Transformer structure

Abstract

The utility model relates to a transformer structure which comprises a first carrier, a coil assembly and an iron core piece, the coil assembly is connected with the first carrier in a stacked mode, and at least one part of the iron core piece penetrates through the first carrier and the coil assembly. Therefore, the size of the transformer can be effectively reduced.

Description

Technical Field

[0001] This utility model claims domestic priority to Taiwan Patent Application No. 112211181 (filing date: October 18, 2023), the complete contents of which are incorporated into the patent specification of this utility model for reference.

[0002] The utility model relates to the electromagnetic field, and in particular to a transformer structure. Background Art

[0003] Transformers are widely used in various fields. The lead frame (bobbin) of a general transformer is mostly made of plastic injection molding, and the wire is wound on the lead frame to form a coil. Therefore, when the transformer maintains the same size, the space for the coil is limited, and it is impossible to further transform the required voltage, current and impedance and reduce leakage inductance. As various electronic devices or equipment move towards miniaturization, in addition to further increasing the number of coils set under the existing size, how to reduce the size of the transformer is also a problem that needs to be solved.

[0004] In view of this, the inventor has focused on the shortcomings of the above-mentioned prior art, conducted intensive research and applied theoretical knowledge to try his best to solve the above-mentioned problems, which has become the goal of the inventor's improvement. Utility Model Content

[0005] The main purpose of the utility model is to effectively reduce the volume of the transformer.

[0006] To achieve the above objectives, the utility model provides a transformer structure, including a first carrier, a coil assembly and an iron core member, wherein the coil assembly is stacked and connected with the first carrier, and at least a portion of the iron core member passes through the first carrier and the coil assembly.

[0007] In one embodiment of the present invention, a coil circuit is further included. The coil circuit includes a first coil circuit. The first carrier is a printed circuit board having a first upper surface and a first lower surface. The first coil circuit is printed and arranged on the first upper surface or the first lower surface.

[0008] In one embodiment of the present invention, a second carrier is further included. The second carrier is connected to the coil assembly. At least a portion of the core member passes through the first carrier, the second carrier and the coil assembly.

[0009] In an embodiment of the present invention, the second carrier is a hollow cylinder, the second carrier is stacked and connected to the first carrier, and the coil assembly is wound around the second carrier.

[0010] In one embodiment of the present invention, a coil circuit is further included. The coil circuit includes a first coil circuit. The first carrier is a printed circuit board having a first upper surface and a first lower surface. The first coil circuit is printed and arranged on the first upper surface or the first lower surface.

[0011] In an embodiment of the present invention, a coil circuit is further included. The coil circuit includes a second coil circuit. The second carrier has an inner wall and an outer wall. The second coil circuit is etched and arranged on the inner wall or the outer wall.

[0012] In one embodiment of the utility model, a coil circuit is further included, the coil circuit includes a first coil circuit and a second coil circuit, the first carrier is a printed circuit board and has a first upper surface and a first lower surface, the first coil circuit is printed and arranged on the first upper surface or the first lower surface, the second carrier has an inner wall and an outer wall, and the second coil circuit is etched and arranged on the inner wall or the outer wall.

[0013] In an embodiment of the present invention, the second carrier is parallel to the first carrier, and the coil assembly is stacked and connected between the first carrier and the second carrier.

[0014] In one embodiment of the present invention, a coil circuit is further included. The coil circuit includes a first coil circuit. The first carrier is a printed circuit board having a first upper surface and a first lower surface. The first coil circuit is printed and arranged on the first upper surface or the first lower surface.

[0015] In one embodiment of the present invention, a coil circuit is further included, the coil circuit includes a second coil circuit, the second carrier is a printed circuit board and has a second upper surface and a second lower surface, and the second coil circuit is printed and arranged on the second upper surface or the second lower surface.

[0016] In one embodiment of the utility model, a coil circuit is further included, the coil circuit includes a first coil circuit and a second coil circuit, the first carrier is a printed circuit board and has a first upper surface and a first lower surface, the first coil circuit is printed and arranged on the first upper surface or the first lower surface, the second carrier is a printed circuit board and has a second upper surface and a second lower surface, the second coil circuit is printed and arranged on the second upper surface or the second lower surface.

[0017] In one embodiment of the present invention, a second carrier, a third carrier and a coil circuit are further included. The second carrier is parallel to the first carrier, the third carrier is stacked and connected between the first carrier and the second carrier, at least a portion of the core member passes through the first carrier, the second carrier, the third carrier and the coil component, the coil circuit is arranged on at least one of the first carrier, the second carrier and the third carrier, and the coil component is wound around the third carrier and is located between the first carrier and the second carrier.

[0018] In one embodiment of the present invention, the coil circuit includes a first coil circuit. The first carrier is a printed circuit board having a first upper surface and a first lower surface. The first coil circuit is printed and arranged on the first upper surface or the first lower surface.

[0019] In one embodiment of the present invention, the coil circuit includes a second coil circuit. The second carrier is a printed circuit board having a second upper surface and a second lower surface. The second coil circuit is printed and arranged on the second upper surface or the second lower surface.

[0020] In an embodiment of the present invention, the coil circuit includes a third coil circuit. The third carrier is a hollow cylinder having an inner wall and an outer wall. The third coil circuit is etched and arranged on the inner wall or the outer wall.

[0021] In one embodiment of the present invention, the coil circuit includes a first coil circuit and a second coil circuit, the first carrier is a printed circuit board and has a first upper surface and a first lower surface, the second carrier is a printed circuit board and has a second upper surface and a second lower surface, the first coil circuit is printed and arranged on the first upper surface or the first lower surface, and the second coil circuit is printed and arranged on the second upper surface or the second lower surface.

[0022] In one embodiment of the present invention, the coil circuit includes a first coil circuit and a third coil circuit, the first carrier is a printed circuit board and has a first upper surface and a first lower surface, the third carrier is a hollow cylinder and has an inner wall and an outer wall, the first coil circuit is printed and arranged on the first upper surface or the first lower surface, and the third coil circuit is etched and arranged on the inner wall or the outer wall.

[0023] In one embodiment of the present invention, the coil circuit includes a first coil circuit, a second coil circuit and a third coil circuit, the first carrier is a printed circuit board and has a first upper surface and a first lower surface, the second carrier is a printed circuit board and has a second upper surface and a second lower surface, the third carrier is a hollow cylinder and has an inner wall and an outer wall, the first coil circuit is printed and arranged on the first upper surface or the first lower surface, the second coil circuit is printed and arranged on the second upper surface or the second lower surface, and the third coil circuit is etched and arranged on the inner wall or the outer wall.

[0024] In an embodiment of the present invention, two ends of the third carrier respectively have a first card slot and a second card slot, the first carrier is locked in the first card slot, and the second carrier is locked in the second card slot.

[0025] In one embodiment of the present invention, the third carrier is connected between the first carrier and the second carrier by bonding, pressing, hot melting or ultrasonic welding.

[0026] The transformer structure of the utility model can effectively reduce the volume of the transformer by stacking and connecting the pre-wound and shaped coil assembly with the first carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a three-dimensional exploded view of the first embodiment of the utility model;

[0028] Figure 2 It is a three-dimensional exploded view of the second embodiment of the utility model;

[0029] Figure 3 This is a three-dimensional appearance diagram of the upper insulating frame of the utility model;

[0030] Figure 4 This is a three-dimensional appearance diagram of the lower insulating frame of the utility model;

[0031] Figure 5 It is a three-dimensional exploded view of the third embodiment of the utility model;

[0032] Figure 6 It is a three-dimensional exploded view of the fourth embodiment of the utility model;

[0033] Figure 7 It is a three-dimensional exploded view of the fifth embodiment of the utility model;

[0034] Figure 8 It is a three-dimensional appearance diagram of the insulating column of the utility model;

[0035] Fig. 9 It is a three-dimensional exploded view of the sixth embodiment of the utility model;

[0036] Fig.10 It is a three-dimensional appearance diagram of the sixth embodiment of the utility model;

[0037] Fig.11 is a cross-sectional side view of a sixth embodiment of the utility model;

[0038] Fig.12 yes Fig.11 A partial enlarged view of

[0039] Fig.13 It is a sectional side view of the seventh embodiment of the utility model.

[0040]

Explanation of symbols

[0041] 10: Coil assembly

[0042] 20: Coil circuit

[0043] 21: First coil circuit

[0044] 22: Second coil circuit

[0045] 23: The third coil circuit

[0046] 30: Printed circuit board

[0047] 40: Lower printed circuit board

[0048] 50:Hollow cylinder

[0049] 60: Upper insulation frame

[0050] 70: Lower insulation frame

[0051] 80: Insulation column

[0052] 90: Core parts

[0053] 901: Core column

[0054] 91: Upper core

[0055] 92: Lower core

[0056] C1: First carrier

[0057] C2: Second carrier

[0058] C3: The third carrier

[0059] C31: First card slot

[0060] C32: Second card slot

[0061] C33: Guide slope DETAILED DESCRIPTION

[0062] In the description of the present invention, it should be understood that the terms "front side", "rear side", "left side", "right side", "front end", "rear end", "end", "longitudinal", "lateral", "vertical", "top", "bottom" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0063] As used herein, terms such as "first," "second," "third," "fourth," and "fifth" describe various elements, components, regions, layers, and / or portions, which should not be limited by these terms. These terms may only be used to distinguish one element, component, region, layer, or portion from another. Unless the context clearly indicates, terms such as "first," "second," "third," "fourth," and "fifth" as used herein do not imply a sequence or order.

[0064] The detailed description and technical contents of the present invention are described below with reference to the accompanying drawings. However, the accompanying drawings are only for illustrative purposes and are not intended to limit the present invention.

[0065] The utility model provides a transformer structure, please refer to Figure 1 FIG. 1 is a first embodiment of the transformer structure of the present invention, which includes a first carrier C1 , a coil assembly 10 and an iron core 90 .

[0066] In the present embodiment, the first carrier C1 is roughly in the shape of a rectangular plate, but the present invention is not limited thereto. The coil assembly 10 is composed of a plurality of coils (not numbered in the figure) formed by winding a conductive wire (not numbered in the figure). The present invention does not particularly limit the winding form of each coil, that is, the winding can be performed in the form of staggered, sandwich, primary-to-secondary, secondary-to-primary, etc. In the present embodiment, the coil assembly 10 is formed by pre-winding a conductive wire. The coil assembly 10 is stacked and connected to the first carrier C1. In the present embodiment, the first carrier C1 is stacked and connected on top of the coil assembly 10, but the present invention is not limited thereto. For example Figure 2 The second embodiment of the present invention is shown, in which the first carrier C1 is stacked and connected to the bottom of the coil assembly 10. Specifically, the coil assembly 10 and the first carrier C1 stack can be connected and fixed by bonding, pressing, hot melting, clamping or ultrasonic welding. At least a part of the core piece 90 is penetrated by the first carrier C1 and the coil assembly 10. Specifically, the core piece 90 in this embodiment includes a symmetrical upper core 91 and a lower core 92, and the upper core 91 and the lower core 92 respectively have an elliptical cylinder-shaped core column 901. The upper core 91 is combined with the lower core 92 to clamp the first carrier C1 and the coil assembly 10 between the upper core 91 and the lower core 92, so that each core column 901 penetrates the first carrier C1 and the coil assembly 10, but the form of the core piece 90 of the present invention is not limited to this.

[0067] Thus, by pre-winding the coil assembly 10 and then stacking and connecting the coil assembly 10 and the first carrier C1, the volume of the transformer structure can be effectively reduced without winding the wires on the wire frame as in the conventional method, which results in an excessively large volume.

[0068] Also, see Figure 1As shown, the first embodiment of the utility model further includes a coil circuit 20 electrically connected to the coil assembly 10. The coil circuit 20 in this embodiment includes a first coil circuit 21, and the first carrier C1 is an upper printed wiring board 30 (printed wiring board, PWB). The first carrier C1 serves as an upper printed wiring board 30, which has a first upper surface (not numbered in the figure, subject to the direction in the figure) and a first lower surface (not numbered in the figure, subject to the direction in the figure) parallel to each other. The first coil circuit 21 is printed and arranged on the first upper surface or the first lower surface. In this embodiment, since the first carrier C1 is stacked and connected on the top of the coil assembly 10, the first coil circuit 21 is printed and arranged on the first upper surface, but the utility model is not limited to this. In this way, since the coil circuit 20 is arranged on the first carrier C1, the transformer can further increase the number of coils and reduce leakage inductance under the existing volume size. Of course, when there is no need to reduce the leakage inductance and the number of coils does not need to be increased, the first carrier C1 of this embodiment can be as follows Figure 3 An upper insulating frame 60 of the coil line 20 is not provided for replacement.

[0069] Also, see Figure 2 As shown, the second embodiment of the utility model also includes a coil circuit 20 electrically connected to the coil assembly 10, but the first carrier C1 is stacked and connected at the bottom of the coil assembly 10. The coil circuit 20 in this embodiment includes a first coil circuit 21, and the first carrier C1 is a lower printed wiring board 40 (printed wiring board, PWB). It is particularly noted that when the first carrier C1 is stacked and connected at the top of the coil assembly 10, it is an upper printed wiring board 30, but when the first carrier C1 is stacked and connected at the bottom of the coil assembly 10, it is a lower printed wiring board 40. The difference between the two is that the position, number and appearance are slightly different, but the two are substantially the same. The lower printed wiring board 40 of the first carrier C1 has a first upper surface (not numbered in the figure, subject to the direction in the figure) and a first lower surface (not numbered in the figure, subject to the direction in the figure) parallel to each other. The first coil circuit 21 is printed and arranged on the first upper surface or the first lower surface. In this embodiment, since the first carrier C1 is stacked and connected to the bottom of the coil assembly 10, the first coil circuit 21 is printed and arranged on the first lower surface, but the utility model is not limited to this. In this way, since the coil circuit 20 is arranged on the first carrier C1, the transformer can further increase the number of coils and reduce leakage inductance under the existing volume. Of course, when there is no need to reduce leakage inductance and increase the number of coils, the lower printed circuit board 40 of the first carrier C1 in this embodiment can be as follows: Figure 4 The lower insulating frame 70 of the coil line 20 is not provided for replacement.

[0070] Please read next Figure 5 As shown, it is the third embodiment of the utility model, and the main difference between it and the first embodiment is that it also includes a second carrier C2. The second carrier C2 is roughly rectangular plate-shaped and connected to the coil assembly 10. Specifically, the second carrier C2 is parallel to the first carrier C1, and the coil assembly 10 is stacked and connected between the first carrier C1 and the second carrier C2 by bonding, pressing, hot melting, clamping or ultrasonic welding. At least a part of the core piece 90 is penetrated by the first carrier C1, the second carrier C2 and the coil assembly 10. Specifically, the upper core 91 of the core piece 90 in this embodiment corresponds to the lower core 92 and combines the first carrier C1, the second carrier C2 and the coil assembly 10 between the upper core 91 and the lower core 92, so that each core column 901 penetrates the first carrier C1, the second carrier C2 and the coil assembly 10, but the form of the core piece 90 of the utility model is not limited to this. The third embodiment of the utility model also includes a coil circuit 20. The coil circuit 20 includes a first coil circuit 21 and a second coil circuit 22, and the first carrier C1 and the second carrier C2 are both printed wiring boards (PWB). More specifically, the first carrier C1 is an upper printed wiring board 30, and the second carrier C2 is a lower printed wiring board 40. The first coil circuit 21 is printed and arranged on the first carrier C1, and the second coil circuit 22 is printed and arranged on the second carrier C2. Specifically, the first carrier C1 serves as the upper printed wiring board 30, which has a first upper surface (not numbered in the figure, based on the direction in the figure) and a first lower surface (not numbered in the figure, based on the direction in the figure) parallel to each other, and the second carrier C2 serves as the lower printed wiring board 40, which has a second upper surface (not numbered in the figure, based on the direction in the figure) and a second lower surface (not numbered in the figure, based on the direction in the figure) parallel to each other. The first coil circuit 21 is printed and arranged on the first upper surface or the first lower surface, and the second coil circuit 22 is printed and arranged on the second upper surface or the second lower surface. In this embodiment, since the first carrier C1 is stacked and connected on the top of the coil assembly 10, and the second carrier C2 is stacked and connected on the bottom of the coil assembly 10, the first coil circuit 21 is printed and arranged on the first upper surface of the upper printed circuit board 30, and the second coil circuit 22 is printed and arranged on the second lower surface of the lower printed circuit board 40, but the utility model is not limited thereto. Accordingly, the first carrier C1 and the second carrier C2 in this embodiment are respectively provided with the first coil circuit 21 and the second coil circuit 22, that is, the coil circuit 20 is simultaneously provided on the first carrier C1 and the second carrier C2, thereby further increasing the number of coils provided and reducing leakage inductance.

[0071] Of course, when there is no need to reduce the leakage inductance and increase the number of coils, the upper insulating frame 60 or the lower insulating frame 70 without the coil line 20 can also be used as a replacement. Figure 3 The upper insulating frame 60 is used to replace the upper printed circuit board 30 in this embodiment, or a single insulating frame such as Figure 4 The lower insulating frame 70 is used to replace the lower printed circuit board 40 in this embodiment, or the lower printed circuit board 40 is used at the same time. Figure 3 The upper insulation frame 60 and Figure 4 The lower insulating frame 70 of the embodiment can be used to replace the upper printed circuit board 30 and the lower printed circuit board 40 respectively, depending on the use requirements. In other words, the utility model does not specifically limit the location of the coil circuit 20, that is, as long as the coil circuit 20 is disposed on at least one of the first carrier C1 and the second carrier C2, it should fall within the protection scope of this embodiment.

[0072] Please read next Figure 6 , is the fourth embodiment of the utility model, which is mainly different from the third embodiment in that the second carrier C2 is a hollow cylinder 50, and the second carrier C2 is stacked and connected to the first carrier C1, and the coil assembly 10 is wound on the outside of the second carrier C2. Specifically, the second carrier C2 is an elliptical hollow cylinder 50 having an inner wall (not numbered in the figure) and an outer wall (not numbered in the figure), and the second carrier C2 in this embodiment is stacked and connected to the bottom of the first carrier C1. The fourth embodiment of the utility model also includes a coil circuit 20. The coil circuit 20 includes a first coil circuit 21 and a second coil circuit 22, and the first carrier C1 is an upper printed wiring board 30 (printed wiring board, PWB). The first coil circuit 21 is printed and arranged on the first carrier C1, and the second coil circuit 22 is etched and arranged on the second carrier C2. Specifically, the upper printed circuit board 30 of the first carrier C1 has a first upper surface (not numbered in the figure, subject to the direction in the figure) and a first lower surface (not numbered in the figure, subject to the direction in the figure) parallel to each other. The first coil circuit 21 is printed and arranged on the first upper surface or the first lower surface, and the second coil circuit 22 is etched and arranged on the inner wall or the outer wall of the hollow cylinder 50. In this embodiment, since the first carrier C1 is stacked and connected on the top of the second carrier C2 and the coil assembly 10, the first coil circuit 21 is printed and arranged on the first upper surface, and the second coil circuit 22 is printed and arranged on the outer wall of the hollow cylinder 50, but the utility model is not limited to this. Accordingly, the first carrier C1 and the second carrier C2 in this embodiment are respectively provided with the first coil circuit 21 and the second coil circuit 22, that is, the coil circuit 20 is simultaneously provided on the first carrier C1 and the second carrier C2, thereby further increasing the number of coils provided and reducing leakage inductance.

[0073] Of course, when there is no need to reduce the leakage inductance and increase the number of coils, the above-mentioned Figure 3 The upper insulating frame 60 without the coil circuit 20 is used to replace the upper printed circuit board 30 of the first carrier C1 in this embodiment, or a single insulating frame 60 is used as shown. Figure 8 The insulating column 80 without the coil circuit 20 is used to replace the second carrier C2 in this embodiment, or to replace the second carrier C2 in this embodiment. Figure 3 The upper insulation frame 60 and Figure 8 The insulating cylinder 80 can be used to replace the upper printed circuit board 30 and the hollow cylinder 50 in this embodiment, depending on the use requirements. In other words, the utility model does not specifically limit the location of the coil circuit 20, that is, as long as the coil circuit 20 is disposed on at least one of the first carrier C1 and the second carrier C2, it should fall within the protection scope of this embodiment.

[0074] Please read next Figure 7, is the fifth embodiment of the utility model, which is mainly different from the fourth embodiment in that the second carrier C2 is stacked and connected on the top of the first carrier C1, that is, the second carrier C2 and the coil assembly 10 are both located on the top of the first carrier C1, and the coil assembly 10 is still wound on the outside of the second carrier C2. Specifically, the second carrier C2 is an elliptical hollow cylinder 50 having an inner wall (not numbered in the figure) and an outer wall (not numbered in the figure). The fifth embodiment of the utility model also includes a coil circuit 20. The coil circuit 20 includes a first coil circuit 21 and a second coil circuit 22, and the first carrier C1 is a lower printed wiring board 40 (printed wiring board, PWB). It is particularly noted that when the first carrier C1 is stacked and connected on the top of the second carrier C2, it is an upper printed wiring board 30, but when the first carrier C1 is stacked and connected at the bottom of the second carrier C2, it is a lower printed wiring board 40. The difference between the two is that the position, number and appearance are slightly different, but the two are substantially the same. The first coil circuit 21 is printed and arranged on the first carrier C1, and the second coil circuit 22 is etched and arranged on the second carrier C2. Specifically, the lower printed circuit board 40 of the first carrier C1 has a first upper surface (not numbered in the figure, subject to the direction in the figure) and a first lower surface (not numbered in the figure, subject to the direction in the figure) parallel to each other. The first coil circuit 21 is printed and arranged on the first upper surface or the first lower surface, and the second coil circuit 22 is etched and arranged on the inner wall or outer wall of the hollow cylinder 50. In this embodiment, since the first carrier C1 is stacked and connected to the bottom of the second carrier C2 and the coil assembly 10, the first coil circuit 21 is printed and arranged on the first lower surface, and the second coil circuit 22 is printed and arranged on the outer wall of the hollow cylinder 50, but the utility model is not limited to this. Accordingly, the first carrier C1 and the second carrier C2 in this embodiment are respectively provided with the first coil line 21 and the second coil line 22 , that is, the coil line 20 is simultaneously provided on the first carrier C1 and the second carrier C2 , thereby further increasing the number of coils provided and reducing leakage inductance.

[0075] Of course, when there is no need to reduce the leakage inductance and increase the number of coils, the above-mentioned Figure 4 The lower insulating frame 70 without the coil circuit 20 is used to replace the lower printed circuit board 40 in this embodiment, or a single insulating frame 70 is used as shown. Figure 8 The insulating cylinder 80 without the coil line 20 is used to replace the second carrier C2 in this embodiment, or to replace the second carrier C2 in this embodiment. Figure 4 The lower insulating frame 70 and Figure 8The insulating cylinder 80 can be used to replace the lower printed circuit board 40 and the hollow cylinder 50 in this embodiment, depending on the use requirements. In other words, the utility model does not specifically limit the location of the coil circuit 20, that is, as long as the coil circuit 20 is disposed on at least one of the first carrier C1 and the second carrier C2, it should fall within the protection scope of this embodiment.

[0076] Please read next Fig. 9 and Fig.10, is the sixth embodiment of the present invention, which differs from the first embodiment mainly in that it further includes a second carrier C2 and a third carrier C3. Specifically, the second carrier C2 is parallel to the first carrier C1, and the third carrier C3 is stacked and connected between the first carrier C1 and the second carrier C2. The coil assembly 10 is wound around the outside of the third carrier C3 and is located between the first carrier C1 and the second carrier C2. At least a portion of the core piece 90 is penetrated by the first carrier C1, the second carrier C2, the third carrier C3 and the coil assembly 10. Specifically, the upper core 91 of the core piece 90 in this embodiment is combined with the lower core 92 to sandwich the first carrier C1, the second carrier C2, the third carrier C3 and the coil assembly 10 between the upper core 91 and the lower core 92, so that each core column 901 is penetrated by the first carrier C1, the second carrier C2, the third carrier C3 and the coil assembly 10, but the form of the core piece 90 of the present invention is not limited to this. The sixth embodiment of the present invention also includes a coil circuit 20. The coil circuit 20 includes a first coil circuit 21, a second coil circuit 22 and a third coil circuit 23. The first carrier C1 and the second carrier C2 are both printed wiring boards (PWB). More specifically, the first carrier C1 is an upper printed wiring board 30 and has a first upper surface (not numbered in the figure, based on the direction in the figure) and a first lower surface (not numbered in the figure, based on the direction in the figure) that are parallel to each other, and the second carrier C2 is a lower printed wiring board 40 and has a second upper surface (not numbered in the figure, based on the direction in the figure) and a second lower surface (not numbered in the figure, based on the direction in the figure) that are parallel to each other. The third carrier C3 is an elliptical hollow cylinder 50 and has an inner wall (not numbered in the figure) and an outer wall (not numbered in the figure). The first coil circuit 21 is printed and arranged on the first carrier C1, the second coil circuit 22 is printed and arranged on the second carrier C2, and the third coil circuit 23 is etched and arranged on the third carrier C3. Since the third carrier C3 in this embodiment is stacked and connected between the first carrier C1 and the second carrier C2, and the first carrier C1 is located on the top of the third carrier C3, and the second carrier C2 is located at the bottom of the third carrier C3, the first coil circuit 21 is printed and arranged on the first upper surface of the upper printed circuit board 30, the second coil circuit 22 is printed and arranged on the second lower surface of the lower printed circuit board 40, and the third coil circuit 23 is etched and arranged on the outer wall of the hollow cylinder 50. In this way, the first carrier C1, the second carrier C2 and the third carrier C3 in this embodiment are respectively provided with the first coil circuit 21, the second coil circuit 22 and the third coil circuit 23, that is, the coil circuit 20 is provided on the first carrier C1, the second carrier C2 and the third carrier C3, so that the transformer can greatly increase the number of coils under the existing volume size and can effectively reduce the leakage inductance.

[0077] Of course, if there is no need to reduce the leakage inductance and increase the number of coils, it can also be done as follows Figure 3 The upper insulating frame 60 without the coil circuit 20 is used to replace the upper printed circuit board 30 in this embodiment, or as shown in FIG. Figure 4 The lower insulating frame 70 without the coil circuit 20 is used to replace the lower printed circuit board 40 in this embodiment, or as shown in FIG. Figure 8 The insulating cylinder 80 without the coil circuit 20 is used to replace the hollow cylinder 50 in this embodiment, or any two of the above-mentioned methods are used to replace the hollow cylinder 50 at the same time, or the above-mentioned three methods are used to replace the hollow cylinder 50 at the same time, depending on the use requirements. In other words, the utility model does not specifically limit the location of the coil circuit 20, that is, as long as the coil circuit 20 is set on at least one of the first carrier C1, the second carrier C2 and the third carrier C3, it should fall within the protection scope of this embodiment.

[0078] Please read next Fig.11 and Fig.12 As shown, the two ends of the third carrier C3 in this embodiment have a first card slot C31 and a second card slot C32 respectively. The first carrier C1 is snapped into the first card slot C31, and the second carrier C2 is snapped into the second card slot C32, so that the first carrier C1 and the second carrier C2 are snapped and fixed at the upper and lower ends of the third carrier C3 respectively. Preferably, the third carrier C3 can be provided with guiding inclined surfaces C33 at the end corners of the upper and lower ends to facilitate the first carrier C1 and the second carrier C2 to be snapped into the first card slot C31 and the second card slot C32, but these guiding inclined surfaces C33 are not necessary restrictions of this embodiment.

[0079] Of course, the connection method between the third carrier C3 and the first carrier C1 and the second carrier C2 is not limited to the above. For example, the third carrier C3 can also be connected between the first carrier C1 and the second carrier C2 by bonding, pressing, hot melting or ultrasonic welding. Fig.13 , is the seventh embodiment of the present invention. In this embodiment, the third carrier C3 is connected between the first carrier C1 and the second carrier C2 by bonding, so there is no need to set the first card groove C31 and the second card groove C32 at the upper and lower ends of the third carrier C3 for the first carrier C1 and the second carrier C2 to be respectively connected.

[0080] The transformer structure of the present invention can effectively reduce the volume of the transformer by stacking and connecting the pre-wound coil assembly 10 and the first carrier C1.

[0081] In summary, the above disclosure of the utility model is to enable those with ordinary knowledge in the field to clearly understand the technical content of the utility model and implement it accordingly, and is not intended to limit the scope of patent protection of the utility model. In addition, the utility model can of course have other unlisted embodiments. Without departing from the spirit and essence of the utility model, those familiar with the field should be able to evolve various corresponding changes and deformations based on the utility model, but these corresponding changes and deformations should all fall within the scope of protection of the patent applied for the utility model.

Claims

1. A transformer structure, characterized in that: include: a first carrier; a coil assembly connected to the first carrier stack; as well as An iron core piece, at least a portion of which passes through the first carrier and the coil assembly.

2. The transformer structure according to claim 1, characterized in that: It also includes a coil circuit, which includes a first coil circuit. The first carrier is a printed circuit board and has a first upper surface and a first lower surface. The first coil circuit is printed and arranged on the first upper surface or the first lower surface.

3. The transformer structure according to claim 1, characterized in that: The invention also includes a second carrier, which is connected to the coil component. At least a part of the iron core member passes through the first carrier, the second carrier and the coil component.

4. The transformer structure according to claim 3, characterized in that: The second carrier is a hollow cylinder. The second carrier is stacked and connected to the first carrier. The coil assembly is wound around the second carrier.

5. The transformer structure according to claim 4, characterized in that: It also includes a coil circuit, which includes a first coil circuit. The first carrier is a printed circuit board and has a first upper surface and a first lower surface. The first coil circuit is printed and arranged on the first upper surface or the first lower surface.

6. The transformer structure according to claim 4, characterized in that: The invention also includes a coil circuit, which includes a second coil circuit. The second carrier has an inner wall and an outer wall. The second coil circuit is etched and arranged on the inner wall or the outer wall.

7. The transformer structure according to claim 4, characterized in that: It also includes a coil circuit, which includes a first coil circuit and a second coil circuit. The first carrier is a printed circuit board and has a first upper surface and a first lower surface. The first coil circuit is printed and arranged on the first upper surface or the first lower surface. The second carrier has an inner wall and an outer wall. The second coil circuit is etched and arranged on the inner wall or the outer wall.

8. The transformer structure according to claim 3, characterized in that: The second carrier is parallel to the first carrier, and the coil assembly is stacked and connected between the first carrier and the second carrier.

9. The transformer structure according to claim 8, characterized in that: It also includes a coil circuit, which includes a first coil circuit. The first carrier is a printed circuit board and has a first upper surface and a first lower surface. The first coil circuit is printed and arranged on the first upper surface or the first lower surface.

10. The transformer structure according to claim 8, characterized in that: It also includes a coil circuit, which includes a second coil circuit. The second carrier is a printed circuit board and has a second upper surface and a second lower surface. The second coil circuit is printed and arranged on the second upper surface or the second lower surface.

11. The transformer structure according to claim 8, characterized in that: It also includes a coil circuit, which includes a first coil circuit and a second coil circuit. The first carrier is a printed circuit board and has a first upper surface and a first lower surface. The first coil circuit is printed and arranged on the first upper surface or the first lower surface. The second carrier is a printed circuit board and has a second upper surface and a second lower surface. The second coil circuit is printed and arranged on the second upper surface or the second lower surface.

12. The transformer structure according to claim 1, characterized in that: It also includes a second carrier, a third carrier and a coil circuit. The second carrier is parallel to the first carrier. The third carrier is stacked and connected between the first carrier and the second carrier. At least a portion of the core member passes through the first carrier, the second carrier, the third carrier and the coil component. The coil circuit is arranged on at least one of the first carrier, the second carrier and the third carrier. The coil component is wound around the third carrier and is located between the first carrier and the second carrier.

13. The transformer structure according to claim 12, characterized in that: The coil circuit includes a first coil circuit. The first carrier is a printed circuit board and has a first upper surface and a first lower surface. The first coil circuit is printed and arranged on the first upper surface or the first lower surface.

14. The transformer structure according to claim 12, characterized in that: The coil circuit includes a second coil circuit. The second carrier is a printed circuit board and has a second upper surface and a second lower surface. The second coil circuit is printed and arranged on the second upper surface or the second lower surface.

15. The transformer structure according to claim 12, characterized in that: The coil circuit includes a third coil circuit. The third carrier is a hollow cylinder having an inner wall and an outer wall. The third coil circuit is etched and arranged on the inner wall or the outer wall.

16. The transformer structure according to claim 12, characterized in that: The coil circuit includes a first coil circuit and a second coil circuit. The first carrier is a printed circuit board and has a first upper surface and a first lower surface. The second carrier is a printed circuit board and has a second upper surface and a second lower surface. The first coil circuit is printed and arranged on the first upper surface or the first lower surface, and the second coil circuit is printed and arranged on the second upper surface or the second lower surface.

17. The transformer structure according to claim 12, characterized in that: The coil circuit includes a first coil circuit and a third coil circuit. The first carrier is a printed circuit board and has a first upper surface and a first lower surface. The third carrier is a hollow cylinder and has an inner wall and an outer wall. The first coil circuit is printed and arranged on the first upper surface or the first lower surface, and the third coil circuit is etched and arranged on the inner wall or the outer wall.

18. The transformer structure according to claim 12, characterized in that: The coil circuit includes a first coil circuit, a second coil circuit and a third coil circuit. The first carrier is a printed circuit board and has a first upper surface and a first lower surface. The second carrier is a printed circuit board and has a second upper surface and a second lower surface. The third carrier is a hollow cylinder and has an inner wall and an outer wall. The first coil circuit is printed and arranged on the first upper surface or the first lower surface, the second coil circuit is printed and arranged on the second upper surface or the second lower surface, and the third coil circuit is etched and arranged on the inner wall or the outer wall.

19. The transformer structure according to claim 12, characterized in that: The two ends of the third carrier are respectively provided with a first card slot and a second card slot. The first carrier is carded in the first card slot, and the second carrier is carded in the second card slot.

20. The transformer structure according to claim 12, characterized in that: The third carrier is connected between the first carrier and the second carrier by bonding, pressing, hot melting or ultrasonic welding.

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