Heat dissipation assembly of power module and power module
By designing the heat dissipation components of the power module, the coolant first exchanges heat in the high-temperature area through the first cooling flow channel, and then flows to multiple second cooling flow channels, which solves the problem of reduced heat dissipation effect caused by the one-way flow of coolant in the existing technology. problem, achieving more efficient heat dissipation and longer service life.
Patent Information
- Application Number
- CN202420942528.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-30
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-04-30
AI Technical Summary
The existing power modules have a one-way flow of coolant, which leads to a reduction in the cooling effect of the chip in the lower tube area, resulting in a high chip junction temperature and increasing the risk of module failure.
Design a heat dissipation component of a power module, including a substrate, a first heat exchange area and a plurality of second heat exchange areas. The coolant first exchanges heat in the first heat exchange area with a higher temperature through the first cooling flow channel, and then Flows to multiple second cooling channels to achieve more efficient heat dissipation.
It effectively improves the heat dissipation effect of the heat dissipation component, extends the service life of the power module, and prevents failure due to excessive temperature.
Smart Images
Figure CN222380584U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of power modules, and in particular to a heat dissipation component of a power module and a power module. Background Art
[0002] In the related technology, with the improvement of the vehicle mass, speed and power of electric vehicles, the operating junction temperature and power density of power semiconductor modules are also getting higher and higher. Therefore, a more efficient heat dissipation method is needed to ensure the stability of the product. The existing heat dissipation method is direct cooling of coolant. The coolant is in a unidirectional flow under the module. The upper and lower tube coolants are in series. After the coolant flows through the upper tube, the water temperature rises, thereby reducing the cooling effect of the chip in the lower tube area, causing the chip junction temperature in the lower tube area of the entire module to be higher than the chip in the upper tube area, thereby increasing the risk of module failure. Utility Model Content
[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the present application is to provide a heat dissipation component of a power module, which has a better heat dissipation effect and effectively prolongs the overall life of the power module.
[0004] The present application also proposes a power module having the above heat dissipation component.
[0005] According to the heat dissipation component of the power module of the embodiment of the present application, it includes: a substrate, a first heat exchange area and a plurality of second heat exchange areas are formed on the side of the substrate facing away from the power module, the plurality of second heat exchange areas are located at least partially on the periphery of the first heat exchange area, a first cooling channel suitable for the circulation of coolant is formed on the first heat exchange area, a second cooling channel suitable for the circulation of coolant is formed on the second heat exchange area, and the inlet end of each of the second cooling channels is connected to the first cooling channel; wherein the coolant is suitable for flowing from the first cooling channel to the plurality of second cooling channels.
[0006] According to the heat dissipation assembly of the power module of the embodiment of the present application, the heat dissipation assembly has a first heat exchange zone and multiple second heat exchange zones, the multiple second heat exchange zones are located at least partially around the first heat exchange zone, and the first cooling channel on the first heat exchange zone is respectively connected to the second cooling channel on each second heat exchange zone, ensuring that the coolant first flows to the first cooling channel to exchange heat with the first heat exchange zone with a higher temperature, and then flows from the first cooling channel to the multiple second cooling channels, effectively improving the heat dissipation effect of the heat dissipation assembly, thereby increasing the service life of the power module and preventing the power module from failing due to excessive temperature.
[0007] In some embodiments of the present application, the first cooling channel is extended in a first direction, and a plurality of the second cooling channels are symmetrically arranged on both sides of the first cooling channel along a second direction, and the second direction is orthogonal to the first direction.
[0008] In some embodiments of the present application, the second heat exchange zone is provided with a first protrusion and a second protrusion, the first protrusion and the second protrusion are both extended in a direction away from the substrate, the first protrusion and the second protrusion are spirally shaped and staggered along the same axis, and a second cooling channel is formed between the first protrusion and the second protrusion.
[0009] In some embodiments of the present application, a confluence end is formed near the center of the axis of the first protrusion and the second protrusion, and the second cooling channel includes a first sub-channel and a second sub-channel, and the first sub-channel, the confluence end and the second sub-channel are connected in sequence.
[0010] In some embodiments of the present application, a liquid inlet end and a liquid outlet end spaced apart in the first direction are formed on the substrate, the first heat exchange zone and the second heat exchange zone are respectively located between the liquid inlet end and the liquid outlet end, the liquid inlet end is connected to the first cooling channel, and the liquid outlet end is connected to the outlet ends of multiple second cooling channels.
[0011] In some embodiments of the present application, the first cooling channel includes a first section and a second section connected in sequence in the first direction, and one end of the first section facing the liquid outlet and one end of the second section facing the liquid outlet are respectively connected to the inlet ends of two adjacent second cooling channels; wherein in the second direction, the width of the first section is greater than the width of the second section.
[0012] In some embodiments of the present application, the heat dissipation component also includes: a heat dissipation pin, which is arranged in the first heat exchange zone and is arranged to penetrate along the thickness direction of the substrate, one end of the heat dissipation pin exchanges heat with the coolant flowing through the first cooling channel, and the other end of the heat dissipation pin exchanges heat with the power module.
[0013] In some embodiments of the present application, the heat dissipation pin is constructed to be a plurality of heat dissipation pins sequentially arranged along the first direction and / or the second direction in the first heat exchange zone, and the plurality of heat dissipation pins are arranged at intervals to define the first cooling channel.
[0014] In some embodiments of the present application, a partition plate extending in the first direction is provided in the first heat exchange zone to separate the first heat exchange zone into a first area and a second area, the first cooling channel is provided in the first area, and the heat dissipation needle is provided in the second area.
[0015] The power module according to the embodiment of the present application is briefly described below.
[0016] According to the power module of the embodiment of the present application, there is provided a heat dissipation assembly of the above-mentioned embodiment. Since the power module of the embodiment of the present application is provided with the heat dissipation assembly of the above-mentioned embodiment, the heat dissipation assembly of the power module can ensure that the coolant first flows to the first cooling channel to exchange heat with the first heat exchange zone with a higher temperature, and then flows from the first cooling channel to the multiple second cooling channels, thereby effectively improving the heat dissipation effect of the heat dissipation assembly, thereby increasing the service life of the power module and preventing the problem of failure of the power module due to excessively high temperature.
[0017] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
[0019] Figure 1 is a schematic structural diagram of a heat dissipation assembly of a power module according to an embodiment of the present application;
[0020] Figure 2 yes Figure 1 Another structural schematic diagram of the heat dissipation component;
[0021] Figure 3 yes Figure 1 Schematic diagram of the coolant flow direction of the heat dissipation component;
[0022] Figure 4 is a schematic structural diagram of a heat dissipation assembly according to a second embodiment of the present application;
[0023] Figure 5 yes Figure 4 Schematic diagram of the coolant flow in the heat dissipation component.
[0024] Reference numerals:
[0025] 10. Heat dissipation components;
[0026] 11. substrate; 111. first cooling channel; 1111. first section; 1112. second section;
[0027] 112, second cooling channel; 1121, first sub-channel; 1122, second sub-channel;
[0028] 113. first protrusion; 114. second protrusion; 115. confluence end;
[0029] 116, liquid inlet end; 117, liquid outlet end; 118, partition plate;
[0030] 101, first area; 102, second area;
[0031] 12. Heat dissipation pin. DETAILED DESCRIPTION
[0032] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.
[0033] Reference below Figure 1-Figure 5 A heat dissipation assembly 10 of a power module according to an embodiment of the present application is described, wherein the heat dissipation assembly 10 includes a substrate 11, wherein a first heat exchange zone and a plurality of second heat exchange zones are formed on a side of the substrate 11 facing away from the power module, wherein the plurality of second heat exchange zones are located at least partially on the periphery of the first heat exchange zone, wherein a first cooling channel 111 suitable for the circulation of a coolant is formed on the first heat exchange zone, and a second cooling channel 112 suitable for the circulation of a coolant is formed on the second heat exchange zone, wherein an inlet end of each second cooling channel 112 is connected to the first cooling channel 111, wherein the coolant is suitable for flowing from the first cooling channel 111 to the plurality of second cooling channels 112.
[0034] At present, with the improvement of the vehicle mass, speed and power of electric vehicles, the operating junction temperature and power density of power semiconductor modules are also getting higher and higher. Therefore, a more efficient heat dissipation method is needed to ensure the stability of the product. The existing heat dissipation method is direct cooling of coolant. The coolant flows in one direction under the module. The upper and lower tube coolants are in series. After the coolant flows through the upper tube, the water temperature rises, thereby reducing the cooling effect of the chip in the lower tube area, causing the chip junction temperature in the lower tube area of the entire module to be higher than the chip in the upper tube area, thereby increasing the risk of module failure.
[0035] like Figure 1 and Figure 2 As shown, specifically, the heat dissipation assembly 10 includes a substrate 11, which can be located at the bottom end of the power module and serve as a supporting structure of the power module. A first heat exchange zone and a second heat exchange zone are formed on the side of the substrate 11 away from the power module. The first heat exchange zone and the second heat exchange zone are respectively arranged opposite to the chips inside the power module, and due to the different temperatures of the internal chips, the temperature of the first heat exchange zone is higher than that of the second heat exchange zone. During actual heat exchange, the first heat exchange zone needs to perform heat exchange first, thereby ensuring the heat exchange efficiency of the coolant.
[0036] like Figure 3As shown, the second heat exchange zone can be constructed in multiple forms, and the multiple second heat exchange zones can be respectively located at least partially on the periphery of the first heat exchange zone, ensuring that the multiple second heat exchange zones can be evenly distributed on the substrate 11. A first cooling channel 111 is formed on the first heat exchange zone, and a second cooling channel 112 is formed on the second heat exchange zone. The first cooling channel 111 and the second cooling channel 112 are both used for the circulation of the coolant, so that the coolant exchanges heat with the first heat exchange zone and the second heat exchange zone respectively. Furthermore, the inlet end of each second cooling channel 112 is connected to the first cooling channel 111. It can be understood that the multiple second cooling channels 112 are connected in parallel with the first cooling channel 111, and flow through The coolant in the first cooling channel 111 can flow toward the multiple second cooling channels 112, so that the coolant can first flow to the first cooling channel 111 and exchange heat with the first heat exchange zone, and then flow from the first cooling channel 111 to the second cooling channel 112 and exchange heat with the second heat exchange zone. Since the temperature of the first heat exchange zone is higher than that of the second heat exchange zone, the coolant preferentially flows to the first heat exchange zone to better improve the cooling effect of the coolant, realizes the effect of heat conduction from the high temperature zone to the low temperature zone, increases the service life of the power module, balances the temperature of the chips inside the power module, avoids the failure of the intermediate chip due to overheating, and thus achieves the thermal balance of the entire power module.
[0037] In short, the heat dissipation component 10 of the present application has a first heat exchange zone and multiple second heat exchange zones, and the multiple second heat exchange zones are located on at least part of the periphery of the first heat exchange zone. The first cooling channel 111 on the first heat exchange zone is respectively connected to the second cooling channel 112 on each second heat exchange zone, ensuring that the coolant first flows to the first cooling channel 111 to exchange heat with the first heat exchange zone with a higher temperature, and then flows from the first cooling channel 111 to the multiple second cooling channels 112, effectively improving the heat dissipation effect of the heat dissipation component 10, thereby increasing the service life of the power module and preventing the power module from failing due to excessive temperature.
[0038] like Figure 1 and Figure 2 As shown, in some embodiments of the present application, the first cooling channel 111 can be extended in the first direction, and multiple second cooling channels 112 can be symmetrically arranged on both sides of the first cooling channel 111 along the second direction, and the second direction is orthogonal to the first direction, so as to ensure the uniformity of heat dissipation between the multiple second cooling channels 112, balance the temperature of the chips inside the power module, and ensure that the multiple second cooling channels 112 do not affect each other, and by adopting the above arrangement, it can be ensured that the second cooling channel 112 can exchange heat at multiple locations of the power module, thereby increasing the heat exchange area. In a specific embodiment, the second cooling channel 112 can be configured as four.
[0039] like Figure 1 and Figure 2As shown, in some embodiments of the present application, the second heat exchange zone is provided with a first protrusion 113 and a second protrusion 114, and the first protrusion 113 and the second protrusion 114 are both extended in a direction away from the substrate 11, and the first protrusion 113 and the second protrusion 114 are spiral in radial cross-section, and the first protrusion 113 and the second protrusion 114 are staggered along the same axis, wherein a second cooling channel 112 is formed between the first protrusion 113 and the second protrusion 114, and the above structure can ensure that the heat exchange area of the second cooling channel 112 is larger, thereby improving the heat exchange efficiency of the internal coolant of the second cooling channel 112, and at the same time, the coolant can dissipate heat by convection in each second cooling channel 112, thereby greatly improving the heat dissipation efficiency.
[0040] like Figure 1 and Figure 2 As shown, in some embodiments of the present application, a confluence end 115 is formed at a position near the center of the axis of the first protrusion 113 and the second protrusion 114, and the second cooling channel 112 includes a first sub-channel 1121 and a second sub-channel 1122. The first sub-channel 1121, the confluence end 115 and the second sub-channel 1122 are connected in sequence. Therefore, the coolant flows from the first sub-channel 1121 from the outside to the inside to the confluence end 115, and then flows from the confluence end 115 to the second sub-channel 1122, and flows out from the inside to the outside in the second sub-channel 1122. By setting the above structure, the flow resistance of the coolant can be effectively reduced and the cooling effect of the coolant can be improved.
[0041] like Figure 1 and Figure 2 As shown, in some embodiments of the present application, a liquid inlet end 116 and a liquid outlet end 117 are formed on the substrate 11 and are spaced apart in a first direction. The liquid inlet end 116 can be used as an input end for the coolant, and the liquid outlet end 117 can be used as an output end for the coolant. The first heat exchange zone and the second heat exchange zone are respectively located between the liquid inlet end 116 and the liquid outlet end 117. The liquid inlet end 116 is connected to the first cooling channel 111, and the liquid outlet end 117 is connected to the outlet ends of the plurality of second cooling channels 112, so as to ensure that the coolant can flow from the liquid inlet end 116 to the first cooling channel 111 of the first heat exchange zone, and then from the first cooling channel 111 to the plurality of second cooling channels 112, and finally from the plurality of second cooling channels 112 to the liquid outlet end 117.
[0042] like Figure 1 and Figure 2As shown, in some embodiments of the present application, the first cooling channel 111 includes a first section 1111 and a second section 1112, and the first section 1111 and the second section 1112 are connected in sequence in the first direction, and one end of the first section 1111 facing the liquid outlet end 117 and one end of the second section 1112 facing the liquid outlet end 117 are respectively connected to the inlet ends of two adjacent second cooling channels 112, and in the second direction, the width of the first section 1111 is greater than the width of the second section 1112, so that the coolant can flow quickly from the first section 1111 to the center position and dissipate heat at the center position, thereby improving the heat dissipation efficiency.
[0043] like Figure 1 As shown, in some embodiments of the present application, the heat dissipation assembly 10 also includes a heat dissipation needle 12, which is arranged in the first heat exchange zone, and the heat dissipation needle 12 can be arranged through the thickness direction of the substrate 11, one end of the heat dissipation needle 12 exchanges heat with the coolant flowing through the first cooling channel 111, and the other end of the heat dissipation needle 12 exchanges heat with the power module, thereby indirectly increasing the contact area of the coolant and improving the heat dissipation efficiency of the heat dissipation assembly 10. Furthermore, the shape of the heat dissipation needle 12 can be constructed as an ellipse, a rhombus, a polygon, etc., thereby balancing the heat dissipation efficiency and the fluid resistance.
[0044] like Figure 1 As shown, in some embodiments of the present application, the heat dissipation needle 12 is constructed as a plurality of heat dissipation needles 12 arranged in sequence along the first direction or the second direction in the first heat exchange zone, or the heat dissipation needle 12 is constructed as a plurality of heat dissipation needles 12 arranged in sequence along the first direction and the second direction in the first heat exchange zone. By providing a plurality of heat dissipation needles 12, the contact area with the coolant can be further increased, thereby improving the heat dissipation effect, and the plurality of heat dissipation needles 12 are arranged at intervals to define a first cooling channel 111, thereby preventing the heat dissipation needles 12 from obstructing the flow of the coolant.
[0045] like Figure 4 and Figure 5 As shown, in some embodiments of the present application, at least one partition plate 118 is provided in the first heat exchange zone, the partition plate 118 can be extended in the first direction, and the partition plate 118 can divide the first heat exchange zone into a first area 101 and a second area 102, the first cooling channel 111 is provided in the first area 101, the heat dissipation needle 12 is provided in the second area 102, and the coolant in the first area 101 does not exchange heat with the heat dissipation needle 12. Therefore, the coolant in the first area 101 is lower in temperature than the coolant in the second area 102, thereby optimizing the cooling effect, while ensuring that the heat dissipation needle 12 does not affect the circulation of the coolant, thereby reducing the flow resistance of the coolant. Furthermore, the partition plate 118 can be constructed in a straight line or a wavy shape to further balance the flow resistance of the coolant and avoid the situation where the cooling effect is insufficient due to excessive coolant in the middle and too little coolant on both sides.
[0046] The power module according to the embodiment of the present application is briefly described below.
[0047] According to the power module of the embodiment of the present application, the heat dissipation component 10 of the above-mentioned embodiment is provided. Since the power module of the embodiment of the present application is provided with the heat dissipation component 10 of the above-mentioned embodiment, the heat dissipation component 10 of the power module can ensure that the coolant first flows to the first cooling channel 111 to exchange heat with the first heat exchange zone with a higher temperature, and then flows from the first cooling channel 111 to the multiple second cooling channels 112, thereby effectively improving the heat dissipation effect of the heat dissipation component 10, thereby improving the service life of the power module and preventing the power module from failing due to excessive temperature.
[0048] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0049] In the description of this application, "first feature" or "second feature" may include one or more of the features.
[0050] In the description of the present application, “plurality” means two or more.
[0051] In the description of the present application, a first feature being “on” or “under” a second feature may include that the first and second features are directly in contact with each other, or may include that the first and second features are not in direct contact with each other but are in contact with each other via another feature therebetween.
[0052] In the description of the present application, “above”, “over” and “above” a first feature to a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.
[0053] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0054] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.
Claims
1. A heat dissipation component of a power module, characterized in that: include: A substrate, wherein a first heat exchange area and a plurality of second heat exchange areas are formed on a side of the substrate away from the power module, the plurality of second heat exchange areas are located at least partially around the first heat exchange area, a first cooling channel suitable for the circulation of a coolant is formed on the first heat exchange area, a second cooling channel suitable for the circulation of a coolant is formed on the second heat exchange area, and an inlet end of each of the second cooling channels is connected to the first cooling channel; wherein The coolant is suitable for flowing from the first cooling channel to the plurality of second cooling channels.
2. The heat dissipation assembly of the power module according to claim 1, characterized in that: The first cooling channel is extended in a first direction, and a plurality of the second cooling channels are symmetrically arranged on both sides of the first cooling channel along a second direction, and the second direction is orthogonal to the first direction.
3. The heat dissipation assembly of the power module according to claim 2, characterized in that: The second heat exchange zone is provided with a first protrusion and a second protrusion, the first protrusion and the second protrusion are both extended in a direction away from the substrate, the first protrusion and the second protrusion are spirally shaped and staggered along the same axis, and a second cooling channel is formed between the first protrusion and the second protrusion.
4. The heat dissipation assembly of the power module according to claim 3, characterized in that: The first protrusion and the second protrusion form a confluence end near the center of the axis, the second cooling channel includes a first sub-channel and a second sub-channel, and the first sub-channel, the confluence end and the second sub-channel are connected in sequence.
5. The heat dissipation assembly of the power module according to claim 2, characterized in that: The substrate is formed with a liquid inlet and a liquid outlet which are spaced apart in the first direction, the first heat exchange zone and the second heat exchange zone are respectively located between the liquid inlet and the liquid outlet, the liquid inlet is connected to the first cooling channel, and the liquid outlet is connected to the outlet ends of the plurality of second cooling channels.
6. The heat dissipation assembly of the power module according to claim 5, characterized in that: The first cooling channel includes a first section and a second section that are sequentially connected in the first direction, and one end of the first section facing the liquid outlet and one end of the second section facing the liquid outlet are respectively connected to the inlet ends of two adjacent second cooling channels; In the second direction, the width of the first segment is greater than the width of the second segment.
7. The heat dissipation assembly of the power module according to claim 5, characterized in that: Also includes: A heat dissipation pin is arranged in the first heat exchange zone and is arranged through the thickness direction of the substrate. One end of the heat dissipation pin exchanges heat with the coolant flowing through the first cooling channel, and the other end of the heat dissipation pin exchanges heat with the power module.
8. The heat dissipation assembly of the power module according to claim 7, characterized in that: The heat dissipation pins are structured to be a plurality of heat dissipation pins sequentially arranged along the first direction and / or the second direction in the first heat exchange area, and the plurality of heat dissipation pins are arranged at intervals to define the first cooling channel.
9. The heat dissipation assembly of the power module according to claim 7, characterized in that: A partition plate extending in the first direction is arranged in the first heat exchange zone to divide the first heat exchange zone into a first area and a second area. The first cooling channel is arranged in the first area, and the heat dissipation needle is arranged in the second area.
10. A power module, characterized in that: Comprising a heat dissipation assembly as described in any one of claims 1-9.