Loudspeaker module

Abstract

The utility model discloses a loudspeaker module. The loudspeaker module comprises a housing; a flexible circuit board, wherein the flexible circuit board is adhered to the inner wall of the shell; the foam is adhered to the inner wall, and the foam and the flexible circuit board are arranged in an intersecting and overlapping manner, so that a first overlapping part is formed at the intersecting and overlapping position of the flexible circuit board and the foam, and a second overlapping part is formed at the intersecting and overlapping position of the foam and the flexible circuit board; the first overlapping part is arranged on one side, close to the inner wall, of the second overlapping part; and the shell is provided with a glue injection hole corresponding to the position where the flexible circuit board and the foam are intersected and overlapped, the sealing element is formed after glue injected into the glue injection hole is solidified, the sealing element forms a groove corresponding to the first overlapping part, and the sealing element is bonded with the second overlapping part. According to the loudspeaker module provided by the utility model, the sealing performance of the rear cavity of the loudspeaker module can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of loudspeakers, in particular to a loudspeaker module. Background Art

[0002] As electronic products are constantly updated, the performance requirements of electronic products are getting higher and higher, and the size of electronic products tends to be miniaturized and thinner. Half-cavity module speakers have the advantage of low cost and are widely used in electronic products. Existing half-cavity module speakers use flexible circuit boards to achieve electrical connection with the main control board of the electronic device. When assembling the foam of the half-cavity module speaker, the foam used to seal the sound cavity cannot completely wrap the flexible circuit board, so there is a gap between the foam and the flexible circuit board, which results in poor sealing of the sound cavity of the half-cavity module speaker. The half-cavity module speaker may have problems with excessive amplitude and noise, which may cause the half-cavity module speaker to have noise or no sound. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a loudspeaker module to solve the problem that the existing half-cavity module loudspeaker has poor sealing performance.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is: a speaker module, comprising:

[0005] case;

[0006] A flexible circuit board, wherein the flexible circuit board is bonded to the inner wall of the housing;

[0007] Foam, the foam is bonded to the inner wall, the foam and the flexible circuit board are arranged to intersect and overlap, so that the position where the flexible circuit board and the foam intersect and overlap forms a first overlapping portion, and the position where the foam and the flexible circuit board intersect and overlap forms a second overlapping portion, and the first overlapping portion is arranged on a side of the second overlapping portion close to the inner wall;

[0008] A sealing member, wherein a glue injection hole is provided at a position where the shell corresponds to the intersection and overlap of the flexible circuit board and the foam, and the sealing member is formed after the glue injected in the glue injection hole is cured, and the sealing member forms a groove corresponding to the first overlapping portion, and the sealing member is bonded to the second overlapping portion.

[0009] Furthermore, an avoidance groove is provided on the inner wall of the shell corresponding to the first overlapping portion.

[0010] Furthermore, it also includes a back glue, which is arranged on the flexible circuit board, and the width of the back glue is smaller than the width of the flexible circuit board, and the sealing component forms a stepped groove corresponding to the back glue and the first overlapping part.

[0011] Furthermore, two ends of the glue injection hole are respectively provided with a glue injection port and a glue outlet.

[0012] Furthermore, the diameter of the glue injection port is larger than the diameter of the glue outlet port.

[0013] Furthermore, the glue outlet is in a rectangular shape, the length of the glue outlet is greater than the width of the first overlapping portion, and the width of the glue outlet is less than the width of the second overlapping portion.

[0014] Furthermore, the glue injection hole includes a first hole section, a connecting port and a second hole section which are connected in sequence from the glue injection port to the glue outlet, the aperture of the first hole section increases from the connecting port to the glue injection port, and the aperture of the second hole section increases from the connecting port to the glue outlet, so that the radial cross-section of the glue injection hole is in the shape of an hourglass.

[0015] Furthermore, a positioning column is provided on the inner wall, and a positioning hole is provided on the flexible circuit board corresponding to the positioning column.

[0016] Furthermore, the shell includes a first cavity and a second cavity, the foam is arranged between the first cavity and the second cavity, and the first solder pad and the second solder pad are respectively arranged at both ends of the flexible circuit board, the first solder pad is arranged in the first cavity, and the second solder pad is arranged in the second cavity.

[0017] Furthermore, it also includes a speaker unit and a main control board, the speaker unit is arranged in the first cavity, the first soldering pad is electrically connected to the speaker unit, and the second soldering pad is electrically connected to the main control board.

[0018] The beneficial effect of the present invention is that a glue injection hole is opened in the shell of the speaker module provided by the present invention at the position where the flexible circuit board and the foam intersect and overlap, so that glue is injected into the glue injection hole and solidified to form a seal, thereby sealing the gap between the flexible circuit board and the foam. The speaker module can improve the sealing of its rear cavity, avoid the problem of air leakage in the rear cavity and excessive amplitude caused by the gap between the flexible circuit board and the foam, and the speaker module has high reliability, which can reduce the defective rate of noise or silence in the speaker module. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a structural explosion diagram of the speaker module of the utility model in one embodiment;

[0020] Figure 2 for Figure 1 Enlarged view of part A in the middle;

[0021] Figure 3 for Figure 1 Schematic diagram of the speaker module structure;

[0022] Figure 4 for Figure 3 Enlarged view of part B;

[0023] Figure 5 for Figure 1 A cross-sectional view of a speaker module in FIG.

[0024] Figure 6 for Figure 5 Enlarged view of part C in the middle;

[0025] Figure 7 for Figure 1 Schematic diagram of the structure of the middle seal;

[0026] Figure 8 for Figure 1 Shell section view in ;

[0027] Fig. 9 for Figure 8 Enlarged view of part D in the middle.

[0028] Description of labels:

[0029] 1. Shell; 11. Glue injection hole; 111. Glue injection port; 112. Glue outlet; 113. First hole section; 114. Communication port; 115. Second hole section; 12. Avoidance groove; 13. Positioning column; 14. Inner wall;

[0030] 2. flexible circuit board; 21. first overlapping portion; 22. first pad; 23. second pad; 24. positioning hole;

[0031] 3. Foam; 31. Second overlapping portion;

[0032] 4. sealing member; 41. groove; 43. fixing portion; 42. projection;

[0033] 5. Adhesive backing;

[0034] 6. Speaker unit;

[0035] 7. Main control board. DETAILED DESCRIPTION

[0036] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following is an explanation in conjunction with the implementation modes and the accompanying drawings.

[0037] Please refer to Figures 1 to 9 The utility model provides a speaker module, comprising:

[0038] Shell 1;

[0039] A flexible circuit board 2, wherein the flexible circuit board 2 is bonded to the inner wall 14 of the housing 1;

[0040] The foam 3 is bonded to the inner wall 14, and the foam 3 and the flexible circuit board 2 are arranged to intersect and overlap, so that the position where the flexible circuit board 2 and the foam 3 intersect and overlap forms a first overlapping portion 21, and the position where the foam 3 and the flexible circuit board 2 intersect and overlap forms a second overlapping portion 31, and the first overlapping portion 21 is arranged on a side of the second overlapping portion 31 close to the inner wall 14;

[0041] The seal 4 is a sealant 4, wherein a glue injection hole 11 is provided at the position where the shell 1 corresponds to the intersection and overlap of the flexible circuit board 2 and the foam 3, and the sealant 4 is formed after the glue injected in the glue injection hole 11 is cured, and the sealant 4 forms a groove 41 corresponding to the first overlapping portion 21, and the sealant 4 is bonded to the second overlapping portion 31.

[0042] From the above description, it can be seen that the beneficial effect of the utility model is that the shell 1 of the speaker module provided by the utility model opens a glue injection hole 11 corresponding to the position where the flexible circuit board 2 and the foam 3 intersect and overlap, so that glue is injected into the glue injection hole 11 and solidified to form a seal 4, thereby sealing the gap between the flexible circuit board 2 and the foam 3. The speaker module can improve the sealing of its back cavity, avoid the problem of air leakage in the back cavity and excessive amplitude caused by the gap between the flexible circuit board 2 and the foam 3, and the speaker module has high reliability, which can reduce the defective rate of noise or silence in the speaker module.

[0043] Furthermore, an avoidance groove 12 is provided on the inner wall 14 of the housing 1 corresponding to the first overlapping portion 21 .

[0044] It can be known from the above description that the first overlapping portion 21 of the flexible circuit board 2 can be accommodated in the avoidance groove 12 , which can prevent the flexible circuit board 2 from bending.

[0045] Furthermore, it also includes adhesive backing 5, which is arranged on the flexible circuit board 2, and the width of the adhesive backing 5 is smaller than the width of the flexible circuit board 2. The sealing member 4 forms a stepped groove 41 corresponding to the adhesive backing 5 and the first overlapping portion 21.

[0046] Furthermore, two ends of the glue injection hole 11 are respectively provided with a glue injection port 111 and a glue outlet 112 .

[0047] Furthermore, the diameter of the glue injection port 111 is greater than the diameter of the glue outlet 112 .

[0048] It can be seen from the above description that the diameter of the glue injection port 111 is relatively large, which makes it easy for operators to perform glue injection operations.

[0049] Furthermore, the glue outlet 112 is in a rectangular shape, the length of the glue outlet 112 is greater than the width of the first overlapping portion 21 , and the width of the glue outlet 112 is less than the width of the second overlapping portion 31 .

[0050] As can be seen from the above description, the length of the glue outlet 112 is greater than the width of the first overlapping portion 21, which is beneficial for the glue to wrap the width direction of the first overlapping portion 21 of the flexible circuit board 2, so that the seal 4 formed after the glue is cured forms a groove 41 corresponding to the first overlapping portion 21 to completely wrap the first overlapping portion 21; the width of the glue outlet 112 is less than the width of the second overlapping portion 31, and the glue can flow along the width of the second overlapping portion 31, so that the seal 4 after the glue is cured forms a convex block 42, and the convex block 42 can be engaged with the glue outlet 112. The speaker module designs the shape of the glue outlet 112 so that the seal 4 formed after the glue is cured can be closely matched with the structure between the housing 1, the flexible circuit board 2 and the foam 3, thereby improving the sealing of the speaker module.

[0051] Furthermore, the glue injection hole 11 includes a first hole section 113, a connecting port 114 and a second hole section 115 which are connected in sequence from the glue injection port 111 to the glue outlet 112, the aperture of the first hole section 113 increases from the connecting port 114 to the glue injection port 111, and the aperture of the second hole section 115 increases from the connecting port 114 to the glue outlet 112, so that the radial cross-section of the glue injection hole 11 is in the shape of an hourglass.

[0052] From the above description, it can be seen that the seal 4 can form a fixing portion 43 corresponding to the shape of the glue injection hole 11. Therefore, the radial cross-section of the fixing portion 43 is in an hourglass shape. The seal 4 is closely matched with the shape of the glue injection hole 11, which can improve the fixing performance of the seal 4, thereby ensuring the sealing of the speaker module.

[0053] Furthermore, a positioning column 13 is provided on the inner wall 14 , and a positioning hole 24 is provided on the flexible circuit board 2 corresponding to the positioning column 13 .

[0054] As can be seen from the above description, the flexible circuit board 2 can be positioned and fixed by the positioning posts 13 , which can reduce the possibility that the flexible circuit board 2 is separated from the inner wall 14 of the housing 1 and affects the sealing of the speaker module.

[0055] Furthermore, the shell 1 includes a first cavity and a second cavity, the foam 3 is arranged between the first cavity and the second cavity, and the first solder pad 22 and the second solder pad 23 are respectively provided at both ends of the flexible circuit board 2, the first solder pad 22 is arranged in the first cavity, and the second solder pad 23 is arranged in the second cavity.

[0056] Furthermore, it also includes a speaker unit 6 and a main control board 7. The speaker unit 6 is arranged in the first cavity, the first soldering pad 22 is electrically connected to the speaker unit 6, and the second soldering pad 23 is electrically connected to the main control board 7.

[0057] It can be seen from the above description that the speaker module can ensure the sealing between the first cavity and the second cavity.

[0058] Embodiment 1:

[0059] Please refer to Figures 1 to 9 The first embodiment of the utility model is: to provide a speaker module, including a shell 1, a flexible circuit board 2, a foam 3, and a sealing member 4, wherein the flexible circuit board 2 and the foam 3 are both bonded to the inner wall 14 of the shell 1; wherein the foam 3 and the flexible circuit board 2 are arranged to intersect and overlap, so that the position where the flexible circuit board 2 and the foam 3 intersect and overlap forms a first overlapping portion 21, and the position where the foam 3 and the flexible circuit board 2 intersect and overlap forms a second overlapping portion 31, and the first overlapping portion 21 is arranged on one side of the second overlapping portion 31 close to the inner wall 14; the shell 1 is provided with a glue injection hole 11 corresponding to the position where the flexible circuit board 2 and the foam 3 intersect and overlap, and the glue injected in the glue injection hole 11 is cured to form a sealing member 4, and the sealing member 4 forms a groove 41 corresponding to the first overlapping portion 21, and the sealing member 4 is bonded to the second overlapping portion 31.

[0060] like Figure 2 As shown, an avoidance groove 12 is provided on the inner wall 14 of the housing 1 corresponding to the first overlapping portion 21 , so that the first overlapping portion 21 and the second overlapping portion 31 can avoid each other without bending or deforming.

[0061] In this embodiment, the flexible circuit board 2 of the speaker module is bonded to the inner wall 14 of the shell 1 through the adhesive 5, wherein the width of the adhesive 5 is smaller than the width of the flexible circuit board 2, and the sealant 4 forms a stepped groove 41 corresponding to the adhesive 5 and the first overlapping portion 21.

[0062] Please refer to Fig. 9In this embodiment, a glue injection port 111 and a glue outlet 112 are respectively provided at both ends of the glue injection hole 11, wherein the diameter of the glue injection port 111 is larger than the diameter of the glue outlet 112; the glue outlet 112 is rectangular in shape, the length of the glue outlet 112 is larger than the width of the first overlapping portion 21, and the width of the glue outlet 112 is smaller than the width of the second overlapping portion 31. In detail, the length of the glue outlet 112 is larger than the width of the first overlapping portion 21, which is beneficial for the glue to wrap the width direction of the first overlapping portion 21 of the flexible circuit board 2, so that the seal 4 formed after the glue is cured forms a groove 41 corresponding to the first overlapping portion 21 and completely wraps the first overlapping portion 21; the width of the glue outlet 112 is smaller than the width of the second overlapping portion 31, and the glue can flow along the width of the second overlapping portion 31, so that the seal 4 after the glue is cured forms a convex block 42, and the convex block 42 can be engaged with the glue outlet 112. The speaker module designs the shape of the glue outlet 112 so that the seal 4 formed after the glue is cured can fit tightly with the structure between the housing 1, the flexible circuit board 2 and the foam 3, thereby improving the sealing performance of the speaker module.

[0063] In addition, the glue injection hole 11 includes a first hole section 113, a connecting port 114 and a second hole section 115 which are connected in sequence from the glue injection port 111 to the glue outlet 112. The aperture of the first hole section 113 increases from the connecting port 114 to the glue injection port 111, and the aperture of the second hole section 115 increases from the connecting port 114 to the glue outlet 112, so that the radial cross-section of the glue injection hole 11 is in the shape of an hourglass.

[0064] like Figure 6 and Figure 7 As shown, the seal 4 can form a fixing portion 43 corresponding to the shape of the glue injection hole 11. Therefore, the radial cross-section of the fixing portion 43 is in an hourglass shape. The seal 4 is closely matched with the shape of the glue injection hole 11, which can improve the fixing performance of the seal 4, thereby ensuring the sealing of the speaker module.

[0065] like Figure 1 As shown, a positioning column 13 is provided on the inner wall 14, and a positioning hole 24 is provided on the flexible circuit board 2 corresponding to the positioning column 13. The flexible circuit board 2 can be positioned and fixed by the positioning column 13, which can reduce the possibility of the flexible circuit board 2 being separated from the inner wall 14 of the housing 1 and affecting the sealing of the speaker module.

[0066] The housing 1 of the speaker module described in this embodiment includes a first cavity and a second cavity, the foam 3 is arranged between the first cavity and the second cavity, and the two ends of the flexible circuit board 2 are respectively provided with a first pad 22 and a second pad 23, the first pad 22 is arranged in the first cavity, and the second pad 23 is arranged in the second cavity. The speaker unit 6 and the main control board 7 of the speaker module are respectively arranged in the first cavity and the second cavity, the first pad 22 is electrically connected to the speaker unit 6, and the second pad 23 is electrically connected to the main control board 7.

[0067] To sum up, the shell 1 of the speaker module provided by the utility model has a glue injection hole 11 corresponding to the position where the flexible circuit board 2 and the foam 3 intersect and overlap, so that glue is injected into the glue injection hole 11 and solidified to form a seal 4, thereby sealing the gap between the flexible circuit board 2 and the foam 3. The speaker module can improve the sealing performance of its rear cavity, avoid the problem of air leakage in the rear cavity and excessive amplitude caused by the gap between the flexible circuit board 2 and the foam 3, and the speaker module has high reliability, which can reduce the defective rate of noise or silence in the speaker module.

[0068] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent transformations made using the contents of the specification and drawings of the present invention, or directly or indirectly applied in the relevant technical field, are also included in the patent protection scope of the present invention.

Claims

1. A speaker module, characterized in that: include: case; A flexible circuit board, wherein the flexible circuit board is bonded to the inner wall of the housing; Foam, the foam is bonded to the inner wall, the foam and the flexible circuit board are arranged to intersect and overlap, so that the position where the flexible circuit board and the foam intersect and overlap forms a first overlapping portion, and the position where the foam and the flexible circuit board intersect and overlap forms a second overlapping portion, and the first overlapping portion is arranged on a side of the second overlapping portion close to the inner wall; A sealing member, wherein a glue injection hole is provided at a position where the shell corresponds to the intersection and overlap of the flexible circuit board and the foam, and the sealing member is formed after the glue injected in the glue injection hole is cured, and the sealing member forms a groove corresponding to the first overlapping portion, and the sealing member is bonded to the second overlapping portion.

2. The speaker module according to claim 1, characterized in that: An avoidance groove is provided on the inner wall of the shell corresponding to the first overlapping portion.

3. The speaker module according to claim 1, characterized in that: It also includes a back glue, which is arranged on the flexible circuit board, and the width of the back glue is smaller than the width of the flexible circuit board. The sealing component forms a stepped groove corresponding to the back glue and the first overlapping portion.

4. The speaker module according to claim 1, characterized in that: The two ends of the glue injection hole are respectively provided with a glue injection port and a glue outlet.

5. The speaker module according to claim 4, characterized in that: The diameter of the glue injection port is larger than the diameter of the glue outlet port.

6. The speaker module according to claim 4, characterized in that: The glue outlet is in a rectangular shape, the length of the glue outlet is greater than the width of the first overlapping portion, and the width of the glue outlet is less than the width of the second overlapping portion.

7. The speaker module according to claim 4, characterized in that: The glue injection hole includes a first hole section, a connecting port, and a second hole section that are connected in sequence from the glue injection port to the glue outlet. The aperture of the first hole section increases from the connecting port to the glue injection port, and the aperture of the second hole section increases from the connecting port to the glue outlet, so that the radial cross-section of the glue injection hole is in the shape of an hourglass.

8. The speaker module according to claim 1, characterized in that: The inner wall is provided with a positioning column, and the flexible circuit board is provided with a positioning hole corresponding to the positioning column.

9. The speaker module according to claim 1, characterized in that: The shell includes a first cavity and a second cavity, the foam is arranged between the first cavity and the second cavity, and the first solder pad and the second solder pad are respectively arranged at both ends of the flexible circuit board. The first solder pad is arranged in the first cavity, and the second solder pad is arranged in the second cavity.

10. The speaker module according to claim 9, characterized in that: It also includes a speaker unit and a main control board. The speaker unit is arranged in the first cavity. The first soldering pad is electrically connected to the speaker unit, and the second soldering pad is electrically connected to the main control board.

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