Optical fiber heat dissipation device
By designing an optical fiber heat dissipation device including a radiator and a heat dissipation structure, the problem of local overheating at the optical fiber splice is solved, effective heat dissipation of the optical fiber is achieved, and the service life of the optical fiber is extended.
Patent Information
- Application Number
- CN202420022299.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-04
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-01-04
AI Technical Summary
There is a problem of local overheating at the welding joints of existing optical fibers, which leads to the easy burning of the optical fibers.
Design an optical fiber heat dissipation device, including a radiator and a heat dissipation structure. The radiator has a mounting slot for installing fused optical fibers. The heat dissipation structure is covered at the slot and is used to dissipate heat on the side away from the fused optical fiber to ensure the peripheral side of the optical fiber. The walls are completely wrapped and dissipate heat.
This device effectively prevents heat from accumulating on the side away from the optical fiber splice, avoids local overheating, improves the heat dissipation capacity of the optical fiber, and prolongs its service life.
Smart Images
Figure CN222381053U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of optical fiber heat dissipation, in particular to an optical fiber heat dissipation device. Background Art
[0002] As the maximum output optical power of fiber lasers increases year by year, the heat generated by the optical fiber also increases year by year, but the temperature resistance of the optical fiber has not been significantly improved. Therefore, it is necessary to increase the heat dissipation capacity of the optical fiber so that the temperature of the optical fiber can be kept within the temperature resistance range, especially for the weak points of the optical fiber that are prone to burning, such as the optical fiber fusion point, the heat dissipation capacity must be particularly strengthened.
[0003] At present, the heat dissipation solution for the fiber splice point is usually to carve a rectangular or U-shaped fiber groove on the liquid cooling plate, place the fiber splice point in the fiber groove, and then apply curable glue to dissipate the heat of the fiber splice point. However, in this solution, the temperature of the area covered by the fiber groove at the fiber splice point is relatively low, and the temperature of the area not covered by the fiber groove (i.e., above the fiber splice point) is relatively high, resulting in a local hot spot at the fiber splice point, which is prone to failure and burning. Utility Model Content
[0004] The main purpose of the utility model is to provide an optical fiber heat dissipation device, aiming to solve the problem of local overheating at the fusion joint of the existing optical fiber.
[0005] To achieve the above object, the utility model provides an optical fiber heat dissipation device, comprising:
[0006] A heat sink having a first mounting side end and a second mounting side end opposite to each other, wherein the first mounting side end is provided with a mounting groove for mounting a fused optical fiber; and
[0007] The heat dissipation structure is covered at the notch of the installation groove and is used for dissipating heat from the side of the fused optical fiber away from the second installation side end.
[0008] Optionally, the heat dissipation structure includes a heat dissipation plate arranged at the first mounting side end.
[0009] Optionally, the heat sink comprises a metal plate; and / or,
[0010] The heat sink includes a liquid cooling plate.
[0011] Optionally, the liquid cooling plate is provided with a liquid cooling channel for the flow of cooling liquid;
[0012] A heat dissipation fin is provided on a side of the liquid cooling channel close to the first mounting side end, and the heat dissipation fin extends away from the first mounting side end.
[0013] Optionally, the heat sink plate can be detachably mounted on the radiator.
[0014] Optionally, the heat dissipation structure includes a semiconductor cooling plate arranged at the first mounting side end.
[0015] Optionally, the heat dissipation structure further includes a heat dissipation component arranged at the side end of the semiconductor refrigeration plate facing away from the first installation side.
[0016] Optionally, the heat sink is made of metal.
[0017] Optionally, a receiving groove is provided on a side of the heat sink facing the first mounting side end to accommodate the semiconductor cooling plate.
[0018] Optionally, the accommodating groove is filled with thermal conductive paste.
[0019] In the technical solution of the utility model, a mounting groove is provided at the first mounting side end so that the fused optical fiber can be sunk into the radiator to dissipate heat for the fused optical fiber, and the heat dissipation structure cover is provided at the notch of the mounting groove to close the notch of the mounting groove so as to dissipate heat for the side of the fused optical fiber away from the second mounting side end. In this way, the radiator is provided to dissipate heat for the side of the fused optical fiber except the notch of the mounting groove, and at the same time, the heat dissipation structure is provided to completely wrap the peripheral side wall of the fused optical fiber with the radiator so as to dissipate heat for the peripheral side wall of the fused optical fiber, prevent heat from accumulating on the side of the fused optical fiber away from the second mounting side end, and avoid local overheating of the fused optical fiber, thereby solving the problem of local overheating at the fusion joint of the existing optical fiber. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0021] Figure 1 A schematic side structural diagram of a first embodiment of the optical fiber heat dissipation device provided by the utility model;
[0022] Figure 2 for Figure 1 A side structural schematic diagram of a second embodiment of the optical fiber heat dissipation device;
[0023] Figure 3 for Figure 2 Schematic diagram of the three-dimensional structure of the liquid cooling plate;
[0024] Figure 4 for Figure 1A side structural schematic diagram of a third embodiment of the optical fiber heat dissipation device;
[0025] Figure 5 for Figure 4 Schematic diagram of the three-dimensional structure of the heat sink.
[0026] Description of Figure Numbers:
[0027] Label name Label name 100 Optical fiber heat sink 211 Cooling fins 1 heat sink 22 Semiconductor Refrigeration Chip 11 First installation side 23 Heat sink 12 Second installation side 231 Storage tank 13 Mounting slot 200 Fusion fiber 21 Heat sink
[0028] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0030] It should be noted that if a directional indication is involved in the embodiments of the present invention, the directional indication is only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.
[0031] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0032] As the maximum output optical power of fiber lasers increases year by year, the heat generated by the optical fiber also increases year by year, but the temperature resistance of the optical fiber has not been significantly improved. Therefore, it is necessary to increase the heat dissipation capacity of the optical fiber so that the temperature of the optical fiber can be kept within the temperature resistance range, especially for the weak points of the optical fiber that are prone to burning, such as the optical fiber fusion point, the heat dissipation capacity must be particularly strengthened.
[0033] At present, the heat dissipation solution for the fiber splice point is usually to carve a rectangular or U-shaped fiber groove on the liquid cooling plate, place the fiber splice point in the fiber groove, and then apply curable glue to dissipate the heat of the fiber splice point. However, in this solution, the temperature of the area covered by the fiber groove at the fiber splice point is relatively low, and the temperature of the area not covered by the fiber groove (i.e., above the fiber splice point) is relatively high, resulting in a local hot spot at the fiber splice point, which is prone to failure and burning.
[0034] Based on this, the utility model provides a light heat dissipation device, which aims to solve the problem of local overheating at the fusion joint of existing optical fibers. Figures 1 to 5 This is a schematic structural diagram of the optical fiber heat dissipation device provided by the utility model.
[0035] See also Figures 1 to 5 The optical fiber heat dissipation device 100 includes a heat sink 1 and a heat dissipation structure. The heat sink 1 has a first mounting side end 11 and a second mounting side end 12 relative to each other. The first mounting side end 11 is provided with a mounting groove 13 for mounting the fused optical fiber 200. The heat dissipation structure cover is provided at the notch of the mounting groove 13 for dissipating heat to the side of the fused optical fiber 200 away from the second mounting side end 12.
[0036] In the technical solution of the utility model, the first installation side end 11 is provided with an installation groove 13, so that the fused optical fiber 200 can be sunk into the radiator 1 to dissipate heat for the fused optical fiber 200, and the heat dissipation structure cover is arranged at the notch of the installation groove 13 to close the notch of the installation groove 13 to dissipate heat for the side of the fused optical fiber 200 away from the second installation side end 12. In this way, the radiator 1 is arranged to dissipate heat for the side of the fused optical fiber 200 except the notch of the installation groove 13, and at the same time, the heat dissipation structure is arranged to completely wrap the peripheral side wall of the fused optical fiber 200 with the radiator 1 to dissipate heat for the peripheral side wall of the fused optical fiber 200, prevent heat from accumulating on the side of the fused optical fiber 200 away from the second installation side end 12, and avoid local overheating of the fused optical fiber 200, thereby solving the problem of local overheating at the fusion joint of the existing optical fibers.
[0037] In some embodiments of the present invention, please refer to Figures 1 to 3 The heat dissipation structure includes a heat dissipation plate 21 disposed at the first installation side end 11. Thus, by disposing the heat dissipation plate 21, heat is dissipated from the side of the fused optical fiber 200 away from the second installation side end 12 to prevent the fused optical fiber 200 from being locally overheated. Further, in one embodiment, please refer to Figure 1The heat sink 21 includes a metal plate. Thus, the metal plate is provided to seal the notch of the installation slot 13 so as to transfer the heat at the notch of the installation slot 13 to the heat sink 1 to prevent the fusion optical fiber 200 from being locally overheated. In another embodiment, see Figure 2 and Figure 3 , the heat sink 21 includes a liquid cooling plate, so that the liquid cooling plate is provided to directly dissipate heat from the notch of the installation slot 13, so as to prevent heat from gathering on the side of the fused optical fiber 200 away from the second installation side end 12. It can be understood that the above two related technical features: "the heat sink 21 includes a metal plate" and "the heat sink 21 includes a liquid cooling plate" can be set selectively or simultaneously, and the present invention does not limit this.
[0038] In some embodiments of the utility model, the liquid cooling plate is provided with a liquid cooling channel for the flow of coolant, and a heat dissipation fin 211 is provided on a side of the liquid cooling channel close to the first mounting side end 11, and the heat dissipation fin 211 extends away from the first mounting side end 11. In this way, by providing the heat dissipation fin 211, the heat exchange area between the liquid cooling plate and the coolant in the liquid cooling channel is increased, so that the heat of the side wall of the liquid cooling plate facing the radiator 1 can be promptly taken away by the coolant, thereby helping to improve the heat dissipation effect of the liquid cooling plate.
[0039] There are many ways to connect the heat sink 21 to the radiator 1. The heat sink 21 can be detachably mounted on the radiator 1 by snaps, or can be fixedly mounted on the radiator 1 by bonding, etc. The utility model does not limit this. Specifically, in this embodiment, the heat sink 21 is detachably mounted on the radiator 1 to facilitate loading and unloading of the heat sink 21 for subsequent maintenance or replacement. It is understandable that there are many detachable connection structures, for example, it can be a snap connection structure, it can also be a screw connection structure, etc. The utility model does not limit this.
[0040] In some embodiments of the present invention, please refer to Figure 4 and Figure 5 The heat dissipation structure includes a semiconductor refrigeration plate 22 arranged on the first installation side end 11. In this way, by setting the semiconductor refrigeration plate 22, the notch of the installation groove 13 can be directly dissipated to prevent heat from accumulating on the side of the fused optical fiber 200 away from the second installation side end 12, thereby preventing the fused optical fiber 200 from being locally overheated.
[0041] In some embodiments of the utility model, the heat dissipation structure also includes a heat sink 23 disposed on the semiconductor refrigeration plate 22 away from the first installation side end 11. In this way, by providing the heat sink 23, the heat dissipation end of the semiconductor refrigeration plate 22 can be dissipated, thereby helping to improve the cooling effect of the semiconductor refrigeration plate 22.
[0042] Furthermore, there are various materials for the heat sink 23. For example, the heat sink 23 can be made of metal materials such as iron and aluminum, or alloy materials such as steel and aluminum alloy, or inorganic non-metallic materials such as nano-ceramics, etc. The utility model does not limit this. Specifically, in this embodiment, the heat sink 23 is made of metal. Since metal has a large thermal conductivity and a low price, the use of metal can not only quickly transfer the heat of the semiconductor refrigeration plate 22 to prevent heat accumulation, but also reduce the cost of the heat dissipation structure.
[0043] In some embodiments of the utility model, a receiving groove 231 is provided on the side of the heat sink 23 facing the first mounting side end 11 for accommodating the semiconductor cooling plate 22. Thus, by providing the receiving groove 231 to accommodate the semiconductor cooling plate 22, the heat sink 23 can be attached to the heat sink 1 to transfer the heat at the hot end of the semiconductor cooling plate 22 to the heat sink 1 so as to use the heat sink 1 for heat dissipation, so that the heat of the heat sink 23 can be quickly dissipated, thereby helping to improve the heat dissipation effect of the heat dissipation structure.
[0044] In some embodiments of the utility model, the receiving groove 231 is filled with thermal conductive paste. Thus, by providing the thermal conductive paste to fill the gap between the semiconductor refrigeration plate 22 and the heat sink 23, it is beneficial to improve the heat transfer coefficient between the semiconductor refrigeration plate 22 and the heat sink 1, thereby helping to quickly transfer the heat of the semiconductor refrigeration plate 22 to the heat sink 23.
[0045] There are many ways to connect the heat sink 23 to the radiator 1. The heat sink 23 can be detachably mounted on the radiator 1 by snaps, or can be fixedly mounted on the radiator 1 by bonding, etc. The utility model does not limit this. Specifically, in this embodiment, the heat sink 23 is detachably mounted on the radiator 1 to facilitate loading and unloading of the heat sink 23 for subsequent maintenance or replacement. It is understandable that there are many detachable connection structures, for example, it can be a snap connection structure, it can also be a screw connection structure, etc. The utility model does not limit this.
[0046] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made under the concept of the present invention using the contents of the specification and drawings of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. An optical fiber heat dissipation device, characterized in that: include: The heat sink has a first mounting side end and a second mounting side end opposite to each other, wherein the first mounting side end is provided with a mounting groove for mounting the fused optical fiber; as well as, The heat dissipation structure is covered at the notch of the installation groove and is used for dissipating heat from the side of the fused optical fiber away from the second installation side end.
2. The optical fiber heat dissipation device according to claim 1, characterized in that: The heat dissipation structure includes a heat dissipation plate arranged at the first installation side end.
3. The optical fiber heat dissipation device according to claim 2, characterized in that: The heat sink comprises a metal plate; and / or, The heat sink includes a liquid cooling plate.
4. The optical fiber heat dissipation device according to claim 3, characterized in that: The liquid cooling plate is provided with a liquid cooling channel for the flow of cooling liquid; A heat dissipation fin is provided on a side of the liquid cooling channel close to the first installation side end, and the heat dissipation fin extends away from the first installation side end.
5. The optical fiber heat dissipation device according to claim 2, characterized in that: The heat dissipation plate is detachably mounted on the radiator.
6. The optical fiber heat dissipation device according to claim 1, characterized in that: The heat dissipation structure includes a semiconductor cooling plate arranged at the first installation side end.
7. The optical fiber heat dissipation device according to claim 6, characterized in that: The heat dissipation structure further includes a heat dissipation component arranged at the end of the semiconductor refrigeration plate away from the first installation side.
8. The optical fiber heat dissipation device according to claim 7, characterized in that: The heat sink is made of metal.
9. The optical fiber heat dissipation device according to claim 7, characterized in that: A receiving groove is provided on one side of the heat sink facing the first installation side end for receiving the semiconductor cooling plate.
10. The optical fiber heat dissipation device according to claim 9, characterized in that: The containing groove is filled with thermal conductive paste.