Special-shaped flat plate coating jig

Abstract

The utility model relates to the technical field of coating machines and coating machine accessories, in particular to a special-shaped flat plate coating jig, which comprises a base, the coating platform deck is arranged at the top of the base and is suitable for placing a crystal silicon wafer; the positioning mechanism comprises four positioning modules, the four positioning modules are located on the periphery of the coating carrying table, each positioning module is connected to the base in a sliding mode in the direction perpendicular to the side wall of the coating carrying table, and the four positioning modules are suitable for clamping the crystal silicon wafer in a surrounding mode; and the height adjusting mechanism is arranged on the base, the adjusting end of the height adjusting mechanism is connected with the coating carrying table, and the height adjusting mechanism is suitable for adjusting the height of the coating carrying table. The technical problems that an existing platform can only be suitable for coating of crystal silicon wafers with the single thickness, and the application range is small are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of coating machines and coating machine accessories, in particular to a coating jig for a special-shaped flat plate. Background Art

[0002] At present, many new energy companies use crystalline silicon-perovskite tandem solar cells as the main technical route to build the next generation of "ultra-efficient + low-cost" photovoltaic technology that can significantly break through the theoretical limits of crystalline silicon solar cells and has the potential for large-scale application. Currently, many new energy companies have begun to deploy crystalline silicon tandem perovskite coating. In order to apply the slurry to the surface of the crystalline silicon wafer more evenly and accurately, the crystalline silicon wafer is usually placed on a flat marble platform or other planes with high flatness to ensure the uniformity of the coating, and then the substrate is adsorbed and fixed through the pores on the platform, and finally the slurry is applied to the surface of the crystalline silicon wafer through the die head.

[0003] In the related art, a pre-coating area module, a finishing module and two clamping modules are usually arranged on the peripheral side of the platform to enclose the four sides of the crystalline silicon wafer. In order to achieve a better coating effect, the upper surface of the crystalline silicon wafer usually needs to be flush with the upper surfaces of the pre-coating area module, the finishing module and the two clamping modules. However, the existing platform can only be used for coating crystalline silicon wafers of a single thickness, and the scope of application is relatively small. Utility Model Content

[0004] The utility model provides a special-shaped flat plate coating jig, which solves the technical problem that the existing platform can only be used for coating of crystalline silicon wafers of a single thickness and has a small application range.

[0005] In view of this, the utility model provides a special-shaped flat plate coating jig, comprising:

[0006] Base;

[0007] A coating stage, arranged on the top of the base, suitable for placing a crystalline silicon wafer;

[0008] A positioning mechanism, comprising four groups of positioning modules, the four groups of positioning modules are respectively located around the coating stage, and each group of positioning modules is slidably connected to the base in a direction perpendicular to the side wall of the coating stage, and the four groups of positioning modules are suitable for enclosing and clamping the silicon wafer;

[0009] A height adjustment mechanism is arranged on the base, and an adjustment end of the height adjustment mechanism is connected to the coating platform, and is suitable for adjusting the height of the coating platform.

[0010] Optionally, the height adjustment mechanism includes multiple groups of adjustment components, which are arranged at intervals around the circumference of the coating platform; each group of the adjustment components includes an adjustment wedge and a first driving member, and the inclined surface of the adjustment wedge abuts the bottom of the coating platform; the first driving member is fixedly arranged on the base, and the output end of the first driving member is connected to the adjustment wedge, suitable for driving the adjustment wedge away from or close to the coating platform; a plurality of connecting blocks are provided on the circumference of the coating platform, and the connecting blocks are connected to the base through limiting bolts; the limiting bolts can slidably pass through the connecting blocks in the vertical direction, and the bottom end of the limiting bolts is threadedly connected to the base.

[0011] Optionally, the first driving member includes a fixed block and a differential head, the fixed block is fixedly arranged on the base, the differential head is connected to the fixed block, and an output end of the differential head is connected to the adjusting wedge block;

[0012] And / or, a plurality of guide pins are provided on both sides of the adjusting wedge on the base, and the guide pins are fitted with the adjusting wedge and are suitable for limiting the movable direction of the adjusting wedge;

[0013] And / or, at least one limiting groove is provided on the adjusting wedge block along its movable direction, the limiting groove passes through the adjusting wedge block in a vertical direction, a limiting pin is provided in the limiting groove, and the limiting pin is fixedly connected to the base.

[0014] Optionally, the positioning module includes a compensation baffle and a second driving member; the compensation baffle is slidably connected to the base in a direction perpendicular to the side wall of the coating platform, and one end of the compensation baffle facing the coating platform is suitable for adapting and abutting against the peripheral side of the crystalline silicon wafer; the second driving member is fixedly arranged on the base, and the output end of the second driving member is drivingly connected to the compensation baffle, suitable for driving the compensation baffle to approach or move away from the coating platform; wherein the four compensation baffles are suitable for enclosing and clamping the crystalline silicon wafer.

[0015] Optionally, the positioning module further comprises at least one guide rail, the guide rail is arranged on the top of the base in a direction perpendicular to the side wall of the coating carrier, the compensation baffle is slidably connected to the guide rail via a slider; a stopper is provided at one end of the guide rail away from the coating carrier;

[0016] And / or, the positioning module further includes a buffer limit assembly, the buffer limit assembly includes a limit block, the limit block is fixedly arranged on the base, a buffer bolt is connected to the limit block in a direction perpendicular to the side wall of the coating carrier, and two buffer nuts are sleeved on the buffer bolt at intervals; the compensation baffle can be slidably sleeved on the buffer bolt through a limit portion, and the limit portion is located between the two buffer nuts;

[0017] And / or, a limiting plate is provided at the bottom of one end of the compensation baffle plate facing the coating carrier, and the limiting plate is suitable for abutting against the coating carrier for limiting.

[0018] Optionally, an inclined surface is provided at the bottom of one end of the compensation baffle plate facing the coating carrier, and the inclined surface is gradually inclined from top to bottom toward a side away from the coating carrier, and a plurality of first air holes are provided at intervals along the periphery of the compensation baffle plate on the inclined surface, and the first air holes are arranged horizontally; a plurality of first air path connectors connected to the first air holes are provided on the compensation baffle plate, and the first air path connectors are suitable for connecting to an external negative pressure device;

[0019] Optionally, one end of one of the compensation baffles facing the coating carrier is provided with a plurality of overflow slits, and the plurality of overflow slits are arranged at intervals along the periphery of the compensation baffle;

[0020] And / or, a cover plate is provided on the inclined surface, the cover plate is parallel to the inclined surface, and the cover plate covers the plurality of first air holes.

[0021] Optionally, a protrusion is extended from the circumference of the coating carrier, a waste liquid groove is recessed on the protrusion around the circumference of the coating carrier, a waste liquid port is provided in the waste liquid groove, and a drainage port connected to the waste liquid port is provided on the circumference of the protrusion.

[0022] Optionally, a cavity is provided in the coating platform, a plurality of second air holes connected to the cavity are provided on the top of the coating platform, a plurality of second air path connectors connected to the cavity are provided on the surrounding side of the coating platform, and the second air path connectors are suitable for connecting to an external negative pressure device to adsorb the crystalline silicon wafer through the second air holes.

[0023] Optionally, the coating platform includes a platform body and a sealing plate, the bottom of the platform body is concavely provided with a groove, the sealing plate is detachably connected to the bottom of the platform body, and the sealing plate and the groove enclose the cavity.

[0024] The technical solution of the utility model has the following advantages:

[0025] In the present invention, when coating is required, the crystalline silicon wafer is placed on the coating stage, and at the same time, each group of positioning modules is adjusted to slide toward the coating stage, so that the four groups of positioning modules enclose and clamp the crystalline silicon wafer, and play a certain sealing role on the peripheral side of the crystalline silicon wafer to prevent liquid from flowing to the side of the crystalline silicon wafer. At the same time, the four groups of positioning modules play a positioning role, and push the crystalline silicon wafer to adjust to a preset position, so that the fixed position of the crystalline silicon wafer is kept flush with the edge of the coating stage, so as to avoid the phenomenon of coating misalignment due to inaccurate positioning of the crystalline silicon wafer during the coating process. At the same time, the height of the coating stage can be adjusted according to the thickness of the different crystalline silicon wafers through the height adjustment mechanism, so as to facilitate the adjustment of the alignment of the crystalline silicon wafer with the positioning module, and at the same time, the upper surface of the crystalline silicon wafer is flush with the upper surface of the positioning module, and the edge of the crystalline silicon wafer is coated to compensate for the coating, so that the coating completely covers the surface of the crystalline silicon wafer, which increases the flexibility of adjustment, has a wider range of application, and can cope with a variety of working conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A top view of a special-shaped flat plate coating jig provided by the utility model;

[0028] Figure 2 A side view schematic diagram of the connection between the height adjustment mechanism provided by the utility model and the base;

[0029] Figure 3 for Figure 2 The enlarged view of point C in the figure;

[0030] Figure 4 A top view of the connection between the height adjustment mechanism provided by the utility model and the base;

[0031] Figure 5 for Figure 4 The enlarged view of point D in the figure;

[0032] Figure 6 This is a schematic diagram of the bottom-up structure of the positioning module provided by the utility model;

[0033] Figure 7 A top view of a positioning module provided with an overflow slit provided by the utility model;

[0034] Figure 8 for Figure 7 The cross-sectional view at EE in FIG.

[0035] Fig. 9 A structural view from another angle of the positioning module provided with an overflow slit provided by the utility model;

[0036] Fig.10 for Fig. 9 The sectional view at FF in FIG.

[0037] Fig.11 for Figure 1 The cross-sectional view at BB in FIG.

[0038] Fig.12 for Fig.11 The enlarged view of G in the figure;

[0039] Fig.13 for Figure 1 Sectional view at AA in the figure;

[0040] Fig.14 for Figure 1 Sectional view at point HH in FIG.

[0041] Description of reference numerals:

[0042] 1. Base; 2. Coating carrier; 3. Sealing strip; 4. Height adjustment mechanism; 401. Adjusting wedge; 402. Connecting block; 403. Limiting bolt; 404. Fixing block; 405. Differential head; 406. Guide pin; 407. Limiting groove; 408. Limiting pin; 5. Positioning module; 501. Compensating baffle; 502. Second driving member; 503. Guide rail; 504. Slider; 505. Block; 506. Limiting block; 507. Buffering bolt; 508. Buffering nut; 509. Limiting part; 510. Limiting plate; 511. First air hole; 512. First air path connector; 513. Overflow slit; 514. Cover plate; 6. Waste liquid tank; 7. Waste liquid outlet; 8. Drain port; 9. Cavity; 10. Second air hole; 11. Second air path connector; 12. Sealing plate. DETAILED DESCRIPTION

[0043] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0044] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0045] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0047] Example 1

[0048] See also Figures 1 to 14 The present embodiment provides a special-shaped flat plate coating fixture, comprising: a base 1; a coating platform 2, which is arranged on the top of the base 1 and is suitable for placing a crystalline silicon wafer; a positioning mechanism, comprising four groups of positioning modules 5, the four groups of positioning modules 5 are respectively located around the coating platform 2, and each group of positioning modules 5 is slidably connected to the base 1 in a direction perpendicular to the side wall of the coating platform 2, and the four groups of positioning modules 5 are suitable for enclosing and clamping the crystalline silicon wafer; a height adjustment mechanism 4, which is arranged on the base 1, and the adjustment end of the height adjustment mechanism 4 is connected to the coating platform 2, and is suitable for adjusting the height of the coating platform 2.

[0049] It should be noted that the cross section of the coating platform 2 is rectangular, that is, the four groups of positioning modules 5 are symmetrically arranged in a cross shape.

[0050] In the present embodiment, when coating is required, the crystalline silicon wafer is placed on the coating carrier 2, and at the same time, each group of positioning modules 5 is adjusted to slide toward the coating carrier 2, so that the four groups of positioning modules 5 enclose and clamp the crystalline silicon wafer, and play a certain sealing role on the peripheral side of the crystalline silicon wafer to prevent the liquid from flowing to the side of the crystalline silicon wafer. At the same time, the four groups of positioning modules 5 play a positioning role, and push the crystalline silicon wafer to be adjusted to a preset position, so that the fixed position of the crystalline silicon wafer is kept flush with the edge of the coating carrier 2, so as to avoid the phenomenon of coating misalignment caused by inaccurate positioning of the crystalline silicon wafer during the coating process. At the same time, the height of the coating carrier 2 can be adjusted by the height adjustment mechanism 4 according to the thickness of the different crystalline silicon wafers, so as to facilitate the adjustment of the alignment of the crystalline silicon wafer with the positioning module 5, and at the same time, the upper surface of the crystalline silicon wafer is flush with the upper surface of the positioning module 5, and the edge of the crystalline silicon wafer is coated so that the coating completely covers the surface of the crystalline silicon wafer, which increases the flexibility of adjustment, has a wider range of application, and can cope with a variety of working conditions.

[0051] Example 2

[0052] As a further improvement to Example 1, Figures 1 to 5 As shown, the height adjustment mechanism 4 includes a plurality of adjustment components, which are arranged at intervals around the circumference of the coating platform 2; each group of adjustment components includes an adjustment wedge 401 and a first driving member, and the inclined surface of the adjustment wedge 401 abuts against the bottom of the coating platform 2; the first driving member is fixedly arranged on the base 1, and the output end of the first driving member is connected to the adjustment wedge 401, suitable for driving the adjustment wedge 401 away from or close to the coating platform 2; a plurality of connecting blocks 402 are provided on the circumference of the coating platform 2, and the connecting blocks 402 are connected to the base 1 through limiting bolts 403; the limiting bolts 403 can slide through the connecting blocks 402 in the vertical direction, and the bottom end of the limiting bolts 403 is threadedly connected to the base 1.

[0053] In this embodiment, by evenly arranging multiple groups of adjustment components on the circumference of the coating platform 2, it is convenient to adjust the height of the coating platform 2. The adjusting wedge block 401 is driven by the first driving member to move toward the coating platform 2, and the adjusting wedge block 401 is always against the coating platform 2. At the same time, the limiting bolt 403 is rotated to rise so that the coating platform 2 has space for movement to rise. The coating platform 2 moves in the vertical direction under the limiting action of the limiting bolt 403, thereby achieving the effect of adjusting the coating platform 2 to rise. Conversely, the adjusting wedge block 401 is driven by the first driving member to move away from the coating platform 2, and the adjusting wedge block 401 is always against the coating platform 2. At the same time, the coating platform 2 descends in the vertical direction under the limiting action of the limiting bolt 403, thereby achieving the effect of adjusting the coating platform 2 to descend. After the height of the coating platform 2 is adjusted, the limiting bolt 403 can be tightened to fix the coating platform 2 to improve stability.

[0054] Based on the above implementation, in a preferred implementation, Figure 2 and Figure 3 As shown, the first driving member includes a fixed block 404 and a differential head 405 . The fixed block 404 is fixedly disposed on the base 1 . The differential head 405 is connected to the fixed block 404 , and an output end of the differential head 405 is connected to the adjusting wedge 401 .

[0055] In this embodiment, the differential head 405 is fixed on the base 1 by the fixing block 404, and the movement of the adjusting wedge 401 is adjusted by the differential head 405 to adjust the height of the coating carrier 2. The adjustment accuracy can be improved by the differential head 405, so as to facilitate the adjustment of the upper surface of the silicon wafer with different thicknesses to be flush with the upper surface of the positioning module 5.

[0056] Based on the above implementation, in a preferred implementation, Figures 2 to 5 As shown, a plurality of guide pins 406 are provided on both sides of the adjusting wedge block 401 on the base 1 , and the guide pins 406 fit in with the adjusting wedge block 401 , and are suitable for limiting the movable direction of the adjusting wedge block 401 .

[0057] It should be noted that the guide pins 406 are located on both sides of the movable direction of the adjusting wedge block 401 .

[0058] In this embodiment, guide pins 406 are provided on both sides of the adjusting wedge block 401 to limit the movable direction of the adjusting wedge block 401, thereby playing a guiding role, improving the stability of the adjusting wedge block 401 during movement, and avoiding deviation and affecting the adjustment accuracy.

[0059] Based on the above implementation, in a preferred implementation, Figure 4 and Figure 5 As shown, at least one limiting groove 407 is provided on the adjusting wedge block 401 along its movable direction, the limiting groove 407 penetrates the adjusting wedge block 401 along the vertical direction, a limiting pin 408 is provided in the limiting groove 407, and the limiting pin 408 is fixedly connected to the base 1.

[0060] In this embodiment, a limiting groove 407 is provided on the adjusting wedge block 401 and a limiting pin 408 is arranged in the limiting groove 407, which plays a guiding role as well as a limiting role to prevent the adjusting wedge block 401 from moving too far.

[0061] Specifically, Figures 2 to 3As shown, the adjusting wedge block 401 corresponds to the connecting block 402 one by one, and the adjusting wedge block 401 is arranged at the bottom of the connecting block 402. The adjusting wedge block 401 and the connecting block 402 cooperate to adjust the height of the coating carrier 2. The bottom of the connecting block 402 is provided with an inclined structure corresponding to the inclined surface of the adjusting wedge block 401, and the inclined structure is adapted to the inclined surface of the adjusting wedge block 401 to improve the smoothness of the adjustment.

[0062] In one embodiment, if Figure 1 , Figure 2 and Figure 4 As shown, the number of adjustment components is four, two adjustment components form a group and the two groups of adjustment components are symmetrically arranged on both sides of the coating platform 2, wherein the adjustment wedge 401 moves in a direction perpendicular to the side wall of the coating platform 2. The uniform arrangement of multiple groups of adjustment components improves the adjustment accuracy and stability during the adjustment process.

[0063] As a convertible embodiment, the height adjustment mechanism 4 may be a hydraulic cylinder, which is located at the bottom of the coating platform 2, and the output end of the hydraulic cylinder is connected to the coating platform 2 in the vertical direction, suitable for driving the coating platform 2 to move in the vertical direction to adjust the height.

[0064] Based on the above implementation, in a preferred implementation, Figure 1 and Figure 6 As shown, the positioning module 5 includes a compensation baffle 501 and a second driving member 502; the compensation baffle 501 is slidably connected to the base 1 in a direction perpendicular to the side wall of the coating platform 2, and the end of the compensation baffle 501 facing the coating platform 2 is suitable for adapting and abutting against the peripheral side of the crystalline silicon wafer; the second driving member 502 is fixedly arranged on the base 1, and the output end of the second driving member 502 is drivingly connected to the compensation baffle 501, suitable for driving the compensation baffle 501 to approach or move away from the coating platform 2; wherein the four compensation baffles 501 are suitable for enclosing and clamping the crystalline silicon wafer.

[0065] It should be noted that the upper surface of the crystalline silicon wafer is flush with the upper surface of the compensation baffle 501 .

[0066] In this embodiment, the compensation baffle 501 is driven to slide on the base 1 by the second driving member 502, and the four compensation baffles 501 are surrounded on the peripheral side of the crystalline silicon wafer to compensate for the edge of the crystalline silicon wafer to prevent the coating slurry liquid from flowing to the back of the crystalline silicon wafer, thereby ensuring that the coating completely covers the surface of the crystalline silicon wafer. At the same time, the compensation baffle 501 cooperates to adjust the horizontal position of the crystalline silicon wafer in four directions, so that the fixed position of the crystalline silicon wafer remains flush with the edge of the coating carrier 2, thereby avoiding the phenomenon of coating misalignment due to inaccurate positioning of the crystalline silicon wafer during the coating process.

[0067] Specifically, the second driving member 502 is a cylinder.

[0068] As a convertible implementation, the second driving member 502 may also be a linear driving motor.

[0069] Based on the above implementation, in a preferred implementation, Figure 6 and Figure 7 As shown, the positioning module 5 also includes at least one guide rail 503, which is arranged on the top of the base 1 in a direction perpendicular to the side wall of the coating carrier 2, and the compensation baffle 501 is slidably connected to the guide rail 503 through a slider 504; a stop block 505 is provided at one end of the guide rail 503 away from the coating carrier 2.

[0070] In this embodiment, the compensation baffle 501 moves on the guide rail 503 via the slider 504 to improve stability, and is limited by the stopper 505 provided on the guide rail 503 to avoid excessive movement and separation from the guide rail 503.

[0071] In one embodiment, the number of the guide rails 503 is two, and they are symmetrically arranged at the bottom of the compensation baffle 501 . The stability is further improved by arranging two sets of guide rails 503 .

[0072] Based on the above implementation, in a preferred implementation, Figure 6 and Figure 7 As shown, the positioning module 5 also includes a buffer limit assembly, which includes a limit block 506, which is fixed on the base 1, and a buffer bolt 507 is connected to the limit block 506 in a direction perpendicular to the side wall of the coating carrier 2, and two buffer nuts 508 are spaced apart on the buffer bolt 507; the compensation baffle 501 can be slidably mounted on the buffer bolt 507 through a limit portion 509, and the limit portion 509 is located between the two buffer nuts 508.

[0073] It should be noted that the buffer nut 508 is threadedly connected to the buffer bolt 507 .

[0074] In this embodiment, when the compensation baffle 501 moves, it drives the limiting part 509 to move on the buffer bolt 507. At the same time, the limiting part 509 is limited by two buffer nuts 508 when moving, so as to avoid damaging the silicon wafer due to excessive movement distance or abutting and interfering with other compensation baffles 501. Since the buffer nut 508 is threadedly connected with the buffer bolt 507, when the limiting part 509 abuts against the buffer nut 508, the thrust of the limiting part 509 on the buffer nut 508 will be converted into the rotational force of the buffer nut 508 on the buffer bolt 507, thereby having a buffering effect.

[0075] Specifically, the number of the buffer limit assemblies is two, and they are symmetrically arranged on both sides of the compensation baffle 501 to further enhance stability.

[0076] Based on the above implementation, in a preferred implementation, Figure 3 , Figure 8 and Fig.12 As shown, a limiting plate 510 is provided at the bottom of one end of the compensation baffle 501 facing the coating carrier 2 , and the limiting plate 510 is suitable for abutting against the coating carrier 2 for limiting.

[0077] In this embodiment, when the compensation baffle 501 slides toward one side of the coating platform 2 to reach the preset position, the limiting plate 510 at the bottom abuts against the side wall of the coating platform 2 for limitation, thereby preventing the compensation baffle 501 from further moving to damage the silicon wafer or abutting and interfering with other compensation baffles 501.

[0078] Based on the above implementation, in a preferred implementation, Figures 8 to 12 As shown, an inclined surface is provided at the bottom of one end of the compensation baffle 501 facing the coating platform 2, and the inclined surface gradually inclines from top to bottom toward the side away from the coating platform 2, and a plurality of first air holes 511 are provided at intervals along the periphery of the compensation baffle 501 on the inclined surface, and the first air holes 511 are arranged horizontally; a plurality of first air path connectors 512 connected to the first air holes 511 are provided on the compensation baffle 501, and the first air path connector 512 is suitable for connecting an external negative pressure device.

[0079] In the present embodiment, an inclined surface is provided on the compensation baffle 501, and a first air opening is provided on the inclined surface. The first air hole 511 is connected to an external negative pressure device through a first air path connector 512. When coating is performed, air is drawn through the external negative pressure device to form suction on one side of the inclined surface. Under the action of the suction, the liquid that has leaked between the crystalline silicon wafer and the compensation baffle 501 flows toward the side with the inclined surface, thereby preventing the liquid from flowing to the back side of the crystalline silicon wafer and improving the coating effect.

[0080] Based on the above implementation, in a preferred implementation, Figures 7 to 10 As shown, a plurality of overflow slits 513 are formed at one end of one of the compensation baffles 501 facing the coating carrier 2 , and the plurality of overflow slits 513 are arranged at intervals along the periphery of the compensation baffle 501 .

[0081] It should be noted that one side of the compensation baffle 501 provided with the overflow slit 513 is the starting position of the coating die head advancing direction.

[0082] In this embodiment, when coating is performed, in order to achieve a full coating effect, it is usually necessary to pre-spray the coating die head when it reaches the crystalline silicon wafer, that is, the coating starting position is located on the compensation baffle 501. In order to prevent the liquid remaining on the compensation baffle 501 from flowing to the back of the crystalline silicon wafer, the liquid remaining on the compensation baffle 501 flows into the bottom of the compensation baffle 501 through the overflow slit 513, and the liquid is drained to one side of the compensation baffle 501 through the adsorption force generated by the first air hole 511.

[0083] Based on the above implementation, in a preferred implementation, Fig.12 As shown, a cover plate 514 is disposed on the inclined surface. The cover plate 514 is parallel to the inclined surface and covers the plurality of first air holes 511 .

[0084] In this embodiment, since the junction between the crystalline silicon wafer and the compensation baffle 501 is located obliquely above the inclined surface, and the adsorption force generated by the first air hole 511 is directed in the horizontal direction, the cover plate 514 is provided so that the adsorption force generated by the first air hole 511 is inclined toward the junction between the crystalline silicon wafer and the compensation baffle 501 to improve the adsorption effect on the liquid, improve the drainage effect, and prevent the liquid from flowing to the back of the crystalline silicon wafer.

[0085] Specifically, the bottom and both sides of the cover plate 514 are sealed from the inclined surface to improve the adsorption effect.

[0086] On the basis of the above-mentioned embodiment, in a preferred embodiment, a protrusion is extended on the peripheral side of the coating platform 2, a waste liquid tank 6 is recessed around the peripheral side of the coating platform 2 on the protrusion, a waste liquid port 7 is provided in the waste liquid tank 6, and a discharge port 8 connected to the waste liquid port 7 is provided on the peripheral side of the protrusion.

[0087] It should be noted that the position of the waste liquid tank 6 corresponds to the junction of the silicon wafer and the compensation baffle 501 .

[0088] In this embodiment, a waste liquid tank 6 is provided on the peripheral side of the coating carrier 2 to collect the liquid leaked during the coating process, and discharge it to the drain port 8 through the waste liquid port 7, and then connect to external equipment for recycling and processing to avoid polluting the equipment.

[0089] Specifically, the connection block 402 is provided on the peripheral side of the protruding portion.

[0090] Based on the above implementation, in a preferred implementation, Fig.13 and Fig.14 As shown, a cavity 9 is provided in the coating platform 2, a plurality of second air holes 10 connected to the cavity 9 are provided on the top of the coating platform 2, a plurality of second air path connectors 11 connected to the cavity 9 are provided on the peripheral side of the coating platform 2, and the second air path connectors 11 are suitable for connecting to an external negative pressure device to adsorb the silicon wafers through the second air holes 10.

[0091] In this embodiment, after the crystalline silicon wafer is positioned on the coating carrier 2, negative pressure is provided by an external negative pressure device, and at the same time, the cavity 9 and the second air hole 10 are connected through the second air path connector 11 to generate negative pressure, which has an adsorption effect on the crystalline silicon wafer, fixes it on the coating carrier 2, and improves stability.

[0092] Based on the above implementation, in a preferred implementation, Fig.13 and Fig.14 As shown, the coating platform 2 includes a platform body and a sealing plate 12 . A groove is concavely provided at the bottom of the platform body. The sealing plate 12 is detachably connected to the bottom of the platform body. The sealing plate 12 and the groove enclose a cavity 9 .

[0093] In this embodiment, the sealing plate 12 and the stage body are used to enclose a cavity 9, which is convenient for installation and disassembly and for cleaning.

[0094] Specifically, a sealing strip 3 is provided at the bottom of the carrier body at the periphery of the groove to improve the sealing performance.

[0095] The working principle of the special-shaped flat plate coating fixture provided in this embodiment is as follows: first, a crystalline silicon wafer is placed on the coating carrier 2, and according to the thickness of the crystalline silicon wafer, the adjusting wedge 401 is adjusted by the differential head 405 to cooperate with the connecting block 402 to adjust the height of the coating carrier 2, so that the upper surface of the crystalline silicon wafer is flush with the upper surface of the compensation block 505, and then the four compensation blocks 505 are driven by the second driving member 502 to slide toward the crystalline silicon wafer until they stop moving under the action of the limit plate 510 and the buffer limit assembly. At this time, the four compensation baffles 501 are enclosed at the periphery of the crystalline silicon wafer, and the crystalline silicon wafer is positioned to the preset position at the same time. At the same time, the negative pressure device is used to make the second air hole 10 generate suction to fix the crystalline silicon wafer, and then the coating die head uses the side of the compensation baffle 501 provided with the overflow slit 513 as the coating starting position to coat the crystalline silicon wafer, and the coating direction is as follows: Figure 1 As shown, during the coating process, the liquid leaking between the crystalline silicon wafer and the compensation baffle 501 is drained toward one side of the compensation baffle 501 under the adsorption force generated by the first air hole 511, and the liquid remaining on the compensation baffle 501 at the initial coating position is drained toward one side of the compensation baffle 501 under the adsorption force after passing through the overflow slit 513, avoiding flowing to the back of the crystalline silicon wafer. In addition, the leaked liquid is discharged through the waste liquid port 7 of the waste liquid tank 6. The technical problem that the existing platform can only be applied to the coating of crystalline silicon wafers of a single thickness and has a small application range is solved.

[0096] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.

Claims

1. A coating jig for a special-shaped flat plate, characterized in that: include: Base (1); A coating carrier (2) is arranged on the top of the base (1) and is suitable for placing a crystalline silicon wafer; A positioning mechanism, comprising four groups of positioning modules (5), the four groups of positioning modules (5) being respectively located around the coating platform (2), and each group of positioning modules (5) being slidably connected to the base (1) in a direction perpendicular to the side wall of the coating platform (2), and the four groups of positioning modules (5) being suitable for enclosing and clamping the silicon wafer; A height adjustment mechanism (4) is arranged on the base (1), and an adjustment end of the height adjustment mechanism (4) is connected to the coating carrier (2) and is suitable for adjusting the height of the coating carrier (2).

2. The special-shaped flat plate coating jig according to claim 1, characterized in that: The height adjustment mechanism (4) comprises a plurality of adjustment components, which are arranged at intervals around the circumference of the coating platform (2); each group of the adjustment components comprises an adjustment wedge (401) and a first driving member, the inclined surface of the adjustment wedge (401) abuts against the bottom of the coating platform (2); the first driving member is fixedly arranged on the base (1), and the output end of the first driving member is connected to the adjustment wedge (401), suitable for driving the adjustment wedge (401) away from or close to the coating platform (2); a plurality of connecting blocks (402) are provided on the circumference of the coating platform (2), and the connecting blocks (402) are connected to the base (1) through limiting bolts (403); the limiting bolts (403) can slide through the connecting blocks (402) in the vertical direction, and the bottom ends of the limiting bolts (403) are threadedly connected to the base (1).

3. The special-shaped flat plate coating jig according to claim 2, characterized in that: The first driving member comprises a fixed block (404) and a differential head (405), wherein the fixed block (404) is fixedly arranged on the base (1), the differential head (405) is connected to the fixed block (404), and an output end of the differential head (405) is connected to the adjusting wedge block (401); And / or, a plurality of guide pins (406) are provided on both sides of the adjusting wedge block (401) on the base (1), and the guide pins (406) are fitted with the adjusting wedge block (401) and are suitable for limiting the movable direction of the adjusting wedge block (401); And / or, at least one limiting groove (407) is provided on the adjusting wedge block (401) along its movable direction, the limiting groove (407) passes through the adjusting wedge block (401) in the vertical direction, a limiting pin (408) is provided in the limiting groove (407), and the limiting pin (408) is fixedly connected to the base (1).

4. The special-shaped flat plate coating jig according to any one of claims 1 to 3, characterized in that: The positioning module (5) comprises a compensation baffle (501) and a second driving member (502); the compensation baffle (501) is slidably connected to the base (1) in a direction perpendicular to the side wall of the coating carrier (2), and one end of the compensation baffle (501) facing the coating carrier (2) is suitable for matching and abutting against the peripheral side of the crystalline silicon wafer; the second driving member (502) is fixedly arranged on the base (1), and the output end of the second driving member (502) is drivingly connected to the compensation baffle (501), suitable for driving the compensation baffle (501) to approach or move away from the coating carrier (2); wherein four compensation baffles (501) are suitable for enclosing and clamping the crystalline silicon wafer.

5. The special-shaped flat plate coating jig according to claim 4, characterized in that: The positioning module (5) further comprises at least one guide rail (503), wherein the guide rail (503) is arranged on the top of the base (1) in a direction perpendicular to the side wall of the coating carrier (2), and the compensation baffle (501) is slidably connected to the guide rail (503) via a slider (504); a stopper (505) is provided at one end of the guide rail (503) away from the coating carrier (2); And / or, the positioning module (5) further comprises a buffer limit assembly, the buffer limit assembly comprising a limit block (506), the limit block (506) being fixedly arranged on the base (1), the limit block (506) being connected with a buffer bolt (507) in a direction perpendicular to the side wall of the coating carrier (2), the buffer bolt (507) being sleeved with two buffer nuts (508) at intervals; the compensation baffle (501) is slidably sleeved on the buffer bolt (507) via a limit portion (509), and the limit portion (509) is located between the two buffer nuts (508); And / or, a limiting plate (510) is provided at the bottom of one end of the compensation baffle (501) facing the coating carrier (2), and the limiting plate (510) is suitable for abutting against the coating carrier (2) for limiting.

6. The coating jig for special-shaped flat plates according to claim 4, characterized in that: The bottom of one end of the compensation baffle (501) facing the coating platform (2) is provided with an inclined surface, and the inclined surface is gradually inclined from top to bottom toward the side away from the coating platform (2), and a plurality of first air holes (511) are provided on the inclined surface along the periphery of the compensation baffle (501), and the first air holes (511) are arranged horizontally; the compensation baffle (501) is provided with a plurality of first air path connectors (512) connected to the first air holes (511), and the first air path connectors (512) are suitable for connecting to an external negative pressure device.

7. The coating jig for special-shaped flat plates according to claim 6, characterized in that: One end of one of the compensation baffles (501) facing the coating carrier (2) is provided with a plurality of overflow slits (513), and the plurality of overflow slits (513) are arranged at intervals along the periphery of the compensation baffle (501); And / or, a cover plate (514) is provided on the inclined surface, the cover plate (514) is parallel to the inclined surface, and the cover plate (514) covers the plurality of first air holes (511).

8. The special-shaped flat plate coating jig according to claim 1, characterized in that: A protrusion is extended on the circumferential side of the coating carrier (2), a waste liquid tank (6) is recessed on the protrusion around the circumferential side of the coating carrier (2), a waste liquid port (7) is provided in the waste liquid tank (6), and a liquid discharge port (8) connected to the waste liquid port (7) is provided on the circumferential side of the protrusion.

9. The special-shaped flat plate coating jig according to claim 1, characterized in that: The coating platform (2) is provided with a cavity (9) inside, the top of the coating platform (2) is provided with a plurality of second air holes (10) connected to the cavity (9), the peripheral side of the coating platform (2) is provided with a plurality of second air path connectors (11) connected to the cavity (9), and the second air path connectors (11) are suitable for connecting to an external negative pressure device to adsorb the crystalline silicon wafer through the second air holes (10).

10. The coating jig for special-shaped flat plates according to claim 9, characterized in that: The coating platform (2) comprises a platform body and a sealing plate (12); a groove is concavely provided at the bottom of the platform body; the sealing plate (12) is detachably connected to the bottom of the platform body; the sealing plate (12) and the groove enclose the cavity (9).

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