Die bonding device

Abstract

The utility model provides a die bonding device. The die bonding device comprises a chip bearing mechanism, a substrate bearing mechanism and a die bonding mechanism, the chip bearing mechanism is used for bearing a blue film in which chips are stored and enabling the chips to be picked up on the blue film to move to the wafer picking station; the substrate bearing mechanism is used for bearing a substrate and enabling a to-be-die-bonded area on the substrate to move to a die bonding station; the die bonding mechanism comprises a rotary driving part and a die bonding assembly, and the rotary driving part is used for driving the die bonding assembly to rotate, so that the die bonding assembly sequentially rotates to the position above the die taking station and the position above the die bonding station; the die bonding assembly picks up the chip when rotating to the position above the die taking station, and fixes the chip to the to-be-die-bonded area of the substrate when rotating to the position above the die bonding station. The die bonding assembly picks up the chip from the die bonding mechanism under the rotary driving of the rotary driving part and fixes the chip to the substrate located on the substrate bearing mechanism, and compared with linear motion, the resonance amplitude of a machine table caused by rotary motion is small, so that the die bonding precision is improved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor packaging, and in particular to a die bonding device. Background Art

[0002] The die bonding operation is an important process in the production of semiconductor devices, which requires picking up the chip from the blue film and mounting the chip on the substrate. The existing die bonding method is that the die bonding head first absorbs the chip from the blue film, and then the die bonding head moves the chip to the top of the substrate under the drive of the translation module, and mounts the chip to the specified position of the substrate. Then, the die bonding head moves again to the top of the blue film under the drive of the translation module to absorb the next chip, thereby realizing the cyclic loading process.

[0003] The existing die bonding method requires the die bonding head to move back and forth, and each reciprocating movement can only complete the die bonding operation of one chip, which has low die bonding efficiency. In addition, the frequent translation movement of the die bonding head will cause machine resonance, affecting the die bonding accuracy. Utility Model Content

[0004] In order to solve the above technical problems, the present application provides a die bonding device, which adopts the following technical solutions:

[0005] A die bonding device comprises a chip carrying mechanism, a substrate carrying mechanism and a die bonding mechanism, wherein:

[0006] The chip carrying mechanism is used to carry and tension the blue film on which the chips are stored, and to drive the blue film to move so that the chips to be picked up on the blue film are moved to the wafer taking station;

[0007] The substrate carrying mechanism is used to carry the substrate and drive the substrate to move so that the area to be bonded on the substrate moves to the bonding station;

[0008] The crystal bonding mechanism comprises a rotary drive unit and at least two crystal bonding components, wherein the at least two crystal bonding components are equidistantly arranged on the driving end of the rotary drive unit, and the rotary drive unit is used to drive the at least two crystal bonding components to rotate synchronously and step by step, so that each crystal bonding component rotates to the top of the crystal taking station and the top of the crystal bonding station in sequence;

[0009] When the crystal bonding component rotates to above the crystal picking station, it is configured to pick up the chip to be picked up from the crystal picking station; when the crystal bonding component rotates to above the crystal bonding station, it is configured to fix the chip to the area to be bonded on the substrate.

[0010] The crystal bonding device of the present application has a crystal bonding mechanism including at least two crystal bonding components. Under the rotational drive of the rotational drive unit, the at least two crystal bonding components cyclically pick up chips from the chip carrier mechanism and fix the chips to the substrate located on the substrate carrier mechanism, thereby improving the chip loading efficiency. In addition, compared with linear motion, the machine resonance amplitude caused by rotational motion is smaller, thereby improving the crystal bonding accuracy.

[0011] In some embodiments, the rotary drive unit includes a frame, a rotary drive member and a turntable, wherein: the turntable is rotatably mounted on the frame and is transmission-connected to the rotary drive member disposed on the frame, the rotary drive member being used to drive the turntable to rotate; at least two crystal fixing components are equidistantly mounted on the edge of the turntable along the circumferential direction.

[0012] A rotary drive unit with a simple structure and stable driving is provided. When the rotary drive unit drives the turntable to rotate, each crystal bonding component can be driven to rotate to the top of the crystal retrieval station and the top of the crystal bonding station in turn, so that each crystal bonding component picks up the chip from the wafer carrier mechanism and fixes the chip to the substrate located on the substrate carrier mechanism.

[0013] In some embodiments, the crystal bonding assembly includes a lifting drive part, an elastic connection part, a rotation drive part and an adsorption head, wherein: the lifting drive part is arranged on a turntable, the rotation drive part is connected to the lifting drive part telescopically up and down via the elastic connection part, and the adsorption head is connected to the driving end of the rotation drive part; the lifting drive part is used to drive the adsorption head to lift and lower, so as to drive the adsorption head to pick up the chip from the crystal retrieval station and fix the chip to the area to be crystal bonded; the rotation drive part is used to drive the adsorption head to rotate in a horizontal plane to adjust the angle of the chip.

[0014] By setting the crystal bonding component, the crystal bonding component can pick up the chip from the crystal picking station and fix the chip to the area to be crystal bonded on the substrate. Due to the provision of an elastic connection part, the suction head realizes elastic downward pressure on the chip, and finally makes the chip fit in all directions with the area to be crystal bonded, improves the crystal bonding effect, and prevents the chip from being damaged by pressure. Due to the provision of a rotating drive part, the suction head can adjust the angle of the chip, so that the chip is aligned with the area to be crystal bonded, ensuring the accuracy of crystal bonding.

[0015] In some embodiments, the elastic connection part includes a mounting seat, a lifting seat and a spring, wherein: the mounting seat is connected to the driving end of the lifting drive part; the lifting seat is slidably connected to the mounting seat and can slide up and down along the mounting seat, a first limit plate is formed on the lifting seat, and a second limit plate is formed on the mounting seat and is located below the first limit plate; the lower end of the spring abuts against the second limit plate, and the upper end of the spring abuts against the first limit plate.

[0016] When the suction head presses the chip down to the area of ​​the substrate to be bonded, the lifting seat rises under pressure, and the spring is stretched, so that the suction head elastically presses the chip down to the area to be bonded. After the chip is fixed, the suction head rises and detaches from the substrate, and the spring loses pressure and retracts, thereby driving the lifting seat to return to its original position.

[0017] In some embodiments, after the rotation driving unit drives at least two die-bonding components to rotate step by step each time, there is a die-bonding component above the die-taking station and above the die-bonding station.

[0018] When the die bonding component at the die picking station picks up the chip from the die bonding mechanism, another die bonding component at the die bonding station fixes the chip to the area to be bonded on the substrate, thereby further improving the die bonding efficiency.

[0019] In some embodiments, the chip carrying mechanism includes a first translation module and a blue film carrying assembly, wherein the blue film carrying assembly is connected to a movable part of the first translation module; the blue film carrying assembly is used to carry and tension the blue film, and the first translation module is used to drive the blue film carrying assembly to translate so that the chip to be picked up on the blue film is moved to the crystal retrieval station.

[0020] By setting up the chip carrying mechanism, the chip carrying mechanism can carry and tension the blue film, and can adjust the position of the blue film, so that the chip to be picked up on the blue film can be moved to the crystal retrieval station, ensuring that the crystal bonding component rotated above the crystal retrieval station can smoothly pick up the chip.

[0021] In some embodiments, the substrate carrying mechanism includes a second translation module and a substrate conveying module, wherein the substrate conveying module is connected to the movable part of the second translation module; the substrate conveying module is used to carry and convey the substrate, and the second translation module is used to drive the substrate conveying module to translate so that the area of ​​the substrate to be bonded is moved to the bonding station.

[0022] By setting up the substrate carrying mechanism, the substrate carrying mechanism can carry and transport the substrate, and can adjust the position of the substrate, so that the area to be bonded on the substrate is moved to the bonding station, ensuring that the bonding component rotated above the bonding station can smoothly fix the chip to the area to be bonded.

[0023] In some embodiments, the substrate carrying mechanism further includes a lifting module, the substrate conveying module is connected to a movable part of the lifting module, and the lifting module is used to drive the substrate conveying module to move up and down to adjust the height of the substrate.

[0024] By setting up the lifting module, the height adjustment of the substrate is achieved, so that the height difference between the substrate area to be bonded and the bonding component rotated to the bonding station meets the bonding requirements, further ensuring the bonding effect.

[0025] In some embodiments, the crystal bonding device also includes a first positioning mechanism and a second positioning mechanism, wherein: the first positioning mechanism is arranged above the chip supporting mechanism, and the first positioning mechanism is used to position the chip located at the crystal picking station to obtain the position information of the chip, and the crystal bonding component picks up the chip from the crystal picking station based on the position information of the chip; the second positioning mechanism is arranged above the substrate supporting mechanism, and the second positioning mechanism is used to position the area to be crystal bonded located at the crystal bonding station to obtain the position information of the area to be crystal bonded, and the crystal bonding component fixes the chip to the area to be crystal bonded based on the position information of the area to be crystal bonded.

[0026] By setting the first positioning mechanism, the positioning of the chip located at the crystal retrieval station is realized, so that the crystal bonding component rotated to the top of the crystal retrieval station can smoothly pick up the chip to be picked up based on the position information of the chip to be picked up. By setting the second positioning mechanism, the positioning of the area to be crystal bonded at the crystal bonding station is realized, so that the crystal bonding component rotated to the top of the crystal bonding station can accurately fix the chip to the area to be crystal bonded based on the position information of the area to be crystal bonded.

[0027] In some embodiments, the crystal bonding mechanism includes at least three crystal bonding components, and the crystal bonding device also includes a third positioning mechanism; before the crystal bonding component fixes the chip to the area to be crystal bonded, the third positioning mechanism is configured to position the chip to obtain the position information of the chip; the crystal bonding component fixes the chip to the area to be crystal bonded based on the position information of the area to be crystal bonded and the position information of the chip.

[0028] The die-bonding assembly rotated to the top of the die-bonding station can adjust the chip to the optimal position and fix it to the area to be bonded based on the position information of the area to be bonded and the position information of the chip adsorbed thereon, thereby further ensuring that the chip is accurately fixed to the area to be bonded. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the structure of the die bonding device in the embodiment of the present application;

[0030] Figure 2 It is a schematic diagram of the three-dimensional structure of the crystal bonding mechanism in the embodiment of the present application at one viewing angle;

[0031] Figure 3 It is a schematic side view of the structure of the crystal bonding mechanism in the embodiment of the present application;

[0032] Figure 4 It is a bottom view structural schematic diagram of the crystal bonding mechanism in the embodiment of the present application;

[0033] Figure 5 is a schematic diagram of the three-dimensional structure of the crystal bonding mechanism in the embodiment of the present application from another viewing angle;

[0034] Figure 6 for Figure 5 A local enlarged view of the C region in FIG.

[0035] Figure 7 It is a schematic diagram of the structure of the die-bonding assembly in the embodiment of the present application;

[0036] Figure 8 Schematic diagram of the structure of the substrate supporting mechanism in the embodiment of the present application.

[0037] Figures 1 to 8 It includes: a chip carrying mechanism 1, a substrate carrying mechanism 2, a second translation module 21, a substrate conveying module 22, a lifting module 23, a crystal fixing mechanism 3, a rotation driving part 31, a frame 311, a rotation driving part 312, a turntable 313, a crystal fixing assembly 32, an elastic connecting part 321, a rotation driving part 322, an adsorption head 323, a mounting seat 324, a lifting seat 325, a spring 326, a slide rail 327, a first limit plate 328, a second limit plate 329, a first positioning mechanism 4, and a second positioning mechanism 5. DETAILED DESCRIPTION

[0038] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0039] like Figure 1 As shown, the die bonding device in the embodiment of the present application includes a chip carrying mechanism 1, a substrate carrying mechanism 2 and a die bonding mechanism 3, wherein:

[0040] The chip carrier mechanism 1 is used to carry and tension the blue film, on which a number of chips are stored. The chip carrier mechanism 1 can drive the blue film to move, so that one of the chips on the blue film is moved to the crystal retrieval station as the chip to be picked up. Whenever a chip is taken away, the chip carrier mechanism 1 immediately drives the blue film to move, so that another chip is moved to the crystal retrieval station.

[0041] The substrate carrying mechanism 2 is used to carry the substrate. There are several areas to be bonded on the substrate, and each area to be bonded needs to fix a chip. The substrate carrying mechanism 2 can drive the substrate to move, so as to move one of the areas to be bonded on the substrate to the bonding station. Whenever a chip is fixed in an area to be bonded, the substrate carrying mechanism 2 immediately drives the substrate to move, so that another area to be bonded moves to the bonding station.

[0042] The crystal bonding mechanism 3 includes a rotation drive unit 31 and at least two crystal bonding components 32, wherein at least two crystal bonding components 32 are equidistantly arranged on the driving end of the rotation drive unit 31, and the rotation drive unit 32 is used to drive at least two crystal bonding components 32 to rotate synchronously and step by step, so that each crystal bonding component 32 rotates to the top of the crystal retrieval station and the top of the crystal bonding station in sequence. When the crystal bonding component 32 rotates to the top of the crystal retrieval station, the chip to be picked up is picked up from the crystal retrieval station. When the crystal bonding component 32 rotates to the top of the crystal bonding station, the picked up chip is fixed to the area to be crystal bonded of the substrate.

[0043] The die bonding device in the embodiment of the present application has a die bonding mechanism 3 including at least two die bonding components 32. The at least two die bonding components 32, under the rotational drive of the rotational drive unit 31, cyclically pick up the chip from the chip carrier mechanism 1 and fix the chip to the substrate on the substrate carrier mechanism 2, thereby improving the chip loading efficiency. In addition, compared with the linear motion, the machine resonance amplitude caused by the rotational motion is smaller, thereby improving the die bonding accuracy.

[0044] like Figures 2 to 5 As shown, optionally, the rotation driving unit 31 includes a frame 311, a rotation driving member 312 and a turntable 313, wherein: the turntable 313 is rotatably mounted on the frame 311 and is in driving connection with the rotation driving member 312 disposed on the frame 311, and the rotation driving member 312 is used to drive the turntable 313 to rotate. At least two crystal bonding assemblies 32 are equidistantly mounted on the edge of the turntable 313 along the circumferential direction.

[0045] Figures 2 to 5 In the embodiment, the turntable 313 is circular, and 16 crystal bonding assemblies 32 are equidistantly installed on the edge of the turntable 313 along the circumferential direction. The rotating drive member 312 drives the turntable 313 to rotate once in a stepwise manner, and the turntable 313 rotates 22.5°. By setting the positions of the crystal picking station and the crystal bonding station, for example, Figure 4 As shown, the crystal picking station A and the crystal bonding station B are arranged around the turntable 313. Specifically, the crystal picking station A and the crystal bonding station B are arranged on the motion track of the crystal bonding component 32. It can be realized that 16 crystal bonding components 32 can be rotated to the crystal picking station A and the crystal bonding station B in sequence. In addition, after each rotation of the turntable 313, there is a crystal bonding component 32 above the crystal picking station A and above the crystal bonding station B. While the crystal bonding component 32 above the crystal picking station A picks up the chip, the crystal bonding component 32 above the crystal bonding station B fixes the picked up chip to the substrate, thereby further improving the crystal bonding efficiency.

[0046] Of course, 2, 3, 4 or other smaller numbers of die-bonding assemblies 32 may be provided, or 17, 18 or other larger numbers of die-bonding assemblies 32 may be provided. For example, in order to save costs, only two die-bonding assemblies 32 may be provided. The rotary drive member 312 drives the turntable 313 to rotate once in a stepwise manner, and the turntable 313 rotates 180°. In this way, the positions of the two die-bonding assemblies 32 above the crystal retrieval station A and above the crystal bonding station B may be exchanged, so that the two die-bonding assemblies 32 alternately pick up chips from the blue film at the crystal retrieval station A, and alternately fix the chips to the area to be bonded at the crystal bonding station B.

[0047] The turntable 313 may also be configured in other shapes. For example, when the number of the crystal-bonding components 32 is 3, the turntable 313 may be configured in a triangle, and each vertex of the triangular turntable 313 is respectively provided with a crystal-bonding component 32. In this case, the rotating drive member 312 drives the turntable 313 to rotate once in a step, and the turntable 313 rotates 60°. For another example, when the number of the crystal-bonding components 32 is 4, the turntable 313 may be configured in a square, and each vertex of the square turntable 313 is respectively provided with a crystal-bonding component 32. In this case, the rotating drive member 312 drives the turntable 313 to rotate once in a step, and the turntable 313 rotates 90°.

[0048] The rotation driving member 312 may adopt various existing drive modules capable of driving the turntable 313 to rotate, such as a rotation driving module composed of a motor and gears.

[0049] like Figures 5 to 7 As shown, optionally, the crystal fixing assembly 32 includes a lifting drive unit (not shown in the figure), an elastic connection unit 321, a rotation drive unit 322 and an adsorption head 323, wherein: the lifting drive unit is arranged on the turntable 313, the rotation drive unit 322 is connected to the lifting drive unit via the elastic connection unit 321 so as to be telescopically connected up and down, and the adsorption head 323 is connected to the driving end of the rotation drive unit 322.

[0050] When the die bonding assembly 32 is driven by the turntable 313 to rotate above the die picking station, the lifting drive unit 322 drives the adsorption head 323 to descend and then ascend, thereby driving the adsorption head 323 to pick up the chip from the die picking station.

[0051] When the die bonding assembly 32 is driven by the turntable 313 to rotate to the die bonding station, the lifting drive unit 322 drives the adsorption head 323 to descend, thereby driving the adsorption head 323 to press the chip down to the area to be bonded. When the adsorption head 323 presses the chip down, the elastic connection unit 321 produces elastic deformation, and finally the chip is elastically pressed against the area to be bonded, thereby forming an all-round fit with the area to be bonded, improving the die bonding effect, and preventing the chip from being damaged by pressure.

[0052] In addition, after the adsorption head 323 picks up the chip from the crystal picking station, the rotation drive unit 322 can drive the adsorption head 323 to rotate in the horizontal plane, so as to adjust the angle of the chip so that the chip is aligned with the area to be crystal-bonded, and finally ensure the crystal bonding accuracy. For example, if the chip and the area to be crystal-bonded are both square, the four sides of the chip can be aligned with the four sides of the area to be crystal-bonded by adjusting the angle of the chip.

[0053] like Figure 6 to Figure 7 As shown, optionally, the elastic connection part 321 includes a mounting seat 324, a lifting seat 325 and a spring 326, wherein: the mounting seat 324 is connected to the driving end of the lifting drive part. The lifting seat 325 is slidably connected to the mounting seat 324 via a slide rail 327, and can slide up and down along the mounting seat 324. A first limit plate 328 is formed on the lifting seat 325, and a second limit plate 329 located below the first limit plate 328 is formed on the mounting seat 324. The lower end of the spring 326 abuts against the second limit plate 329, and the upper end of the spring 326 abuts against the first limit plate 328.

[0054] When the adsorption head 323 presses the chip down to the area to be bonded on the substrate, the lifting seat 325 is pressed up, and the spring 326 is stretched and pulls the lifting seat 325 downward, so that the adsorption head 323 elastically presses the chip down to the area to be bonded. After the chip is fixed, the adsorption head 323 rises and detaches from the substrate, and the spring 326 loses pressure and retracts, thereby driving the lifting seat 325 to descend and return to its original position.

[0055] Optionally, the chip carrier mechanism 1 includes a first translation module and a blue film carrier assembly, wherein the blue film carrier assembly is connected to a movable part of the first translation module. The blue film carrier assembly is used to carry and tension the blue film, and the first translation module is used to drive the blue film carrier assembly to translate, so that the chip to be picked up on the blue film moves to the crystal retrieval station.

[0056] In order to achieve flexible adjustment of the position of the blue film on the horizontal plane, optionally, the first translation module can be composed of an X-axis translation module and a Y-axis translation module, wherein the Y-axis translation module is connected to the movable part of the X-axis translation module, and the blue film bearing assembly is connected to the movable part of the Y-axis translation module. The X-axis translation module can drive the blue film bearing assembly to translate on the X-axis, and the Y-axis translation module can drive the blue film bearing assembly to translate on the Y-axis. Through the coordination and adjustment of the X-axis translation module and the Y-axis translation module, it can be ensured that the chip to be picked up on the blue film is moved to the crystal retrieval station. Both the X-axis translation module and the Y-axis translation module can adopt various existing linear drive modules, such as a cylinder drive module composed of a cylinder, a slide rail and a slider, and a screw drive module composed of a motor, a lead screw and a lead screw nut.

[0057] The blue film bearing assembly can adopt various existing blue film bearing mechanisms that can implement the bearing and tensioning of the blue film. For example, the blue film bearing assembly includes annular clamping seats arranged in upper and lower parts. The material rack installed with the blue film is transported between the annular clamping seats. The annular clamping seats move up and down to clamp the blue film, thereby achieving the tensioning of the blue film.

[0058] like Figure 8 As shown, optionally, the substrate carrying mechanism 2 includes a second translation module 21 and a substrate conveying module 22, wherein the substrate conveying module 22 is connected to the movable part of the second translation module 21. The substrate conveying module 22 is used to carry and convey the substrate, and the second translation module 21 is used to drive the substrate conveying module 22 to translate, so that the area to be bonded of the substrate moves to the bonding station.

[0059] Similarly, in order to achieve flexible adjustment of the position of the substrate on the horizontal plane, the second translation module 21 can optionally be composed of an X-axis translation module and a Y-axis translation module, wherein the X-axis translation module can drive the substrate conveying module 22 to translate on the X-axis, and the Y-axis translation module can drive the substrate conveying module 22 to translate on the Y-axis. Through the coordinated adjustment of the X-axis translation module and the Y-axis translation module, it can be ensured that the substrate area to be bonded on the substrate conveying module 22 is accurately adjusted to the fixed position.

[0060] Continue to refer Figure 8 As shown, optionally, the substrate supporting mechanism 2 also includes a lifting module 23, and the substrate conveying module 22 is connected to the movable parts of the lifting module 23. The lifting module 23 is used to drive the substrate conveying module 22 to rise and fall to adjust the height of the substrate, so that the height difference between the area to be bonded of the substrate and the bonding component 32 rotated to the bonding station meets the bonding requirements, ensuring that the bonding component 32 can fix the chip to the area to be bonded.

[0061] like Figures 1 to 3 and Figure 5 As shown, optionally, the die-bonding device in the embodiment of the present application further includes a first positioning mechanism 4 and a second positioning mechanism 5, wherein:

[0062] The first positioning mechanism 4 is arranged above the chip carrier mechanism 1 and is used to position the chip at the wafer picking station to obtain the chip position information. The die bonding assembly 32 picks up the chip from the wafer picking station based on the chip position information, thereby ensuring that the chip can be picked up smoothly.

[0063] The second positioning mechanism 5 is arranged above the substrate supporting mechanism 2. The second positioning mechanism 5 is used to position the area to be crystal-bonded located at the crystal bonding station to obtain the position information of the area to be crystal-bonded. The crystal bonding component 32 fixes the chip to the area to be crystal-bonded based on the position information of the area to be crystal-bonded, thereby ensuring that the chip can be accurately fixed to the area to be crystal-bonded.

[0064] Optionally, for the case where the number of the die-bonding components 32 is three or more, the die-bonding device in the embodiment of the present application may further include a third positioning mechanism. Before the die-bonding component 32 fixes the chip to the area to be bonded, the third positioning mechanism is configured to position the chip sucked by the die-bonding component 32 to obtain the position information of the chip on the die-bonding component 32. The die-bonding component 32 fixes the chip to the area to be bonded at a predetermined angle and position parameters based on the position information of the area to be bonded and the position information of the chip. In this way, it can be further ensured that the chip is accurately fixed to the area to be bonded.

[0065] The first positioning mechanism 4 , the second positioning mechanism 5 and the third positioning mechanism can all adopt positioning cameras.

[0066] The above description of the present application is sufficiently detailed and has certain particularities. Those skilled in the art should understand that the description in the embodiments is merely exemplary, and all changes made without departing from the true spirit and scope of the present application should fall within the scope of protection of the present application. The scope of protection claimed in the present application is defined by the claims, not by the above description in the embodiments. Moreover, the embodiments mentioned in the present application are not limited to being implemented individually, and some embodiments can also be implemented in combination.

Claims

1. A die bonding device, characterized in that: The die bonding device comprises a chip carrying mechanism, a substrate carrying mechanism and a die bonding mechanism, wherein: The chip carrying mechanism is used to carry and tension the blue film on which the chips are stored, and to drive the blue film to move so that the chip to be picked up on the blue film moves to the wafer taking station; The substrate carrying mechanism is used to carry the substrate and drive the substrate to move so that the area to be bonded on the substrate moves to the bonding station; The crystal bonding mechanism comprises a rotation drive unit and at least two crystal bonding components, wherein at least two of the crystal bonding components are equidistantly arranged on the driving end of the rotation drive unit, and the rotation drive unit is used to drive at least two of the crystal bonding components to rotate synchronously and stepwise, so that each of the crystal bonding components rotates to the top of the crystal taking station and the top of the crystal bonding station in sequence; When the crystal bonding component rotates to above the crystal retrieval station, it is configured to pick up the chip to be picked up from the crystal retrieval station; when the crystal bonding component rotates to above the crystal bonding station, it is configured to fix the chip to the area to be bonded on the substrate.

2. The die bonding device according to claim 1, characterized in that: The rotary drive unit comprises a frame, a rotary drive member and a turntable, wherein: The turntable is rotatably mounted on the frame and is drivingly connected to the rotation driving member disposed on the frame, and the rotation driving member is used to drive the turntable to rotate; At least two of the die-bonding assemblies are equidistantly mounted on the edge of the turntable along the circumferential direction.

3. The die bonding device according to claim 2, characterized in that: The die-bonding assembly includes a lifting drive unit, an elastic connection unit, a rotation drive unit and an adsorption head, wherein: The lifting drive unit is arranged on the turntable, the rotating drive unit is connected to the lifting drive unit via the elastic connecting unit so as to be telescopically connected to the lifting drive unit, and the adsorption head is connected to the driving end of the rotating drive unit; The lifting drive unit is used to drive the adsorption head to rise and fall, so as to drive the adsorption head to pick up the chip from the crystal retrieval station and fix the chip to the area to be crystal bonded; the rotation drive unit is used to drive the adsorption head to rotate in a horizontal plane, so as to adjust the angle of the chip.

4. The die bonding device according to claim 3, characterized in that: The elastic connection part includes a mounting seat, a lifting seat and a spring, wherein: The mounting seat is connected to the driving end of the lifting drive unit; The lifting seat is slidably connected to the mounting seat and can slide up and down along the mounting seat. A first limit plate is formed on the lifting seat, and a second limit plate located below the first limit plate is formed on the mounting seat. The lower end of the spring abuts against the second limiting plate, and the upper end of the spring abuts against the first limiting plate.

5. The die bonding device according to claim 1, characterized in that: After the rotation driving part drives at least two of the crystal bonding components to rotate step by step each time, there is one crystal bonding component above the crystal taking station and one crystal bonding station.

6. The die bonding device according to claim 1, characterized in that: The chip carrying mechanism comprises a first translation module and a blue film carrying component, wherein the blue film carrying component is connected to the movable part of the first translation module; The blue film bearing assembly is used to bear and tension the blue film, and the first translation module is used to drive the blue film bearing assembly to translate, so that the chip to be picked up on the blue film moves to the wafer retrieval station.

7. The die bonding device according to claim 1, characterized in that: The substrate carrying mechanism comprises a second translation module and a substrate conveying module, wherein the substrate conveying module is connected to a movable component of the second translation module; The substrate conveying module is used for carrying and conveying the substrate, and the second translation module is used for driving the substrate conveying module to translate, so that the area to be bonded of the substrate moves to the bonding station.

8. The die bonding device according to claim 7, characterized in that: The substrate carrying mechanism further comprises a lifting module, the substrate conveying module is connected to a movable part of the lifting module, and the lifting module is used to drive the substrate conveying module to move up and down to adjust the height of the substrate.

9. The die bonding device according to claim 1, characterized in that: The die-bonding device further comprises a first positioning mechanism and a second positioning mechanism, wherein: The first positioning mechanism is arranged above the chip carrying mechanism, and is used to position the chip located at the wafer picking station to obtain the position information of the chip, and the die bonding component picks up the chip from the wafer picking station based on the position information of the chip; The second positioning mechanism is arranged above the substrate supporting mechanism, and is used to position the area to be bonded at the bonding station to obtain position information of the area to be bonded, and the bonding component fixes the chip to the area to be bonded based on the position information of the area to be bonded.

10. The die bonding device according to claim 9, characterized in that: The crystal bonding mechanism includes at least three crystal bonding components, and the crystal bonding device also includes a third positioning mechanism; Before the die-bonding assembly fixes the chip to the area to be die-bonded, the third positioning mechanism is configured to position the chip to obtain position information of the chip; The die-bonding assembly fixes the chip to the area to be die-bonded based on the position information of the area to be die-bonded and the position information of the chip.

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