Diamond saw blade laser processing machine

Abstract

The utility model discloses a diamond saw blade laser processing machine which comprises a base, a separating mechanism is arranged on the surface of the base and used for separating and collecting cut materials and raw materials, and the separating mechanism comprises a separating unit which is arranged above the base and used for separating the cut materials and the raw materials. The utility model relates to the technical field of laser processing machines. According to the laser processing machine for the diamond saw blade, when a workpiece is processed, firstly, a laser beam can preliminarily cut a diamond, then chippings can be generated at the cut edge in the process, and connected parts still exist at the fracture part; and at the moment, the carving knife is arranged on the left side of the laser head and used for cutting and separating the materials again after laser cutting, the carving knife can move along with movement of the laser head, physical cutting and separating are conducted again immediately after cutting, the connecting position is separated, and therefore redundant materials on the surface of the workpiece are cleaned, and subsequent machining is prevented from being affected.

Description

Technical Field

[0001] The utility model relates to the technical field of laser processing machines, in particular to a diamond saw blade laser processing machine. Background Art

[0002] Diamond is relatively hard and is usually processed using a laser cutting machine.

[0003] Referring to Chinese patent: CN217513111U (diamond saw blade laser processing machine), the above patent proposes a solution to solve the problem of slow speed and high pollution of electric spark processing in the prior art, by setting up a laser cutting machine to process diamond.

[0004] The above patent sets up a laser cutting machine to process diamonds. However, in the prior art, gaps appear between material interfaces during the processing and results. However, due to the gravitational force between the materials, the original positions will be maintained, or the cut materials will accumulate on the surface of the workpiece, affecting subsequent processing. For this reason, the utility model provides a diamond saw blade laser processing machine. Utility Model Content

[0005] In view of the deficiencies of the prior art, the utility model provides a diamond saw blade laser processing machine, which solves the problem of easy generation of material pile-up in diamond processing in the prior art.

[0006] To achieve the above purpose, the utility model is implemented by the following technical solutions: a diamond saw blade laser processing machine, including a base, the surface of the base is provided with a separation mechanism for separating and collecting the cut material from the raw material, the separation mechanism includes:

[0007] A separation unit is arranged above the base for separating the cut material from the raw material, the separation unit comprises a connector, a laser frame is installed on the top of the base, and the connector is connected to the laser frame through a telescopic component, a laser head is arranged on the surface of the connector, and the connector is connected to a scribing knife through an adjustment component;

[0008] The carrying unit is arranged on the top of the base and is used for placing the workpiece and collecting the cut materials.

[0009] Preferably, the telescopic assembly includes a telescopic shaft and a telescopic sleeve, the telescopic sleeve is installed on the front side of the laser frame, the telescopic shaft slides inside the telescopic sleeve, and the front end of the telescopic shaft is installed with the connector.

[0010] Preferably, the adjustment assembly includes an adjustment frame and a threaded shaft, the adjustment frame is installed on the front side of the connector, the threaded shaft is installed on the left side of the adjustment frame, and the threaded shaft is threadedly connected to the scribing cutter.

[0011] Preferably, the carrying unit comprises a placing table, a rotating disk is arranged on the top of the placing table, the rotating disk is driven to rotate by a driving assembly, and a collecting assembly is arranged on the side of the placing table for collecting debris and cutting materials.

[0012] Preferably, the driving assembly includes a driving gear and an engaging groove, wherein the engaging groove is provided at the bottom of the placement table, and the driving gear is engaged with a gear inside the engaging groove for transmission.

[0013] Preferably, the collecting assembly comprises a collecting plate and a collecting trough, wherein the collecting plate is mounted on a side of the placing table, and the collecting trough is opened on a surface of the collecting plate, and the collecting trough can collect the cut debris and materials for centralized processing.

[0014] Beneficial Effects

[0015] The utility model provides a diamond saw blade laser processing machine. Compared with the prior art, it has the following beneficial effects:

[0016] (1) When processing a workpiece, the laser beam of the diamond saw blade laser processing machine first performs a preliminary cutting on the diamond. Then, in the process, some debris is generated at the cut edge and there are still connected places at the broken part. At this time, a scribing knife is set on the left side of the laser head for re-cutting and separation of the material after laser cutting. The scribing knife moves with the movement of the laser head and performs physical cutting and separation again immediately after cutting, so that the connected parts are separated, thereby cleaning the surface of the workpiece of excess material to avoid affecting subsequent processing.

[0017] (2) The diamond saw blade laser processing machine is connected by rotating the adjustment frame and the threaded shaft. The tail of the scoring cutter slides on the surface of the adjustment frame. The tail of the scoring cutter is threadedly connected to the threaded shaft and can be adjusted in position to adapt to the processing of materials of different shapes. Excess materials will directly fall onto the surface of the collection slot of the collection plate, which is convenient for centralized processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the load-bearing unit of the utility model;

[0020] Figure 3 It is a schematic diagram of the separation unit structure of the utility model.

[0021] In the figure: 1-base, 2-telescopic assembly, 21-telescopic shaft, 22-telescopic sleeve, 3-separation unit, 31-connector, 32-laser frame, 33-scratching knife, 4-adjustment assembly, 41-adjustment frame, 42-threaded shaft, 5-bearing unit, 51-placing table, 6-driving assembly, 61-driving gear, 62-meshing groove, 7-collecting assembly, 71-collecting plate, 72-collecting groove. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-3 , the utility model provides two technical solutions:

[0024] Embodiment 1

[0025] A diamond saw blade laser processing machine includes a base 1. A separation mechanism is provided on the surface of the base 1 for separating and collecting the cut material from the raw material. The separation mechanism includes:

[0026] The separation unit 3 is arranged above the base 1 for separating the material from the raw material after cutting. The separation unit 3 includes a connector 31, and a laser frame 32 is installed on the top of the base 1. The laser frame 32 is fixed to the top of the base 1 by bolts and the internal laser circuit is connected to the external circuit. The connector 31 is connected to the laser frame 32 through the telescopic component 2. A laser head is arranged on the surface of the connector 31. A scribing knife 33 is arranged on the left side of the laser head for re-cutting and separation of the material after laser cutting. The connector 31 is connected to the scribing knife 33 through the adjustment component 4. When processing the workpiece, the laser beam will first perform a preliminary cutting on the diamond. Then, in this process, some debris will be generated at the cut edge and there will be some connected places at the broken part. At this time, the scribing knife 33 is arranged on the left side of the laser head for re-cutting and separation of the material after laser cutting. The scribing knife 33 will move with the movement of the laser head, and will perform physical cutting and separation again immediately after cutting, so that the connected part is separated, thereby cleaning the workpiece surface of more materials to avoid affecting subsequent processing;

[0027] The carrying unit 5 is arranged on the top of the base 1 and is used for placing workpieces and collecting cut materials.

[0028] Embodiment 2

[0029] The main difference from Example 1 is:

[0030] A diamond saw blade laser processing machine, the telescopic component 2 includes a telescopic shaft 21 and a telescopic sleeve 22, the connection between the front end of the telescopic shaft 21 and the connecting head 31 can preset an adjustment angle, a gas rod is arranged inside the telescopic sleeve 22 to push the telescopic shaft 21 to move forward and backward, the telescopic sleeve 22 is installed on the front side of the laser frame 32, the telescopic shaft 21 slides inside the telescopic sleeve 22, the front end of the telescopic shaft 21 is installed with the connecting head 31, the adjustment component 4 includes an adjustment frame 41 and a threaded shaft 42, the adjustment frame 41 and the threaded shaft 42 are rotatably connected, the tail of the scoring knife 33 slides on the surface of the adjustment frame 41, the tail of the scoring knife 33 is threadedly connected with the threaded shaft 42, the position can be adjusted to adapt to the processing of materials of different shapes, the excess material will directly fall on the surface of the collection slot 72 of the collection plate 71, which is convenient for centralized processing, the adjustment frame 41 and the threaded shaft 42 are rotatably connected, the tail of the scoring knife 33 slides on the surface of the adjustment frame 41, the tail of the scoring knife 33 The part is threadedly connected with the threaded shaft 42, the adjustment frame 41 is installed on the front side of the connecting head 31, the threaded shaft 42 is installed on the left side of the adjustment frame 41, the threaded shaft 42 is threadedly connected with the scoring knife 33, the carrying unit 5 includes a placing table 51, a rotating disk is arranged on the top of the placing table 51, a clamp is arranged on the surface of the rotating disk for clamping the material, the rotating disk is driven to rotate by the driving component 6, a collecting component 7 is arranged on the side of the placing table 51 for collecting debris and cutting materials, the driving component 6 includes a driving gear 61 and a meshing groove 62, a gear shaft is arranged inside the meshing groove 62 and the shaft core is fixed to the rotating disk, the meshing groove 62 is opened at the bottom of the placing table 51, the driving gear 61 is meshed with the gear inside the meshing groove 62 for transmission, the collecting component 7 includes a collecting plate 71 and a collecting groove 72, the collecting plate 71 is installed on the side of the placing table 51, the collecting groove 72 is opened on the surface of the collecting plate 71, the collecting groove 72 can collect the cut debris and materials and process them centrally.

[0031] Meanwhile, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.

[0032] During operation, when processing the workpiece, the laser beam will first perform a preliminary cutting on the diamond, and then in this process, some debris will be generated at the cut edge and there will still be connected places at the broken parts. At this time, the scribing knife 33 is set on the left side of the laser head for re-cutting and separation of the material after laser cutting. The scribing knife 33 will move with the movement of the laser head, and will perform physical cutting and separation again immediately after cutting, so that the connected parts will be detached, thereby cleaning the excess material on the surface of the workpiece to avoid affecting subsequent processing. By adjusting the rotation connection between the frame 41 and the threaded shaft 42, the tail of the scribing knife 33 slides on the surface of the adjusting frame 41, and the tail of the scribing knife 33 is threadedly connected to the threaded shaft 42, and the position can be adjusted to adapt to the processing of materials of different shapes. Excess material will directly fall on the surface of the collection slot 72 of the collection plate 71, which is convenient for centralized processing.

[0033] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A diamond saw blade laser processing machine, comprising a base (1), characterized in that: The surface of the base (1) is provided with a separation mechanism for separating and collecting the cut material from the raw material, and the separation mechanism comprises: A separation unit (3) is arranged above the base (1) and is used for separating the cut material from the raw material. The separation unit (3) comprises a connection head (31), and a laser frame (32) is installed on the top of the base (1). The connection head (31) is connected to the laser frame (32) via a telescopic component (2). A laser head is arranged on the surface of the connection head (31), and the connection head (31) is connected to a scribing knife (33) via an adjustment component (4). A carrying unit (5) is arranged on the top of the base (1) and is used for placing workpieces and collecting cut materials.

2. A diamond saw blade laser processing machine according to claim 1, characterized in that: The telescopic assembly (2) comprises a telescopic shaft (21) and a telescopic sleeve (22), wherein the telescopic sleeve (22) is mounted on the front side of the laser frame (32), the telescopic shaft (21) slides inside the telescopic sleeve (22), and the front end of the telescopic shaft (21) is mounted on the connector (31).

3. The diamond saw blade laser processing machine according to claim 1, characterized in that: The adjustment assembly (4) comprises an adjustment frame (41) and a threaded shaft (42), wherein the adjustment frame (41) is installed on the front side of the connector (31), and the threaded shaft (42) is installed on the left side of the adjustment frame (41), and the threaded shaft (42) is threadedly connected to the scoring knife (33).

4. The diamond saw blade laser processing machine according to claim 1, characterized in that: The carrying unit (5) comprises a placing table (51), a rotating disk is arranged on the top of the placing table (51), and the rotating disk is driven to rotate by a driving component (6), and a collecting component (7) is arranged on the side of the placing table (51) for collecting debris and cut materials.

5. The diamond saw blade laser processing machine according to claim 4, characterized in that: The driving assembly (6) comprises a driving gear (61) and an engagement groove (62); the engagement groove (62) is provided at the bottom of the placement platform (51); the driving gear (61) is engaged with a gear inside the engagement groove (62) for transmission.

6. The diamond saw blade laser processing machine according to claim 4, characterized in that: The collecting assembly (7) comprises a collecting plate (71) and a collecting trough (72); the collecting plate (71) is mounted on the side of the placing table (51); the collecting trough (72) is opened on the surface of the collecting plate (71); the collecting trough (72) can receive the cut debris and materials for centralized processing.

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