Multifunctional development device of vehicle-mounted system

Abstract

The utility model discloses a multifunctional development device of a vehicle-mounted system, which relates to the field of vehicle testing, and comprises an MCU (Microprogrammed Control Unit) minimum system, the MCU minimum system comprises an MCU, the MCU is connected with a power supply through a power conversion circuit, and the MCU is connected with a plurality of function testing circuits; various functions for a vehicle-mounted system are integrated, a user can select required tests and applications, a development suite serves as scheme verification, the time for building a user hardware scheme is shortened, and the stability and efficiency of the test are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle testing, in particular to a multifunctional development device for a vehicle-mounted system. Background Art

[0002] Usually, if users plan to design a product with CAN, LIN, wireless charging, NFC, high-side driver and audio amplifier chips, they need to find demos of each chip for separate testing. In particular, MCU demos only have the minimum system and simple peripherals, and cannot perform a complete solution evaluation. After testing the demo, customers also need to design their own development boards to integrate the solutions, which poses the risk of not being able to go into mass production for the first time, as well as the problem of a long development cycle.

[0003] For example, Chinese patent CN217605992U, published on October 18, 2022, discloses a vehicle electronic and electrical testing system, including: a rack, in which the test system is integrated; a measurement and control module includes a host industrial computer and a network switch connected thereto; the Victor VT system is connected to the host industrial computer via a network switch and Ethernet; a high-voltage source module is connected to the input end of the sample under test; the input end of the constant current source module is connected to the output end of the sample under test, and the output end of the constant current source module is connected to the high-voltage source module; and a temperature detection module is connected to the host industrial computer via a network switch. Although the test system integrates some test function modules, some common functional tests of CAN, LIN, wireless charging, NFC, high-side drive and audio amplifier cannot be implemented. Utility Model Content

[0004] The technical problem to be solved by the utility model is that the existing development of vehicle-mounted functions requires separate testing, which takes a long time and has a long development cycle. A multifunctional development device for a vehicle-mounted system is proposed. The development kit integrates a variety of functions for the vehicle-mounted system, reduces the time for users to build hardware solutions, and improves the stability and efficiency of the test.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is: a multifunctional development device of a vehicle-mounted system, including an MCU minimum system, the MCU minimum system includes an MCU, the MCU is connected to a power supply through a power conversion circuit, and the MCU is connected to a number of functional test circuits.

[0006] A multifunctional development device for an in-vehicle system includes an MCU minimum system. The MCU minimum system is connected to a power conversion circuit and multiple functional test circuits. The power conversion circuit converts 12V to 5V and then to 3.3V to provide a stable power supply for the system and various peripherals. The functional test circuit can test multiple functions such as CAN, LIN, wireless charging, NFC, high-side drive and audio amplifier, so as to meet the test of commonly used in-vehicle functions and improve test efficiency.

[0007] Preferably, the functional test circuit includes a wireless charging test circuit, the wireless charging test circuit includes a wireless charging chip, the wireless charging chip is connected to the MCU via I2C, and the wireless charging chip is connected to the wireless charging application circuit. The wireless charging chip communicates with the MCU via I2C, and the development kit also provides a wireless charging transmitting coil that supports the Qi protocol, which can support up to 5W charging power.

[0008] Preferably, the functional test circuit includes an NFC test circuit, the NFC test circuit includes an NFC chip, the NFC chip is connected to the MCU via SPI, and the NFC chip is connected to the NFC application circuit. The NFC chip communicates with the MCU via the SPI bus, and the development kit includes an NFC antenna for user evaluation, supporting card swiping function or keyless start.

[0009] Preferably, the functional test circuit includes a CAN communication test circuit and a LIN communication test circuit, the CAN communication test circuit includes a CAN conversion chip, the CAN conversion chip is connected to the MCU via CANFD, and the CAN conversion chip is connected to the CAN application circuit. An external CAN conversion chip is provided as the main communication bus of the vehicle system.

[0010] Preferably, the LIN communication test circuit includes a LIN conversion chip, the LIN conversion chip is connected to the MCU via LIN, and the LIN conversion chip is connected to the LIN application circuit. The LIN conversion chip can be used as an auxiliary communication bus of the sensor.

[0011] Preferably, the functional test circuit includes an audio power amplifier test circuit, the audio power amplifier test circuit includes an audio power amplifier chip, the audio power amplifier chip is connected to the MCU via I2S, and the audio power amplifier chip is connected to the audio power amplifier application circuit. The audio power amplifier chip communicates with the MCU via I2S to realize the audio playback function.

[0012] Preferably, the power conversion circuit includes a DCDC and an LDO, one end of the DCDC is connected to the input power supply, the other end of the DCDC is connected to one end of the LDO, and the other end of the LDO is connected to the MCU. The controller input voltage is 12V, and 5V is output through the DCDC conversion chip, and 5V is output through the LDO to 3.3V to power the MCU.

[0013] Preferably, the MCU minimum system includes a crystal oscillator circuit and a memory circuit, wherein the crystal oscillator circuit is connected to the MCU, the memory circuit is connected to the MCU via I2C, and the MCU is connected to a USB connector via a UART to USB chip. The crystal oscillator circuit, MCU, memory circuit and UART constitute the MCU minimum system.

[0014] The substantial effect of the utility model is that the utility model integrates a variety of functions for vehicle-mounted systems, including CAN, LIN, wireless charging, NFC, high-side driver and audio amplifier chips. Users can select the tests and applications they need. The development kit is used as a solution verification to reduce the time for users to build hardware solutions and improve the stability and efficiency of the test. The development kit can provide customers with a complete design solution, which can be more convenient for users to design and develop and reduce development risks. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a functional framework diagram of the first embodiment.

[0016] Figure 2 This is the power conversion circuit of the first embodiment.

[0017] Figure 3 This is the CAN communication test circuit of Example 1.

[0018] Figure 4 This is the LIN communication test circuit of embodiment 1.

[0019] Figure 5 This is a diagram of the NFC chip of Example 1.

[0020] Figure 6 This is the NFC test circuit of embodiment 1.

[0021] Figure 7 FIG. 1 is a diagram of a wireless charging chip according to Embodiment 1.

[0022] Figure 8 This is the wireless charging application circuit of the first embodiment.

[0023] Fig. 9 This is the audio power amplifier circuit of embodiment 1.

[0024] Among them: 1. DCDC, 2. LDO, 3. MCU, 4. 24M Crystal, 5. 32.768K Crystal, 6. EEPROM, 7. USB, 8. CAN, 9. LIN, 10. NFC, 11. Wireless charging, 12. High-side driver, 13. Audio amplifier. DETAILED DESCRIPTION

[0025] The specific implementation of the utility model is further described below through specific embodiments and in conjunction with the accompanying drawings.

[0026] Embodiment one:

[0027] A multifunctional development device for vehicle-mounted systems, such as Figure 1 As shown, the development kit used in this utility mainly includes three parts: MCU minimum system, power conversion circuit and functional test circuit. Among them, the MCU minimum system is composed of MCU3, 24MCrystal4, 32.768K Crystal5, EEPROM6 and UART, and the power conversion circuit is composed of DCDC1 and LDO2. The functional test circuits used in this utility include wireless charging 11 test circuit, NFC10 test circuit, CAN8 communication test circuit, LIN9 communication test circuit, audio amplifier 13 test circuit and high-side driver 12 test circuit, etc. These functional test circuits can meet the test of some common functional development in the development of vehicle network communication system.

[0028] Common in-vehicle network communication systems include: CAN bus system, LIN bus system, LAN bus system and MOST bus system, among which CAN bus is the most widely used. CAN bus system is a bus system developed by BOSCH and Intel for internal data exchange in automobiles. The high-speed drive CAN bus consists of a microprocessor, a controller, a transceiver, two twisted pairs, and two data transmission terminals. The low-speed body or comfort CAN bus lacks terminal resistance and can run on a single line. The LIN bus system is a subsystem under the CAN bus network and is used for networking between automotive sensors and actuators. The full name of the in-vehicle NFC function is Near Field Communication, which is a short-range high-frequency wireless communication technology. NFC technology is mainly used in automobiles and is a digital key for automobiles. The NFC function of the car means that the owner no longer has to bother to take the car key when driving. He can unlock, lock and start the car with a mobile phone. In-vehicle wireless charging technology is a convenient, efficient and environmentally friendly charging method that can bring users a new charging experience. It can not only meet consumers' needs for convenient travel, but also provide automobile manufacturers with more intelligent and efficient charging solutions. When users develop new functions, they can use this in-vehicle system development kit, which covers CAN, LIN, wireless charging, NFC, high-side driver and audio amplifier chips, to quickly evaluate solutions and perform performance tests. The MCU resources are reasonably allocated, while supporting customer selection, reducing user development time and achieving rapid mass production.

[0029] The circuit board of the development kit connects the LDO to the MCU chip, and then connects the DCDC to the LDO to form the power conversion circuit in the circuit. When powered on, the 12V voltage is connected from the outside through the DCDC, and then the 5V voltage is output as the first-level power supply through the DCDC converter, broadband input, and then the 5V voltage is output. Then, the 5V voltage output by the DCDC comes to the LDO, and the input 5V voltage is converted into a 3.3V output voltage through the low voltage difference linear stabilizer, which provides a stable voltage for the system as the second-level power supply.

[0030] The MCU chip in the MCU minimum system is used as a processing chip, based on a 32-bit Cortex-M33, with a main frequency of up to 120MHz, FPU and DSP, 256KB flash and 32KB SRAM. A 24M Crystal or 32.768K Crystal model is selected as the crystal oscillator in the crystal oscillator circuit to provide a stable oscillation frequency for the MCU. The EEPROM is connected to the MCU via I2C, and the EEPROM uses a 4Kb memory. Connect USB7 to the UART button on the MCU, convert UART to USB, support Type C interface, and facilitate connection with external functional modules to be tested.

[0031] The CAN communication test circuit in the functional test circuit is connected to the MCU via CANFD, and the LIN communication test circuit is connected to the MCU via LIN. The NFC test circuit is connected to the MCU via SPI, and is used for automotive-grade high-performance NFC card readers for CCC digital keys and car center consoles. The wireless charging test circuit is connected to the MCU via I2C. The wireless charging test circuit complies with the Qi standard inductive wireless power transmitter and supports up to 5W applications. The audio power amplifier test circuit is connected to the MCU via I2S. The audio power amplifier test circuit is a single-channel 10W classD automotive audio amplifier. The high-side driver test circuit is connected to the MCU via SPI.

[0032] In this development kit, the controller input voltage is 12V, which is converted to 5V through the DCDC conversion chip. The 5V is converted to 3.3V through the LDO to power the MCU. Together with the 24M Crystal, 32.768K Crystal, EEPROM and UART, the minimum system is formed. The CAN conversion chip is used as the main communication bus of the vehicle system; the LIN conversion chip can be used as an auxiliary communication bus for sensors. The NFC chip communicates with the MCU via the SPI bus. The development kit includes an NFC antenna for user evaluation, which supports card swiping or keyless start. The wireless charging chip communicates with the MCU via I2C. The development kit also provides a wireless charging transmitter coil that supports the Qi protocol, which can support up to 5W charging power. The audio amplifier chip communicates with the MCU via I2S to realize the audio playback function.

[0033] like Figure 2As shown, U11 is a DCDC conversion chip and U12 is an LDO conversion chip. Pin 1 of chip U11 is connected to one end of capacitor C114, and the other end of capacitor C114 is grounded. Pin 1 of chip U11 is also connected to one end of resistor R63, and the other end of resistor R63 is grounded. Pin 3 of chip U11 is connected to one end of resistor R68, and the other end of resistor R68 is grounded. Pin 3 of chip U11 is also connected to one end of resistor R65, and the other end of resistor R65 is connected to pin 6 of chip U11. Pin 7 of chip U11 is connected to pin 6. Pin 6 of chip U11 is connected to one end of capacitor C113, and the other end of capacitor C113 is grounded. Pin 6 of chip U11 is connected to one end of capacitor C111, and the other end of capacitor C111 is grounded. Pin 6 of chip U11 is connected to one end of capacitor C110, and the other end of capacitor C110 is grounded. Pin 6 of chip U11 is connected to one end of capacitor C109, and the other end of capacitor C109 is grounded. Pin 6 of chip U11 is also connected to the VBAT pin. Pin 6 of chip U11 is connected to the cathode of diode D14, the anode of diode D14 is connected to one end of resistor R64, and the other end of resistor R64 is grounded. Pin 6 of chip U11 is connected to the S pole of field effect transistor Q1, the G pole of field effect transistor Q1 is connected to the ungrounded end of resistor R64, the D pole of field effect transistor Q1 is connected to one end of TVS tube D15, and the other end of TVS tube D15 is grounded. The D pole of field effect transistor Q1 is connected to filter SDN1. The D pole of field effect transistor Q1 is connected to interface J23 for connecting to an external power supply. Pin 0 and pin 4 of chip U11 are grounded. Pin 5 of chip U11 is connected to one end of resistor R66, the other end of resistor R66 is connected to one end of capacitor C115, and the other end of capacitor C115 is grounded. Pin 8 of chip U11 is connected to one end of resistor R64, and the other end of resistor R64 is grounded. Pin 2 of chip U11 is connected to the cathode of diode D21, and the anode of diode D21 is grounded. Pin 2 of chip U11 is connected to one end of inductor L13, and the other end of inductor L13 is connected to one end of capacitor C102, and the end of inductor L13 connected to capacitor C102 is connected to one end of capacitor C103, and the other end of capacitor C103 is grounded. The end of inductor L13 connected to capacitor C102 is connected to one end of capacitor C104, and the other end of capacitor C104 is grounded. The end of inductor L13 connected to capacitor C102 is connected to one end of capacitor C105, and the other end of capacitor C105 is grounded. The end of inductor L13 connected to capacitor C102 is connected to one end of capacitor C106, and the other end of capacitor C106 is grounded. One end of the inductor L13 connected to the capacitor C102 is connected to one end of the capacitor C107, and the other end of the capacitor C107 is grounded. One end of the inductor L13 connected to the capacitor C102 is connected to one end of the resistor R62, and the other end of the resistor R62 is connected to the pin 8 of the chip U11.One end of the inductor L13 connected to the capacitor C102 is connected to one end of the capacitor C108, and the other end of the capacitor C108 is connected to the pin 8 of the chip U11.

[0034] Pin 1 of chip U12 is connected to pin 2. Pin 1 of chip U12 is connected to one end of capacitor C123, and the other end of capacitor C123 is grounded. Pin 1 of chip U12 is connected to one end of capacitor C116, and the other end of capacitor C116 is grounded. Pin 1 of chip U12 is connected to one end of capacitor C117, and the other end of capacitor C117 is grounded. Pin 1 of chip U12 is connected to one end of capacitor C118, and the other end of capacitor C118 is grounded. Pin 1 of chip U12 is connected to one end of capacitor C119, and the other end of capacitor C119 is grounded. Pin 1 of chip U12 is connected to VDD. Pin 0 and pin 3 of chip U12 are grounded. Pin 5 of chip U12 is connected to pin 8. Pin 8 of chip U12 is connected to one end of capacitor C112, and the other end of capacitor C112 is grounded. Pin 8 of chip U12 is connected to one end of capacitor C121, and the other end of capacitor C121 is grounded. Pin 8 of chip U12 is connected to one end of capacitor C120, and the other end of capacitor C120 is grounded. Pin 8 of chip U12 is connected to one end of capacitor C122, and the other end of capacitor C122 is grounded. Pin 8 of chip U12 is connected to a 5V power supply.

[0035] like Figure 3 As shown, the CAN communication test circuit is composed of three identical circuits, and the structure diagram of one of the circuits is shown in the figure. The circuit includes a CAN conversion chip U2, and the pins 1, 4 and 8 of the chip U2 are respectively connected to the pins 2, 4 and 6 of the interface P2, and the pins 1, 3 and 5 of the interface P2 are respectively connected to the corresponding interfaces on the MCU, and the three different CAN communication test circuits are respectively connected to the corresponding MCU pins through the interfaces. Pin 2 of the chip is grounded, and the pin 3 of the chip is connected to one end of the capacitor C27, and the other end of the capacitor C27 is grounded. Pin 5 of the chip U2 is connected to one end of the capacitor C26, and the other end of the capacitor C26 is grounded. Pin 6 and pin 7 of the chip U2 are respectively connected to pin 4 and pin 1 of the common mode inductor, and pin 2 of the transformer is connected to one end of the capacitor C24, and the other end of the capacitor C24 is grounded. Pin 2 of the common mode inductor is connected to one end of the TVS tube D1, and the other end of the TVS tube D1 is grounded. Pin 3 of the common mode inductor is connected to one end of capacitor C24, and the other end of capacitor C28 is grounded. Pin 3 of the common mode inductor is connected to one end of resistor R19, and the other end of resistor R19 is connected to pin 2 of the common mode inductor. Pins 2 and 3 of the common mode inductor are respectively connected to the pins of interface P3 for connecting to an external circuit.

[0036] like Figure 4As shown, the LIN communication test circuit is composed of two identical circuits, and the structure diagram of one of the circuits is shown in the figure. The circuit includes a LIN conversion chip U5, and the pin 1 of the chip U5 is connected to one end of the resistor R22, and the other end of the resistor R22 is connected to VDD. The resistor R22 is also connected to one end of the capacitor C39, and the other end of the capacitor C39 is grounded. The pin 3 of the chip U5 is connected to one end of the resistor R32, and the other end of the resistor R32 is respectively connected to one end of the resistor R26 and the C pole of the transistor Q2, and the other end of the resistor E2 is connected to VBAT, and the B pole of the transistor Q2 is connected to one end of the resistor R90, and the other end of the resistor R90 is connected to the E pole of the transistor Q2, and the E pole of the transistor Q2 is grounded. The B pole of the transistor Q2 is connected to one end of the resistor R91, and the other end of the resistor R91 is connected to the corresponding pin on the MCU. The pin 5 of the chip U5 is connected to one end of the capacitor C43, and the other end of the capacitor C43 is grounded, and the pin 5 of the chip U5 is grounded. Pin 6 of chip U5 is connected to one end of TVS tube D19, and the other end of TVS tube D19 is grounded. Pin 6 of chip U5 is connected to pin 2 of T interface P8. Pin 7 of chip U5 is connected to one end of capacitor C41, and the other end of capacitor C41 is grounded. Pin 7 of chip U5 is connected to the cathode of diode D7, and the anode of diode D7 is connected to VBAT. Pin 8 of chip U5 is connected to one end of resistor R28, and the other end of resistor R28 is respectively connected to the anode of diode D9 and one end of resistor R24, and the other end of resistor R24 ​​is connected to pin 7 of chip U5, and the cathode of diode D9 is connected to one end of resistor R29, and the other end of resistor R29 is connected to pin 2 of interface P8. Interface P8 is used to connect to an external circuit.

[0037] like Figure 5 and Figure 6 As shown, it mainly includes an NFC chip U10 and a corresponding application circuit connected thereto.

[0038] like Figure 7 and Figure 8 As shown, the corresponding pins of the wireless charging chip are shown as chip U13, and the application circuit connected thereto is mainly composed of Figure 7As shown, a capacitor C127 is provided between the AC1 pin and the BOOT1 pin of the chip U13. The AC1 pin of chip U13 is respectively connected to one end of capacitor C125, capacitor C126, capacitor C128, and capacitor C132. The other ends of capacitor C125, capacitor C126, capacitor C128, and capacitor C132 are all connected to the positive electrode of diode D16. The negative electrode of the diode is connected to one end of resistor R70. The other end of resistor R70 is respectively connected to resistor R27, capacitor C130, resistor R71, one end of TVS tube D17, and pin 1 of interface P24. The other end of resistor R74 is grounded. The other end of capacitor C130 is connected to one end of capacitor C134. The other end of capacitor C134 is grounded. The other end of resistor R71 is connected to one end of capacitor C131. The other end of capacitor C131 is respectively connected to one end of capacitor C135 and TVS tube D18. The other ends of capacitor C135, capacitor C125, capacitor C126, capacitor C128, and capacitor C132 are all grounded. Pin 2 of interface P24 is connected to one end of resistor R72, the other end of resistor R72 is respectively connected to one end of capacitor C129 and resistor R73, the other end of capacitor C129 is grounded, the other end of resistor R73 is respectively connected to one end of capacitor C133 and resistor R76, the other end of capacitor C133 is grounded, the other end of resistor R76 is respectively connected to one end of capacitor C136 and resistor R80, and the other ends of capacitor C136 and resistor R80 are both grounded.

[0039] like Fig. 9 As shown, pin 19 of the audio power amplifier chip U1 is connected to one end of the inductor L5, and the other end of the inductor L5 is connected to pin 1 of the interface P1. Pin 22 of the audio power amplifier chip U1 is connected to one end of the inductor L4, and the other end of the inductor L4 is connected to pin 1 of the interface P2. The interface P2 is used to connect to an external circuit. The audio power amplifier chip U1 is also connected to the MCU through various protection circuits.

[0040] The above embodiments only express several implementation methods of the utility model, and the descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model.

Claims

1. A multifunctional development device for an in-vehicle system, characterized in that: The invention comprises an MCU minimum system, wherein the MCU minimum system comprises an MCU, the MCU is connected to a power source through a power conversion circuit, and the MCU is connected to a plurality of functional test circuits.

2. The multifunctional development device of a vehicle-mounted system according to claim 1, characterized in that: The functional test circuit includes a wireless charging test circuit, the wireless charging test circuit includes a wireless charging chip, the wireless charging chip is connected to the MCU via I2C, and the wireless charging chip is connected to the wireless charging application circuit.

3. The multifunctional development device of a vehicle-mounted system according to claim 1, characterized in that: The functional test circuit includes an NFC test circuit, the NFC test circuit includes an NFC chip, the NFC chip is connected to the MCU via SPI, and the NFC chip is connected to the NFC application circuit.

4. The multifunctional development device of a vehicle-mounted system according to claim 1, characterized in that: The functional test circuit includes a CAN communication test circuit and a LIN communication test circuit. The CAN communication test circuit includes a CAN conversion chip. The CAN conversion chip is connected to the MCU via CANFD, and the CAN conversion chip is connected to the CAN application circuit.

5. The multifunctional development device of a vehicle-mounted system according to claim 4, characterized in that: The LIN communication test circuit comprises a LIN conversion chip, the LIN conversion chip is connected to the MCU via LIN, and the LIN conversion chip is connected to a LIN application circuit.

6. The multifunctional development device of a vehicle-mounted system according to claim 1, characterized in that: The functional test circuit includes an audio power amplifier test circuit, the audio power amplifier test circuit includes an audio power amplifier chip, the audio power amplifier chip is connected to the MCU via I2S, and the audio power amplifier chip is connected to the audio power amplifier application circuit.

7. A multifunctional development device for an on-vehicle system according to claim 1 or 2 or 3 or 4 or 5 or 6, characterized in that: The power conversion circuit includes a DCDC and an LDO, one end of the DCDC is connected to an input power supply, the other end of the DCDC is connected to one end of the LDO, and the other end of the LDO is connected to the MCU.

8. A multifunctional development device for an on-vehicle system according to claim 1 or 2 or 3 or 4 or 5 or 6, characterized in that: The MCU minimum system includes a crystal oscillator circuit and a memory circuit. The crystal oscillator circuit is connected to the MCU. The memory circuit is connected to the MCU via I2C. The MCU is connected to a USB connector via a UART to USB chip.

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