Igbt module with double-sided heat dissipation structure

Abstract

The utility model relates to an igbt module, in particular to an igbt module with a double-sided heat dissipation structure. The igbt module with the double-face heat dissipation structure comprises an igbt module body, heat conduction copper sheets, a heat dissipation panel I, a heat dissipation sheet I, a heat dissipation panel II and a heat dissipation sheet II, the heat conduction copper sheets distributed up and down are installed on the igbt module body, the heat dissipation panel I is installed at the bottom of the heat conduction copper sheet on the lower side, and the heat dissipation sheet II is installed at the bottom of the heat dissipation panel II. The bottom of the heat dissipation panel I is connected with heat dissipation fins I which are evenly distributed at intervals, the top of the heat conduction copper sheet on the upper side is provided with a heat dissipation panel II used for heat dissipation, and the top of the heat dissipation panel II is connected with heat dissipation fins II which are evenly distributed at intervals. By arranging a heat conduction copper sheet, a heat dissipation panel I, a heat dissipation panel II, a heat dissipation fin I and a heat dissipation fin II, the purpose of progressive increase heat dissipation is achieved, and the temperature of the igbt module body is prevented from being too high.

Description

Technical Field

[0001] The utility model relates to an IGBT module, in particular to an IGBT module with a double-sided heat dissipation structure. Background Art

[0002] IGBT is an insulated gate bipolar transistor, a composite fully controlled voltage-driven power semiconductor device composed of BJT and MOS. IGBT module is a modular semiconductor product formed by IGBT and FWD through a specific circuit bridge package. It has the characteristics of energy saving, easy installation and maintenance, and stable heat dissipation.

[0003] The patent with the patent authorization announcement number CN210984736U discloses an IGBT module, including an aluminum substrate and a pin, wherein the pin includes a first connection portion welded to the aluminum substrate. Although the above patent can improve the welding quality of the pin by increasing the welding area between the pin and the aluminum substrate, the IGBT module will generate a large amount of heat when it is running. The IGBT module cannot dissipate heat by itself, which easily causes the IGBT module to overheat and burn out the circuit.

[0004] Therefore, an IGBT module with a double-sided heat dissipation structure is particularly needed to solve the problems existing in the prior art. Utility Model Content

[0005] In order to overcome the shortcomings of the existing patents that the IGBT module cannot be cooled, which may easily lead to excessive temperature of the IGBT module and burn out the circuit, the utility model provides an IGBT module with a double-sided heat dissipation structure.

[0006] The utility model is realized through the following technical approaches: an IGBT module with a double-sided heat dissipation structure, comprising an IGBT module body, a heat-conducting copper sheet, a heat-dissipating panel I, a heat-dissipating panel II and a heat-dissipating panel II; the IGBT module body is provided with heat-conducting copper sheets distributed up and down; the bottom of the heat-conducting copper sheet on the lower side is provided with a heat-dissipating panel I; the bottom of the heat-dissipating panel I is connected with heat-dissipating panels I distributed evenly at intervals; the top of the heat-conducting copper sheet on the upper side is provided with a heat-dissipating panel II for heat dissipation; the top of the heat-dissipating panel II is connected with heat-dissipating panels II distributed evenly at intervals; the heat of the IGBT module body is absorbed by the heat-dissipating panel I, the heat-dissipating panel II, the heat-dissipating panels II and the heat-dissipating panels II.

[0007] As an optimal technical solution of the utility model, it also includes a condenser and a liquid inlet pipe. A condenser is connected between the heat dissipation panel I and the heat dissipation panel II. The condenser is filled with cooling liquid. The right end of the condenser is connected and communicated with the liquid inlet pipe. A sealing plug is provided on the liquid inlet pipe. The heat of the heat dissipation panel I and the heat dissipation panel II is absorbed by the cooling liquid in the condenser.

[0008] As a preferred technical solution of the utility model, the liquid inlet pipe is arranged at the upper end of the condenser.

[0009] As a preferred technical solution of the utility model, a fan is also included, and fans are installed on both the heat dissipation panel I and the heat dissipation panel II.

[0010] As a preferred technical solution of the utility model, a filter screen is also included. The fan is connected to a filter screen for filtering dust and impurities.

[0011] As an optimal technical solution of the utility model, it also includes a first air guide duct and a second air guide duct, the heat dissipation panel I and the heat dissipation panel II are both provided with air inlets, the heat dissipation panel I and the heat dissipation panel II are both provided with air outlets I, the fan is located outside the air inlet, the heat dissipation panel I and the heat dissipation panel II are both provided with first air guide ducts on the rear sides, the first air guide duct is communicated with the air outlet, the first air guide duct is connected to and communicated with a second air guide duct, and the second air guide duct is located on the rear side of the IGBT module body.

[0012] As a preferred technical solution of the utility model, it also includes an air guide plate, and the second air guide duct is connected to the air guide plate for guiding the air.

[0013] As a preferred technical solution of the utility model, it also includes a first air guide block, and the first air guide block is evenly and fixedly connected inside the first air guide duct.

[0014] As a preferred technical solution of the utility model, it also includes a second air guide block, and the second air guide blocks are evenly spaced and fixedly connected inside the first air guide duct.

[0015] As an optimal technical solution of the utility model, it also includes a third air guide duct, the heat dissipation panel I and the heat dissipation panel II are both provided with air outlets II, the third air guide duct is installed on the front side of the heat dissipation panel I and the heat dissipation panel II, the third air guide duct is connected to the air outlet II, and the first air guide blocks are fixedly connected to the inside of the third air guide duct at even intervals.

[0016] From the above description of the structure of the utility model, it can be seen that the design starting point, concept and advantages of the utility model are: 1. By arranging a thermally conductive copper sheet, a heat dissipation panel I, a heat dissipation panel II, a heat sink I and a heat sink II, the purpose of incremental heat dissipation is achieved to avoid excessive temperature of the IGBT module body.

[0017] 2. By setting up a condenser, the coolant inside it absorbs the heat of the heat dissipation panel I and the heat dissipation panel II, so that the heat dissipation panel I and the heat dissipation panel II can continue to absorb the heat conducted by the thermal conductive copper sheet, thereby achieving a continuous heat dissipation effect.

[0018] 3. By arranging a fan, a first air guide duct, a second air guide duct, an air guide plate, a third air guide duct and a first air guide block, air is discharged to the front and rear sides of the IGBT module body, thereby accelerating the heat dissipation speed of the IGBT module body. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0020] Figure 2 It is a three-dimensional cross-sectional structural schematic diagram of the liquid inlet pipe, the IGBT module body and the heat dissipation panel II of the utility model.

[0021] Figure 3 It is a schematic diagram of the three-dimensional cross-sectional structure of the heat dissipation panel I of the utility model.

[0022] Figure 4 It is a three-dimensional cross-sectional structural schematic diagram of the first air guide duct, the second air guide duct and the air guide plate of the utility model.

[0023] Figure 5 It is a schematic diagram of the three-dimensional structure of the first air guide duct, the first air guide block and the second air guide block of the utility model.

[0024] Figure 6 It is a three-dimensional structural schematic diagram of the heat sink I, the heat dissipation panel and the thermal conductive copper sheet of the utility model.

[0025] Figure 7 It is a three-dimensional structural schematic diagram of the first air guide duct, the second air guide duct and the heat sink II of the utility model.

[0026] Figure 8 It is a schematic diagram of the three-dimensional cross-sectional structure of the heat dissipation panel I of the utility model.

[0027] Fig. 9 It is a three-dimensional cross-sectional structural schematic diagram of the heat dissipation panel I, the IGBT module body and the third air guide duct of the utility model.

[0028] Wherein: 1. heat sink Ⅰ, 2. heat dissipation panel Ⅰ, 3. condenser, 4. liquid inlet pipe, 5. igbt module body, 6. heat dissipation panel Ⅱ, 7. air inlet, 8. air outlet Ⅰ, 9. first air guide duct, 10. second air guide duct, 11. air guide plate, 12. first air guide block, 13. second air guide block, 14. heat sink Ⅱ, 15. air outlet Ⅱ, 16. third air guide duct, 17. fan, 18. filter, 19. thermal conductive copper sheet. DETAILED DESCRIPTION

[0029] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention.

[0030] Embodiment 1: An IGBT module with a double-sided heat dissipation structure, see Figure 1-Figure 4 , Figure 6 , Figure 8 and Fig. 9 As shown, it includes an IGBT module body 5, a thermally conductive copper sheet 19, a heat dissipation panel Ⅰ2, a heat dissipation panel Ⅰ1, a heat dissipation panel Ⅱ6 and a heat dissipation panel Ⅱ14. The IGBT module body 5 is connected to the thermally conductive copper sheet 19 distributed up and down by means of bolts, the bottom of the lower thermally conductive copper sheet 19 is connected to the heat dissipation panel Ⅰ2 by means of bolts, the bottom of the heat dissipation panel Ⅰ2 is connected to the heat dissipation panels Ⅰ1 evenly distributed at intervals, the top of the upper thermally conductive copper sheet 19 is connected to the heat dissipation panel Ⅱ6 for heat dissipation by means of bolts, and the top of the heat dissipation panel Ⅱ6 is connected to the heat dissipation panels Ⅱ14 evenly distributed at intervals.

[0031] See also Figure 1 and Figure 2 As shown, it also includes a condenser 3 and a liquid inlet pipe 4. The condenser 3 is connected between the heat dissipation panel Ⅰ2 and the heat dissipation panel Ⅱ6. The condenser 3 is filled with coolant. The right end of the condenser 3 is connected and communicated with the liquid inlet pipe 4. The liquid inlet pipe 4 is arranged at the upper end of the condenser 3, and a sealing plug is provided on the liquid inlet pipe 4.

[0032] When the IGBT module generates heat, the thermally conductive copper sheet 19 absorbs the heat of the IGBT module body 5 and conducts the heat to the heat dissipation panel Ⅰ2 and the heat dissipation panel Ⅱ6. The heat dissipation panel Ⅰ2 and the heat dissipation panel Ⅱ6 continue to conduct the heat to the heat sink Ⅰ1 and the heat sink Ⅱ14, thereby achieving the purpose of incremental heat dissipation and preventing the temperature of the IGBT module body 5 from being too high. At the same time, the coolant in the condenser 3 absorbs the heat of the heat dissipation panel Ⅰ2 and the heat dissipation panel Ⅱ6, so that the heat dissipation panel Ⅰ2 and the heat dissipation panel Ⅱ6 can continue to absorb the heat conducted by the thermally conductive copper sheet 19, thereby achieving the effect of continuous heat dissipation.

[0033] Example 2: Based on Example 1, refer to Figure 1 and Figure 3-Figure 9As shown, it also includes a fan 17, a filter 18, a first air guide duct 9, a second air guide duct 10, an air guide plate 11, a first air guide block 12, a second air guide block 13 and a third air guide duct 16. The fan 17 is connected to the heat dissipation panel I2 and the heat dissipation panel II6 by bolts. The fan 17 is connected to the filter 18 for filtering dust and impurities. The heat dissipation panel I2 and the heat dissipation panel II6 are both provided with an air inlet 7. The heat dissipation panel I2 and the heat dissipation panel II6 are both provided with an air outlet I8. The fan 17 is located outside the air inlet 7. The rear sides of the heat dissipation panels I2 and II6 are both connected to the first air guide duct 9 by bolts. The first air guide duct 9 is connected to the air outlet. The first air duct 9 is connected to the second air duct 10 and is located at the rear side of the IGBT module body 5. The second air duct 10 is connected to an air guide plate 11 for guiding air. The first air duct 9 is evenly spaced inside with first air guide blocks 12 connected by welding. The first air duct 9 is evenly spaced inside with second air guide blocks 13 connected by welding. The heat dissipation panel Ⅰ2 and the heat dissipation panel Ⅱ6 are both provided with air outlets Ⅱ15. The front sides of the heat dissipation panels Ⅰ2 and Ⅱ6 are both connected with third air ducts 16 by bolts. The third air duct 16 is connected with the air outlet Ⅱ15. The third air duct 16 is evenly spaced inside with first air guide blocks 12 connected by welding.

[0034] During the heat dissipation process, the fan 17 is started, and the fan 17 rotates to blow air into the heat dissipation panel Ⅰ2 and the heat dissipation panel Ⅱ6 through the air inlet 7, and then flows into the first air guide duct 9 and the second air guide duct 10 through the air outlet Ⅰ8, and then dispersed by the air guide plate 11 and discharged to the rear side of the IGBT module body 5, thereby accelerating the heat dissipation speed of the IGBT module body 5. At the same time, the air flows into the third air guide duct 16 through the air outlet Ⅱ15, and then is discharged to the front side of the IGBT module body 5 through the first air guide block 12, thereby further accelerating the heat dissipation speed of the IGBT module body 5.

[0035] Although the present disclosure has been described with respect to only a limited number of embodiments, those skilled in the art having benefit of this disclosure will appreciate that various other embodiments may be designed without departing from the scope of the present invention. Therefore, the scope of the present invention should be limited only by the appended claims.

Claims

1. An IGBT module with a double-sided heat dissipation structure, characterized in that: The invention comprises an IGBT module body (5), a heat-conducting copper sheet (19), a heat-dissipating panel I (2), a heat-dissipating sheet I (1), a heat-dissipating panel II (6) and a heat-dissipating sheet II (14); the IGBT module body (5) is provided with heat-conducting copper sheets (19) distributed up and down; the bottom of the heat-conducting copper sheet (19) on the lower side is provided with a heat-dissipating panel I (2); the bottom of the heat-dissipating panel I (2) is connected with heat-dissipating sheets I (1) distributed evenly at intervals; the top of the heat-conducting copper sheet (19) on the upper side is provided with a heat-dissipating panel II (6) for heat dissipation; the top of the heat-dissipating panel II (6) is connected with heat-dissipating sheets II (14) distributed evenly at intervals.

2. An IGBT module with a double-sided heat dissipation structure as claimed in claim 1, characterized in that: It also includes a condenser (3) and a liquid inlet pipe (4); the condenser (3) is connected between the heat dissipation panel I (2) and the heat dissipation panel II (6); the condenser (3) is filled with cooling liquid; the right end of the condenser (3) is connected and communicated with the liquid inlet pipe (4); and a sealing plug is provided on the liquid inlet pipe (4).

3. An IGBT module with a double-sided heat dissipation structure as claimed in claim 2, characterized in that: The liquid inlet pipe (4) is arranged at the upper end of the condenser pipe (3).

4. An IGBT module with a double-sided heat dissipation structure as claimed in claim 3, characterized in that: It also includes a fan (17), and the fan (17) is installed on both the heat dissipation panel I (2) and the heat dissipation panel II (6).

5. An IGBT module with a double-sided heat dissipation structure as claimed in claim 4, characterized in that: A filter screen (18) is also included. The fan (17) is connected to the filter screen (18) for filtering dust and impurities.

6. An IGBT module with a double-sided heat dissipation structure as claimed in claim 5, characterized in that: The invention also comprises a first air guide duct (9) and a second air guide duct (10); an air inlet (7) is provided on the heat dissipation panel I (2) and the heat dissipation panel II (6); an air outlet I (8) is provided inside the heat dissipation panel I (2) and the heat dissipation panel II (6); the fan (17) is located outside the air inlet (7); a first air guide duct (9) is installed on the rear side of the heat dissipation panel I (2) and the heat dissipation panel II (6); the first air guide duct (9) is connected to the air outlet; the first air guide duct (9) is connected to and communicated with a second air guide duct (10); the second air guide duct (10) is located on the rear side of the IGBT module body (5).

7. An IGBT module with a double-sided heat dissipation structure as claimed in claim 6, characterized in that: It also includes an air guide plate (11), and the second air guide duct (10) is connected to the air guide plate (11) for guiding air.

8. An IGBT module with a double-sided heat dissipation structure as claimed in claim 7, characterized in that: It also includes a first air guide block (12), and the first air guide duct (9) is evenly and fixedly connected with the first air guide blocks (12) at intervals inside.

9. An IGBT module with a double-sided heat dissipation structure as claimed in claim 8, characterized in that: It also includes a second air guide block (13), and the first air guide duct (9) is evenly and fixedly connected with the second air guide blocks (13) inside.

10. An IGBT module with a double-sided heat dissipation structure as claimed in claim 9, characterized in that: It also includes a third air guide duct (16), the heat dissipation panel I (2) and the heat dissipation panel II (6) are both provided with air outlets II (15), the third air guide duct (16) is installed on the front side of the heat dissipation panel I (2) and the heat dissipation panel II (6), the third air guide duct (16) is connected to the air outlet II (15), and the first air guide blocks (12) are evenly spaced and fixedly connected inside the third air guide duct (16).

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