Ceramic atomizing core and atomizing device

Abstract

The utility model relates to a ceramic atomizing core and an atomizing device.The ceramic atomizing core comprises a ceramic base body and a resistive layer, the ceramic base body comprises a body and a boss protruding out of one surface of the body, and the boss is matched with the resistive layer in shape; the resistive layer is printed and molded on the surface of the boss away from the body. Because the boss protrudes out of the surface of the body, a height difference exists between the surface, far away from the body, of the boss and the body, due to the existence of the height difference, the resistive layer is not formed on the surface of the body during printing and is only formed on the surface, far away from the body, of the boss, and slurry for preparing the resistive layer extends and covers the surface, far away from the body, of the boss; the edge of the resistance layer is flat, an arc and a sharp combination surface are avoided, core pasting caused by concentrated heating can be avoided, and the atomization effect is stable; and the atomization area in the ceramic atomization core not only comprises the surface, far away from the body, of the boss below the resistance layer, but also comprises the side surface, intersecting with the body, of the boss, so that the atomization area is large, and the atomization effect is good.

Description

Technical Field

[0001] The present application relates to the field of atomization technology, and in particular to a ceramic atomization core and an atomization device. Background Art

[0002] In the field of atomization technology, the ceramic atomization core, as an atomization component with ceramic as the main body and a resistance layer introduced for heating, has a more stable atomization effect compared to the cotton core and is widely used in various industries involving atomization, such as medicine, beauty, etc.

[0003] In the prior art, the ceramic atomization core is composed of a ceramic substrate, a resistor layer, an electrode and other parts. The resistor layer is stacked on the ceramic substrate, and the electrode is connected to an external power source, so that the resistor layer is electrically heated to perform atomization operations. In order to avoid problems such as local high temperature burning caused by unstable and uneven temperature distribution, insufficient atomization effect, and to ensure a stable atomization effect, the resistor layer needs to be processed more precisely. The commonly used method is to attach a layer of resistor pattern as a resistor layer on the surface of the ceramic substrate through thick film printing technology, but this thick film printing has problems such as uneven silk screen edges, arcs and sharp bonding surfaces, and a small atomization area, which leads to atomization core sticking and unstable atomization effect. Summary of the invention

[0004] Based on this, it is necessary to provide a ceramic atomizer core and an atomizer device to address the above problems. In the ceramic atomizer core, the edge of the resistance layer is uniform and the atomization area is larger, which can reduce the atomization core sticking and ensure a stable atomization effect.

[0005] The present application provides a ceramic atomization core, comprising a ceramic substrate and a resistance layer, wherein:

[0006] The ceramic substrate comprises a main body and a boss protruding from a surface of the main body, wherein the boss is adapted to the shape of the resistance layer;

[0007] The resistance layer is printed and formed on the surface of the boss away from the body.

[0008] In the above-mentioned ceramic atomization core, since the boss protrudes from the surface of the main body, there is a height difference between the surface of the boss away from the main body and the main body. The existence of this height difference prevents the resistance layer from being formed on the surface of the main body during printing, but only on the surface of the boss away from the main body. At this time, the slurry for preparing the resistance layer extends and covers the surface of the boss away from the main body, so that the edge of the resistance layer is smooth, and the arc and sharp bonding surface of the existing silk screen printing will not appear, which can avoid core sticking caused by concentrated heat and stabilize the atomization effect; and the atomization area in the ceramic atomization core includes not only the surface of the boss away from the main body under the resistance layer, but also the side surface where the boss intersects with the main body, so that the atomization area is larger and the atomization effect is better.

[0009] In one of the embodiments, the height of the boss relative to the body is less than or equal to 2.5 mm.

[0010] In one embodiment, the height of the boss relative to the body is greater than or equal to 1 mm.

[0011] In one of the embodiments, a projection of an end of the boss away from the body on the body falls within a projection contour of an end of the boss close to the body on the body.

[0012] In one embodiment, the side surface of the boss intersecting with the body surface is a smooth surface.

[0013] In one of the embodiments, a projection area of ​​the boss on the body gradually decreases in a direction away from the body.

[0014] In one embodiment, the taper of the boss is 5°-10°.

[0015] In one embodiment, the ceramic matrix is ​​a structural component formed by hot die casting and then sintering.

[0016] In one embodiment, the resistance layer is a structural component formed by screen printing and then sintering.

[0017] In addition, the present application also provides an atomization device, comprising the ceramic atomization core described in any of the above technical solutions.

[0018] In the above-mentioned atomization device, the ceramic atomization core has a boss protruding from the surface of the body, so that there is a height difference between the surface of the boss away from the body and the body. The existence of this height difference prevents the resistance layer from being formed on the surface of the body during printing, but only on the surface of the boss away from the body. At this time, the slurry for preparing the resistance layer extends and covers the surface of the boss away from the body, so that the edge of the resistance layer is smooth, and there will be no arc and sharp joint surface of the existing silk screen printing, which can avoid the core from being stuck due to concentrated heat, and the atomization effect is stable; and the atomization area in the ceramic atomization core includes not only the surface of the boss away from the body below the resistance layer, but also the side surface where the boss intersects with the body, so that the atomization area is larger and the atomization effect is better. Therefore, the atomization device with the ceramic atomization core can reduce the atomization core sticking and ensure the stable atomization effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the structure of a ceramic atomizer core provided in this application.

[0020] Figure 2 for Figure 1 Top view of the ceramic atomizer core.

[0021] Figure 3 for Figure 2 Cross-sectional view of the ceramic atomizer core at the BB' position.

[0022] Figure 4 A schematic structural diagram of a ceramic substrate provided in this application.

[0023] Figure 5 for Figure 4 Top view of the ceramic substrate.

[0024] Figure 6 for Figure 5 Cross-sectional view of the ceramic substrate at the CC' position.

[0025] Figure 7 for Figure 1 An enlarged schematic diagram of the ceramic atomizer core at position A.

[0026] Figure 8 A schematic diagram of the structure of a ceramic atomizer core provided by the prior art.

[0027] Reference numerals:

[0028] This application: 10, ceramic atomizer core; 100, ceramic substrate; 110, body; 120, boss; 200, resistor layer;

[0029] Existing technology: 01, ceramic atomization core; 011, ceramic substrate; 012, resistance layer. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0031] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial" and "circumferential" indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two or three, unless otherwise clearly and specifically defined.

[0033] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0034] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0035] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0036] The technical solution provided by the embodiments of the present application is described below in conjunction with the accompanying drawings.

[0037] like Figure 1 , Figure 2 as well as Figure 3As shown, the present application provides a ceramic atomization core 10, including a ceramic substrate 100 and a resistor layer 200. Of course, the structure of the ceramic atomization core 10 is not limited to the above-mentioned ceramic substrate 100 and the resistor layer 200, but also includes other structural parts, such as electrodes. Since the present application does not involve improvements to other structural parts except the ceramic substrate 100 and the resistor layer 200, other structural parts can still adopt the existing structure, and the present application will not elaborate on this.

[0038] See also Figure 4 , Figure 5 as well as Figure 6 The ceramic substrate 100 includes a body 110 and a boss 120, and the boss 120 protrudes from a surface of the body 110, and the boss 120 is adapted to the shape of the resistor layer 200. In one embodiment, the boss 120 and the body 110 can be integrally formed, for example, by injection molding, casting and other processes, so as to facilitate processing and manufacturing. In another embodiment, the boss 120 and the body 110 can also be separately formed, for example, by multiple processes, so as to be suitable for different materials and structures of the boss 120.

[0039] Continue reading Figure 1 , Figure 2 as well as Figure 3 The resistor layer 200 is printed and formed on the surface of the boss 120 away from the body 110. Since the shape of the boss 120 is adapted to the shape of the resistor layer 200, when the resistor layer 200 is printed and formed, the metal slurry used to prepare the resistor layer 200 covers the surface of the boss 120 away from the body 110 and extends on the surface of the boss 120 away from the body 110 without overflowing. After forming, the edge of the resistor layer 200 is uniform and flat.

[0040] In the above-mentioned ceramic atomization core 10, since the boss 120 protrudes from the surface of the main body 110, there is a height difference between the surface of the boss 120 away from the main body 110 and the main body 110. The existence of this height difference prevents the resistance layer 200 from being formed on the surface of the main body 110 during printing, but only on the surface of the boss 120 away from the main body 110. At this time, the slurry for preparing the resistance layer 200 extends and covers the surface of the boss 120 away from the main body 110, so that the edge of the resistance layer 200 is smooth, and the arc and sharp bonding surface of the existing silk screen printing will not appear, which can avoid the core sticking caused by concentrated heat and the atomization effect is stable; and the atomization area in the ceramic atomization core 10 includes not only the surface of the boss 120 away from the main body 110 below the resistance layer 200, but also the side surface where the boss 120 intersects with the main body 110, so that the atomization area is larger and the atomization effect is better.

[0041] In order to facilitate the preparation and molding of the ceramic substrate 100, in a preferred embodiment, the height of the boss 120 relative to the main body 110 can be less than or equal to 2.5 mm, so that the height of the boss 120 is not too high. On the one hand, it can facilitate the demolding of the ceramic substrate 100 during preparation, and can avoid damage to the boss 120 during the demolding process, thereby improving the convenience and reliability of the preparation of the boss 120; on the other hand, it can ensure the oil conduction rate of the ceramic substrate 100, avoid reducing the oil conduction rate, and ensure the atomization effect. In one example, the height of the boss 120 relative to the main body 110 can be 2.5 mm, 2.4 mm, 2.3 mm, 2.2 mm, 2.1 mm, 2.0 mm. Of course, the height of the boss 120 relative to the main body 110 is not limited to the above specific values, and can also be other values ​​within the range of less than or equal to 2.5 mm.

[0042] In order to improve the flatness of the edge of the resistor layer 200, in a preferred embodiment, the height of the boss 120 relative to the body 110 can be greater than or equal to 1 mm, so as to avoid the metal paste from contacting the body 110 due to printing process problems during printing and molding, resulting in the metal paste overflowing and causing the side of the resistor layer 200 to be uneven. In an example, the height of the boss 120 relative to the body 110 can be 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm. Of course, the height of the boss 120 relative to the body 110 is not limited to the above specific values, and can also be other values ​​within the range of greater than or equal to 1mm.

[0043] The boss 120 has various structural forms, see Figure 4 , Figure 5 as well as Figure 6 The boss 120 may be vertically disposed on the surface of the body 110. In order to facilitate demoulding of the ceramic substrate 100 during preparation, in a preferred embodiment, continue to refer to Figure 1 , Figure 2 as well as Figure 3 The projection of the end of the boss 120 away from the body 110 on the body 110 falls within the projection contour of the end of the boss 120 close to the body 110 on the body 110, so that the size of the end of the boss 120 away from the body 110 is smaller than the size of the end of the boss 120 close to the body 110, thereby facilitating the demolding operation and avoiding damage to the boss 120 during the demolding process, thereby improving the preparation convenience and reliability of the boss 120.

[0044] Continue reading Figure 1 , Figure 2 , Figure 3 as well as Figure 7Specifically, the side surface of the boss 120 that intersects with the surface of the body 110 is a smooth surface, so that the side surface of the boss 120 has a smooth transition, which can make it easier to separate during demolding, thereby making demolding more convenient and will not damage the boss 120.

[0045] Continue reading Figure 1 , Figure 2 as well as Figure 3 Specifically, the projection area of ​​the boss 120 on the main body 110 gradually decreases in the direction away from the main body 110, so that the outer contour of the boss 120 gradually decreases in the direction away from the main body 110, which can facilitate the separation between the blank and the mold after injection molding, thereby making demolding more convenient.

[0046] More specifically, the taper of the boss 120 can be 5°-10°. On the one hand, it can prevent the boss 120 from being too tapered, which may reduce the area of ​​the boss 120 used to carry the resistor layer 200, and at the same time prevent the boss 120 from being damaged, thereby improving the structural stability of the boss 120. On the other hand, it can prevent the boss 120 from being too tapered, which may cause inconvenience or damage to the boss 120 during demolding, thereby ensuring the convenience and reliability of the preparation of the boss 120. In one example, the taper of the boss 120 can be 5°, 5.5°, 6°, 6.5°, 7°, 7.5°, 8°, 8.5°, 9°, 9.5°, or 10°. Of course, the taper of the boss 120 is not limited to the above specific values, and can also be other values ​​within the range of 5°-10°.

[0047] In order to facilitate the preparation of the ceramic matrix 100, in a preferred embodiment, the ceramic matrix 100 can be a structural part formed by hot die casting and then sintering. Since hot die casting is a process of injecting ceramic slurry into a mold by pressure to plastically deform it into a desired shape, the ceramic matrix 100 after subsequent sintering has the advantages of high product density, stable quality, high efficiency, wide application range, and low cost. In the preparation process, first, by designing the injection mold, the injection mold has a cavity that matches the outer contour of the body 110 and the boss 120; secondly, adding ceramic slurry to the injection mold and forming a ceramic blank by hot die casting, at this time, the outer contour of the ceramic blank is consistent with the outer contour of the body 110 and the boss 120; then, the ceramic blank is sintered to form the ceramic matrix 100.

[0048] In order to facilitate the preparation of the resistance layer 200, in a preferred embodiment, the resistance layer 200 is a structural part that is sintered after screen printing. During the preparation process, first, the ceramic substrate 100 is fixed on a screen printing fixture, and a layer of metal resistance slurry is printed on the boss 120 using a screen printer. The metal resistance slurry will leave a resistance layer on the boss 120, and there will be no metal slurry residue on the main body 110; then, the ceramic substrate 100 with the resistance layer is sintered to obtain the ceramic atomization core 10.

[0049] In addition, the present application also provides an atomization device, which can be applied to various industries involving atomization, such as medicine, beauty, etc. The atomization device includes the ceramic atomization core 10 of any of the above technical solutions.

[0050] In the above-mentioned atomization device, the ceramic atomization core 10 has a height difference between the surface of the boss 120 away from the body 110 and the body 110 because the boss 120 protrudes from the surface of the body 110. The existence of this height difference prevents the resistance layer 200 from being formed on the surface of the body 110 during printing, but only on the surface of the boss 120 away from the body 110. At this time, the slurry for preparing the resistance layer 200 extends and covers the surface of the boss 120 away from the body 110, so that the edge of the resistance layer 200 is smooth, and there will be no arc and sharp bonding surface of the existing silk screen printing, which can avoid the core from being burnt due to concentrated heat, and the atomization effect is stable; and the atomization area in the ceramic atomization core 10 includes not only the surface of the boss 120 below the resistance layer 200 away from the body 110, but also the side surface where the boss 120 intersects with the body 110, so that the atomization area is larger and the atomization effect is better. Therefore, the atomization device with the ceramic atomization core 10 can reduce the atomization core burn and ensure the stable atomization effect.

[0051] The atomizing device of the prior art is compared with the atomizing device of the present application. Figure 8 As shown, in the prior art, the ceramic atomization core 01 includes a ceramic substrate 011 and a resistance layer 012. After the ceramic substrate 011 is formed by hot die casting, the electronic layer 012 is directly screen-printed on the surface of the ceramic substrate 011. Due to the thickness of the screen printing screen, the metal slurry will have an arc and a sharp bonding surface after screen printing. After the electronic layer 012 is sintered, the atomization area is small at the resistance layer 012 and the ceramic substrate 011. The specific comparison of the use experience of the atomization device is shown in Table 1.

[0052] Table 1

[0053]

[0054] As can be seen from Table 1 above, the resistance layer 200 in the atomizing device of the present application has significantly improved the printing yield rate compared with the prior art, and is close to 100%, so that the yield rate of the atomizing device is high and there are fewer defective products in the same batch. The atomizing device of the present application has greatly improved the atomization amount compared with the prior art, so as to improve the atomization effect and make the utilization rate of the atomizing medium higher. The atomizing device of the present application has greatly improved the atomization taste compared with the prior art, so as to improve the user experience.

[0055] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A ceramic atomizing core, characterized in that: It includes a ceramic substrate and a resistor layer, wherein: The ceramic substrate comprises a body and a boss protruding from the surface of the body, and the boss is adapted to the shape of the resistance layer; The resistance layer is printed and formed on the surface of the boss away from the body.

2. The ceramic atomizer core according to claim 1, characterized in that: The height of the boss relative to the body is less than or equal to 2.5 mm.

3. The ceramic atomizer core according to claim 1 or 2, characterized in that: The height of the boss relative to the body is greater than or equal to 1 mm.

4. The ceramic atomizer core according to claim 1, characterized in that: The projection of one end of the boss away from the body on the body falls within the projection contour of one end of the boss close to the body on the body.

5. The ceramic atomizer core according to claim 4, characterized in that: The side surface of the boss intersecting with the body surface is a smooth surface.

6. The ceramic atomizer core according to claim 4 or 5, characterized in that: The projection area of ​​the boss on the main body gradually decreases along a direction away from the main body.

7. The ceramic atomizer core according to claim 6, characterized in that: The taper of the boss is 5°-10°.

8. The ceramic atomizer core according to claim 1, characterized in that: The ceramic matrix is ​​a structural component formed by hot die casting and then sintering.

9. The ceramic atomizer core according to claim 1, characterized in that: The resistance layer is a structural component formed by sintering after screen printing.

10. An atomizing device, characterized in that: It comprises the ceramic atomization core as described in any one of claims 1 to 9.

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