Electronic device

Abstract

The utility model provides electronic equipment, and relates to the field of electronic equipment. The electronic equipment comprises a heating component; the fan assembly is arranged towards the heating component so as to directly blow airflow to the heating component; the shell is internally provided with the heating component and the fan assembly, the shell is provided with a ventilation opening, the ventilation opening is located in the side, away from the fan assembly, of the heating component, and the fan assembly exhausts airflow blown to the heating component through the ventilation opening.

Description

Technical Field

[0001] The present application relates to the field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] When a laptop is in use, the internal components will generate heat. If the heat cannot be discharged in time, it will affect the user experience.

[0003] Currently, the heat from the heat source is brought to the fan assembly through the heat dissipation module, and then the fan assembly blows out wind to take away the temperature through the heat dissipation fins. However, there is a certain distance from the heat source to the fan assembly, which affects the heat dissipation efficiency of the heat dissipation module.

[0004] Therefore, how to provide a structure that can improve heat dissipation efficiency becomes an urgent problem to be solved. Utility Model Content

[0005] The purpose of this application is to provide an electronic device.

[0006] In order to solve the above technical problems, the embodiments of the present application provide the following technical solutions:

[0007] A first aspect of the present application provides an electronic device, including:

[0008] Heat generating components;

[0009] A fan assembly, wherein the fan assembly is arranged toward the heat-generating component to blow airflow directly toward the heat-generating component;

[0010] A shell, wherein the heat-generating component and the fan assembly are arranged in the shell, and a vent is arranged on the shell, wherein the vent is located on a side of the heat-generating component away from the fan assembly, and the fan assembly discharges the airflow blown toward the heat-generating component through the vent.

[0011] In some modified implementations of the first aspect of the present application, the following further includes:

[0012] A heat dissipation structure is connected to the heat-generating component, and an orthographic projection of the heat dissipation structure along a first direction at least partially covers the heat-generating component.

[0013] In some modified implementations of the first aspect of the present application, the heat dissipation structure includes:

[0014] A heat conducting member connected to the heat generating component and arranged between the fan assembly and the vent to discharge the heat generated by the heat generating component and the heat conducted by the heat conducting member through the vent.

[0015] In some modified implementations of the first aspect of the present application, the heat dissipation structure further includes:

[0016] The heat dissipation fins are connected to the heat conducting member, and the heat dissipation channel formed by the heat dissipation fins has a first opening and a second opening, the first opening faces the fan assembly, and the second opening faces the vent.

[0017] In some modified implementations of the first aspect of the present application, the following further includes:

[0018] An air guiding structure is connected with the fan assembly to form an air guiding area, and the heat generating component is located in the air guiding area.

[0019] In some modified implementations of the first aspect of the present application, the fan assembly includes at least one fan, and the at least one fan corresponds to the wind guide area formed by the wind guide structure.

[0020] In some modified implementations of the first aspect of the present application, the fan assembly comprises a plurality of fans, and the plurality of fans face the same direction and face the vent.

[0021] In some modified implementations of the first aspect of the present application, the heat generating component includes at least a first heat generating component and a second heat generating component;

[0022] The wind guide structure includes a partition plate for separating the first heat-generating component and the second heat-generating component to at least form a first wind guide area corresponding to the first heat-generating component and a second wind guide area corresponding to the second heat-generating component.

[0023] In some modified implementations of the first aspect of the present application, the first wind guiding area and the second wind guiding area are connected to the vent; or

[0024] The first wind guiding area and the second wind guiding area are communicated with the corresponding first ventilation opening and second ventilation opening respectively.

[0025] In some modified implementations of the first aspect of the present application, the more heat the heat-generating component generates, the faster the rotation speed of the fan assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become easy to understand. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0027] Figure 1 The schematic diagram schematically shows the internal structure of an electronic device provided by an embodiment of the present application;

[0028] Figure 2 A schematic diagram of the internal structure of another electronic device provided in an embodiment of the present application is schematically shown;

[0029] Figure 3 The following schematically shows a structural diagram of another electronic device provided in an embodiment of the present application;

[0030] Figure 4 The following schematically shows a structural diagram of another electronic device provided in an embodiment of the present application;

[0031] Figure 5 The following schematically shows a structural diagram of another electronic device provided in an embodiment of the present application;

[0032] Figure 6 A schematic diagram of the internal structure of another electronic device provided in an embodiment of the present application is schematically shown.

[0033] Description of Figure Numbers:

[0034] Electronic device 1, heat-generating component 11, first heat-generating component 111, second heat-generating component 112, fan assembly 12, first fan 121, second fan 122, housing 13, vent 131, heat dissipation structure 14, heat-conducting member 141, heat dissipation fins 142, wind guide structure 15. DETAILED DESCRIPTION

[0035] The exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present application and to fully convey the scope of the present application to those skilled in the art.

[0036] like Figures 1 to 6 As shown, the present application provides an electronic device 1, including:

[0037] Heat generating component 11;

[0038] A fan assembly 12, wherein the fan assembly 12 is disposed toward the heat-generating component 11 to blow air directly toward the heat-generating component 11;

[0039] The shell 13 has the heat generating component 11 and the fan assembly 12 disposed therein. The shell 13 has a vent 131 disposed thereon. The vent 131 is located on a side of the heat generating component 11 away from the fan assembly 12. The fan assembly 12 discharges the airflow blown toward the heat generating component 11 through the vent 131.

[0040] An electronic device 1 provided in an embodiment of the present application comprises a heating component 11, a fan assembly 12 and a housing 13. The heating component 11 and the fan assembly 12 are arranged in the housing 13. The heating component 11 generates heat when working. The fan assembly 12 is arranged toward the heating component 11. The housing 13 has a vent 131. The heating component 11 is arranged near the vent 131, and the two opposite sides of the heating component 11 respectively have the fan assembly 12 and the vent 131. Thus, when the heating component 11 generates heat, the airflow of the fan assembly 12 can be blown directly toward the heating component 11, and the airflow is discharged from the vent of the housing 13 after passing through the heating component 11, thereby reducing the distance from the heating component 11 to the fan assembly 12.

[0041] Therefore, in an electronic device 1 provided by the present application, the airflow of the fan assembly 12 is blown directly toward the heat-generating component 11, and then the airflow carrying the heat of the heat-generating component 11 is directly discharged from the vent 131 of the shell 13, thereby reducing the heat dissipation path and improving the heat dissipation efficiency.

[0042] like Figures 3 to 5 As shown, in the embodiment of the present application, it also includes:

[0043] The heat dissipation structure 14 is connected to the heat-generating component 11 , and the orthographic projection of the heat dissipation structure 14 along the first direction at least partially covers the heat-generating component 11 .

[0044] In this embodiment, the electronic device 1 includes a heat generating component 11, a fan assembly 12, a heat dissipation structure 14 and a housing 13. The housing 13 is provided with the heat generating component 11, the fan assembly 12 and the heat dissipation structure 14. The housing 13 has a vent 131. The heat generating component 11 and the heat dissipation structure 14 are both provided between the fan assembly 12 and the vent 131 of the housing 13. The heat dissipation structure 14 is connected to the heat generating component 11, and the orthographic projection of the heat dissipation structure 14 along the first direction at least covers the heat generating component 11, and the first direction is a direction perpendicular to the heat generating component 11, that is, the heat dissipation component is located above the heat generating component 11 and at least covers the heat generating component 11, so that part of the heat of the heat generating component 11 can be transferred to the heat dissipation structure 14 for heat dissipation. Therefore, the heat generated by the heat generating component 11 can be blown by the airflow of the fan assembly 12 and discharged from the vent 131 of the housing 13, and can also be dissipated through the heat dissipation structure 14, which increases the heat dissipation mode, thereby further improving the heat dissipation efficiency.

[0045] like Figures 3 to 5 As shown, in the embodiment of the present application, the heat dissipation structure 14 includes:

[0046] The heat conductive member 141 is connected to the heat generating component 11 , and is disposed between the fan assembly 12 and the vent 131 to discharge the heat generated by the heat generating component 11 and the heat conducted by the heat conductive member 141 through the vent 131 .

[0047] In this embodiment, the heat dissipation structure 14 includes a heat conductor 141, which is a heat pipe or a heat spreader. The heat pipe or the heat spreader is connected to the heat-generating component 11, so as to receive the heat generated by the heat-generating component 11, and the heat conductor 141 is also arranged between the fan assembly 12 and the vent 131, so that after absorbing the heat of the heat-generating component 11, the heat of the heat conductor 141 is discharged from the vent 131 of the shell 13 through the airflow blown by the fan assembly 12, thereby increasing the heat dissipation path of the heat-generating component 11 and improving the heat dissipation efficiency.

[0048] like Figures 3 to 5 As shown, in the embodiment of the present application, the heat dissipation structure 14 further includes:

[0049] The heat dissipation fins 142 are connected to the heat conducting member 141 , and the heat dissipation channel formed by the heat dissipation fins 142 has a first opening and a second opening, wherein the first opening faces the fan assembly 12 , and the second opening faces the vent 131 .

[0050] In this embodiment, the heat dissipation structure 14 includes a heat conductor 141 and heat dissipation fins 142. The heat conductor 141 is a heat pipe or a heat spreader. The heat conductor 141 is connected to the heat-generating component 11 to receive the heat generated by the heat-generating component 11. The heat dissipation fins 142 are connected to the heat conductor 141, and the heat dissipation fins 142 have multiple heat dissipation channels. The heat dissipation channels have a first opening and a second opening. The first opening is connected to the heat conductor 141, and the first opening is set toward the fan assembly 12. The first opening is set toward the vent 131. The extension direction of the heat dissipation channel is the same as the airflow direction of the fan assembly 12. Therefore, when the fan assembly 12 is turned on, the heat of the heat-generating component 11 absorbed by the heat conductor 141 can be discharged from the vent 131 of the shell 13 through the heat dissipation channel of the heat dissipation fins 142 under the action of the fan assembly 12, thereby improving the heat dissipation efficiency.

[0051] In this embodiment, if Figure 5As shown, the heat dissipation structure 14 is connected to 12, and the heat dissipation structure 14 includes 142. The heat dissipation fins 142 can also be directly connected to the fan assembly 12. A heat dissipation channel is formed between two adjacent heat dissipation fins 142. The heat dissipation channel has a first opening and a second opening. The first opening is arranged toward the fan assembly 12, and the second opening is arranged toward the vent 131 of the housing 13. A heat-generating component 11 is arranged below the heat dissipation fins 142, so that heat is dissipated through the heat dissipation fins 142. And the end of the heat dissipation fin 142 located at the edge connected to the fan assembly 12 has a triangular structure toward the outside, so that the range of the heat dissipation channel formed is larger, so that the heat dissipation effect is better.

[0052] like Figure 2 As shown, in the embodiment of the present application, it also includes:

[0053] The wind guiding structure 15 is connected with the fan assembly 12 to form a wind guiding area, and the heat generating component 11 is located in the wind guiding area.

[0054] In this embodiment, the electronic device 1 includes a heat-generating component 11, a fan assembly 12, an air-guiding structure 15 and a shell 13. The heat-generating component 11, the fan assembly 12 and the air-guiding structure 15 are arranged in the shell 13. The shell 13 has a vent 131. The heat-generating component 11 is arranged between the fan assembly 12 and the vent 131 of the shell 13, and the air-guiding structure 15 is connected to the fan assembly 12 to form an air-guiding area. The heat-generating component 11 is located in the air-guiding area. The other end of the original fan in the air-guiding area is arranged toward the vent 131 of the shell 13, and the extension direction of the air-guiding area is the same as the airflow direction of the fan assembly 12, so that the airflow of the fan assembly 12 can be blown to the heat-generating component 11 through the air-guiding area, and then the heat of the heat-generating component 11 is blown out from the vent 131 of the shell 13. The formation of the air-guiding area can provide a guiding effect for the airflow direction of the fan assembly 12, thereby ensuring the airflow flow of the fan assembly 12 to the heat-generating component 11, thereby improving the heat dissipation effect.

[0055] In the embodiment of the present application, the fan assembly 12 includes at least one fan, and the at least one fan corresponds to the wind guide area formed by the wind guide structure 15 .

[0056] In this embodiment, the electronic device 1 includes a heat-generating component 11, a fan assembly 12, an air guide structure 15 and a shell 13. The heat-generating component 11, the fan assembly 12 and the air guide structure 15 are arranged in the shell 13. The shell 13 has a vent 131. The heat-generating component 11 is arranged between the fan assembly 12 and the vent 131 of the shell 13, and the air guide structure 15 is connected to the fan assembly 12 to form an air guide area. The air guide structure 15 is foam. The heat-generating component 11 is located in the air guide area. The fan assembly 12 includes at least one fan, and at least one fan corresponds to the air guide area formed by the air guide structure 15, so that the airflow of at least one fan can be blown to the air guide area. After entering the air guide area, the airflow blows toward the heat-generating component 11, and then blows the heat of the heat-generating component 11 out of the vent 131 of the shell 13, thereby ensuring the airflow flow of the fan assembly 12 to the heat-generating component 11, thereby improving the heat dissipation effect.

[0057] like Figures 1 to 5 As shown, in the embodiment of the present application, the fan assembly 12 is a plurality of fans, and the plurality of fans are oriented in the same direction and toward the vent 131 .

[0058] In this embodiment, the fan assembly 12 may include one fan or multiple fans. When there is one fan, the fan blows toward the vent 131. The air guide structure 15 is arranged between the fan and the vent 131 and is connected to the fan, so that the air guide structure 15 is connected to the fan to form an air guide area, so that the fan can blow toward the air guide area, so that the heat-generating component 11 in the air guide area is blown by the airflow, and then the airflow takes away the heat of the heat-generating component 11 and discharges it from the vent 131 of the housing 13. When there are multiple fans, the multiple fans have the same direction and are all arranged toward the vent 131. The air guide structure 15 is arranged between the multiple fans and the vent 131, and the multiple fans all blow toward the air guide area formed by the air guide structure 15 and the fan assembly 12, so that the heat-generating component 11 in the air guide area can be blown by multiple fans, thereby increasing the flow rate of the airflow, so that the heat of the heat-generating component 11 is higher and faster discharged from the vent 131 of the housing 13 through the blowing of the airflow of multiple fans, thereby further improving the heat dissipation effect.

[0059] like Figure 1 As shown, in the embodiment of the present application, the heat generating component 11 at least includes a first heat generating component 111 and a second heat generating component 112;

[0060] The air guide structure 15 includes a partition plate for separating the first heat-generating component 111 and the second heat-generating component 112 to at least form a first air guide area corresponding to the first heat-generating component 111 and a second air guide area corresponding to the second heat-generating component 112 .

[0061] In this embodiment, the electronic device 1 includes a heat-generating component 11, a fan assembly 12, an air guide structure 15 and a shell 13. The heat-generating component 11, the fan assembly 12 and the air guide structure 15 are arranged in the shell 13. The shell 13 has a vent 131. The heat-generating component 11 is arranged between the fan assembly 12 and the vent 131 of the shell 13. The heat-generating component 11 includes a first heat-generating component 111 and a second heat-generating component 112. The air guide structure 15 includes a partition, which separates the first heat-generating component 111 and the second heat-generating component 112, thereby forming a first air guide area having the first heat-generating component 111 and a second air guide area having the second heat-generating component 112.

[0062] In one embodiment of the present application, the fan assembly 12 may include a fan, which is connected to both the first air guide area and the second air guide area, so as to blow air to the first air guide area and the second air guide area at the same time, so that the air flow passes through the first air guide area and the second air guide area at the same time to take away the heat of the first heat-generating component 111 in the first air guide area and the second heat-generating component 112 in the second air guide area, and discharge it from the vent 131 of the shell 13.

[0063] In another embodiment of the present application, the fan assembly 12 may also be two or more, so that at least one fan is correspondingly arranged in each of the first air guide area and the second air guide area, so that the fans corresponding to the first air guide area and the second air guide area can blow air respectively according to the heating intensity of the first heating component 111 and the second heating component 112 in the first air guide area and the second air guide area. If the first heating component 111 generates heat, the fan corresponding to the first heat conduction area rotates to blow air to the first heating component 111 in the first heat conduction area, and blows the heat of the first heating component 111 to the vent 131, so as to dissipate heat for the first heating component 111; if the second heating component 112 generates heat, the fan corresponding to the second air guide area rotates to blow air to the second heating component 112 in the second air guide area, and blows the heat of the second heating component 112 to the vent 131, so as to dissipate heat for the second heating component 112. Thus, the first heating component 111 and the second heating component 112 can dissipate heat simultaneously or separately.

[0064] In this embodiment, the number of fans corresponding to the first air guide area and the second air guide area can also be set according to the heating intensity of the first heat-generating component 111 and the second heat-generating component 112 in the first air guide area and the second air guide area. The greater the heating intensity, the more heat is generated, and the corresponding number of fans is also greater, thereby achieving better heat dissipation.

[0065] In the embodiment of the present application, the first air guide area and the second air guide area are connected to the vent 131; or

[0066] The first wind guiding area and the second wind guiding area are communicated with the corresponding first ventilation opening and second ventilation opening respectively.

[0067] In this embodiment, the electronic device 1 includes a heat-generating component 11, a fan assembly 12, an air guide structure 15 and a shell 13. The heat-generating component 11, the fan assembly 12 and the air guide structure 15 are arranged in the shell 13. The shell 13 has a vent 131. The heat-generating component 11 is arranged between the fan assembly 12 and the vent 131 of the shell 13. The heat-generating component 11 includes a first heat-generating component 111 and a second heat-generating component 112. The air guide structure 15 includes a partition, which separates the first heat-generating component 111 and the second heat-generating component 112, thereby forming a first air guide area with the first heat-generating component 111 and a second air guide area with the second heat-generating component 112. The fan assembly 12 blows air to the first air guide area and the second air guide area, so that the heat of the heat-generating component 11 can be discharged from the vent 131 of the shell 13 under the blowing of the airflow of the fan assembly 12.

[0068] In one embodiment of the present application, there may be only one vent 131 , and the first air guide area and the second air guide area are both arranged corresponding to the vent 131 , so that the heat of the heat-generating component 11 is discharged from the vent 131 .

[0069] In another embodiment of the present application, there are two vents 131, including a first vent and a second vent, the first vent corresponds to the first air guide area, and the second vent corresponds to the second air guide area, so that the airflow blown by the fan assembly 12 to the first air guide area and the second air guide area is discharged through the first vent and the second vent respectively, so as to ensure the discharge speed of the airflow in the first air guide area and the second air guide area, thereby improving the heat dissipation efficiency.

[0070] In the embodiment of the present application, the more heat the heat generating component 11 generates, the faster the rotation speed of the fan assembly 12 is.

[0071] In this embodiment, the electronic device 1 includes a heat-generating component 11, a fan assembly 12, an air guide structure 15 and a shell 13. The heat-generating component 11, the fan assembly 12 and the air guide structure 15 are arranged in the shell 13. The shell 13 has a vent 131. The heat-generating component 11 is arranged between the fan assembly 12 and the vent 131 of the shell 13. The heat-generating component 11 includes a first heat-generating component 111 and a second heat-generating component 112. The air guide structure 15 includes a partition, which separates the first heat-generating component 111 and the second heat-generating component 112, thereby forming a first air guide area with the first heat-generating component 111 and a second air guide area with the second heat-generating component 112. The fan assembly 12 includes a first fan 121 and a second fan 122, and the two fans correspond to the first air guide area and the second air guide area respectively. The vent 131 of the shell 13 includes a first vent and a second vent, and the first air guide area and the second air guide area are connected to the first vent and the second vent respectively. Thus, the first fan 121 blows air to the first air guide area to discharge the heat of the first heating component 111 in the first air guide area through the first vent; thus, the second fan 122 blows air to the second air guide area to discharge the heat of the second heating component 112 in the second air guide area through the second vent; when the heat generated by the first heating component 111 and the second heating component 112 is different, the rotation speeds of the first fan 121 and the second fan 122 are also different, and the more heat the heating component 11 generates, the faster the rotation speed of the fan assembly 12 is; correspondingly, when the heat generated by the first heating component 111 and the second heating component 112 is different, the sizes of the first vent and the second vent are also different, and the more heat the heating component 11 generates, the larger the size of the vent 131 is. Thus, the rotation speeds of the first fan 121 and the second fan 122 can be set according to the heat generated by the first heating component 111 and the second heating component 112, and the sizes of the corresponding first vent and the second vent can be set, so as to better achieve heat dissipation and improve the heat dissipation effect.

[0072] In this embodiment, the first heat-generating component 111 and the second heat-generating component 112 may be a CPU and a GPU, or may be other heat-generating components.

[0073] Therefore, in an electronic device 1 provided by the present application, the airflow of the fan assembly 12 is blown directly toward the heat-generating component 11, and then the airflow carrying the heat of the heat-generating component 11 is directly discharged from the vent 131 of the shell 13, thereby reducing the length of the heat dissipation path, reducing the weight of the heat dissipation module, and improving the heat dissipation efficiency, thereby reducing the temperature of the keyboard part, and blowing inside the fan assembly 12 will reduce noise and enhance the user experience.

[0074] It is understandable that the related features in the above devices can be referenced to each other. In addition, the "first", "second" and the like in the above embodiments are used to distinguish the various embodiments, and do not represent the advantages and disadvantages of the various embodiments.

[0075] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. In some instances, well-known structures and technologies are not shown in detail so as not to obscure the understanding of this description.

[0076] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An electronic device, characterized in that: include: Heat generating components; A fan assembly, wherein the fan assembly is arranged toward the heat-generating component to blow airflow directly toward the heat-generating component; A shell, wherein the heat-generating component and the fan assembly are arranged in the shell, and a vent is arranged on the shell, wherein the vent is located on a side of the heat-generating component away from the fan assembly, and the fan assembly discharges the airflow blown toward the heat-generating component through the vent.

2. The electronic device according to claim 1, characterized in that: Also includes: A heat dissipation structure is connected to the heat-generating component, and an orthographic projection of the heat dissipation structure along a first direction at least partially covers the heat-generating component.

3. The electronic device according to claim 2, characterized in that: The heat dissipation structure comprises: A heat conducting member connected to the heat generating component and arranged between the fan assembly and the vent to discharge the heat generated by the heat generating component and the heat conducted by the heat conducting member through the vent.

4. The electronic device according to claim 3, characterized in that: The heat dissipation structure also includes: The heat dissipation fins are connected to the heat conducting member, and the heat dissipation channel formed by the heat dissipation fins has a first opening and a second opening, the first opening faces the fan assembly, and the second opening faces the vent.

5. The electronic device according to claim 1, characterized in that: Also includes: An air guiding structure is connected with the fan assembly to form an air guiding area, and the heat generating component is located in the air guiding area.

6. The electronic device according to claim 5, characterized in that: The fan assembly includes at least one fan, and the at least one fan corresponds to the wind guide area formed by the wind guide structure.

7. The electronic device according to claim 1, characterized in that: The fan assembly comprises a plurality of fans, and the plurality of fans face the same direction and face the vent.

8. The electronic device according to claim 5, characterized in that: The heat generating component comprises at least a first heat generating component and a second heat generating component; The wind guide structure includes a partition plate for separating the first heat-generating component and the second heat-generating component to at least form a first wind guide area corresponding to the first heat-generating component and a second wind guide area corresponding to the second heat-generating component.

9. The electronic device according to claim 8, characterized in that: The first air guiding area and the second air guiding area are in communication with the vent; or The first wind guiding area and the second wind guiding area are communicated with the corresponding first ventilation opening and second ventilation opening respectively.

10. The electronic device according to claim 1 or 9, characterized in that: The more heat the heat generating component generates, the faster the rotation speed of the fan assembly increases.

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