer ring loading device 10 can be hung outside the machine platform of the crystal bonding machine, which greatly reduces the overall footprint of the machine. In addition, the wafer ring loading device 10 mounted outside the die bonding machine can be directly repaired, which not only makes maintenance more convenient, but also reduces the impact of the wafer ring loading device 10 on other die bonding parts on the die bonding machine during the repair process.

[0039] The technical solution of the present invention is to assemble the base 100, the material storage module 200, the transport module 300 and the crystal retrieval module 400 into one body. There is no need to separately add or remove the material storage module 200, the transport module 300 and the crystal retrieval module 400 one by one on the machine platform of the crystal bonding machine. The material storage module 200, the transport module 300 and the crystal retrieval module 400 can be directly added to the machine platform of the crystal bonding machine, or can be directly removed from the machine platform of the crystal bonding machine, thereby reducing the difficulty of disassembly and assembly of the wafer ring loading device 10. The material storage module 200, the transport module 300 and the crystal retrieval module 400 can be added or removed at any time, thereby improving the convenience of disassembly and assembly of the wafer ring loading device 10.

[0040] In one embodiment, the base 100 also has a transfer position, and the handling module 300 includes a grabbing mechanism 310 and a transfer mechanism 320. The grabbing mechanism 310 can grab the wafer ring in the material box 210 and move the wafer ring to the transfer position. The transfer mechanism 320 is used to transfer the wafer ring located at the transfer position to the wafer seat 410.

[0041] See also Figures 1 to 3 The base 100 has a material storage position, a transfer position and a wafer retrieval position. The setting of the transfer position can further improve the accuracy and efficiency of the wafer ring handling of the wafer ring loading device 10. The grabbing mechanism 310 is used to grab the wafer ring in the material box 210 and move it to the transfer position to achieve rapid transfer of the wafer ring. The transfer mechanism 320 is used to smoothly transfer the wafer ring located at the transfer position to the wafer seat 410 to ensure a smooth transition and precise placement of the wafer ring. When the transfer mechanism 320 is transporting the previous wafer ring, the grabbing mechanism 310 can grab the next wafer ring, so that through the mutual cooperation of the grabbing mechanism 310 and the transfer mechanism 320, the handling process of the handling module 300 is smoother, the handling process is more efficient, and the convenience and reliability of wafer ring removal and transfer are improved.

[0042] It is worth mentioning that the positions of the material storage position, transfer position and crystal retrieval position on the base 100 are not fixed, that is, the relative positions of the material storage module 200, the transport module 300 and the crystal retrieval module 400 are flexible and variable. For example, in one embodiment, the material storage position, transfer position and crystal retrieval position are arranged in sequence along the X-axis direction of the base 100, and the material storage module 200, the transport module 300 and the crystal retrieval module 400 are arranged in sequence along the X-axis direction of the base 100 corresponding to the material storage position, transfer position and crystal retrieval position; the transport module 300 may also not be arranged at the material storage position, but be arranged on the outside of the material storage module 200 and the crystal retrieval module 400 along the Y-axis direction of the base 100. In another embodiment, the material storage position and the transfer position are arranged in sequence along the X-axis direction of the base 100, and the crystal retrieval position and the material storage position or the crystal retrieval position and the transfer position are arranged in sequence along the Y-axis direction of the base 100. By flexibly installing the material storage module 200 , the transport module 300 and the wafer retrieval module 400 on the base 100 , wafer bonding machines of different models and sizes can be adapted to improve the adaptability of the wafer ring loading device 10 .

[0043] In one embodiment, the material grabbing mechanism 310 includes a first mounting frame 311, a first movable module 312 and a material grabbing clamp 313. The first movable module 312 is disposed on the first mounting frame 311 and drives the material grabbing clamp 313 so that the material grabbing clamp 313 can move the wafer ring to the transfer position.

[0044] See also Figure 2 The first moving module 312 is mounted on the first mounting frame 311. The first moving module 312 includes at least a fourth driving member, such as a screw motor, a cylinder, a linear motor, etc. The fourth driving member drives and connects the material grabbing claw 313 to achieve precise control and movement of the material grabbing claw 313. The first moving module 312 may also include a drag chain assembly or a guide rail assembly to guide the movement of the material grabbing claw 313. Driven by the first moving module 312, the material grabbing claw 313 can move back and forth in the direction from the material storage position to the intermediate transfer position. The material grabbing claw 313 can move to the side of the intermediate transfer position away from the material storage position to make way for the transfer mechanism 320 to avoid interference between the two when the transfer mechanism 320 takes materials at the intermediate transfer position.

[0045] In one embodiment, the transfer mechanism 320 includes a second mounting frame 321, a second movable module 322, a supporting cantilever 323 and a transfer clamp 324. The second movable module 322 is disposed on the second mounting frame 321 and is driven to connect to the supporting cantilever 323. The transfer clamp 324 is disposed on the supporting cantilever 323 to move the wafer ring to the wafer seat 410.

[0046] See also Figure 3, the second mobile module 322 is installed on the second mounting frame 321, and is connected to the support cantilever 323 through a driving device to achieve flexible control and movement of the support cantilever 323. The support cantilever 323 is used to stably support the transport clamp 324 to ensure the smooth movement of the wafer seat 410 during transportation. The transport clamp 324 is located on the support cantilever 323, and its function is to clamp the wafer ring and move it to the wafer seat 410 to achieve accurate transportation and accurate placement of the wafer ring. Driven by the second mobile module 322, the support cantilever 323 can move freely on the second mounting frame 321, thereby driving the transport clamp 324 to complete the accurate positioning and transfer of the wafer ring. Through the cooperation between the grasping mechanism 310 and the transport mechanism 320, the efficiency and stability of the handling of the wafer ring loading device 10 are effectively improved.

[0047] In one embodiment, the second movable module 322 includes a transverse movement component 3221 and a first lifting component 3222. The transverse movement component 3221 is disposed on the second mounting frame 321, and the first lifting component 3222 is disposed on the transverse movement component 3221 and can move between the transfer position and the crystal retrieval position. The support cantilever 323 is disposed on the first lifting component 3222, and the first lifting component 3222 can drive the support cantilever 323 to move in the vertical direction.

[0048] See also Figure 3 The second moving module 322 includes a transverse moving assembly 3221 and a first lifting assembly 3222. The transverse moving assembly 3221 is installed on the second mounting frame 321. The transverse moving assembly 3221 includes a fifth driving member, a transverse moving slider and two linear rails arranged at intervals. The linear rails extend from the intermediate transfer position to the crystal retrieval position. The transverse moving slider is arranged on the linear rails and can slide along the extension direction of the linear rails under the drive of the fifth driving member. The supporting cantilever 323 is arranged on the first lifting assembly 3222, and the first lifting assembly 3222 is arranged on the transverse moving slider. The transporting claw 324 on the supporting cantilever 323 can move with the transverse moving slider, so as to realize the transport of the wafer seat 410 from the intermediate transfer position to the crystal retrieval position.

[0049] The first lifting assembly 3222 includes at least a sixth driving member, which is arranged on the transverse sliding slider and drives the connected support cantilever 323, so that the support cantilever 323 can drive the transfer clamp 324 to move in the vertical direction, thereby realizing the multi-degree-of-freedom movement of the transfer mechanism 320 to ensure flexibility, high accuracy and stability during the transfer process.

[0050] In one embodiment, two transport jaws 324 are provided, and the two transport jaws 324 are arranged opposite to each other; the transport mechanism 320 also includes a first driving member 325, and the first driving member 325 can drive the two transport jaws 324 to move toward or away from each other.

[0051] See also Figure 3The transport mechanism 320 adopts a double clamping structure, that is, it is provided with two transport jaws 324, and the two transport jaws 324 are arranged opposite to each other to ensure the stable clamping and balanced transport of the wafer ring. In addition, the transport mechanism 320 also includes a first driving member 325, and the first driving member 325 has the function of driving the two transport jaws 324 to move toward or away from each other. Through the control of the first driving member 325, the coordinated action between the two transport jaws 324 can be achieved, so that they are close to or away from each other at the same time to clamp or release the wafer ring; at the same time, it can also adapt to wafer rings of different sizes, thereby effectively improving the operational flexibility and applicability of the transport jaws 324.

[0052] In one embodiment, a positioning piece 411 is provided at the edge of the upper surface of the wafer seat 410, and the wafer ring loading device 10 also includes a limiting module 600, the limiting module 600 includes a limiting pressure block 620 and a second driving member 610 driving the limiting pressure block 620, and the second driving member 610 can drive the limiting pressure block 620 to move toward the wafer seat 410 and push the wafer ring to abut against the positioning piece 411.

[0053] See also Figure 2 and Figure 4 At least one positioning member 411 is provided on the edge of the upper surface of the wafer seat 410. At least one positioning member 411 is provided on an arc segment on the circumference of the wafer seat 410. The positioning member 411 is used to ensure the accurate positioning and stable fixation of the wafer ring. The positioning member 411 includes a limiting section and a pressing section. The limiting section is provided on the upper surface of the wafer seat 410. The limiting section is used to abut the outer circumference of the wafer ring to limit the position of the wafer ring on the XY plane. The pressing section is provided at the other end of the limiting section away from the upper surface of the wafer seat 410. The lower surface of the pressing section is flared from bottom to top, and the lower surface of the pressing section can abut the wafer ring to press the wafer ring.

[0054] The wafer ring loading device 10 also includes a limit module 600, which can be directly mounted on the base 100; the limit module 600 can also be mounted on the first mounting frame 311 to reduce the occupied area of ​​the base 100, so that the structure of the wafer ring loading device 10 is more compact. When the limit pressing block 620 pushes the wafer ring under the drive of the second driving member 610, the limit pressing block 620 is located on the circumference of the wafer seat 410 and is opposite to the arc segment where the positioning member 411 is located, so that the limit pressing block 620 and the positioning member 411 jointly limit and press the wafer ring, effectively avoiding the deviation and shaking of the wafer ring during the crystal retrieval process, and improving the crystal retrieval efficiency and crystal retrieval quality.

[0055] In one embodiment, the wafer ring loading device 10 also includes a rotating module 500 disposed on the base 100, the rotating module 500 includes a third mounting frame 510, a rotating assembly 520 and a third driving member 530, the third driving member 530 is disposed on the third mounting frame 510, and drives the rotating assembly 520, and the rotating assembly 520 is connected to the wafer seat 410 to drive the wafer seat 410 to rotate.

[0056] See also Figure 4 The wafer ring loading device 10 further includes a rotating module 500 disposed on the base 100. The rotating module 500 is used to realize the rotation of the wafer seat 410, thereby adjusting the position of the wafer ring in the circumferential direction so that the ejector assembly 421 is aligned with the wafer to facilitate the accuracy of the wafer retrieval operation. At the same time, by adjusting the position of the wafer ring in the circumferential direction, the arm length of the crystal retrieval swing arm of the crystal bonder can be reduced, making the crystal retrieval operation of the crystal retrieval swing arm of the crystal bonder more convenient.

[0057] The rotating module 500 includes a third mounting frame 510, a rotating assembly 520 and a third driving member 530. The third driving member 530 is mounted on the third mounting frame 510 and is connected to the rotating assembly 520, and the rotation control of the wafer seat 410 is realized by driving the rotation of the rotating assembly 520. The rotating assembly 520 is tightly connected to the wafer seat 410, and the movement of the rotating assembly 520 drives the wafer seat 410 to rotate together, thereby realizing the rotation positioning of the wafer ring during the crystal retrieval process. The third driving member 530 enables the rotating module 500 to have the ability to accurately control the rotation speed and direction, ensuring the stability and accuracy of the rotation of the wafer seat 410. Through the setting of the rotating module 500, the wafer ring loading device 10 can meet the wafer ring rotation positioning requirements under different process requirements, and provide greater flexibility and convenience for crystal retrieval operations.

[0058] In one embodiment, the rotating module 500 also includes a support member 540, which is disposed at the crystal retrieval position and connected to the third mounting frame 510, the wafer seat 410 is disposed on the support member 540, and the ejector pin assembly 421 can pass through the support member 540 to approach the wafer seat 410; the rotating assembly 520 includes a synchronous ring assembly and a belt, the synchronous ring assembly is disposed on the support member 540 and connected to the wafer seat 410, the belt is sleeved on the outer periphery of the synchronous ring assembly, and the third driving member 530 drives the connecting belt to drive the synchronous ring assembly to rotate, so that the wafer seat 410 rotates.

[0059] See also Figure 4, the support member 540 is arranged at the crystal retrieval position and connected to the third mounting frame 510, and the wafer seat 410 is mounted on the support member 540 through the synchronous ring assembly, so that the support member 540 provides a stable support for the wafer seat 410. In addition, the support member 540 is roughly annular, and the ejector assembly 421 can pass through the support member 540 so as to be close to the wafer seat 410 to realize the stripping of the wafer of the wafer ring. The belt sleeve is arranged on the outer periphery of the synchronous ring assembly, and the third driving member 530 drives the connecting belt, and drives the rotation of the synchronous ring assembly through the movement of the driving belt, thereby realizing the rotation of the wafer seat 410, ensuring the stability and reliability of the rotating module 500, so that the wafer seat 410 maintains a stable and precise motion state during the rotation process. Through the synergistic effect of the rotating module 500, the wafer ring loading device 10 can meet the needs of higher precision rotation positioning, and provide greater flexibility and convenience for crystal retrieval operations.

[0060] In one embodiment, the material storage module 200 includes a second lifting assembly 220, which is connected to the material box 210 and can drive the material box 210 to move in a vertical direction; an opening is provided on the side of the material box 210 close to the conveying module 300, and two side walls of the material box 210 connected to the opening are provided with a plurality of receiving grooves in the vertical direction, and the receiving grooves formed on the two side walls correspond to each other one by one and are connected to the opening.

[0061] See also Figure 1 and Figure 6 The material box 210 is located on one side of the storage module 200 and is provided with an opening on the side close to the transport module 300. The wafer ring in the material box 210 can be taken out from the opening, or the wafer ring can be put back into the material box 210 from the opening. A accommodating space is formed between the two corresponding accommodating grooves on the two side walls, and each accommodating space can accommodate a wafer ring, so that multiple wafer rings can be stacked and stored in the material box 210. Through the control of the second lifting component 220, the material box 210 can be precisely moved in the vertical direction. When the material grabbing claw 313 takes out the first wafer ring and then puts the empty first wafer ring back into the material box 210, the second lifting component 220 drives the material box 210 to move in the vertical direction so that the material grabbing claw 313 faces the second wafer ring, so that the material grabbing claw 313 can take out a new wafer ring. By setting the material box 210 to be able to move in the vertical direction, different wafer rings can be switched to the material grabbing claw 313, thereby realizing automatic material removal.

[0062] Working process of the wafer ring loading device 10:

[0063] See also Figure 1After the second lifting assembly 220 drives the material box 210 to rise to the height position corresponding to the material grabbing claw 313, the fourth driving member drives the material grabbing claw 313 to move toward the material box 210 and clamp the wafer ring. The fourth driving member drives the material grabbing claw 313 to move away from the material box 210 to move the wafer ring from the material box 210 to the intermediate transfer position and below the transport claw 324. The first driving member 325 drives the transport claw 324 to open, and the material grabbing claw 313 continues to move away from the material box 210 to avoid the transport claw 324 to clamp the wafer ring. The sixth driving member drives the transport claw 324 to move downward to clamp the wafer ring, and the sixth driving member drives the transport claw 324 to clamp the wafer ring and rise. The fifth driving member drives the transporting jaw 324 to move the wafer ring toward the wafer taking position, and the wafer ring moves to just above the wafer bed 410. The sixth driving member drives the transporting jaw 324 to descend to place the wafer ring on the wafer bed 410. At this time, the wafer ring is taken and transported.

[0064] The second driving member 610 drives the limiting pressing block 620 to move toward the side where the positioning member 411 is located, so that after the wafer ring abuts against the positioning member 411, the limiting pressing block 620 and the positioning member 411 together position and press the wafer ring. The driving member of the ejector mechanism 420 drives the ejector assembly 421 to rise. The ejector assembly 421 includes an ejector and an ejector cap. The ejector cap just fits tightly against the blue film of the wafer ring. At this time, the vacuum is turned on, and the blue film of the wafer ring is adsorbed on the ejector cap. The ejector peels off the blue film from the wafer, and at the same time, the suction nozzle of the crystal bonding machine comes over to suck the wafer. After taking half of the wafer on the wafer ring, the second driving member 610 drives the limiting pressing block 620 to move away from the positioning member 411, and the third driving member 530 drives the wafer ring to rotate. At this time, the second driving member 610 drives the limiting pressing block 620 again to position and press the wafer ring, and repeats the crystal taking action.

[0065] After all the wafers on the wafer ring are taken, the second driving member 610 drives the limit pressing block 620 to move away from the positioning member 411. At this time, the transporting claw 324 comes over to carry the wafer ring (empty) to the transfer position, and the fourth driving member drives the material grabbing claw 313 to push the wafer ring (empty) into the material box 210, and the material grabbing claw 313 returns to the origin. The wafer ring loading device 10 has completed a cycle of loading and taking wafers.

[0066] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A wafer ring loading device, characterized in that: include: The base has a material storage position and a crystal extraction position; A material storage module, arranged at the material storage position, the material storage module comprises a material box for storing wafer rings; A transport module, disposed on the base, and used for transporting the wafer ring in the material box to the wafer retrieval position; A wafer retrieval module is arranged at the wafer retrieval position, the wafer retrieval module comprises a wafer seat and an ejector mechanism arranged below the wafer seat, the wafer seat is used to place the wafer ring, the ejector mechanism comprises an ejector assembly, and the ejector assembly can move toward the wafer seat; The base, the material storage module, the transport module and the crystal retrieval module are assembled into one.

2. The wafer ring loading device according to claim 1, characterized in that: The base also has a transfer position, and the handling module includes a grabbing mechanism and a transfer mechanism. The grabbing mechanism can grab the wafer ring in the material box and move the wafer ring to the transfer position, and the transfer mechanism is used to transfer the wafer ring located at the transfer position to the wafer seat.

3. The wafer ring loading device according to claim 2, characterized in that: The material grabbing mechanism includes a first mounting frame, a first moving module and a material grabbing clamp. The first moving module is arranged on the first mounting frame and is driven to connect the material grabbing clamp so that the material grabbing clamp can move the wafer ring to the intermediate transfer position.

4. The wafer ring loading device according to claim 2, characterized in that: The transfer mechanism includes a second mounting frame, a second movable module, a supporting cantilever and a transfer clamp. The second movable module is arranged on the second mounting frame and is driven and connected to the supporting cantilever. The transfer clamp is arranged on the supporting cantilever to move the wafer ring to the wafer seat.

5. The wafer ring loading device according to claim 4, characterized in that: The second movable module includes a transverse movement component and a first lifting component. The transverse movement component is arranged on the second mounting frame. The first lifting component is arranged on the transverse movement component and can move between the transfer position and the crystal retrieval position. The supporting cantilever is arranged on the first lifting component. The first lifting component can drive the supporting cantilever to move in the vertical direction.

6. The wafer ring loading device according to claim 4, characterized in that: There are two transfer jaws, which are arranged opposite to each other; the transfer mechanism also includes a first driving member, which can drive the two transfer jaws to move toward or away from each other.

7. The wafer ring loading device according to claim 2, characterized in that: A positioning piece is provided at the edge of the upper surface of the wafer seat, and the wafer ring loading device also includes a limiting module, which includes a limiting pressure block and a second driving member driving and connecting the limiting pressure block, and the second driving member can drive the limiting pressure block to move toward the wafer seat and push the wafer ring to abut against the positioning piece.

8. The wafer ring loading device according to claim 1, characterized in that: The wafer ring loading device also includes a rotating module arranged on the base, and the rotating module includes a third mounting frame, a rotating assembly and a third driving member. The third driving member is arranged on the third mounting frame and is driven to be connected to the rotating assembly. The rotating assembly is connected to the wafer seat to drive the wafer seat to rotate.

9. The wafer ring loading device according to claim 8, characterized in that: The rotating module further comprises a supporting member, which is arranged at the wafer taking position and connected to the third mounting frame, the wafer seat is arranged at the supporting member, and the ejector pin assembly can pass through the supporting member to approach the wafer seat; The rotating assembly includes a synchronous ring assembly and a belt. The synchronous ring assembly is arranged on the supporting member and connected to the wafer seat. The belt is sleeved on the outer circumference of the synchronous ring assembly. The third driving member drives and connects to the belt to drive the synchronous ring assembly to rotate, so that the wafer seat rotates.

10. The wafer ring loading device according to claim 1, characterized in that: The material storage module includes a second lifting assembly, which is connected to the material box and can drive the material box to move in a vertical direction; an opening is provided on a side of the material box close to the transport module, and two side walls of the material box connected to the opening are provided with a plurality of accommodating grooves in a vertical direction, and the accommodating grooves formed on the two side walls correspond to each other one by one and are connected to the opening.

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