Heat conduction and heat dissipation structure of internal storage liquid cooling heat pipe

Abstract

The utility model discloses a memory liquid-cooled heat pipe heat conduction and heat dissipation structure, and relates to the technical field of server memory heat dissipation, a heat conduction pipe comprises a connecting part, a heat conduction part and a heat transfer part, and the heat conduction part is attached to a heating area of a memory bank and is used for absorbing heat of the memory bank; the heat pipe support is provided with a limiting slot, and the connecting part of the heat conduction pipe is connected with the limiting slot in an inserted mode; a heat conduction slot is formed in the top of the liquid cooling seat, the heat transfer part of the heat conduction pipe is connected with the heat conduction slot in an inserted mode, the liquid cooling seat comprises a liquid inlet water nozzle, a liquid outlet water nozzle and a liquid cooling cavity, and the heat conduction slot is located above the liquid cooling cavity. According to the memory liquid cooling heat pipe heat conduction and heat dissipation structure, the heat conduction pipe is matched with the liquid cooling seat to rapidly conduct heat of the heating area of the memory bank and take away heat through the cooling medium, the heat conduction pipe and the liquid cooling equipment of the whole server work together, the heat dissipation efficiency is high, and noise is effectively reduced. The heat conduction efficiency of the heat conduction pipe is higher than the heat transfer efficiency of an existing heat dissipation waistcoat or heat dissipation plate, and a higher heat dissipation effect is achieved in a limited space.

Description

Technical Field

[0001] The utility model relates to the technical field of server memory heat dissipation, in particular to a memory liquid cooling heat pipe heat conduction heat dissipation structure. Background Art

[0002] As server performance improves, the frequency and performance supported by memory sticks are also getting higher and higher, which increases the heat of the server and requires improved heat dissipation efficiency. Currently, memory sticks are usually cooled by air, relying on fans to blow in cold air to remove the heat from the memory sticks. As the frequency, capacity, and performance of memory sticks continue to increase, the power consumption of memory sticks increases. The existing air cooling method can no longer meet the needs of high-power memory sticks for heat dissipation, which has become one of the important reasons restricting the performance improvement of memory sticks.

[0003] CN202210069224.2 discloses a liquid cooling heat dissipation device for DIMM, including a frame, a plurality of liquid cooling plates, a water inlet pipe and a water outlet pipe, the water inlet pipe and the water outlet pipe are respectively connected to opposite sides of the frame, the liquid cooling plate is vertically and parallelly spaced inside the frame, one end of the liquid cooling plate is connected to the side where the water inlet pipe is located, and the other end of the liquid cooling plate is connected to the side where the water outlet pipe is located, the water inlet pipe, the frame, the liquid cooling plate and the water outlet pipe are connected to each other, the liquid enters from the water inlet pipe and flows to the frame, the liquid cooling plate and the frame in turn, and finally flows out from the water outlet pipe.

[0004] Existing server memory modules usually use heat sinks and internal cooling fans to remove heat, which results in high fan power consumption and prominent noise issues. Using liquid cooling to dissipate heat for memory modules in servers requires overcoming the space utilization of the heat dissipation structure. Memory modules are often arranged very densely, which cannot provide enough space for heat dissipation, limiting the heat dissipation of the memory. Ensuring the liquid cooling efficiency of memory modules in a limited space has become the main direction of improvement. Utility Model Content

[0005] The utility model aims to at least solve the technical problems existing in the prior art of "low heat dissipation efficiency of high-performance memory sticks inside servers, high energy consumption of air cooling, high noise, and spatial layout problems of heat dissipation components". To this end, the utility model proposes a memory liquid cooling heat pipe heat conduction and heat dissipation structure, which uses a heat pipe to efficiently conduct heat to the memory stick and quickly removes heat through liquid cooling, has high heat dissipation efficiency, effectively reduces noise, and reasonably utilizes limited space to improve heat dissipation efficiency.

[0006] According to some embodiments of the present invention, a liquid-cooled heat pipe heat conduction and heat dissipation structure includes:

[0007] A heat pipe, the heat pipe comprising a connecting portion, a heat conducting portion and a heat transfer portion, the heat conducting portion being attached to a heat generating area of ​​the memory bar to absorb heat from the memory bar;

[0008] The heat pipe bracket is provided with a limiting slot, and the connecting portion of the heat pipe is plugged into the limiting slot;

[0009] A liquid cooling seat is provided with a heat-conducting slot on the top, the heat transfer part of the heat-conducting pipe is plugged into the heat-conducting slot, the liquid cooling seat includes a liquid inlet nozzle and a liquid outlet nozzle, and a liquid cooling cavity connected to the liquid inlet nozzle and the liquid outlet nozzle is provided inside the liquid cooling seat, the heat-conducting slot is located above the liquid cooling cavity, and the heat of the heat-conducting pipe is transferred to the liquid cooling seat and then taken away by the cooling medium in the liquid cooling cavity.

[0010] According to some embodiments of the present invention, a thermal conductive paste is attached to the heat conductive portion, and the thermal conductive paste covers the heat generating area of ​​the memory stick.

[0011] According to some embodiments of the present utility model, the cross-section of the heat-conducting pipe is in the shape of a flat tube, the thickness of the heat-conducting pipe is 2.0 mm to 2.5 mm, and the wall thickness of the heat-conducting pipe is 0.3 mm to 0.5 mm.

[0012] According to some embodiments of the present invention, the liquid cooling seat comprises a cold plate lower cover and a cold plate upper cover, and the cold plate lower cover and the cold plate upper cover are connected to form the liquid cooling cavity.

[0013] According to some embodiments of the present invention, the cold plate upper cover and the heat conductive slot are integrally formed, and the heat conductive slot extends upward perpendicularly to the surface of the cold plate upper cover.

[0014] According to some embodiments of the present invention, the cold plate upper cover, the liquid inlet nozzle and the liquid outlet nozzle are integrally formed.

[0015] According to some embodiments of the utility model, a liquid separator is provided in the lower cover of the cold plate, and the liquid separator divides the liquid cooling cavity into a liquid inlet area and a liquid outlet area, the liquid inlet nozzle is connected to the liquid inlet area, the liquid outlet nozzle is connected to the liquid outlet area, and the liquid inlet area is connected to the liquid outlet area.

[0016] According to some embodiments of the present invention, two ends of the liquid separation plate are spaced apart from the side walls of the lower cover of the cold plate.

[0017] According to some embodiments of the present invention, the liquid cooling seat and the heat pipe bracket are respectively provided with a fixing seat for connecting a processor clamp.

[0018] According to some embodiments of the present invention, the bottoms of the liquid cooling seat and the heat pipe bracket are respectively provided with mounting holes.

[0019] According to some embodiments of the utility model, the heat conduction and heat dissipation structure of the memory liquid cooling heat pipe has at least the following beneficial effects: the heat conduction pipe cooperates with the liquid cooling seat to quickly conduct heat to the heat generating area of ​​the memory bar and removes the heat through the cooling medium, and works together with the liquid cooling equipment of the server, with high heat dissipation efficiency and effective noise reduction. The heat conduction efficiency of the heat conduction pipe is higher than the heat transfer efficiency of the existing heat dissipation vest or heat dissipation plate, and a higher heat dissipation effect is achieved in a limited space.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0022] Figure 1 It is a first stereoscopic schematic diagram of the heat conduction and heat dissipation structure of the internal liquid cooling heat pipe according to an embodiment of the utility model;

[0023] Figure 2 This is a second stereoscopic schematic diagram of the heat conduction and heat dissipation structure of the internal liquid cooling heat pipe according to an embodiment of the utility model;

[0024] Figure 3 It is a partial cross-sectional view of the heat conduction and heat dissipation structure of the internal liquid cooling heat pipe in the embodiment of the utility model;

[0025] Figure 4 This is an exploded schematic diagram of the heat conduction and heat dissipation structure of the internal liquid cooling heat pipe according to the embodiment of the utility model;

[0026] Figure 5 It is a bottom schematic diagram of the heat conduction and heat dissipation structure of the internal liquid cooling heat pipe in the embodiment of the utility model.

[0027] Reference numerals:

[0028] The heat pipe 100, the connecting part 110, the heat conducting part 120, the heat conducting pad 121, the heat transfer part 130,

[0029] Heat pipe bracket 200, limiting slot 210,

[0030] Liquid cooling seat 300, cold plate upper cover 301, cold plate lower cover 302, liquid separation plate 302a, liquid inlet area 302b, liquid outlet area 302c, heat conduction slot 310, liquid inlet nozzle 330, liquid outlet nozzle 340,

[0031] A fixing seat 410 and a mounting hole 420 . DETAILED DESCRIPTION

[0032] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0033] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, top, bottom, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0034] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0035] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0036] Reference below Figure 1-Figure 5 The invention describes a memory liquid cooling heat pipe heat conduction and heat dissipation structure according to an embodiment of the utility model.

[0037] like Figure 1-Figure 5 As shown, the memory liquid cooling heat pipe heat conduction and heat dissipation structure includes a heat pipe 100 , a heat pipe bracket 200 and a liquid cooling seat 300 .

[0038] Specifically, the heat pipe 100 includes a connecting portion 110, a heat conducting portion 120 and a heat transfer portion 130. The heat conducting portion 120 is attached to the heating area of ​​the memory stick to absorb the heat of the memory stick. The structure of the heat pipe 100 is a technical solution well known to those skilled in the art and will not be described in detail in this embodiment. The heat pipe 100 achieves heat transfer based on the basic principles of heat conduction and heat convection. Specifically, the interior of the heat pipe 100 is hollow and filled with a liquid with a low boiling point. The liquid in the heat conducting portion 120 absorbs the heat from the heating area of ​​the memory stick and vaporizes and flows toward the heat penetrating portion under the action of the pressure difference, condenses into liquid at the end and then flows back to the heat conducting portion 120.

[0039] The heat pipe support 200 is provided with a limiting slot 210 , and the connecting portion 110 of the heat pipe 100 is plugged into the limiting slot 210 . During the process of fixing and installing the heat pipe 100 , the connecting portion 110 is connected to the limiting slot 210 of the heat pipe support 200 .

[0040] A heat-conducting slot 310 is provided on the top of the liquid cooling seat 300, and the heat transfer part 130 of the heat pipe 100 is plugged into the heat-conducting slot 310. Thus, the two ends of the heat pipe 100 are fixed respectively, and the heat pipe 100, the heat pipe bracket 200 and the liquid cooling seat 300 form a stable frame structure. In this embodiment, the number of the limit slots 210 and the heat-conducting slots 310 can be adaptively adjusted according to the number of memory bars of the server, and the arrangement layout of the heat pipe 100 corresponds to the arrangement layout of the memory bar. The heat pipe 100 is used to efficiently transfer heat to the heating area of ​​the memory bar, which has a better heat transfer effect than the existing heat dissipation vest.

[0041] The liquid cooling seat 300 includes a liquid inlet nozzle 330 and a liquid outlet nozzle 340, and a liquid cooling cavity is provided inside the liquid cooling seat 300, which is respectively connected to the liquid inlet nozzle 330 and the liquid outlet nozzle 340. Specifically, the cooling medium of the server whole machine liquid cooling device enters the liquid cooling cavity from the liquid inlet nozzle 330, can absorb the heat of the liquid cooling seat 300, and then flows out from the liquid outlet nozzle 340.

[0042] In order to enable the liquid cooling seat 300 to absorb the heat of the heat pipe 100 more efficiently, the heat conducting slot 310 is located above the liquid cooling cavity. The heat of the heat pipe 100 is transferred to the liquid cooling seat 300 and then taken away by the cooling medium in the liquid cooling cavity. The liquid outlet nozzle 340 of the liquid cooling seat 300 can be connected to the liquid inlet nozzle 330 of another liquid cooling heat pipe heat conduction and heat dissipation structure, so as to realize the series connection of the heat dissipation structure, reduce the layout of the cooling pipeline, improve the space utilization rate, and improve the heat dissipation effect.

[0043] In some embodiments of the present invention, Figure 2 and Figure 3 As shown, the heat conducting part 120 is attached with a heat conducting paste 121, and the heat conducting paste 121 covers the heat generating area of ​​the memory stick. Specifically, the heat conducting paste 121 is provided on both sides of the heat conducting part 120, and the heat conducting paste 121 is attached to the surface of the flash memory chip of the memory stick and the surface of the heat conducting part 120 respectively. The heat conducting paste 121 is used to fill the connection gap between the flash memory chip and the heat conducting pipe 100, and has a high thermal conductivity, which helps to transfer heat to the heat conducting pipe 100.

[0044] In some embodiments of the present invention, Figure 1-Figure 4As shown, the cross-section of the heat pipe 100 is in the shape of a flat tube, the thickness of the heat pipe 100 is 2.0 mm to 2.5 mm, and the wall thickness of the heat pipe 100 is 0.3 mm to 0.5 mm. Specifically, the heat pipe 100 can also be a sintered tube, a grooved tube, a composite tube, etc. In this embodiment, the thickness of the heat pipe 100 is 2.5 mm, which cannot be too thick, because the spacing between the memory bars is fixed, and the compression amount of the thermal paste 121 needs to be reserved. Because the length of the memory bar is relatively long, the wall thickness of the heat pipe 100 is recommended to be 0.50 mm, which is different from the conventional heat pipe 100 with a thickness of 0.25 mm, to avoid deformation of the heat pipe 100 due to the wall thickness being too thin, thereby affecting the heat dissipation effect.

[0045] In some embodiments of the present invention, Figure 2-Figure 4 As shown, the liquid cooling seat 300 includes a cold plate lower cover 302 and a cold plate upper cover 301, which are connected to form a liquid cooling cavity. Specifically, after the cold plate upper cover 301 and the cold plate lower cover 302 are closed, a sealed liquid cooling cavity is formed inside, which can effectively prevent leakage of the cooling medium.

[0046] In a further embodiment, Figure 1 , Figure 2 and Figure 4 As shown, the cold plate upper cover 301 and the heat conducting slot 310 are integrally formed, and the heat conducting slot 310 extends upward perpendicularly to the surface of the cold plate upper cover 301. Specifically, the integral formation of the heat conducting slot 310 and the cold plate upper cover 301 can improve the heat transfer efficiency between the heat conducting slot 310 and the liquid cooling upper cover, so that the heat is transferred to the liquid cooling cavity faster, thereby improving the heat dissipation efficiency.

[0047] In a further embodiment, Figure 2 and Figure 3 As shown, the upper cover 301 of the cold plate, the liquid inlet nozzle 330 and the liquid outlet nozzle 340 are integrally formed to improve the sealing performance of the liquid cooling seat 300. Specifically, the integrally formed liquid inlet nozzle 330 and the liquid outlet nozzle 340 can be connected to the cooling pipe through an adapter and a pagoda joint. The adapter with a corresponding angle is used according to the layout of the cooling pipe, which effectively reduces the bending of the cooling pipe and improves the flow efficiency of the cooling medium.

[0048] In some embodiments of the present invention, Figure 3 and Figure 4 As shown, a liquid separator 302a is provided in the lower cover 302 of the cold plate, and the liquid separator 302a divides the liquid cooling cavity into a liquid inlet area 302b and a liquid outlet area 302c. The liquid inlet nozzle 330 is connected to the liquid inlet area 302b, and the liquid outlet nozzle 340 is connected to the liquid outlet area 302c. The liquid inlet area 302b is connected to the liquid outlet area 302c.

[0049] Specifically, the liquid separator 302a is integrally formed with the cold plate lower cover 302. When the cold plate upper cover 301 is connected to the cold plate lower cover 302, the top of the liquid separator 302a abuts against the inner wall of the cold plate upper cover 301, thereby dividing the liquid cooling cavity into a liquid inlet area 302b and a liquid outlet area 302c.

[0050] Furthermore, if Figure 3 and Figure 4 As shown, the two ends of the liquid separation plate 302a are spaced apart from the side wall of the cold plate lower cover 302. Specifically, after the cooling medium enters the liquid inlet area 302b from the liquid inlet nozzle 330, it needs to flow from both sides of the liquid inlet area 302b and then merge into the liquid outlet area 302c, which extends the flow path of the liquid cooling cavity, so that the cooling medium can more fully absorb the heat of the liquid cooling seat 300.

[0051] In some embodiments of the present invention, Figure 2 and Figure 4 As shown, the liquid cooling seat 300 and the heat pipe bracket 200 are respectively provided with a fixing seat 410 for connecting the processor fixture. Specifically, the heat dissipation structure fixture of the processor can be fixed by the fixing seats 410 on both sides, and the fixing seats 410 are provided with screw holes, which are convenient for the fixture to be connected by screw threads, and convenient for subsequent maintenance and disassembly.

[0052] In some embodiments of the present invention, Figure 5 As shown, the bottom of the liquid cooling seat 300 and the heat pipe bracket 200 are respectively provided with mounting holes 420. When the liquid cooling seat 300 and the heat pipe bracket 200 are installed at the memory bar, the mounting holes 420 are connected from the bottom of the motherboard by screws, so that the positions of the liquid cooling seat 300 and the heat pipe bracket 200 are fixed on the motherboard.

[0053] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0054] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A heat conduction and heat dissipation structure with internal liquid cooling heat pipe, characterized in that: include: A heat-conducting pipe (100), the heat-conducting pipe (100) comprising a connecting portion (110), a heat-conducting portion (120) and a heat-transferring portion (130), the heat-conducting portion (120) being attached to a heat-generating area of ​​a memory bar to absorb heat from the memory bar; The heat pipe support (200) is provided with a limiting slot (210), and the connecting portion (110) of the heat conducting pipe (100) is plugged into the limiting slot (210); A liquid cooling seat (300) is provided with a heat-conducting slot (310) at the top, the heat transfer portion (130) of the heat-conducting pipe (100) is plugged into the heat-conducting slot (310), the liquid cooling seat (300) comprises a liquid inlet nozzle (330) and a liquid outlet nozzle (340), a liquid cooling cavity is provided inside the liquid cooling seat (300) and is respectively connected to the liquid inlet nozzle (330) and the liquid outlet nozzle (340), the heat-conducting slot (310) is located above the liquid cooling cavity, and the heat of the heat-conducting pipe (100) is transferred to the liquid cooling seat (300) and then taken away by the cooling medium in the liquid cooling cavity.

2. The memory liquid cooling heat pipe heat conduction and heat dissipation structure according to claim 1, characterized in that: The heat-conducting portion (120) is attached with a heat-conducting paste (121), and the heat-conducting paste (121) covers the heat-generating area of ​​the memory stick.

3. The memory liquid cooling heat pipe heat conduction and heat dissipation structure according to claim 2, characterized in that: The cross section of the heat-conducting pipe (100) is in the shape of a flat tube, the thickness of the heat-conducting pipe (100) is 2.0 mm to 2.5 mm, and the wall thickness of the heat-conducting pipe (100) is 0.3 mm to 0.5 mm.

4. The memory liquid cooling heat pipe heat conduction and heat dissipation structure according to claim 1, characterized in that: The liquid cooling seat (300) comprises a cold plate lower cover (302) and a cold plate upper cover (301), and the cold plate lower cover (302) and the cold plate upper cover (301) are connected to form the liquid cooling cavity.

5. The memory liquid cooling heat pipe heat conduction and heat dissipation structure according to claim 4, characterized in that: The cold plate upper cover (301) and the heat-conducting slot (310) are integrally formed, and the heat-conducting slot (310) extends upward perpendicularly to the surface of the cold plate upper cover (301).

6. The memory liquid cooling heat pipe heat conduction and heat dissipation structure according to claim 4, characterized in that: The cold plate upper cover (301), the liquid inlet nozzle (330) and the liquid outlet nozzle (340) are integrally formed.

7. The memory liquid cooling heat pipe heat conduction and heat dissipation structure according to claim 4, characterized in that: A liquid separator (302a) is arranged in the lower cover (302) of the cold plate, and the liquid separator (302a) divides the liquid cooling cavity into a liquid inlet area (302b) and a liquid outlet area (302c); the liquid inlet nozzle (330) is connected to the liquid inlet area (302b), the liquid outlet nozzle (340) is connected to the liquid outlet area (302c), and the liquid inlet area (302b) and the liquid outlet area (302c) are connected.

8. The memory liquid cooling heat pipe heat conduction and heat dissipation structure according to claim 7, characterized in that: The two ends of the liquid separation plate (302a) are spaced apart from the side wall of the cold plate lower cover (302).

9. The memory liquid cooling heat pipe heat conduction and heat dissipation structure according to any one of claims 1 to 8, characterized in that: The liquid cooling seat (300) and the heat pipe support (200) are respectively provided with a fixing seat (410) for connecting a processor clamp.

10. The memory liquid cooling heat pipe heat conduction and heat dissipation structure according to any one of claims 1 to 8, characterized in that: The bottoms of the liquid cooling seat (300) and the heat pipe bracket (200) are respectively provided with mounting holes (420).

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