Optical emission assembly and optical module

Abstract

The utility model discloses a light emitting assembly and an optical module. The light emitting assembly comprises a light emitter, a photonic integrated chip, and two isolators which are respectively located in a light incoming path and a light outgoing path of the photonic integrated chip. The light emitting assembly further comprises a magnetic field generating piece which provides a magnetic field for the two isolators at the same time, and the light propagation directions of the two isolators conform to the magnetic field direction of the magnetic field generating piece. Therefore, for the two isolators in the incident light path and the emergent light path of the photonic integrated chip, the same magnetic field generator is adopted to provide the required magnetic field, the two isolators are simple to install and accurate and easy to position, and can be accurately installed on an ideal optical axis, so that the optical path of the photonic integrated chip can be accurately adjusted. And the normal functions of the two isolators can easily meet the design target and cannot be influenced by magnetic field interference.

Description

Technical Field

[0001] The utility model belongs to the technical field of optical communication element manufacturing, and specifically relates to an optical emission component and an optical module. Background Art

[0002] Optical communication technology has advantages such as large bandwidth and low loss. The optical module used to achieve optical / electrical conversion is the core device of optical communication. In recent years, silicon-based optoelectronic devices and integration technologies based on silicon materials have attracted much attention in the industry due to their outstanding advantages such as low power consumption, high speed and small size.

[0003] For the optical transmitter of the optical module, in order to ensure low return loss, isolators are usually set on both the light input side and the light output side of the silicon-based photonic integrated circuit (PIC). Because the isolator must be used with a magnetic field to ensure its normal function, the optical transmitter must be equipped with at least two magnetic field generating components, one of which is equipped with an isolator on the light input side of the PIC, and the other is equipped with an isolator on the light output side of the PIC.

[0004] Thus, on the one hand, in the assembly and production of the optical module, due to the magnetic force (such as magnetic attraction and magnetic repulsion) between the two magnetic field generating components, the installation of a magnetic field generating component installed later is difficult and difficult to install accurately, and it is very easy to cause installation misalignment, which in turn affects the isolator carried by the magnetic field generating component to deviate from the optical axis; on the other hand, due to the different light propagation directions of the isolator on the light input side of the PIC and the isolator on the light output side of the PIC, the magnetic fields of the two magnetic field generating components inevitably interfere with each other, making it difficult for the normal functions of the two isolators to achieve the design goals. Utility Model Content

[0005] In order to solve the problem faced by the prior art that isolators are provided on both the light input side and the light output side of the PIC, the purpose of the utility model is to provide a light emitting component and an optical module.

[0006] To achieve the above object, an embodiment provides a light emitting assembly. The light emitting assembly includes a light emitter, a photon integrated chip, and two isolators respectively located in the light input path and the light output path of the photon integrated chip, and the light emitting assembly also includes:

[0007] A magnetic field generating element provides a magnetic field for the two isolators simultaneously, and the light propagation directions of the two isolators respectively conform to the magnetic field directions of the magnetic field generating element.

[0008] In one embodiment, the photonic integrated chip comprises a first side and a second side adjacent to each other, the two isolators are respectively arranged at the first side and the second side, and the magnetic force generated by the magnetic field generating element on the two isolators is different in magnitude.

[0009] In one embodiment, the light propagation directions of the two isolators are respectively consistent with the magnetic field direction of the magnetic field generating element or are at an acute angle within 25°.

[0010] In one embodiment, the propagation directions of light passing through the two isolators are different.

[0011] In one embodiment, the magnetic field generating element is configured as an integrated magnetic block, or is configured as an integrated body formed by fixedly assembling a plurality of integrated magnetic blocks.

[0012] In one embodiment, the magnetic field generating element is disposed on one side of the photonic integrated chip;

[0013] One of the two isolators is arranged at a distance from the magnetic field generating element on the side of the photon integrated chip, and constitutes a side isolator;

[0014] Another isolator is fixed to one side of the magnetic field generating element in the thickness direction, and constitutes a top isolator;

[0015] The thickness direction is parallel to the thickness direction of the photonic integrated chip, and is perpendicular to the directions of the light-incoming optical path and the light-outgoing optical path of the photonic integrated chip.

[0016] In one embodiment, the saturation magnetic field strength of the side isolator does not exceed 200 Oe, and / or the side isolator is configured as a GSF type isolator and the top isolator is configured as a GTD type isolator.

[0017] In one embodiment, the distance between the side isolator and the magnetic field generating element does not exceed 0.6 mm.

[0018] In one embodiment, the magnetic field generating element comprises:

[0019] An installation area, on which the overhead isolator is fixedly installed; and

[0020] The extension area is integrally connected with the installation area, and the two are arranged side by side along the light propagation direction of the side isolator. The side isolator and the extension area are overlapped and arranged in a direction perpendicular to the light propagation direction of the side isolator.

[0021] In one embodiment, the installation area has an installation groove recessed along the thickness direction, and the top isolator is installed in the installation groove;

[0022] The side isolator is installed on the non-magnetic pad, and the bottom surface of the magnetic field generating element is not higher than the bottom of the side isolator, and the top surface of the magnetic field generating element is not lower than the top surface of the side isolator.

[0023] In one embodiment, the photonic integrated chip has a first side and a second side that are perpendicular to each other, and one of the first side and the second side is provided with a light entrance, and the other is provided with a light exit;

[0024] The installation area and the top isolator are arranged at the light entrance, the extension area extends along the first side and exceeds the second side, and the side isolator is arranged at the light exit.

[0025] In one embodiment, the optical transmission assembly further includes a circuit board, an optical transmitter electrically connected to the circuit board, and an optical fiber;

[0026] The optical transmitter converts the electrical signal received from the circuit board into an optical signal and outputs the optical signal. The optical signal passes through the top isolator, the photonic integrated chip, and the side isolator in sequence and then propagates toward the optical fiber.

[0027] To achieve the above object, an embodiment provides an optical module. The optical module includes the optical emitting component.

[0028] Compared with the commonly used technology, the beneficial effects of the present invention are at least that: for the two isolators in the light input path and the light output path of the photonic integrated chip, the same magnetic field generating element is used to provide the required magnetic field, thereby avoiding the problems of difficult installation and easy misalignment of installation caused by the magnetic force between the two magnetic field generating elements in the conventional technology; the installation of the two isolators is simple, the positioning is accurate and easy, and both can be accurately installed on the ideal optical axis; in addition, the magnetic field interference problem caused by the existence of two magnetic field generating elements in the conventional technology can also be solved, so that the normal functions of the two isolators can easily meet the design goals and will not be affected by the magnetic field interference. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a schematic diagram of the three-dimensional structure of a light emitting component in one embodiment of the present application;

[0030] Figure 2 is a schematic diagram of the three-dimensional structure of a magnetic field generating element and two isolators in one embodiment of the present application, wherein a magnetic field schematic diagram of the magnetic field generating element is also depicted;

[0031] Figure 3 is a top view of a light emitting assembly in one embodiment of the present application;

[0032] Figure 4 is along Figure 3 Section view along line AA;

[0033] Figure 5 is along Figure 3 Section view along line BB. DETAILED DESCRIPTION

[0034] The present invention will be described in detail below in conjunction with the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present application, and any structural, methodological, or functional changes made by a person skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0035] See also Figures 1 to 5 , an embodiment of the present invention provides a light emitting component 100 .

[0036] Basically, the optical transmitter assembly 100 includes a circuit board and an optical transmitter 10. The optical transmitter 10 is electrically connected to the circuit board to receive an electrical signal from the circuit board, and the optical transmitter 10 can convert the electrical signal received from the circuit board into an optical signal and output the optical signal. In a specific embodiment, the optical transmitter 10 can be configured as a semiconductor laser, specifically a distributed feedback laser (Distributed-feedback laser, referred to as DFB-LD), or an electro-absorption modulated laser (Electro-absorption Modulated Laser, referred to as EML), and of course it can also be implemented as other optical transmitters known in the art.

[0037] Ginseng Figure 1 , the optical transmitter assembly 100 further includes a photon integrated chip 40, an isolator 30 located in the light path of the photon integrated chip 40, and an isolator 50 located in the light path of the light outgoing from the photon integrated chip 40. That is, from the perspective of optical signal propagation, the isolator 30 is located before the photon integrated chip 40, and the optical signal output by the optical transmitter 10 first passes through the isolator 30 and then enters the photon integrated chip 40; on the contrary, the isolator 50 is located after the photon integrated chip 40, and the optical signal passes through the isolator 50 after leaving the photon integrated chip 40.

[0038] As mentioned in the background art, both the isolator 30 and the isolator 50 must be used with a magnetic field to ensure their respective normal functions. In conventional techniques, each isolator is equipped with a separate magnetic field generating component, which causes installation difficulties and magnetic field interference problems.

[0039] In order to overcome this technical problem, in one embodiment, the optical emission assembly 100 further includes a magnetic field generator 80. The magnetic field generator 80 provides the isolator 30 and the isolator 50 with the magnetic fields they need at the same time; and the light propagation direction t3 of the isolator 30 and the light propagation direction t5 of the isolator 50 respectively conform to the magnetic field direction of the magnetic field generator 80.

[0040] Thus, an optical transmission component 100 of one embodiment is provided with a common magnetic field generating element 80, which is used to simultaneously provide the required magnetic field for the two isolators in the input / output optical path of the photonic integrated chip 40. In this way, the problem of difficult installation and easy misalignment installation caused by the magnetic force between the two magnetic field generating elements in conventional technology can be solved; the installation of the isolator 30 and the isolator 50 is simple, the positioning is accurate and easy, and both can be accurately installed on the ideal optical axis; in addition, the magnetic field interference problem caused by the two magnetic field generating elements in conventional technology can also be solved, so that the normal functions of the isolator 30 and the isolator 50 can easily meet the design goals and will not be affected by the magnetic field interference.

[0041] Further, Figure 1 and Figure 2 , the light propagation direction t3 of the isolator 30 is consistent with the magnetic field direction of the magnetic field generating element 80 or forms an acute angle, for example, preferably an acute angle within 25°; similarly, the light propagation direction t5 of the isolator 50 is consistent with the magnetic field direction of the magnetic field generating element 80 or forms an acute angle, for example, preferably an acute angle within 25°. In this way, through the positional relationship between the isolator 30, the isolator 50 and the magnetic field generating element 80, the utilization rate of the magnetic field provided by the isolator 30 and the isolator 50 by the magnetic field generating element 80 is improved.

[0042] It is understandable that the magnetic field direction at each position in the magnetic field of the magnetic field generating element 80 is different. The angle between the light propagation direction of each isolator and the magnetic field direction of the magnetic field generating element 80 is based on the magnetic field direction at the location of the isolator.

[0043] In one embodiment, the light propagation direction t3 of the isolator 30 is different from the light propagation direction t5 of the isolator 50, that is, the light propagation direction t3 passing through the isolator 30 is different from the light propagation direction t5 passing through the isolator 50. In such an implementation scenario, the technology of providing a magnetic field through the same magnetic field generating element 80 in this embodiment can further greatly avoid the installation difficulties, easy misalignment installation problems and mutual interference of magnetic fields caused by the magnetic force between the two magnetic field generating elements. The isolator 30 and the isolator 50 can be accurately installed on the ideal optical axis, and normal functions can easily meet the design goals.

[0044] Furthermore, the light propagation direction t3 of the isolator 30 and the light propagation direction t5 of the isolator 50 are perpendicular to each other. In the case where the light propagation directions of the two isolators are perpendicular to each other, in this embodiment, the two isolators share the same magnetic field generating element 80 to provide a magnetic field, which can further reduce the problem of mutual interference between the two magnetic fields, and the advantages are more obvious compared to conventional technologies. Of course, in other embodiments, the light propagation direction t3 of the isolator 30 and the light propagation direction t5 of the isolator 50 can also form an obtuse angle or an acute angle.

[0045] In one embodiment, Figure 3 The photon integrated chip 40 has two relatively large surfaces, and the thickness direction of the photon integrated chip 40 is defined in the normal direction of the two surfaces, for example Figure 3 That is, an orthographic projection view along the normal direction (or thickness direction) of the photon integrated chip 40 is drawn. In the present application, the "up" and "down" directions are defined by the normal direction of the photon integrated chip 40. In the following text, the orientation concepts such as "above", "below", "top", "bottom", and "thickness" are all determined along the normal direction of the photon integrated chip 40. In addition, the thickness direction of the photon integrated chip 40 is perpendicular to the direction of the incident light path of the photon integrated chip 40, and the direction of the incident light path is collinear with the light propagation direction t3 of the isolator 30; the thickness direction of the photon integrated chip 40 is perpendicular to the direction of the outgoing light path of the photon integrated chip 40, and the direction of the outgoing light path is collinear with the light propagation direction t5 of the isolator 50.

[0046] The photonic integrated chip 40 further has a first side edge 40 a and a second side edge 40 b connecting the two surfaces. The first side edge 40 a and the second side edge 40 b are adjacent to and connected to each other. In the embodiment of the figure, the first side edge 40 a and the second side edge 40 b are perpendicular to each other.

[0047] The photon integrated chip 40 has a light inlet 41 and a light outlet 42. One of the light inlet 41 and the light outlet 42 is disposed on the first side 40a, and the other is disposed on the second side 40b. In the drawings, the light inlet 41 is disposed on the first side 40a, and the light outlet 42 is disposed on the second side 40b. The light inlet 41 corresponds to the isolator 30, so that the light emitted from the isolator 30 enters the photon integrated chip 40 through the light inlet 41; and the light outlet 42 corresponds to the isolator 50, so that the light leaves the photon integrated chip 40 through the light outlet 42 and then is emitted to the isolator 50.

[0048] The directions of the light inlet 41 and the light outlet 42 are different corresponding to the light propagation direction t3 of the isolator 30 and the light propagation direction t5 of the isolator 50. For example, when the light propagation direction t3 of the isolator 30 and the light propagation direction t5 of the isolator 50 are perpendicular, the directions of the light inlet 41 and the light outlet 42 are also perpendicular to each other.

[0049] Furthermore, the light propagation direction t3 of the isolator 30 and the light propagation direction t5 of the isolator 50 are both substantially perpendicular to the normal direction of the photonic integrated chip 40 .

[0050] Furthermore, in this embodiment, the magnetic field generating element 80 is disposed on one side of the photonic integrated chip 40 , specifically, on one side of the first side edge 40 a .

[0051] One of the isolator 30 and the isolator 50 is fitted and fixed on the top of the magnetic field generating component 80, that is, on one side of the thickness direction of the magnetic field generating component 80, which can also be named as a top isolator; the other of the two is arranged on the side of the magnetic field generating component 80, that is, arranged on the side of the photonic integrated chip 40 with a gap from the magnetic field generating component 80, which can also be named as a side isolator. For example, as shown in the embodiment of the figure, the isolator 30 is fitted and fixed on the top of the magnetic field generating component 80, and the isolator 50 is arranged on the side of the magnetic field generating component 80. In the following description, this embodiment is referred to as "the embodiment of the accompanying drawings". In a variant embodiment, it can also be: the magnetic field generating component 80 is arranged according to Figure 3 The angle is rotated 90° clockwise, and the isolator 50 in the light output path of the photonic integrated chip 40 is arranged above the magnetic field generating element 80, and the isolator 30 in the light input path of the photonic integrated chip 40 is arranged on the side of the magnetic field generating element 80, that is, the side isolator is arranged as the isolator 30 in the light input path of the photonic integrated chip 40, and the top isolator is arranged as the isolator 50 in the light output path of the photonic integrated chip 40. This variant embodiment will be referred to as “the variant embodiment” hereinafter.

[0052] In this way, by arranging one of the two isolators above the magnetic field generating element 80 and the other one on the side of the magnetic field generating element 80, compared with the conventional technology, it is equivalent to that the side isolator does not have a separate magnetic field generating element (for example, the isolator 50 is installed above the pad 93 instead of a magnetic field generating element), but borrows the magnetic field generating element of the top isolator.

[0053] Of course, within the technical purpose of the present application - the same magnetic field generating element provides a magnetic field for two isolators - the positional relationship between the isolator 30, the isolator 50 and the magnetic field generating element 80 is not limited thereto, for example, both isolators are arranged on the side of the magnetic field generating element 80, or the configuration of the magnetic field generating element 80 is changed so that both isolators are arranged above the magnetic field generating element 80. In contrast, in the embodiment shown in the accompanying drawings, one of the two isolators is arranged above the magnetic field generating element 80, and the other is arranged on the side of the magnetic field generating element 80, which can make the magnetic field provided by the magnetic field generating element 80 easily meet the needs of the two isolators and simplify the structure of the magnetic field generating element 80 itself.

[0054] Further, Figures 3 to 5 The magnetic field generating element 80 includes a mounting area 80a and an extension area 80b.

[0055] The top isolator, such as the isolator 30 in the embodiment of the attached drawings, is fixedly installed above the installation area 80a. More specifically, the installation area 80a has a mounting groove 81 that is recessed downward along the thickness direction of the magnetic field generating member 80, and the isolator 30 is installed in the mounting groove 81. The top 31 of the isolator 30 does not protrude from the mounting groove 81, that is, it is lower than or flush with the top surface 82 of the magnetic field generating member 80.

[0056] The extension area 80b is integrally connected to the mounting area 80a, and the extension area 81b and the mounting area 81a are arranged side by side along the light propagation direction of the side isolator (for example, along the light propagation direction t5 of the isolator 50 in the drawings). The side isolator, such as the isolator 50 in the embodiment of the drawings, is overlapped and arranged with the extension area 81b in the vertical direction of the light propagation direction of the side isolator. Specifically, the extension area 81b includes Figure 3 The S portion indicated by the diagonal line in FIG. 5 is overlapped with the isolator 50 in the direction perpendicular to the light propagation direction t5.

[0057] The side isolator, such as the isolator 50 in the embodiment of the attached drawings, has a bottom that is not lower than the bottom surface of the magnetic field generating member 80, and a top that is not higher than the top surface 82 of the magnetic field generating member 80. In this way, the magnetic field strength provided by the magnetic field generating member 80 to the side isolator can be enhanced, ensuring that the function of the isolator is maximized.

[0058] Furthermore, the mounting area 80a and the top isolator (such as the isolator 30 in the figure) are arranged on the side of the first side 40a of the photonic integrated chip 40, that is, at the light entrance 41; the extension area 80b extends along the first side 40a and exceeds the second side 40b of the photonic integrated chip 40, and the side isolator (such as the isolator 50 in the figure) is arranged on the side of the second side 40b, that is, at the light exit 42.

[0059] Furthermore, the distance L between the side isolator, such as the isolator 50 in the embodiment of the accompanying drawings, and the magnetic field generating element 80 does not exceed 0.6 mm, preferably 0.5 mm or less. The distance L is the straight-line distance from the edge of the isolator 50 to the edge of the magnetic field generating element 80.

[0060] Furthermore, the top isolator and the side isolator are respectively arranged at the first side 40a and the second side 40b. For example, the isolator 50 in the embodiment of the figure is arranged at the second side 40b, and the isolator 30 in the embodiment of the figure is arranged at the first side 40a. The magnetic force generated by the magnetic field generating element 80 on the isolator 30 and the isolator 50 is different in magnitude. Specifically, the magnetic force generated by the magnetic field generating element 80 on the top isolator (for example, the isolator 30 in the figure) is greater than the magnetic force generated on the side isolator (for example, the isolator 50 in the figure).

[0061] The side isolator, such as the isolator 50 in the embodiment of the attached drawings, is set to have a saturation magnetic field strength not exceeding 200Oe, and for example, a GSF type isolator can be specifically selected. In this way, such an isolator with low saturation magnetic field strength, when arranged on the side of the magnetic field generating element 80, can easily meet the magnetic field requirements and thus ensure its normal function. Of course, in the technical purpose of the invention, those skilled in the art can also select other types of isolators or isolators with higher saturation magnetic field strength.

[0062] The top isolator, such as the isolator 30 in the embodiment of the accompanying drawings, can be set to a saturation magnetic field strength not exceeding 200Oe, for example, a GSF type isolator can be specifically selected; it can also be set to a saturation magnetic field strength of about 700Oe, for example, a GTD type isolator can be specifically selected. In this way, not only can the basic function of the isolator be realized under the action of the magnetic field generating element 80, but also low cost can be taken into account.

[0063] Further, regarding the specific structure of the magnetic field generating member 80. In the present embodiment, the magnetic field generating member 80 is configured as an integrated magnetic block, such as an integrated nickel-plated magnet block. Of course, in a variant embodiment, the magnetic field generating member 80 may also be configured as other materials and / or structures known in the art to provide the required magnetic field, for example, the magnetic field generating member 80 is configured as an integrated body fixedly assembled from a plurality of integrated magnetic blocks.

[0064] Furthermore, in one embodiment, the optical transmitter assembly 100 further includes a focusing lens 20, a coupling lens 60 and an optical fiber 70. Thus, the optical transmitter 10 converts the electrical signal into an optical signal and outputs the optical signal. The optical signal first passes through the focusing lens 20 and the isolator 30 in sequence, and then enters the photon integrated chip 40 through the light inlet 41; then leaves the photon integrated chip 40 through the light outlet 42, passes through the isolator 50 and the coupling lens 60 in sequence, and is coupled into the optical fiber 70; finally, it continues to propagate along the optical fiber 70.

[0065] It can be known that the various components mentioned in this article, including optical emitters, photonic integrated chips, isolators, respective lenses, etc., as well as the types of isolators, such as GSF-type isolators, GTD-type isolators, and the types of optical emitters, such as DFB-LD, EML, etc., are all common knowledge in the field, and their respective specific structures can be implemented using any structure known in the field, and will not be repeated in this application.

[0066] Of course, the optical transmission component 100 may also include other optical devices, such as a wavelength division multiplexer (Wavelength Division Multiplexing, referred to as WDM), etc., which can be implemented with any feasible complete optical path known in the art and will not be elaborated here.

[0067] Furthermore, the optical emitting assembly 100 also includes a number of non-magnetic pads to ensure that the optical axis positions of various optical devices match, such as the pad 91 located below the optical emitter 10 as shown in the figure, the pad 92 located below the pad 91 and the magnetic field generating element 80, the pad 93 located below the side isolator (such as the isolator 50 in the figure), the pad 94 located below the pad 93 and the coupling lens 60, and so on.

[0068] Furthermore, an embodiment of the present invention also provides an optical module, which includes a housing, the optical emitting assembly 100 described above, and an optical port.

[0069] The housing comprises a lower housing and an upper housing, and the lower housing and the upper housing are arranged opposite to each other in the up-down direction; the optical emitting assembly 100 is arranged inside the housing, that is, located in the accommodation cavity surrounded by the lower housing and the upper housing.

[0070] The optical port is formed at one end of the housing and is connected to an external optical fiber.

[0071] The optical signal emitted by the optical transmitter 10 in the optical transmitting component 100 passes through the focusing lens 20, the isolator 30, the photonic integrated chip 40, the isolator 50, the coupling lens 60, and the optical fiber 70, and is output to the external optical fiber at the optical port to realize the optical signal emission function of the optical module.

[0072] Based on the structural setting of the optical transmission component 100, the optical module can also solve the problems of difficult installation and easy misalignment installation caused by the magnetic force between the two magnetic field generating components in the conventional technology compared to the conventional optical module; the isolator 30 and the isolator 50 are simple to install, accurate and easy to position, and can be accurately installed on the ideal optical axis; in addition, the magnetic field interference problem caused by the existence of two magnetic field generating components in the conventional technology can also be solved, so that the normal functions of the isolator 30 and the isolator 50 can easily meet the design goals and will not be affected by the magnetic field interference. In summary, the function of the entire optical module is stable.

[0073] Furthermore, in one embodiment, the optical module may be a TOSA (Total Optical Satellite Assay) having only an optical transmission function, or an integrated optical transceiver having both an optical transmission function and an optical reception function. When the optical module is implemented as an integrated optical transceiver, the optical module further includes an optical receiving component, which includes an optical detector, and the optical detector converts the external optical signal received by the optical module into an electrical signal.

[0074] Furthermore, the optical module can be adapted to transmit and / or receive optical signals at various data rates per second, including but not limited to: 1 Gbit, 2Gbit, 4Gbit, 8Gbit, 10Gbit, 20Gbit, 100Gbit, 200Gbit or other bandwidth optical fiber links. In addition, optical modules of other types and configurations or optical modules having elements that differ in some respects from those shown and described herein may also benefit from the principles disclosed herein.

[0075] To sum up, the beneficial effects of this embodiment are: for the two isolators in the light input path and the light output path of the photonic integrated chip 40, the same magnetic field generating element 80 is used to provide the required magnetic field, thereby avoiding the problems of difficult installation and easy misalignment of installation caused by the magnetic force between the two magnetic field generating elements in conventional technology; the installation of the two isolators is simple, the positioning is accurate and easy, and both can be accurately installed on the ideal optical axis; in addition, it can also solve the problem of magnetic field interference caused by the existence of two magnetic field generating elements in conventional technology, so that the normal functions of the two isolators can easily meet the design goals and will not be affected by magnetic field interference.

[0076] It should be understood that although the present specification is described according to embodiments, not every embodiment contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0077] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the utility model. They are not intended to limit the protection scope of the utility model. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. An optical transmission component, comprising an optical transmitter, a photon integrated chip, and two isolators respectively located in the light input path and the light output path of the photon integrated chip, characterized in that: The optical transmission assembly further comprises: A magnetic field generating element provides a magnetic field for the two isolators simultaneously, and the light propagation directions of the two isolators respectively conform to the magnetic field directions of the magnetic field generating element.

2. The light emitting assembly according to claim 1, characterized in that: The photonic integrated chip comprises a first side and a second side adjacent to each other, the two isolators are respectively arranged at the first side and the second side, and the magnetic force generated by the magnetic field generating element on the two isolators is different in magnitude.

3. The light emitting assembly according to claim 2, characterized in that: The light propagation directions of the two isolators are respectively consistent with the magnetic field direction of the magnetic field generating element or are at an acute angle within 25°.

4. The light emitting assembly according to claim 1, characterized in that: The propagation directions of light passing through the two isolators are different.

5. The light emitting assembly according to claim 1, characterized in that: The magnetic field generating element is configured as an integrated magnetic block, or as an integrated body formed by fixedly assembling a plurality of integrated magnetic blocks.

6. The light emitting assembly according to claim 1, characterized in that: The magnetic field generating element is arranged on one side of the photon integrated chip; One of the two isolators is arranged at a distance from the magnetic field generating element on the side of the photon integrated chip, and constitutes a side isolator; Another isolator is fixed to one side of the magnetic field generating element in the thickness direction, and constitutes a top isolator; The thickness direction is parallel to the thickness direction of the photonic integrated chip, and is perpendicular to the directions of the light-incoming optical path and the light-outgoing optical path of the photonic integrated chip.

7. The light emitting assembly according to claim 6, characterized in that: The saturation magnetic field strength of the side isolator does not exceed 200 Oe, and / or the side isolator is configured as a GSF type isolator and the top isolator is configured as a GTD type isolator.

8. The light emitting assembly according to claim 7, characterized in that: The distance between the side isolator and the magnetic field generating element does not exceed 0.6 mm.

9. The light emitting assembly according to claim 6, characterized in that: The magnetic field generating element comprises: An installation area, on which the overhead isolator is fixedly installed; and The extension area is integrally connected with the installation area, and the two are arranged side by side along the light propagation direction of the side isolator. The side isolator and the extension area are overlapped and arranged in a direction perpendicular to the light propagation direction of the side isolator.

10. The light emitting assembly according to claim 9, characterized in that: The installation area has an installation groove recessed along the thickness direction, and the top isolator is installed in the installation groove; The side isolator is installed on the non-magnetic pad, and the bottom surface of the magnetic field generating element is not higher than the bottom of the side isolator, and the top surface of the magnetic field generating element is not lower than the top surface of the side isolator.

11. The light emitting assembly according to claim 9, characterized in that: The photonic integrated chip has a first side and a second side that are perpendicular to each other, one of the first side and the second side is provided with a light entrance, and the other is provided with a light exit; The installation area and the top isolator are arranged at the light entrance, the extension area extends along the first side and exceeds the second side, and the side isolator is arranged at the light exit.

12. The light emitting assembly according to claim 11, characterized in that: The optical transmission assembly also includes a circuit board, an optical transmitter electrically connected to the circuit board, and an optical fiber; The optical transmitter converts the electrical signal received from the circuit board into an optical signal and outputs the optical signal. The optical signal passes through the top isolator, the photonic integrated chip, and the side isolator in sequence and then propagates toward the optical fiber.

13. An optical module, characterized in that: The optical module comprises the optical emitting assembly according to any one of claims 1 to 12.

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