Self-adaptive heat insulation connector for quantum computer
By introducing ionized gas chambers and inert gases into the connectors of superconducting quantum computers and designing adaptive thermal insulation connectors, the problem of large heat conduction losses in traditional connectors is solved, achieving lower heat loss and higher service life.
Patent Information
- Application Number
- CN202421090453.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-17
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-05-17
AI Technical Summary
In superconducting quantum computers, traditional electrical connectors have strong thermal conduction capabilities, resulting in large losses in thermal conduction between high and low temperatures, affecting the low temperature environment and efficiency of the computer.
An adaptive thermal insulation connector is designed, which uses an ionized gas chamber as a heat isolation conduction device. The gas chamber is filled with inert gases, such as mercury vapor, neon, argon and helium. An electric field is applied to the ionization gas chamber through a voltage input device to form a current to achieve conduction.
It effectively reduces the heat loss of superconducting quantum computers, reduces the impact of heat conduction on low-temperature environments, and increases the service life of the connector.
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Figure CN222382014U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of superconducting quantum computers, in particular to an adaptive thermal insulation connector for quantum computers. Background Art
[0002] Superconducting quantum computers work in an insulated vacuum tank close to absolute zero (-273.15℃), performing quantum calculations in this ultra-low temperature and ultra-vacuum state.
[0003] In this state, in order to provide power to the core devices and sensors in the cryogenic tank, several electrical wires need to be connected to the tank for power supply. In order to maintain a continuous ultra-low temperature and ultra-vacuum state, wires with the smallest cross-sectional area are usually selected while meeting the rated minimum working current. The main reason for selecting wires in this way is to minimize the thermal conductivity of the wires while meeting the working current, which helps to maintain the ultra-low temperature environment in the cryogenic tank. Avoid external temperature from leaking heat through the wires and affecting the low temperature environment in the tank.
[0004] like Figure 1 As shown in the figure, the power supply cable connector currently used in superconducting quantum computers is an ordinary electrical connector. The function of an ordinary electrical connector is to physically contact the conductors of the cables at both ends, thereby achieving the function of conducting the circuit. In order to achieve good conduction, the contact pairs (pins and sockets) of traditional electrical connectors usually use copper-plated gold materials, so that the contact resistance of the connector is minimized when mated.
[0005] In order to ensure excellent conduction, the contact parts (pins and sockets) of traditional connectors are made of high-quality conductors (usually copper or copper alloys) and the surface is gold-plated. This metal is usually also an excellent conductor of heat conduction. Therefore, traditional connectors only consider electrical conductivity without considering the need for thermal isolation.
[0006] When the number of quantum bits in a superconducting quantum computer is small, the existing refrigerator can still support a certain number of connector channels. When the number of quantum bits in a superconducting quantum computer grows to a large number, the number of connectors required will increase exponentially. The heat conduction loss caused by this type of connector when it is turned on, from the external environment of about 20°C to -273°C in the tank, cannot be ignored. Utility Model Content
[0007] In order to overcome the deficiencies of the prior art, the purpose of the utility model is to provide an adaptive thermal insulation connector for a quantum computer.
[0008] To achieve the above purpose, the utility model provides the following solutions:
[0009] An adaptive thermal insulation connector for a quantum computer comprises two correspondingly arranged sub-connection devices; each of the sub-connection devices is provided with a contact pair, wherein one of the sub-connection devices is contact-connected with another sub-connection device through the contact pair, and further comprises: a heat insulation conduction device arranged on one side of any one of the contact pairs, wherein the heat insulation conduction device is arranged on the wire of the contact pair on the side where the heat insulation conduction device is located; a voltage input device of the quantum computer is connected to the wire of the contact pair on the side where the heat insulation conduction device is located; the heat insulation conduction device is an ionization gas chamber; the interior of the ionization gas chamber is filled with an inert gas; and the voltage input device is used to apply an electric field to the ionization gas chamber.
[0010] Preferably, the inert gas includes any one of mercury vapor, neon, argon and helium.
[0011] Preferably, the ionization chamber is made of semiconductor material; the thermal conductivity of the semiconductor material is less than a preset threshold.
[0012] Preferably, it also includes: a temperature increasing device; the temperature increasing device is arranged outside the low-temperature tank where the sub-connecting device is located; the temperature increasing device is used to heat the ionization gas chamber.
[0013] According to the specific embodiments provided by the utility model, the utility model discloses the following technical effects:
[0014] The utility model provides an adaptive heat-insulating connector for a quantum computer, including two correspondingly arranged sub-connection devices; the sub-connection devices are each provided with a contact pair, one of the sub-connection devices is contact-connected with another sub-connection device through the contact pair, and also includes: a voltage input device and a heat-insulating conduction device arranged on one side of any of the contact pairs, the heat-insulating conduction device is arranged on the wire of the contact pair on the side where the heat-insulating conduction device is located; the voltage input device is connected to the wire of the contact pair on the side where the heat-insulating conduction device is located; the heat-insulating conduction device is an ionization gas chamber; the interior of the ionization gas chamber is filled with an inert gas; the voltage input device is used to apply an electric field to the ionization gas chamber. The temperature data of the utility model does not need to be collected continuously, and can be turned on once every few seconds. When data needs to be collected, the external computer controls the input voltage to turn on the link. After collecting data, the voltage is disconnected, and the link is also disconnected at the same time. Due to the existence of the gas chamber, the gas is a poor conductor of heat, so the heat loss of the superconducting quantum computer can be greatly reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0016] Figure 1 A schematic diagram of a metal pin and socket of a conventional electrical connector provided by an embodiment of the utility model;
[0017] Figure 2 A schematic diagram of the structure of the device provided in the embodiment of the utility model;
[0018] Figure 3 A schematic diagram of the movement of free electrons provided in an embodiment of the utility model.
[0019] Description of reference numerals:
[0020] 1- conductor, 2- heat insulation conduction device, 3- inert gas, 4- voltage input device, 5- anode, 6- cathode, 7- negative charge, 8- heating device. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0022] The utility model is based on the fact that not all electronic devices such as devices and sensors that need power supply in superconducting quantum computers require power supply at all times. If the connector can be disconnected when no power transmission is required, the heat conduction loss caused by the wire and the connector can be greatly isolated. However, it is inconvenient to manually connect and disconnect the connector, which also affects the service life of the connector (usually the rated life of the connector is 500 plug-in and unplug times). The purpose of the utility model is to provide an adaptive thermal insulation connector for quantum computers, which can greatly reduce the heat loss of superconducting quantum computers.
[0023] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0024] Figure 1 The schematic diagram of the device structure provided by the embodiment of the utility model is as follows: Figure 1As shown, the utility model provides an adaptive thermal insulation connector for a quantum computer, comprising two correspondingly arranged sub-connection devices; each of the sub-connection devices is provided with a contact pair, wherein one of the sub-connection devices is contact-connected with another sub-connection device through the contact pair, and further comprising: and a heat insulation conduction device 2 arranged on one side of any one of the contact pairs, wherein the heat insulation conduction device 2 is arranged on the wire 1 of the contact pair on the side; a voltage input device 4 of the quantum computer is respectively connected to the wires 1 of the two contact pairs; the heat insulation conduction device 2 is an ionization gas chamber; the interior of the ionization gas chamber is filled with an inert gas 3; the voltage input device 4 is used to apply an electric field to the ionization gas chamber.
[0025] Specifically, the voltage input device can generate an input voltage, and the input voltage is the conduction voltage generated by the quantum computer itself when it is running.
[0026] The device provided in this embodiment is a special electrical connector, which does not use traditional copper electrical terminals but uses a material that can insulate heat. The characteristic of this material is that the circuit will be turned on when there is an additional voltage.
[0027] The principle of the adaptive heat-insulating connector of the utility model is that, based on the traditional electrical connector, a device that can isolate heat conduction is set on one side of the connector pin or socket, such as a low thermal conductivity semiconductor material, an ionizable gas chamber, and the gas chamber is filled with appropriate mercury vapor or inert gas such as neon, argon, helium, etc. 3. Exemplarily, the connector gas chamber is set outside the low-temperature tank of the quantum computer.
[0028] The semiconductors set in the heat-insulating conduction device are not only the semiconductor materials commonly used to manufacture chips, but also include ionizable gas materials. It is usually recommended to use gas as a semiconductor material because the thermal conductivity of gas is very low, much lower than that of solid materials. In order to give the patent a wider coverage, the characteristics of the gas material are not obvious. Under standard conditions, the thermal conductivity of air is 0.0244W / (m·K), the thermal conductivity of argon is 0.0173W / (m·K), and neon is 0.0455W / (m·K). The thermal conductivity of solid materials is higher, and the thermal conductivity of the copper pins and sockets of the connector itself is 385W / (m·K). The solid semiconductor materials used in chip manufacturing are 350W / (m·K) for silicon carbide and 40W / (m·K) for silicon nitride. It can be seen that the effect of using gas to make a "heat-insulating conduction device" is obviously much better than others.
[0029] When no power input is required inside the superconducting quantum computer, the gas chamber is in a short-circuit state. At the same time, the gas is also a poor conductor of heat, thus ensuring the insulation effect.
[0030] When the superconducting quantum computer needs power input, a voltage is input from the outside. When the voltage reaches a certain value, an electric field will be formed between the anode and the cathode. The direction of the electric field is from the anode to the cathode. The electrons escaping from the cathode will move toward the anode under the action of the electric field force, thus forming an electric current. The direction of the current is from the anode to the cathode, which is opposite to the direction of movement of free electrons, causing the gas chamber set in the connector to be electrically conductive, thereby achieving the function of supplying power to the interior of the cryogenic tank.
[0031] like Figure 2 As shown, the movement of free electrons is greatly affected by temperature. In this embodiment, a heating device 8 can be appropriately added outside the low-temperature tank (the heating device 8 is arranged in the gas chamber). When the temperature increases, the thermal emission of free electrons (negative charges 7) between the cathode 6 and the anode 5 will be enhanced, and a larger power of electricity can be provided.
[0032] The beneficial effects of the utility model are as follows:
[0033] By adopting the adaptive thermal insulation connector of the utility model, temperature data does not need to be collected continuously, and conduction can be performed every few seconds. When data needs to be collected, an external computer controls the input voltage to conduct the link. After collecting the data, the voltage is disconnected and the link is disconnected at the same time. Due to the existence of the gas chamber, the gas is a poor conductor of heat, which can greatly reduce the heat loss of the superconducting quantum computer.
[0034] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.
[0035] This article uses specific examples to illustrate the principles and implementation methods of the utility model. The above examples are only used to help understand the method and core ideas of the utility model. At the same time, for those skilled in the art, according to the ideas of the utility model, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the utility model.
Claims
1. An adaptive thermal insulation connector for a quantum computer, comprising two correspondingly arranged sub-connection devices; each of the sub-connection devices is provided with a contact pair, wherein one of the sub-connection devices is contact-connected with the other sub-connection device through the contact pair, characterized in that: Also includes: A heat insulating conduction device is arranged on one side of any one of the contact pairs, and the heat insulating conduction device is arranged on the conductor of the contact pair on the side; The voltage input device of the quantum computer is connected to the wire of the contact pair on the side where the heat insulation conduction device is located; the heat insulation conduction device is an ionization gas chamber; the interior of the ionization gas chamber is filled with inert gas; the voltage input device is used to apply an electric field to the ionization gas chamber.
2. The adaptive thermal insulation connector for a quantum computer according to claim 1, characterized in that: The inert gas includes any one of mercury vapor, neon, argon and helium.
3. The adaptive thermal insulation connector for a quantum computer according to claim 1, characterized in that: The ionization chamber is made of semiconductor material; the thermal conductivity of the semiconductor material is less than a preset threshold.
4. The adaptive thermal insulation connector for a quantum computer according to claim 1, characterized in that: Also includes: Heating device; The temperature raising device is arranged outside the low temperature tank where the sub-connecting device is located; The temperature increasing device is used to heat the ionization gas chamber.