Server heat dissipation system

Abstract

The utility model provides a server heat dissipation system, which comprises a cabinet, a plurality of loads and a plurality of cooling devices, and is characterized in that the plurality of cooling devices are used for adapting to different heating conditions and heat dissipation requirements of the plurality of loads; the cabinet is internally provided with a plurality of installation areas which are separated from one another and insulated from one another, and each installation area is correspondingly provided with a load and a cooling device corresponding to the type of the load. According to the utility model, a plurality of mounting areas are arranged in the cabinet, each load is arranged in one mounting area, so that the loads of different load types cannot interfere with each other, and one or more different cooling devices can be arranged in each mounting area according to the load types. Cooling of different intensities can be achieved according to loads with different heat dissipation requirements.

Description

Technical Field

[0001] The utility model relates to the technical field of servers, and in particular to a server cooling system. Background Art

[0002] The rapid development of industries such as Digital China, Industrial Internet, Internet of Things, cloud computing, and artificial intelligence has led to an increase in the use of IT equipment and server density, while also posing greater challenges to the carrying capacity and energy-saving capabilities of data centers. With the continuous increase in heat generated per unit space in data centers and the continuous increase in power density, the further application and promotion of traditional cooling methods and technologies have been severely restricted.

[0003] Among the existing liquid cooling technologies, spray liquid cooling does not have high requirements for server sealing, and a small amount of coolant can achieve a good heat dissipation effect with a fast heat dissipation speed. However, this method will cause the liquid film to accumulate and thicken when sprayed on the load for a long time, which will affect the heat exchange effect. Cold plate liquid cooling technology is the mainstream liquid cooling technology in current data center applications. Although it has a certain heat dissipation efficiency and is safe and reliable, it is difficult to solve the hot spot problems of high heat flux density components such as central processing units. Utility Model Content

[0004] The present application is based on the discovery and understanding of the following problems and facts by the utility model inventor: it is difficult for cold plate liquid cooling technology to solve the hot spot problem of high heat flux density components such as central processing units, and long-term use of spray liquid cooling will cause the liquid film to accumulate and thicken on the load, thereby affecting the heat exchange effect.

[0005] The utility model aims to solve one of the above technical problems at least to a certain extent.

[0006] According to a first aspect of the present disclosure, a server heat dissipation system is provided, comprising: a cabinet, multiple loads and multiple cooling devices, wherein:

[0007] The multiple cooling devices are used to adapt to different heating conditions and heat dissipation requirements of the multiple loads;

[0008] The cabinet is provided with a plurality of installation areas which are separated from each other and insulated from each other, and each of the installation areas is provided with a type of the load and a cooling device corresponding to the type of the load.

[0009] In some embodiments, the multiple cooling devices are configured as follows: each of the cooling devices can be controlled to adopt an adaptive cooling method according to the heating conditions and heat dissipation requirements of the load in the installation area where it is installed, so that the load in the installation area is in an optimal operating temperature range, and the cooling method includes the cooling device type and / or the cooling intensity of the cooling device.

[0010] In some embodiments, the multiple loads include at least a central processing unit or a graphics processing unit or a memory bar or a hard disk;

[0011] The cooling device corresponding to at least one of the loads comprises at least a spray cooling device and a cold plate cooling device;

[0012] The cooling device can be controlled to select a spray cooling device and / or a cold plate cooling device according to the heating condition and heat dissipation demand of the load in the installation area;

[0013] The cooling device can also be controlled to control the cooling intensity of the spray cooling device and / or the cooling intensity of the cold plate cooling device according to the heating condition and heat dissipation demand of the load in the installation area.

[0014] In some embodiments, the load of at least one of the installation areas is a central processing unit or a graphics processing unit, and the corresponding cooling device includes a spray cooling device and a cold plate cooling device.

[0015] In some embodiments, the load of at least one of the installation areas is a memory bar or a hard disk, and the corresponding cooling device includes a spray cooling device or a cold plate cooling device.

[0016] In some embodiments, the spray cooling device includes: a spray cooling liquid inlet pipe, a plurality of spray branch pipes, a plurality of nozzles, and a spray cooling liquid outlet pipe;

[0017] The inlet of the spray branch pipe is connected to the spray coolant inlet pipe, and the outlet of the spray branch pipe is connected to the nozzle. The nozzle is correspondingly arranged above the central processing unit and the graphics processing unit, or the nozzle is rotatably connected to the spray branch pipe, and the nozzle can be rotated to the top of the central processing unit or the graphics processing unit.

[0018] In some embodiments, the spray cooling device further comprises: a spray cooling liquid outlet pipe;

[0019] The spray coolant outlet pipe is arranged on the outer wall of the cabinet, a drainage groove is arranged at the bottom of each installation area, and the spray coolant outlet pipe is provided with a liquid collecting port corresponding to each drainage groove.

[0020] In some embodiments, the graphics processor and the central processor are both arranged in a vertical direction.

[0021] In some embodiments, the cold plate cooling device comprises: a cold plate cooling liquid inlet pipe, a cold plate cooling liquid outlet pipe and a plurality of liquid cooling plates;

[0022] The inlet and outlet of the liquid cooling plate are respectively connected to the cooling liquid inlet pipe and the cooling liquid outlet pipe of the cooling plate, and the liquid cooling plate is correspondingly arranged on each of the central processing unit or the graphics processing unit.

[0023] In some embodiments, the load of at least one of the installation areas is a power supply, and the corresponding cooling device includes an air cooling device.

[0024] In some embodiments, a plurality of heat insulation boards are disposed in the cabinet, and the heat insulation boards are arranged at intervals in a horizontal direction, and every two adjacent heat insulation boards separate the cabinet into one installation area.

[0025] According to an embodiment of the second aspect of the present utility model, a control method for a server cooling system is provided, comprising:

[0026] The server cooling system comprises a cabinet, wherein a plurality of installation areas separated from each other and insulated from each other are arranged in the cabinet, and each installation area is correspondingly provided with a load and a cooling device corresponding to the load type arranged therein;

[0027] The load is a central processing unit or a graphics processing unit; the cooling device includes a spray cooling device and a cold plate cooling device;

[0028] The control method comprises:

[0029] Get the temperature of the CPU and GPU respectively;

[0030] When the central processing unit and / or the graphics processing unit reaches a preset temperature, the cooling intensity of the central processing unit and / or the graphics processing unit is increased by a spray cooling device and a cold plate cooling device.

[0031] In some embodiments, the cooling intensity of the central processing unit and / or the graphics processing unit is improved by using a spray cooling device and a cold plate cooling device, including:

[0032] Turn on the spray cooling device to make the nozzles at the corresponding positions spray the coolant or rotate the nozzles to the corresponding positions to spray the coolant.

[0033] According to the server cooling system of the embodiment of the utility model, a plurality of installation areas are arranged in the cabinet, and each type of load is arranged in an installation area, so that loads of different types will not interfere with each other, and cooling of different intensities can be performed for loads with different cooling requirements. One or more different cooling devices can be arranged in each installation area according to the type of load. In the installation area where the load is a central processing unit or a graphics processing unit, a spray cooling device and a cold plate cooling device can be arranged for mixed cooling. When the required cooling intensity is average, the cold plate cooling device is used for cooling first to avoid continuous spraying of coolant to cause accumulation and thickening of the liquid film that affects the heat dissipation effect. When a hot spot problem of local overheating occurs, the spray cooling device is started for the hot spot to spray coolant for rapid cooling to avoid the hot spot affecting the operation of the server cooling system.

[0034] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a structural schematic diagram according to an embodiment of the utility model;

[0036] Figure 2 is a structural schematic diagram from another perspective according to an embodiment of the utility model;

[0037] Figure 3 is a structural schematic diagram from another perspective according to an embodiment of the utility model;

[0038] Figure 4 It is a schematic diagram of the cross-sectional structure according to an embodiment of the utility model;

[0039] Figure 5 It is a structural schematic diagram of a cold plate cooling device according to an embodiment of the utility model;

[0040] Figure 6 It is a structural schematic diagram of a spray cooling device according to an embodiment of the utility model.

[0041] Reference numerals

[0042] 1. Spray coolant inlet pipe; 2. Cold plate coolant inlet pipe; 3. Valve; 4. Spray branch pipe; 5. Nozzle; 6. Spray coolant outlet pipe; 7. Cold plate coolant outlet pipe; 8. Insulation plate; 9. Spray cooling inlet hole; 10. Cold plate cooling inlet hole; 11. Power supply; 12. Cold plate cooling outlet hole; 13. Spray cooling outlet hole; 14. Other electronic components; 15. Graphics processor; 16. Central processing unit; 17. Memory stick; 18. Hard disk; 19. Liquid cooling plate; 20. Cold plate inlet hole; 21. Cold plate outlet hole; 22. Liquid collecting port. DETAILED DESCRIPTION

[0043] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0044] Throughout the specification and claims, the following terms have at least the meanings explicitly associated herein, unless the context dictates otherwise. The meanings identified below do not necessarily limit the terms, but merely provide illustrative examples of the terms.

[0045] In the description of the utility model, the phrase "in one embodiment" does not necessarily refer to the same embodiment, although it may refer to the same embodiment. Similarly, the phrase "in some embodiments" as used herein, when used multiple times, does not necessarily refer to the same embodiment, although it may refer to the same embodiment. As used herein, the term "or" is an inclusive "or" operator and is equivalent to the term "and / or", unless the context clearly dictates otherwise. The term "based on" is not exclusive and allows for additional factors not described, unless the context clearly dictates otherwise. The word "exemplary" means "used as an example, instance or illustration" in this article. Any embodiment described as "exemplary" herein is not necessarily interpreted as being superior or superior to other embodiments. The scope of the utility model is limited only by the scope of the appended claims, and any examples set forth in this specification are not intended to be limiting, but only to set forth some of the many possible embodiments of the utility model claimed for protection. The various embodiments provided by the utility model should not be interpreted as limiting the scope of protection of the utility model.

[0046] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0047] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0048] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0050] The rapid development of industries such as Digital China, Industrial Internet, Internet of Things, cloud computing, and artificial intelligence has led to an increase in the use of IT equipment and the density of server cooling systems, while also posing greater challenges to the carrying capacity and energy-saving capabilities of data centers. With the continuous increase in the amount of heat generated per unit space in data centers and the continuous increase in power density, the further application and promotion of traditional cooling methods and technologies have been severely restricted. As an emerging cooling technology for data centers, liquid cooling technology has become the most promising technology for the green development of data centers due to its high heat dissipation efficiency, strong adaptability to harsh environments, low noise, and better ability to reduce PUE values.

[0051] Immersion cooling is the most efficient liquid cooling technology. It removes the heat generated by the data center by completely immersing the server cooling system in liquid. However, this method has high requirements for the sealing of the server cooling system and requires a large amount of coolant. It also has the problems of high cost and difficult maintenance. In addition, due to the complex structure of electronic equipment, dead zones will be formed locally, causing the temperature in this area to be too high.

[0052] Spray liquid cooling does not require high sealing of the server cooling system, and a small amount of coolant can achieve a good cooling effect with a fast cooling speed. However, this method will cause the liquid film to accumulate and become thicker when spraying onto the CPU and memory stick, which will affect the heat exchange effect.

[0053] Currently, cold plate liquid cooling technology is the mainstream liquid cooling technology in current data center applications. However, compared with immersion liquid cooling and spray liquid cooling, which are methods where the coolant directly contacts the heat-generating components for heat exchange, this method has lower heat dissipation efficiency and slower heat dissipation rate. At the same time, it is difficult to solve the hot spot problems that occur in high heat flux density components such as central processing units.

[0054] Based on this, Figure 1-Figure 6 As shown, the server cooling system according to the embodiment of the utility model includes: a cabinet, multiple loads and multiple cooling devices, wherein:

[0055] A variety of cooling devices are used to adapt to the different heating conditions and heat dissipation requirements of various loads;

[0056] A plurality of installation areas separated from each other and heat-insulated from each other are arranged in the cabinet, and each installation area is correspondingly provided with a load and a cooling device corresponding to the type of the load arranged therein.

[0057] Specifically, the installation areas have a certain heat insulation function, which can prevent different loads in each installation area from affecting each other, so that the high-heat-generating load will transfer heat to the low-heat-generating load, thereby heating the low-heat-generating load in disguise and affecting the normal operation of the load.

[0058] One cooling device or two cooling devices can be installed in each installation area to dissipate heat and cool down the load in the installation area. For high-heat-generating loads, such as the CPU 16 and the GPU 15, two cooling devices can be set in the corresponding installation area, which can be a spray cooling device and a cold plate cooling device. In normal operation, when the heat generation is not high, a single cold plate cooling device can be used for cooling, or a cold plate cooling device and a spray device can be used for mixed cooling by spraying a small amount. When the heat generation is high, the cold plate cooling device and the spray device can be operated together with high efficiency to achieve rapid cooling and avoid overheating of the load. For low heat generation, For loads such as the memory stick 17 and the hard disk 18, a cooling device can be provided in the corresponding installation area respectively, which can be a cold plate cooling device or a spray cooling device. The spray cooling device can reduce the spraying amount when cooling the memory stick 17 or the hard disk 18, and cool down by intermittent spraying to reduce the accumulation of liquid film. The power supply 11 and other electronic components 14 can be arranged together in the same installation area and can be cooled by an air cooling device. These electronic components themselves do not generate high heat and are arranged in different installation areas from the central processing unit 16 and the graphics processing unit 15. They will not be affected by high heat loads, and the air cooling device can ensure the normal operation of these electronic components.

[0059] According to the server cooling system of the embodiment of the utility model, a plurality of installation areas are arranged in the cabinet, and each type of load is arranged in an installation area, so that loads of different types will not interfere with each other, and cooling of different intensities can be performed for loads with different cooling requirements. One or more different cooling devices can be arranged in each installation area according to the type of load. In the installation area where the load is the central processing unit 16 or the graphics processing unit 15, a spray cooling device and a cold plate cooling device can be arranged for mixed cooling. When the required cooling intensity is average, the cold plate cooling device is used for cooling first to avoid continuous spraying of coolant to produce liquid film accumulation and thickening that affects the heat dissipation effect. When a hot spot problem of local overheating occurs, the spray cooling device is started for the hot spot to spray coolant for rapid cooling to avoid the hot spot affecting the operation of the server cooling system.

[0060] In some embodiments, multiple cooling devices are configured as follows: each cooling device can be controlled to adopt an adaptive cooling method according to the heating conditions and heat dissipation requirements of the load in the installation area where it is installed, so that the load in the installation area is in an optimal operating temperature range. The cooling method includes the type of cooling device and / or the cooling intensity of the cooling device.

[0061] In some embodiments, the multiple loads include at least a central processing unit or a graphics processing unit or a memory bar or a hard disk;

[0062] The cooling device corresponding to at least one load includes at least a spray cooling device and a cold plate cooling device;

[0063] The cooling device can be controlled to select a spray cooling device and / or a cold plate cooling device according to the heating condition and heat dissipation requirements of the load in the installation area;

[0064] The cooling device can also be controlled to control the cooling intensity of the spray cooling device and / or the cooling intensity of the cold plate cooling device according to the heating condition and heat dissipation demand of the load in the installation area.

[0065] In some embodiments, the load of at least one installation area is a central processing unit 16 or a graphics processing unit 15, and the corresponding cooling device includes a spray cooling device and a cold plate cooling device.

[0066] Specifically, the CPU 16 and the GPU 15 have a high heat generation, which is a load that requires a high heat dissipation. The CPU 16 and the GPU 15 are respectively arranged in an installation area, and each CPU 16 and GPU 15 is cooled by a cold plate cooling device, and a spray cooling device is arranged for auxiliary heat dissipation. When the load of the CPU 16 and the GPU 15 is small and the heat generation is low, the cold plate cooling device can be used alone for heat dissipation. When the load of the CPU 16 and the GPU 15 is high, the spray device is started again, and the spray device is adjusted according to the specific temperature to perform intermittent spraying or full-power spraying. Through the cooperation of the cold plate cooling device and the spray cooling device, the heat dissipation requirements of the CPU 16 and the GPU 15 can be guaranteed while avoiding the accumulation of a large amount of liquid film, avoiding the occurrence of hot spots, affecting the normal operation of the server heat dissipation system, and affecting the working efficiency of the server heat dissipation system. In addition, there is no need to use an immersion cooling device, which can reduce the sealing requirements of the server heat dissipation system, improve the reliability of the server heat dissipation system, and facilitate the maintenance of the server heat dissipation system.

[0067] Among them, there may be an installation area where the load installed is the central processing unit 16 or the graphics processing unit 15, or there may be multiple installation areas for installing the central processing unit 16 or multiple installation areas for installing the graphics processing unit 15, as long as the type of load in each installation area is the same.

[0068] The side wall of the cabinet can reserve a cold plate cooling pipe inlet hole 10, a cold plate cooling pipe outlet hole 12, a spray cooling pipe inlet hole 9 and a spray cooling pipe outlet hole 13 to increase the pipe running space for the cold plate cooling device and the spray cooling device. Corresponding valves 3 can be set in the liquid inlet pipes of the cold plate cooling device and the spray cooling device to control the switch of the cold plate cooling device or the spray cooling device.

[0069] In some embodiments, the load of at least one installation area is a memory bar 17 or a hard disk 18, and the corresponding cooling device includes a spray cooling device or a cold plate cooling device.

[0070] Specifically, when the load is a memory stick 17 or a hard disk 18, only one cooling device can be set in the corresponding installation area, which can be a cold plate cooling device or a spray cooling device. Since the heat generated by the memory stick 17 and the hard disk 18 is relatively small, the cold plate cooling device can meet the heat dissipation requirements and no hot spots will occur. The spray cooling device does not require a large amount of spraying when cooling the memory stick 17 and the hard disk 18. The spraying amount can be reduced or intermittent spraying can be used. In a short period of time, a thick liquid film will not accumulate to affect heat dissipation.

[0071] Moreover, the memory stick 17 and the hard disk 18 are separated by the installation area and will not be affected by the large amount of heat generated by the GPU (graphics processing unit) or the CPU (central processing unit), so that the memory stick 17 and the hard disk 18 can work normally.

[0072] In some embodiments, the load of at least one installation area is a power supply 11, and the corresponding cooling device includes an air cooling device.

[0073] Specifically, when the load is the power supply 11 , a simple air cooling device may be used to dissipate heat. The air cooling device may be a simple fan cooling device that removes heat in the installation area where the power supply 11 is located through the fan.

[0074] Among them, other electronic components 14 can also be separately provided with one or more installation areas and cooled by an air cooling device.

[0075] The power supply 11 and other electronic components 14 are also separated from the CPU (central processing unit) and GPU (graphics processing unit) 15 with higher heat generation through the installation area, thereby preventing the heat generated by other loads from heating the power supply 11 and other electronic components 14. This ensures that the power supply 11 and other electronic components 14, which are loads with low heat generation themselves, will not be affected by other heat sources, thereby further reducing the heat dissipation requirements and ensuring normal operation.

[0076] In some embodiments, the spray cooling device includes: a spray cooling liquid inlet pipe 1, a plurality of spray branch pipes 4, a plurality of nozzles 5, and a spray cooling liquid outlet pipe 6;

[0077] The inlet of the spray branch pipe 4 is connected to the spray coolant inlet pipe 1, and the outlet of the spray branch pipe 4 is connected to the nozzle 5. The nozzle 5 is correspondingly arranged above the central processing unit 16 and the graphics processing unit 15, or the nozzle 5 is rotatably connected to the spray branch pipe 4, and the nozzle 5 can be rotated to the top of the central processing unit 16 or the graphics processing unit 15.

[0078] Specifically, the spray coolant inlet pipe 1 can be connected to an external coolant pipeline, and a liquid pump can be set in the coolant pipeline to allow the coolant to enter the nozzle 5 for spraying. The nozzle 5 can be set corresponding to the central processing unit 16 and the graphics processing unit 15. A nozzle 5 is set above each central processing unit 16 and the graphics processing unit 15, or a plurality of rotatable nozzles 5 can be set above. When the temperature of a central processing unit 16 or a graphics processing unit 15 is too high, the nozzle 5 is rotated to the corresponding position for spraying.

[0079] In some embodiments, the spray cooling device further comprises: a spray cooling liquid outlet pipe 6;

[0080] The spray coolant outlet pipe is arranged on the outer wall of the cabinet, a drainage groove is arranged at the bottom of each installation area, and the spray coolant outlet pipe is provided with a liquid collecting port 22 corresponding to each drainage groove.

[0081] Specifically, the drain trough can collect the coolant at the bottom of each installation area, and the coolant then enters the spray coolant outlet pipe 6 through the collecting port 22 and is discharged through the coolant outlet pipe, thereby preventing the coolant from accumulating at the bottom of the installation area.

[0082] The liquid collecting port extends from the spray cooling outlet hole 13 into the cabinet and into the bottom of the liquid drain tank.

[0083] In some embodiments, the graphics processor 15 and the central processor 16 are both arranged in a vertical direction.

[0084] Specifically, the nozzle 5 sprays the graphics processor 15 or the central processing unit 16 from above the graphics processor 15 or the central processing unit 16, and the graphics processor 15 and the central processing unit 16 are both arranged in the vertical direction. Gravity can be used to avoid the formation of liquid film in the spray cooling process, reduce the formation of liquid film, and improve heat exchange efficiency.

[0085] In some embodiments, the cold plate cooling device includes: a cold plate cooling liquid inlet pipe 2, a cold plate cooling liquid outlet pipe 7 and a plurality of liquid cooling plates 19;

[0086] The inlet and outlet of the liquid cooling plate 19 are respectively connected to the cold plate coolant inlet pipe 2 and the cold plate coolant outlet pipe. The liquid cooling plate 19 is correspondingly arranged on each central processing unit 16 or graphics processing unit 15.

[0087] Specifically, the cold plate heat exchange device can connect the liquid cooling plate 19 with the coolant pipeline through the cold plate coolant inlet pipe 2 and the cold plate coolant outlet pipe 7. By circulating the coolant, the liquid cooling plate 19 can quickly take away the heat in the load and provide stable and continuous cooling for the load.

[0088] In some embodiments, a plurality of heat insulation boards 8 are disposed in the cabinet. The heat insulation boards 8 are arranged at intervals in the horizontal direction, and every two adjacent heat insulation boards 8 separate the cabinet into an installation area.

[0089] Specifically, the insulation board 8 can be made of insulation material so that the insulation board 8 has good insulation performance, and the multiple insulation boards 8 arranged in the horizontal direction in the cabinet can divide the space in the cabinet into multiple installation areas with insulation effect. The heat in each installation area will not be transferred to each other, avoiding the influence of high heat load on low heat load.

[0090] Embodiment 2

[0091] The embodiment of the present application also provides a control method for a server heat dissipation system, wherein the server heat dissipation system includes a plurality of installation areas separated from each other and heat-insulated from each other in a cabinet, each installation area correspondingly provided with a load and a cooling device corresponding to the load type provided therein;

[0092] The load is a central processing unit 16 or a graphics processing unit 15; the cooling device includes a spray cooling device and a cold plate cooling device;

[0093] Control methods include:

[0094] respectively obtaining the temperatures of the central processing unit 16 and the graphics processing unit 15;

[0095] When the CPU 16 and / or the GPU 15 reaches a preset temperature, the cooling intensity of the CPU 16 and / or the GPU 15 is increased by the spray cooling device and the cold plate cooling device.

[0096] Specifically, a temperature control controller can be set up to electrically connect each cooling device and each load to the temperature control controller. The temperature control controller can control the opening and closing of each cooling device and the cooling efficiency according to the temperature of each load, thereby controlling the cooling intensity in each installation area.

[0097] Among various loads, the CPU 16 and the GPU 15 generate the largest heat and have the highest cooling requirements. The cooling intensity of the CPU 16 and the GPU 15 can be adjusted by adjusting the real-time temperature of the CPU 16 and the GPU 15 to meet the heat dissipation requirements of the CPU 16 and the GPU 15 without generating hot spots and reducing the accumulation of liquid film.

[0098] In some embodiments, the cooling intensity of the CPU 16 and / or the GPU 15 is improved by using a spray cooling device and a cold plate cooling device, including:

[0099] Turn on the spraying device to make the nozzle 5 at the corresponding position spray the coolant or rotate the nozzle 5 to the corresponding position to spray the coolant.

[0100] Specifically, in order to avoid hot spots in the CPU 16 and the GPU 15 and affect work efficiency, the temperatures of the CPU 16 and the GPU 15 can be obtained to determine the cooling intensity required for the CPU 16 and the GPU 15. When the required cooling intensity is low, the cold plate cooling device can be turned on separately. When the required cooling intensity is average, the spray device can be turned on intermittently while the cold plate cooling device is turned on. When the required cooling intensity is high, the spray device can be turned on all the time while the cold plate cooling device is turned on. The control method of the server cooling system proposed in the present application can meet the cooling requirements of the CPU 16 and the GPU 15 while avoiding the accumulation of a large amount of liquid film on the surface of the CPU 16 and the GPU 15 and affecting the cooling efficiency of the CPU 16 and the GPU 15.

[0101] Among them, Figures 1 to 4 As shown in any of the accompanying drawings, a single layer of server cooling system in the present invention is shown. Server cooling systems and switches are vertically stacked layer by layer to form a vertically placed server cabinet.

[0102] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0103] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A server cooling system, characterized in that: The heat dissipation system includes a cabinet, multiple loads and multiple cooling devices, wherein: The multiple cooling devices are used to adapt to different heating conditions and heat dissipation requirements of the multiple loads; The cabinet is provided with a plurality of installation areas which are separated from each other and insulated from each other, and each of the installation areas is provided with a type of the load and a cooling device corresponding to the type of the load.

2. The server cooling system according to claim 1, characterized in that: The various cooling devices are configured as follows: Each of the cooling devices can be controlled to adopt an adaptive cooling method according to the heating conditions and heat dissipation requirements of the load in the installation area where it is installed, so that the load in the installation area is in the optimal operating temperature range. The cooling method includes the cooling device type and / or the cooling intensity of the cooling device.

3. The server cooling system according to claim 1, characterized in that: The multiple loads at least include a central processing unit (16) or a graphics processing unit (15) or a memory bar (17) or a hard disk (18); The cooling device corresponding to at least one of the loads comprises at least a spray cooling device and a cold plate cooling device; The cooling device can be controlled to select a spray cooling device and / or a cold plate cooling device according to the heating condition and heat dissipation demand of the load in the installation area; The cooling device can also be controlled to control the cooling intensity of the spray cooling device and / or the cooling intensity of the cold plate cooling device according to the heating condition and heat dissipation demand of the load in the installation area.

4. The server cooling system according to claim 1, characterized in that: The load of at least one of the installation areas is a central processing unit (16) or a graphics processing unit (15), and the corresponding cooling device includes a spray cooling device and a cold plate cooling device.

5. The server cooling system according to claim 1, characterized in that: The load of at least one of the installation areas is a memory bar (17) or a hard disk (18), and the corresponding cooling device comprises a spray cooling device or a cold plate cooling device.

6. The server cooling system according to claim 4, characterized in that: The spray cooling device comprises: a spray cooling liquid inlet pipe (1), a plurality of spray branch pipes (4), a plurality of nozzles (5), and a spray cooling liquid outlet pipe (6); The inlet of the spray branch pipe (4) is connected to the spray coolant inlet pipe (1), and the outlet of the spray branch pipe (4) is connected to the nozzle (5). The nozzle (5) is arranged above the central processing unit (16) and the graphics processing unit (15) respectively, or the nozzle (5) is rotatably connected to the spray branch pipe (4), and the nozzle (5) can be rotated to the top of the central processing unit (16) or the graphics processing unit (15).

7. The server cooling system according to claim 6, characterized in that: include: The spray cooling device further comprises: a spray cooling liquid outlet pipe (6); The spray coolant outlet pipe is arranged on the outer wall of the cabinet, a drainage groove is arranged at the bottom of each installation area, and the spray coolant outlet pipe is provided with a liquid collecting port (22) corresponding to each drainage groove.

8. The server cooling system according to claim 4, characterized in that: The graphics processor (15) and the central processor (16) are both arranged in a vertical direction.

9. The server cooling system according to claim 4, characterized in that: include: The cold plate cooling device comprises: a cold plate cooling liquid inlet pipe (2), a cold plate cooling liquid outlet pipe (7) and a plurality of liquid cooling plates (19); The inlet and outlet of the liquid cooling plate (19) are respectively connected to the cold plate cooling liquid inlet pipe (2) and the cold plate cooling liquid outlet pipe, and the liquid cooling plate (19) is correspondingly arranged on each of the central processing unit (16) or the graphics processing unit (15).

10. The server cooling system according to claim 1, characterized in that: The load of at least one of the installation areas is a power source (11), and the corresponding cooling device comprises an air cooling device.

11. The server cooling system according to claim 1, characterized in that: include: A plurality of heat insulation boards (8) are arranged in the cabinet, and the heat insulation boards (8) are arranged at intervals in the horizontal direction, and every two adjacent heat insulation boards (8) divide the cabinet into one installation area.

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