Evaporation device and battery processing system

Abstract

The utility model is suitable for the technical field of vacuum evaporation, and provides an evaporation device and a battery processing system.The evaporation device comprises an evaporation source; the support is arranged on one side of the evaporation source in the height direction, a diverging space is formed between the support and the evaporation source, and the support is provided with an evaporation channel communicated with the diverging space; at least part of the feeding structure is opposite to the evaporation channel; the baffle structure is arranged on the support and comprises a first baffle movably arranged on the support, and the first baffle is used for closing or opening the evaporation channel; according to the evaporation device, the diverging space is arranged between the baffle structure and the evaporation source, so that evaporation material steam formed by the evaporation source can be diverged in the diverging space firstly and then is attached to other positions of the first baffle or the support after diverging, and the thickness increasing speed of evaporation film layers attached to the first baffle and the support is slowed down; the evaporation film layer attached to the first baffle and the support is not prone to falling off, and therefore interference to an evaporation source can be reduced.

Description

Technical Field

[0001] The present application belongs to the field of vacuum evaporation technology, and in particular relates to an evaporation device and a battery processing system. Background Art

[0002] Energy conservation and emission reduction are the key to the sustainable development of the automobile industry. Electric vehicles have become an important part of the sustainable development of the automobile industry due to their advantages of energy conservation and environmental protection. For electric vehicles, battery technology is an important factor related to their development. In the battery processing process, the positive electrode current collector of the battery usually uses an aluminum film as a carrier, and the commonly used coating equipment is a vacuum coating machine.

[0003] In current vacuum coating machines, the material vapor attached to the baffle is easily dropped into the evaporation source after solidification and interferes with the evaporation source. Utility Model Content

[0004] In view of the above problems, the present application provides a vapor deposition device and a battery processing system, which can alleviate the problem that the material vapor attached to the baffle is easy to fall off after solidification.

[0005] In a first aspect, some embodiments of the present application provide an evaporation device, comprising:

[0006] Evaporation source;

[0007] A bracket is arranged on one side of the evaporation source along the height direction of the evaporation device, a divergence space is formed between the bracket and the evaporation source, and a evaporation channel connected to the divergence space is arranged on the bracket;

[0008] A feeding structure is arranged on a side of the support opposite to the evaporation source along the height direction, and at least a part of the feeding structure is opposite to the evaporation channel;

[0009] The baffle structure is arranged on the bracket, and the baffle structure comprises a first baffle movably arranged on the bracket, and the first baffle is used to close or open the evaporation channel.

[0010] In the technical solution of this embodiment, a divergence space is set between the baffle structure and the evaporation source, so that the evaporation material vapor formed by the evaporation source can first diverge in the divergence space, and then adhere to the first baffle and the bracket after divergence, so that the material vapor can more evenly adhere to the surface of the bracket and the first baffle; compared with the method of directly setting the baffle near the evaporation source, this setting can slow down the thickness growth rate of the evaporation film layer attached to the first baffle and the bracket, so that the evaporation film layer attached to the first baffle and the bracket is less likely to fall off, thereby reducing interference with the evaporation source.

[0011] In some embodiments, the baffle structure has a first position and a second position arranged in sequence along a first direction, and the first baffle can move between the first position and the second position;

[0012] When the first baffle is in the first position, the evaporation channel is opened; when the first baffle is in the second position, the evaporation channel is closed.

[0013] In the technical solution of this embodiment, the first baffle is enabled to move along the first direction. Compared with the rotating baffle, the structure of the first baffle that moves linearly along the first direction can be simpler, thus being easier to control. In the process of the first baffle closing the evaporation channel, the linearly moving first baffle can better play the role of blocking material vapor.

[0014] In some embodiments, the baffle structure further includes a second baffle, and the first baffle and the second baffle are respectively disposed on opposite sides of the evaporation channel along the first direction;

[0015] When the first baffle is in the second position, the first baffle is adjacent to the second baffle and closes the evaporation channel.

[0016] In the technical solution of this embodiment, a first baffle and a second baffle are respectively arranged on opposite sides of the evaporation channel, and the first baffle can move toward the direction close to the second baffle to close the evaporation channel; at the same time, the arrangement of the first baffle and the second baffle can enhance the effect of the baffle structure in blocking material vapor.

[0017] In some embodiments, when the first baffle is in the second position, a gap exists between the first baffle and the second baffle.

[0018] When the first baffle plate closes the evaporation channel, the first baffle plate is closer to the second baffle plate. At this time, after the material vapor adheres to the first baffle plate and the second baffle plate and solidifies, it is easy for the first baffle plate to stick to the second baffle plate. Accordingly, the technical solution of this embodiment allows a gap to exist between the first baffle plate and the second baffle plate when the evaporation channel is closed, so that the first baffle plate is not easily adhered to the second baffle plate.

[0019] In some embodiments, the width of the gap ranges from 2 mm to 3 mm.

[0020] The technical solution of this embodiment provides a width range of the gap, so that when the first baffle is in the second position, the first baffle can close the evaporation channel and block the material vapor, and is not easily adhered to the second baffle.

[0021] In some embodiments, the first direction is inclined relative to the width direction of the evaporation device;

[0022] In the height direction of the evaporation device, the distance between the second position and the evaporation source is smaller than the distance between the first position and the evaporation source.

[0023] In the technical solution of this embodiment, the first direction is inclined relative to the width direction of the evaporation device, so that when the first baffle is in the second position, the first baffle can be staggered with the second baffle in the height direction of the evaporation device to better block the material vapor.

[0024] In some embodiments, the angle between the first direction and the width direction is in the range of 5° to 6°.

[0025] The technical solution of this embodiment provides a range of tilt angles in the first direction, so that the first baffle can better block material vapor when in the second position and can also move to the second position faster.

[0026] In some embodiments, the first baffle includes a first plate body and a second plate body, the first plate body is arranged perpendicular to the extension direction of the evaporation channel, and the second plate body is inclined relative to the width direction of the evaporation device, one end of the second plate body is connected to the first plate body, and the other end of the second plate body extends in a direction away from the first plate body and away from the evaporation source.

[0027] In the technical solution of this embodiment, the first baffle includes a first plate body and a second plate body, and the second plate body is inclined relative to the first plate body to increase the area of ​​the first baffle facing the evaporation source, so that the first baffle has a larger area for attaching material vapor; in this structure, after the material vapor adheres to the first baffle and solidifies, the thickness of the evaporated film layer after solidification increases more slowly, and the evaporated film layer attached to the first baffle is less likely to fall off and fall onto the evaporation source, thereby reducing interference with the evaporation source.

[0028] In some embodiments, a rounded corner is formed at a connection between the first plate and the second plate.

[0029] In the technical solution of this embodiment, a rounded corner is set at the connection between the first plate body and the second plate body, so that the solidified evaporated film layer can be more evenly attached to the connection between the first plate body and the second plate body, and the solidified evaporated film layer is not easy to accumulate quickly at the connection between the first plate body and the second plate body, thereby increasing the adhesion of the evaporated film layer at the connection between the first plate body and the second plate body and reducing the interference of the evaporated film layer falling on the evaporation source.

[0030] In some embodiments, the angle between the second plate and the width direction is in the range of 40° to 50°.

[0031] The technical solution of this embodiment provides an inclination angle range for the second plate body, so that the first baffle can have a larger area for the vapor deposition film layer to adhere, while also ensuring that the size of the first baffle in the width direction of the bracket is not too large, thereby reducing the movement distance of the first baffle along the first direction and facilitating the first baffle to quickly close or open the vapor deposition channel.

[0032] In some embodiments, a first protrusion structure is protruded on a side of the second plate body facing the evaporation channel; and / or

[0033] A first protruding structure is protruded on one side of the first plate body facing the evaporation source.

[0034] In the technical solution of this embodiment, a first protruding structure is arranged on the first plate body and / or the second plate body, so as to reduce the surface smoothness of the first plate body and / or the second plate body through the first protruding structure, thereby further increasing the adhesion of the evaporated film layer on the first plate body and / or the second plate body; at the same time, this arrangement can also further increase the area of ​​the first plate body and / or the second plate body, thereby increasing the adhesion area of ​​the evaporated film layer and reducing the increase rate of the thickness of the evaporated film layer on the first plate body and / or the second plate body.

[0035] In some embodiments, the baffle structure further includes a first cooling structure disposed on the first baffle.

[0036] In the technical solution of this embodiment, a first cooling structure is provided on the first baffle plate so that the material vapor attached to the first baffle plate can solidify faster and form a solidified evaporated film layer, thereby facilitating better adhesion of the evaporated film layer to the first baffle plate.

[0037] In some embodiments, the second baffle includes a third plate and a fourth plate, the third plate is arranged perpendicular to the extension direction of the evaporation channel, and the fourth plate is inclined relative to the width direction of the evaporation device, one end of the fourth plate is connected to the third plate, and the other end of the fourth plate extends in a direction away from the third plate and away from the evaporation source.

[0038] In the technical solution of this embodiment, the second baffle includes a third plate body and a fourth plate body, and the fourth plate body is inclined relative to the third plate body to increase the area of ​​the second baffle facing the evaporation source, so that the second baffle has a larger area for attaching the evaporated film layer; in this structure, after the material vapor adheres to the second baffle and solidifies, the thickness of the evaporated film layer after solidification increases more slowly, and the evaporated film layer attached to the second baffle is less likely to fall off and fall onto the evaporation source, thereby reducing interference with the evaporation source.

[0039] In some embodiments, a rounded corner is formed at a connection between the third plate and the fourth plate.

[0040] In the technical solution of this embodiment, a rounded corner is set at the connection between the third plate body and the fourth plate body, so that the solidified evaporated film layer can be more evenly adhered to the connection between the third plate body and the fourth plate body, and the solidified evaporated film layer is not easy to accumulate quickly at the connection between the third plate body and the fourth plate body, thereby increasing the adhesion of the evaporated film layer at the connection between the third plate body and the fourth plate body and reducing interference with the evaporation source.

[0041] In some embodiments, the angle between the fourth plate and the width direction ranges from 70° to 80°.

[0042] The technical solution of this embodiment provides a range of inclination angles of the fourth plate body, so that the second baffle can have a larger area for the vapor-deposited film layer to adhere.

[0043] In some embodiments, when the first baffle is in the second position, an end of the fourth plate body facing away from the third plate body is located on a side of the first baffle plate away from the evaporation source.

[0044] In the technical solution of this embodiment, the end of the fourth plate body away from the third plate body can extend to the side of the first baffle body away from the evaporation source when the first baffle is in the second position, that is, the end of the fourth plate body away from the third plate body can be located above the first baffle plate when the first baffle plate is in the second position. At this time, the end of the fourth plate body away from the third plate body can be above the adjacent position of the first baffle plate and the second baffle plate. If material vapor leaks through the adjacent position of the first baffle plate and the second baffle plate, the leaked material vapor can be blocked by the end of the fourth plate body away from the third plate body and attached to the fourth plate body, so that the first baffle plate and the second baffle plate can better block the material vapor.

[0045] In some embodiments, a second protrusion structure is protruded on a side of the fourth plate body facing the evaporation channel; and / or

[0046] A second protruding structure is protruded from one side of the third plate body facing the evaporation channel.

[0047] In the technical solution of this embodiment, a second protruding structure is arranged on the third plate body and / or the fourth plate body to reduce the surface smoothness of the third plate body and / or the fourth plate body through the second protruding structure, thereby further increasing the adhesion of the evaporated film layer on the third plate body and / or the fourth plate body; at the same time, this arrangement can also further increase the area of ​​the third plate body and / or the fourth plate body, thereby increasing the adhesion area of ​​the evaporated film layer and reducing the increase rate of the thickness of the evaporated film layer on the third plate body and / or the fourth plate body.

[0048] In some embodiments, the baffle structure further includes a second cooling structure disposed on the second baffle.

[0049] In the technical solution of this embodiment, a second cooling structure is provided on the second baffle plate so that the material vapor attached to the second baffle plate can solidify faster and form a solidified evaporated film layer, thereby facilitating better adhesion of the evaporated film layer to the second baffle plate.

[0050] In some embodiments, there are two supports and they are respectively arranged on two opposite sides of the feeding structure along the height direction, and there are two evaporation sources and they are respectively arranged on one side of the two supports opposite to the feeding structure.

[0051] In the technical solution of this embodiment, brackets and evaporation sources are arranged on opposite sides of the feeding structure to perform double-sided evaporation on the material on the feeding structure.

[0052] In a second aspect, some embodiments of the present application further provide a battery processing system, including the evaporation device provided by some embodiments of the first aspect.

[0053] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0055] Figure 1 A schematic diagram of the structure of the evaporation device provided in an embodiment of the present application when the first baffle is in the first position Figure 1 .

[0056] Figure 2 A schematic diagram of the structure of the evaporation device provided in an embodiment of the present application when the first baffle is in the first position Figure 2 .

[0057] Figure 3 A schematic diagram of the structure of the evaporation device provided in an embodiment of the present application when the first baffle is in the second position.

[0058] Figure 4 for Figure 3 A local enlarged schematic diagram of point A in the middle.

[0059] Figure 5 This is a schematic diagram of the structure in which evaporation sources are provided on both sides of the feeding structure in the evaporation device provided in an embodiment of the present application.

[0060] The meanings of the marks in the figure are:

[0061] 100. Evaporation device;

[0062] 10. bracket; 101. evaporation channel; 11. guide structure;

[0063] 20. baffle structure; 21. first baffle; 211. first plate body; 212. second plate body; 213. first protruding structure; 22. second baffle; 221. third plate body; 222. fourth plate body; 223. second protruding structure; 23. first cooling structure; 24. second cooling structure;

[0064] 30. Feeding structure;

[0065] 40. Evaporation source;

[0066] 50. Divergent space. DETAILED DESCRIPTION

[0067] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0068] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0069] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0070] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0071] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0072] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0073] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0074] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0075] At present, from the perspective of market development, the application of power batteries is becoming more and more extensive. Power batteries are not only used in energy storage power systems such as hydropower, thermal power, wind power and solar power stations, but also widely used in electric vehicles such as electric bicycles, electric motorcycles, electric cars, as well as military equipment and aerospace and other fields. With the continuous expansion of the application field of power batteries, the market demand is also constantly expanding.

[0076] During the production and processing of batteries, the positive current collector of the battery usually uses an aluminum film as a carrier. Specifically, a layer of aluminum film needs to be plated on the substrate of the positive current collector to improve the conductivity and stability of the positive current collector. The aluminum film is usually formed on the surface of the substrate by electroplating, chemical plating and vacuum plating. Vacuum plating evaporates aluminum material and forms aluminum vapor, and then makes the aluminum vapor adhere to the surface of the substrate and solidify to form an aluminum film.

[0077] The equipment used for vacuum coating is a vacuum coating machine, which usually includes a feeding system and an evaporation system. The feeding system is used to transport the substrate; the evaporation system is used to evaporate the deposition material and form material vapor. The formed material vapor can adhere to the substrate, and after the material vapor cools and solidifies, a coating can be formed on the substrate.

[0078] When the evaporation system is started and shut down, the material vapor it generates will change; for example, when the evaporation system forms material vapor by heating the evaporated material, the temperature will gradually change when the evaporation system is started and shut down, which can easily lead to insufficient purity of the formed material vapor, and thus easily lead to the coating attached to the substrate not meeting the process requirements.

[0079] Current vacuum evaporation machines are usually equipped with baffles to block the evaporation source during the pre-melting stage of the evaporation material to reduce the dispersion of material vapor, thereby reducing the adhesion of material vapor of insufficient purity to the substrate; at the same time, after the coating of the substrate is completed, the baffle can also quickly block the evaporation source to prevent the material vapor from continuing to adhere to the substrate, thereby achieving precise control of the coating thickness on the substrate.

[0080] At present, the baffles of vacuum evaporation machines are mostly set close to the evaporation source. When the baffle is needed to block the material vapor, the material vapor is not easy to dissipate because the baffle is close to the evaporation source, which easily leads to a small contact area between the baffle and the material vapor, thereby easily causing the thickness of the evaporated film layer solidified on the baffle to increase rapidly, and then causing the solidified evaporated film layer to easily fall off the baffle and fall into the evaporation source, causing interference to the evaporation source.

[0081] Based on the above considerations, in order to alleviate the problem that the material vapor attached to the baffle is easy to fall off after solidification, and to reduce the interference of the falling evaporated film layer on the evaporation source, an embodiment of the present application provides an evaporation device, in which a bracket and a baffle structure are arranged between the evaporation source and the feeding structure, and an evaporation channel for material vapor to pass through is arranged on the bracket, and the evaporation channel is opened and closed by the baffle structure; at the same time, a divergence space is arranged between the baffle structure and the evaporation source for the material vapor to diverge.

[0082] In such an evaporation device, the evaporation material vapor formed by the evaporation source can first diffuse in the divergence space, and then adhere to the first baffle or the bracket after diffusion, so that the material vapor can more evenly adhere to the surface of the bracket and the first baffle. Compared with the method of directly setting the baffle near the evaporation source, this setting can slow down the thickness growth rate of the evaporation film layer attached to the first baffle and the bracket, so that the evaporation film layer attached to the first baffle and the bracket is less likely to fall off, thereby reducing interference with the evaporation source.

[0083] The evaporation device disclosed in the embodiment of the present application can be used to plate an aluminum film on the positive electrode collector of the battery, and can also be used to plate material layers on other structures of the battery. The evaporation device can also be used to plate material layers on other structures and equipment, and is not limited to battery components.

[0084] For the convenience of explanation, the following embodiments are described by taking the evaporation device provided in some embodiments of the present application as an example for coating an aluminum film on a positive electrode collector of a battery.

[0085] In a first aspect, some embodiments of the present application provide a vapor deposition device 100, referring to Figures 1 to 4 ;in, Figure 1 , Figure 2 The direction of the middle Z axis is the height direction of the evaporation device 100 and also the height direction of the bracket 10 ; Figure 1 , Figure 2 The direction of the Y axis is the width direction of the evaporation device 100 , and is also the width direction of the bracket 10 .

[0086] The evaporation device 100 includes an evaporation source 40, a bracket 10, a feeding structure 30 and a baffle structure 20; wherein the bracket 10 is arranged on one side of the evaporation source 40 along the height direction of the evaporation device 100, a divergence space 50 is formed between the bracket 10 and the evaporation source 40, and an evaporation channel 101 connected to the divergence space 50 is provided on the bracket 10; the feeding structure 30 is arranged on the side of the bracket 10 opposite to the evaporation source 40 along the height direction, and at least a part of the feeding structure 30 is opposite to the evaporation channel 101; the baffle structure 20 is arranged on the bracket 10, and the baffle structure 20 includes a first baffle 21 movably arranged on the bracket 10, and the first baffle 21 is used to close or open the evaporation channel 101.

[0087] The evaporation source 40 refers to a structure in the evaporation device 100 that is mainly used to heat the evaporation material and form material vapor. The evaporation source 40 can heat the evaporation material to evaporate or sublime, so as to vaporize the evaporation material into material vapor with a certain amount of energy. The formed material vapor can be diffused into the space where the evaporation source 40 and the feeding structure 30 are located and adhere to the substrate provided by the feeding structure 30, and finally cool and solidify to form a coating film.

[0088] The evaporation source 40 can heat the evaporation material by resistance heating, electron beam heating, arc heating or other methods; the evaporation material can be aluminum or other materials.

[0089] The bracket 10 refers to a structure in the evaporation device 100 that is mainly used to provide a fixed foundation for the feeding structure 30 and the baffle structure 20; the bracket 10 may include a frame structure, a plate structure or other structures; the material of the bracket 10 may include metal, plastic or other materials.

[0090] The feeding structure 30 refers to a structure in the evaporation device 100 that is mainly used to provide the substrate to be coated. The feeding structure 30 may include a feeding roller, a reel, a conveyor belt or other structures that can convey the substrate.

[0091] The bracket 10 is arranged on one side of the evaporation source 40 along the height direction (Z), and the feeding structure 30 is arranged on the side of the bracket 10 opposite to the evaporation source 40 along the height direction (Z). The material vapor formed by the evaporation source 40 can pass through the bracket 10 and adhere to the substrate provided by the feeding structure 30.

[0092] There is a gap between the bracket 10 and the evaporation source 40, and a divergent space 50 is formed between the bracket 10 and the evaporation source 40; the divergent space 50 can be a space set between the bracket 10 and the evaporation source 40, or it can be a space surrounded by structural parts; the divergent space 50 is used to increase the distance between the bracket 10 and the evaporation source 40, so that the material vapor formed by the evaporation source 40 can diverge in the divergent space 50, and the diverged material vapor can be more evenly attached to the substrate or the bracket 10.

[0093] The evaporation channel 101 is formed on the bracket 10, and is used for allowing material vapor to pass through; one end of the evaporation channel 101 is connected to the divergent space 50 so that at least part of the material vapor formed by the evaporation source 40 can enter the evaporation channel 101; the other end of the evaporation channel 101 is opposite to the feeding structure 30, so that the material vapor in the evaporation channel 101 can adhere to the feeding structure 30.

[0094] At least part of the feeding structure 30 is opposite to the evaporation channel 101, that is, the side of the feeding structure 30 facing the evaporation channel 101 may be completely opposite to the evaporation channel 101, or the side of the feeding structure 30 facing the evaporation channel 101 may be only partially opposite to the evaporation channel 101, while the other part extends outside the evaporation channel 101.

[0095] It is understandable that the material vapor entering the evaporation channel 101 can pass through the evaporation channel 101 and adhere to the substrate, while the material vapor not entering the evaporation channel 101 will adhere to the bracket 10 or the baffle structure 20 .

[0096] The baffle structure 20 refers to a structure in the evaporation device 100 that is mainly used to block material vapor; the baffle structure 20 may include a baffle or other structures.

[0097] The first baffle 21 refers to a structure in the baffle structure 20 used to close or open the evaporation channel 101. The first baffle 21 may include a square plate, a circular plate, an arc-shaped plate or a plate of other shapes. The first baffle 21 may also include a plate of other irregular shapes. The material of the first baffle 21 may include metal, plastic or other materials.

[0098] The first baffle 21 can move relative to the bracket 10. The movement of the first baffle 21 relative to the bracket 10 can be driven by a driving device, such as a cylinder, a hydraulic cylinder and other driving devices. The movement of the first baffle 21 relative to the bracket 10 can also be driven by a driving structure, such as a screw nut in conjunction with a motor, a gear rack in conjunction with a motor, etc.; a slide rail, a guide shaft, a guide groove or other guide structures can also be set on the bracket 10 to enable the first baffle 21 to move relative to the bracket 10.

[0099] The first baffle plate 21 is movable relative to the bracket 10 to close or open the evaporation channel 101. When the first baffle plate 21 closes the evaporation channel 101, the material vapor will be blocked by the first baffle plate 21 and adhere to the first baffle plate 21 when it is diffused near the evaporation channel 101, and the material vapor is not easy to enter the evaporation channel 101 at this time; when the first baffle plate 21 opens the evaporation channel 101, the material vapor can enter the evaporation channel 101 and can pass through the evaporation channel 101 and adhere to the substrate of the feeding structure 30.

[0100] In the height direction (Z), the evaporation source 40, the diverging space 50, the bracket 10, and the feeding structure 30 are arranged in sequence from low to high. Since the material vapor formed by the evaporation source 40 can diverge upward, this arrangement facilitates the material vapor to adhere to the substrate, the bracket 10 or the first baffle 21.

[0101] For example, the material vapor formed by the evaporation source 40 can be distributed more evenly after being diverged in the divergence space 50; when the first baffle 21 opens the evaporation channel 101, part of the material vapor adheres to the bracket 10 and the first baffle 21, and part of the material vapor can pass through the evaporation channel 101 and adhere to the substrate of the feeding structure 30; when the first baffle 21 opens the evaporation channel 101, the material vapor will adhere to the bracket 10 and the first baffle 21, and it is not easy to enter the evaporation channel 101.

[0102] Because the baffle is close to the evaporation source 40, it is easy for the material vapor to adhere to part of the surface of the baffle more densely, which is easy to cause the material vapor to adhere to a smaller area, thereby easily causing the thickness of the evaporation film layer formed after the material vapor attached to the baffle solidifies to increase faster; and when the evaporation film layer attached to the baffle is thicker, its adhesion is easy to reduce and it is easy to fall from the baffle into the evaporation source 40, thereby easily interfering with the evaporation source 40.

[0103] Accordingly, in this embodiment, a divergence space 50 is set between the baffle structure 20 and the evaporation source 40, so that the evaporation material vapor formed by the evaporation source 40 can first diverge in the divergence space 50, and then adhere to the first baffle 21 or other positions of the bracket 10 after divergence, so that the material vapor can be more evenly attached to the surface of the bracket 10 and the first baffle 21; compared with the method of directly setting the baffle near the evaporation source 40, this setting can slow down the thickness growth rate of the evaporation film layer attached to the first baffle 21 and the bracket 10, so that the evaporation film layer attached to the first baffle 21 and the bracket 10 is less likely to fall off, thereby reducing interference with the evaporation source 40.

[0104] refer to Figure 5 In some embodiments, there are two supports 10 and they are respectively disposed on opposite sides of the feeding structure 30 along the height direction, and there are two evaporation sources 40 and they are respectively disposed on the side of the two supports 10 opposite to the feeding structure 30 .

[0105] Evaporation sources 40 can be arranged on both sides of a feeding structure 30 to achieve the effect of double-sided evaporation. For example, a feeding structure 30 is provided with brackets 10 on opposite sides, and the two brackets 10 are provided with evaporation sources 40 on the side opposite to the feeding structure 30. At this time, evaporation channels 101 are formed in the two brackets 10, the two brackets 10 are provided with baffle structures 20, and divergent spaces 50 are provided between the two brackets 10 and the adjacent evaporation sources 40.

[0106] In this embodiment, the bracket 10 and the evaporation source 40 are disposed on opposite sides of the feeding structure 30 to achieve a double-sided evaporation effect.

[0107] refer to Figures 1 to 3 In some embodiments, the baffle structure 20 has a first position and a second position arranged in sequence along a first direction, and the first baffle 21 can move between the first position and the second position; when the first baffle 21 is in the first position, the evaporation channel 101 is opened; when the first baffle 21 is in the second position, the evaporation channel 101 is closed.

[0108] The first position and the second position both refer to positions in the baffle structure 20 where the first baffle 21 can move, that is, the first baffle 21 can move to the first position and can also move to the second position; the first position and the second position can be positions set in space or can be positions surrounded by structural parts; it can be understood that in addition to being able to move to the first position and the second position, the first baffle 21 can also move to other positions.

[0109] The first position and the second position are arranged in sequence along the first direction, that is, the first baffle 21 can move along the first direction; the first direction can be a direction parallel to the width direction (Y), and the first direction can also form an angle with the width direction (Y).

[0110] The first baffle 21 can close the evaporation channel 101 when it moves along the first direction to block the material vapor from entering the evaporation channel 101, thereby blocking the material vapor from adhering to the substrate; the first baffle 21 can also open the evaporation channel 101 when it moves along the first direction, so that the material vapor can pass through the evaporation channel 101 and adhere to the substrate.

[0111] For example, when the first baffle plate 21 is in the first position, the evaporation channel 101 is opened, and at least part of the material vapor can enter the evaporation channel 101 and adhere to the substrate of the feeding structure 30 through the evaporation channel 101; when the first baffle plate 21 is in the second position, the evaporation channel 101 is closed, and at this time, the material vapor is not easy to enter the evaporation channel 101, and the material vapor adheres to the first baffle plate 21 and the bracket 10.

[0112] In this embodiment, the first baffle 21 is enabled to move along the first direction. Compared with a rotating baffle, the structure of the first baffle 21 that moves linearly along the first direction can be simpler, thus being easier to control. In addition, in the process of the first baffle 21 closing the evaporation channel 101, the linearly moving first baffle 21 can better block the material vapor.

[0113] refer to Figures 1 to 3 In some embodiments, a guide structure 11 is provided on the bracket 10, and the guide structure 11 extends along a first direction. The first baffle 21 is slidably connected to the guide structure 11 and can move along the guide structure 11 to a first position or a second position. The guide structure 11 can be a slide rail, a slide groove, a guide shaft or other guide structures 11.

[0114] refer to Figures 1 to 3 In some embodiments, the baffle structure 20 also includes a second baffle 22, and the first baffle 21 and the second baffle 22 are respectively arranged on opposite sides of the evaporation channel 101 along the first direction; when the first baffle 21 is in the second position, the first baffle 21 and the second baffle 22 are adjacent to each other and close the evaporation channel 101.

[0115] The second baffle 22 refers to a structure in the baffle structure 20 that is used to cooperate with the first baffle 21 to close the evaporation channel 101; the second baffle 22 may include a square plate body, a circular plate body, an arc-shaped plate body or a plate body of other shapes, and the second baffle 22 may also include a plate body of other irregular shapes; the material of the second baffle 22 may include metal, plastic or other materials.

[0116] The second baffle plate 22 and the first baffle plate 21 are respectively arranged on opposite sides of the evaporation channel 101, and the first baffle plate 21 can move along the first direction to approach or move away from the second baffle plate 22; when the first baffle plate 21 is in the second position, the first baffle plate 21 can be adjacent to the second baffle plate 22 and close the evaporation channel 101; it can be understood that when the first baffle plate 21 is in the second position, the first baffle plate 21 can abut against the second baffle plate 22, or there can be a gap between the first baffle plate 21 and the second baffle plate 22.

[0117] The second baffle 22 can be fixedly connected to the bracket 10 or can move relative to the bracket 10; in some embodiments, the second baffle 22 is fixedly connected to the bracket 10, and only the first baffle 21 can move relative to the bracket 10, and the first baffle 21 can move toward the direction close to the second baffle 22 to close the evaporation channel 101; in other embodiments, the second baffle 22 is movably connected to the bracket 10, and the second baffle 22 can also move toward the direction close to the first baffle 21, that is, the first baffle 21 and the second baffle 22 can approach each other to close the evaporation channel 101.

[0118] In this embodiment, a first baffle 21 and a second baffle 22 are respectively arranged on opposite sides of the evaporation channel 101, and the first baffle 21 can move toward the direction close to the second baffle 22 to close the evaporation channel 101; at the same time, the arrangement of the first baffle 21 and the second baffle 22 can enhance the effect of the baffle structure 20 in blocking material vapor.

[0119] refer to Figure 3 , Figure 4 In some embodiments, when the first baffle 21 is in the second position, there is a gap between the first baffle 21 and the second baffle 22.

[0120] When the first baffle plate 21 is in the second position, the first baffle plate 21 can close the evaporation channel 101 . At this time, the first baffle plate 21 is not in contact with the second baffle plate 22 , and there is a gap between the first baffle plate 21 and the second baffle plate 22 .

[0121] Since the material vapor will cool and solidify after being attached to the first baffle plate 21 and the second baffle plate 22, if the first baffle plate 21 is in contact with the second baffle plate 22 when in the second position, the evaporated film layer on the first baffle plate 21 will easily adhere to the second baffle plate 22 after being cooled and solidified, thereby causing a negative impact on the movement of the first baffle plate 21. At the same time, in the process of the first baffle plate 21 moving from the second position to the first position, it is also easy to cause the evaporated film layer at the contact position between the first baffle plate 21 and the second baffle plate 22 to fall off and interfere with the evaporation source 40.

[0122] Accordingly, in this embodiment, a gap exists between the first baffle plate 21 and the second baffle plate 22 when the first baffle plate 21 closes the evaporation channel 101, so that the first baffle plate 21 is not easily adhered to the second baffle plate 22; in such a structure, the gap between the first baffle plate 21 and the second baffle plate 22 can reduce the occurrence of the situation where the solidified evaporation film layer adheres to the second baffle plate 22, and can also reduce the occurrence of the situation where the material vapor enters the evaporation channel 101 when the evaporation channel 101 is closed.

[0123] refer to Figure 3 , Figure 4 In some embodiments, the width of the gap ranges from 2 mm (millimeter) to 3 mm; for example, the width of the gap can be 2.0 mm, 2.1 mm, 2.2 mm, 2.3 mm, 2.4 mm, 2.5 mm, 2.6 mm, 2.7 mm, 2.8 mm, 2.9 mm, 3.0 mm or other values.

[0124] When the first baffle 21 is in the second position, the width of the gap refers to the distance between the portion of the first baffle 21 closest to the second baffle 22 and the second baffle 22 in the width direction (Y); Figure 4 , the width of the gap is the width shown as h in the figure.

[0125] This embodiment provides a width range of the gap, so that when the first baffle plate 21 is in the second position, the first baffle plate 21 can close the evaporation channel 101 and block the material vapor, and is not easily adhered to the second baffle plate 22.

[0126] refer to Figures 1 to 3 In some embodiments, the first direction is inclined relative to the width direction; in the height direction, the distance between the second position and the evaporation source 40 is smaller than the distance between the first position and the evaporation source 40.

[0127] The first direction is inclined relative to the width direction (Y), and in the height direction (Z), the distance between the second position and the evaporation source 40 is smaller than the distance between the first position and the evaporation source 40, that is, in the process of the first baffle 21 moving from the first position to the second position, the first baffle 21 gradually approaches the evaporation source 40 in the height direction (Z); that is, the first direction is a direction inclined toward the evaporation source 40.

[0128] Because the distance between the second position and the evaporation source 40 is smaller than the distance between the first position and the evaporation source 40, when the first baffle 21 moves to the second position, at least part of the first baffle 21 can be below the second baffle 22, that is, the first baffle 21 can be staggered with the second baffle 22 in the height direction (Z).

[0129] Such a structure enables the evaporation channel 101 to be closed by the first baffle plate 21 and the second baffle plate 22 when the first baffle plate 21 is in the second position, and the material vapor is blocked by the first baffle plate 21 and the second baffle plate 22 and is not easy to enter the evaporation channel 101; because the first baffle plate 21 and the second baffle plate 22 are staggered, even if a small amount of material vapor can leak through the first baffle plate 21 and the second baffle plate 22, the leaked material vapor can be blocked by the second baffle plate 22 and adhere to the second baffle plate 22, thereby further reducing the material vapor entering the evaporation channel 101.

[0130] In this embodiment, the first direction is inclined relative to the width direction (Y), so that when the first baffle 21 is in the second position, the first baffle 21 can be staggered with the second baffle 22 in the height direction (Z) to better block material vapor.

[0131] refer to Figures 1 to 3 In some embodiments, the angle between the first direction and the width direction ranges from 5° to 6°; for example, the angle can be 5.0°, 5.1°, 5.2°, 5.3°, 5.4°, 5.5°, 5.6°, 5.7°, 5.8°, 5.9°, 6.0° or other values.

[0132] The angle between the first direction and the width direction (Y) is Figure 2 The angle shown in the middle angle a determines the inclination of the first direction relative to the width direction (Y) of the bracket 10. The larger the angle, the more inclined the first direction is relative to the width direction (Y) of the bracket 10, and the greater the moving distance required for the first baffle 21 to close the evaporation channel 101.

[0133] Accordingly, when the first baffle 21 is in the second position and can be staggered with the second baffle 22, the angle between the first direction and the width direction (Y) should be smaller to reduce the moving distance required for the first baffle 21 to close the evaporation channel 101, so that the first baffle 21 can quickly close the evaporation channel 101.

[0134] This embodiment provides a tilt angle range in the first direction, so that the first baffle 21 can be staggered with the second baffle 22 in the second position to better block the material vapor, and can also move quickly to the second position to quickly close the evaporation channel 101.

[0135] refer to Figure 1 , Figure 3In some embodiments, the first baffle 21 includes a first plate body 211 and a second plate body 212. The first plate body 211 is arranged perpendicular to the extension direction of the evaporation channel 101, and the second plate body 212 is inclined relative to the width direction. One end of the second plate body 212 is connected to an end of the first plate body 211 close to the evaporation channel 101, and an end of the second plate body 212 facing away from the first plate body 211 extends in a direction away from the first plate body 211 and away from the evaporation source 40.

[0136] The first plate body 211 refers to the plate body in the first baffle 21 facing the evaporation source 40. The first plate body 211 can be a square plate body, a circular plate body or a plate body of other shapes. The first plate body 211 can also be a plate body of an irregular shape. The material of the first plate body 211 may include metal, plastic or other materials.

[0137] After the evaporation material is heated to form material vapor, its rising directionality is poor, that is, the material vapor can fall on the position where the substrate needs to be coated, the position where the substrate does not need to be coated, and can also fall on the feeding structure 30; the first plate 211 is arranged perpendicular to the extension direction of the evaporation channel 101, so that the first plate 211 is mainly used to block the material vapor from adhering to the feeding structure 30 and other positions of the substrate. The first plate 211 can also block the material vapor from entering the evaporation channel 101 when the first baffle 21 moves to the second position; for example, when the extension direction of the evaporation channel 101 is parallel to the height direction (Z), the first plate 211 is parallel to the width direction (Y).

[0138] The second plate body 212 refers to the plate body in the first baffle 21 facing the evaporation channel 101. The second plate body 212 can be a square plate body, a circular plate body or a plate body of other shapes. The second plate body 212 can also be a plate body of irregular shape; the material of the second plate body 212 can include metal, plastic or other materials; the second plate body 212 can be integrally formed with the first plate body 211, and can also be connected to the first plate body 211 by welding, bonding, etc.

[0139] One end of the second plate 212 is connected to one end of the first plate 211 close to the evaporation channel 101, that is, the second plate 212 is also close to the evaporation channel 101, and the other end of the second plate 212 away from the first plate 211 extends in a direction away from the first plate 211 and the evaporation source 40, that is, the other end of the second plate 212 extends toward the inside of the evaporation channel 101; for example, refer to Figure 1 The end of the second plate body 212 away from the first plate body 211 is inclined upward along the height direction (Z) and rightward along the width direction (Y).

[0140] Because the feeding structure 30 needs to drive the substrate to move so that the material vapor can adhere to different positions of the substrate and cover the substrate as needed, there is a gap between the bracket 10 and the feeding structure 30 to reduce the possibility that the bracket 10 scratches the substrate or scratches the film layer after the substrate is coated; and because the directionality of the material vapor rising is poor, part of the material vapor may leak through the gap between the bracket 10 and the feeding structure 30 and adhere to other positions of the substrate or the feeding structure 30; extending the end of the second plate body 212 away from the first plate body 211 toward the inside of the evaporation channel 101 can block the material vapor through the second plate body 212 to reduce the material vapor dissipated between the bracket 10 and the feeding structure 30.

[0141] At the same time, compared with setting the first baffle 21 as a flat plate, the combination of the first plate body 211 and the second plate body 212 can also increase the adhesion area of ​​the material vapor on the first baffle 21, thereby slowing down the thickness growth rate of the solidified vapor-deposited film layer on the first baffle 21, increasing the adhesion of the solidified vapor-deposited film layer on the first baffle 21, reducing the situation of the solidified vapor-deposited film layer falling from the first baffle 21, and reducing interference with the vapor deposition source 40.

[0142] refer to Figure 2 In some embodiments, the angle between the second plate 212 and the width direction of the bracket 10 ranges from 40° to 50°; for example, the angle can be 40°, 41°, 42°, 43°, 44°, 45°, 46°, 47°, 48°, 49°, 50° or other values.

[0143] The angle between the second plate body 212 and the width direction (Y) is the angle shown as angle b in the figure. When the angle is in the range of 40° to 50°, the second plate body 212 can not only block the material vapor from radiating between the bracket 10 and the feeding structure 30, but also block the material vapor from entering the steam channel when the first baffle 21 is in the second position.

[0144] Since the second plate 212 is used to block the material vapor from radiating between the bracket 10 and the feeding structure 30, the angle between the second plate 212 and the width direction (Y) should not be too small; and since the second plate 212 is also used to block the material vapor from entering the steam channel when the first baffle 21 is in the second position, the angle between the second plate 212 and the width direction (Y) should not be too large.

[0145] Accordingly, this embodiment provides a tilt angle range of the second plate body 212 so that the first baffle 21 can have a larger area for the vapor deposition film layer to adhere, while also ensuring that the size of the first baffle 21 in the width direction (Y) is not too large, thereby reducing the movement distance of the first baffle 21 along the first direction, making it easier for the first baffle 21 to quickly close or open the vapor deposition channel 101.

[0146] refer to Figures 1 to 3 In some embodiments, a rounded corner is formed at the connection between the first plate body 211 and the second plate body 212 .

[0147] If an edge is formed at the connection between the first plate body 211 and the second plate body 212, the adhesion of the solidified vapor-deposited film layer on the edge and near the edge is low, and the solidified vapor-deposited film layer is easy to accumulate quickly on the edge and near the edge. As the thickness of the solidified vapor-deposited film layer gradually increases, the solidified vapor-deposited film layer is more likely to fall from the first baffle 21 and interfere with the vapor deposition source 40.

[0148] Accordingly, in this embodiment, rounded corners are set at the connection between the first plate body 211 and the second plate body 212 so that the solidified evaporated film layer can be more evenly adhered to the connection between the first plate body 211 and the second plate body 212, and the solidified evaporated film layer is not easy to accumulate quickly at the connection between the first plate body 211 and the second plate body 212, thereby increasing the adhesion of the evaporated film layer at the connection between the first plate body 211 and the second plate body 212 and reducing interference with the evaporation source 40.

[0149] refer to Figures 1 to 3 In some embodiments, a first protruding structure 213 is protruded from a side of the second plate 212 facing the evaporation channel 101 ; and / or a first protruding structure 213 is protruded from a side of the first plate 211 facing the evaporation source 40 .

[0150] The first protruding structure 213 refers to a structure protruding from the first plate body 211 and / or the second plate body 212; the first protruding structure 213 can be a bolt, a bump or other structure provided on the first plate body 211 and / or the second plate body 212, or it can be a protruding portion integrally formed on the first plate body 211 and / or the second plate body 212; the material of the first protruding structure 213 can be the same as the material of the first plate body 211 and / or the second plate body 212, or it can be different. Specifically, the material of the first protruding structure 213 can include metal, plastic or other materials.

[0151] The first protruding structure 213 may be provided only on the first plate 211 or the second plate 212, or may be provided on both the first plate 211 and the second plate 212; one first protruding structure 213 may be provided on the first plate 211 and / or the second plate 212, or two or more first protruding structures 213 may be provided.

[0152] The first protruding structure 213 is arranged on the side of the first plate 211 facing the evaporation source 40, and / or the first protruding structure 213 is arranged on the side of the second plate 212 facing the evaporation channel 101. This arrangement can increase the roughness of the surface of the first plate 211 and / or the second plate 212 for attaching material vapor, so as to increase the adhesion of the solidified evaporated film layer on the first plate 211 or the second plate 212. At the same time, this arrangement can also increase the surface area of ​​the first plate 211 and / or the second plate 212 for attaching material vapor, so as to better slow down the thickness increase rate of the evaporated film layer after solidification.

[0153] In this embodiment, a first protruding structure 213 is provided on the first plate body 211 and / or the second plate body 212, so as to reduce the surface smoothness of the first plate body 211 and / or the second plate body 212 through the first protruding structure 213, thereby further increasing the adhesion of the evaporated film layer on the first plate body 211 and / or the second plate body 212; at the same time, this setting can also further increase the area of ​​the first plate body 211 and / or the second plate body 212, thereby increasing the adhesion area of ​​the evaporated film layer and reducing the increase rate of the thickness of the evaporated film layer on the first plate body 211 and / or the second plate body 212.

[0154] refer to Figures 1 to 3 In some embodiments, the baffle structure 20 further includes a first cooling structure 23 disposed on the first baffle 21 .

[0155] The first cooling structure 23 refers to a structure in the baffle structure 20 for reducing the temperature of the first baffle 21; the first cooling structure 23 may be an air cooling structure, a water cooling structure or other cooling structures; in some embodiments, the first cooling structure 23 is a water cooling structure.

[0156] The first cooling structure 23 can be fixedly connected to the first baffle plate 21 by welding, bonding or other means, and can also be detachably connected to the first baffle plate 21 by snap-on, screw-on or other means; the first cooling structure 23 can be arranged at any position of the first baffle plate 21. In order to reduce the negative impact of material vapor on the first cooling structure 23, the first cooling structure 23 can be arranged on the side of the first baffle plate 21 away from the evaporation source 40.

[0157] Since the material vapor is formed by heating the vapor deposition material by the vapor deposition source 40, a first cooling structure 23 is provided on the first baffle plate 21 so that the material vapor attached to the first baffle plate 21 can be quickly solidified to form a vapor deposition film layer, thereby reducing the material vapor from escaping to other locations and also reducing the material vapor from falling during the solidification process and causing interference to the vapor deposition source 40.

[0158] In this embodiment, a first cooling structure 23 is provided on the first baffle plate 21 so that the material vapor attached to the first baffle plate 21 can solidify faster and form a solidified evaporated film layer, thereby facilitating better adhesion of the evaporated film layer to the first baffle plate 21 .

[0159] refer to Figures 1 to 3 In some embodiments, the second baffle 22 includes a third plate 221 and a fourth plate 222. The third plate 221 is extended along the width direction, and the fourth plate 222 is inclined relative to the width direction. One end of the fourth plate 222 is connected to the third plate 221, and one end of the fourth plate 222 is away from the third plate 221 and extends in a direction away from the third plate 221 and away from the evaporation source 40.

[0160] The third plate 221 refers to the plate in the second baffle 22 facing the evaporation source 40. The third plate 221 may be a square plate, a circular plate or a plate of other shapes. The third plate 221 may also be an irregularly shaped plate. The material of the third plate 221 may include metal, plastic or other materials.

[0161] After the evaporation material is heated to form material vapor, its rising directionality is poor, that is, the material vapor can fall on the position where the substrate needs to be coated, the position where the substrate does not need to be coated, and can also fall on the feeding structure 30; the third plate 221 is arranged perpendicular to the extension direction of the evaporation channel 101, so that the third plate 221 is mainly used to block the material vapor from adhering to the feeding structure 30 and other positions of the substrate, and the third plate 221 can also block the material vapor from entering the evaporation channel 101 when the second baffle 22 moves to the second position; for example, when the extension direction of the evaporation channel 101 is parallel to the height direction (Z), the third plate 221 is parallel to the width direction (Y).

[0162] The fourth plate body 222 refers to the plate body in the second baffle 22 facing the evaporation channel 101. The fourth plate body 222 can be a square plate body, a circular plate body or a plate body of other shapes. The fourth plate body 222 can also be a plate body of irregular shape; the material of the fourth plate body 222 can include metal, plastic or other materials; the fourth plate body 222 can be integrally formed with the third plate body 221, and can also be connected to the third plate body 221 by welding, bonding, etc.

[0163] One end of the fourth plate 222 is connected to one end of the third plate 221 close to the evaporation channel 101, that is, the fourth plate 222 is also close to the evaporation channel 101, and the other end of the fourth plate 222 away from the third plate 221 extends in a direction away from the third plate 221 and the evaporation source 40, that is, the other end of the fourth plate 222 extends toward the inside of the evaporation channel 101; for example, refer to Figure 1The end of the fourth plate body 222 away from the third plate body 221 is inclined upward along the height direction (Z) and to the left along the width direction (Y).

[0164] Because the feeding structure 30 needs to drive the substrate to move so that the material vapor can adhere to different positions of the substrate and cover the substrate as needed, there is a gap between the bracket 10 and the feeding structure 30 to reduce the possibility that the bracket 10 scratches the substrate or scratches the film layer after the substrate is coated; and because the directionality of the material vapor rising is poor, part of the material vapor may leak through the gap between the bracket 10 and the feeding structure 30 and adhere to other positions of the substrate or the feeding structure 30; extending the end of the fourth plate body 222 away from the third plate body 221 toward the inside of the evaporation channel 101 can block the material vapor through the fourth plate body 222 to reduce the material vapor dissipated between the bracket 10 and the feeding structure 30.

[0165] At the same time, compared with setting the second baffle 22 as a flat plate, the combination of the third plate body 221 and the fourth plate body 222 can also increase the adhesion area of ​​the material vapor on the second baffle 22, thereby slowing down the thickness growth rate of the solidified vapor-deposited film layer on the second baffle 22, increasing the adhesion of the solidified vapor-deposited film layer on the second baffle 22, reducing the situation of the solidified vapor-deposited film layer falling from the second baffle 22, and reducing interference with the vapor deposition source 40.

[0166] refer to Figure 2 In some embodiments, the angle between the fourth plate 222 and the width direction ranges from 70° to 80°; for example, the angle can be 70°, 71°, 72°, 73°, 74°, 75°, 76°, 77°, 78°, 79°, 80° or other values.

[0167] The angle between the fourth plate 222 and the width direction (Y) is the angle shown as angle c in the figure. When the angle range is 70° to 80°, the fourth plate 222 can not only block the material vapor from radiating between the bracket 10 and the feeding structure 30, but also block the material vapor from entering the steam channel.

[0168] Since the fourth plate 222 is used to block the material vapor from radiating between the bracket 10 and the feeding structure 30, the angle between the fourth plate 222 and the width direction (Y) should not be too small; and since the fourth plate 222 is also used to block the material vapor from entering the steam channel when the second baffle 22 is in the second position, the angle between the fourth plate 222 and the width direction (Y) should not be too large.

[0169] Accordingly, this embodiment provides a range of inclination angles of the fourth plate body 222 so that the second baffle plate 22 can have a larger area for material vapor to adhere to, while also reducing the amount of material vapor entering between the bracket 10 and the feeding structure 30 .

[0170] refer to Figure 3 , Figure 4 In some embodiments, when the first baffle plate 21 is in the second position, an end of the fourth plate body 222 facing away from the third plate body 221 is located on a side of the first baffle plate 21 away from the evaporation source 40 .

[0171] When the first baffle 21 is in the second position, one end of the fourth plate 222 can be located on the side of the first baffle 21 away from the evaporation source 40. At this time, the portion of the fourth plate 222 located on the side of the first baffle 21 away from the evaporation source 40 can also play a role in blocking material vapor.

[0172] When the first baffle 21 is in the second position, the second plate 212 and the fourth plate 222 are close to or abutted against each other, and at this time, the second plate 212 and the fourth plate 222 can play a role in blocking material vapor; because the fourth plate 222 is an inclined plate, the fourth plate 222 is located on the side of the first baffle 21 away from the evaporation source 40 and can cover the adjacent parts of the second plate 212 and the fourth plate 222 above the part, and the material vapor leaking from between the second plate 212 and the fourth plate 222 is easily blocked by the fourth plate 222 and attached to the fourth plate 222; that is, when the first baffle 21 is in the second position, the fourth plate 222 is also used to further block the material vapor from entering the evaporation channel 101.

[0173] It can be understood that when there is a gap between the first baffle 21 and the second baffle 22, material vapor is more likely to leak between the second plate 212 and the fourth plate 222, and the fourth plate 222 can better block the material vapor.

[0174] In this embodiment, the end of the fourth plate body 222 away from the third plate body 221 can extend to the side of the first baffle plate 21 away from the evaporation source 40 when the first baffle plate 21 is in the second position, that is, the end of the fourth plate body 222 away from the third plate body 221 can be located above the first baffle plate 21 when the first baffle plate 21 is in the second position. At this time, the end of the fourth plate body 222 away from the third plate body 221 can be above the adjacent position of the first baffle plate 21 and the second baffle plate 22. If material vapor leaks through the adjacent position of the first baffle plate 21 and the second baffle plate 22, the leaked material vapor can be blocked by the end of the fourth plate body 222 away from the third plate body 221 and attached to the fourth plate body 222, so that the first baffle plate 21 and the second baffle plate 22 can better block the material vapor.

[0175] refer to Figures 1 to 3 In some embodiments, a rounded corner is formed at the connection between the third plate body 221 and the fourth plate body 222 .

[0176] If an edge is formed at the connection between the third plate body 221 and the fourth plate body 222, the adhesion of the solidified vapor-deposited film layer on the edge and near the edge is low, and the solidified vapor-deposited film layer is easy to accumulate quickly on the edge and near the edge. As the thickness of the solidified vapor-deposited film layer gradually increases, the solidified vapor-deposited film layer is more likely to fall from the second baffle 22 and interfere with the vapor deposition source 40.

[0177] Accordingly, in this embodiment, rounded corners are provided at the connection between the third plate body 221 and the fourth plate body 222 so that the solidified evaporated film layer can be more evenly adhered to the connection between the third plate body 221 and the fourth plate body 222, and the solidified evaporated film layer is not easy to accumulate quickly at the connection between the third plate body 221 and the fourth plate body 222, thereby increasing the adhesion of the evaporated film layer at the connection between the third plate body 221 and the fourth plate body 222 and reducing interference with the evaporation source 40.

[0178] refer to Figures 1 to 3 In some embodiments, a second protruding structure 223 is protruded from a side of the fourth plate 222 facing the evaporation channel 101 ; and / or a second protruding structure 223 is protruded from a side of the third plate 221 facing the evaporation channel 101 .

[0179] The second protruding structure 223 refers to a structure protruding from the third plate body 221 and / or the fourth plate body 222; the second protruding structure 223 can be a bolt, a protrusion or other structure provided on the third plate body 221 and / or the fourth plate body 222, or it can be a protrusion integrally formed on the third plate body 221 and / or the fourth plate body 222; the material of the second protruding structure 223 can be the same as the material of the third plate body 221 and / or the fourth plate body 222, or it can be different. Specifically, the material of the second protruding structure 223 can include metal, plastic or other materials.

[0180] The second protruding structure 223 may be provided only on the third plate 221 or the fourth plate 222, or may be provided on both the third plate 221 and the fourth plate 222; one second protruding structure 223 may be provided on the third plate 221 and / or the fourth plate 222, or two or more second protruding structures 223 may be provided.

[0181] The second protruding structure 223 is arranged on the side of the third plate 221 facing the evaporation source 40, and / or the second protruding structure 223 is arranged on the side of the fourth plate 222 facing the evaporation channel 101. This arrangement can increase the roughness of the surface of the third plate 221 and / or the fourth plate 222 for attaching material vapor, so as to increase the adhesion of the solidified evaporated film layer on the third plate 221 or the fourth plate 222. At the same time, this arrangement can also increase the area of ​​the surface of the third plate 221 and / or the fourth plate 222 for attaching material vapor, so as to better slow down the thickness increase rate of the evaporated film layer after solidification.

[0182] In this embodiment, a second protruding structure 223 is provided on the third plate body 221 and / or the fourth plate body 222, so as to reduce the surface smoothness of the third plate body 221 and / or the fourth plate body 222 through the second protruding structure 223, thereby further increasing the adhesion of the evaporated film layer on the third plate body 221 and / or the fourth plate body 222; at the same time, this setting can also further increase the area of ​​the third plate body 221 and / or the fourth plate body 222, thereby increasing the adhesion area of ​​the evaporated film layer and reducing the increase rate of the thickness of the evaporated film layer on the third plate body 221 and / or the fourth plate body 222.

[0183] refer to Figures 1 to 3 In some embodiments, the baffle structure 20 further includes a second cooling structure 24 disposed on the second baffle 22 .

[0184] The second cooling structure 24 refers to a structure in the baffle structure 20 for reducing the temperature of the second baffle 22; the second cooling structure 24 may be an air cooling structure, a water cooling structure or other cooling structures; in some embodiments, the second cooling structure 24 is a water cooling structure.

[0185] The second cooling structure 24 can be fixedly connected to the second baffle plate 22 by welding, bonding or other means, and can also be detachably connected to the second baffle plate 22 by snap-on, screw-on or other means; the second cooling structure 24 can be arranged at any position of the second baffle plate 22. In order to reduce the negative impact that material vapor may have on the second cooling structure 24, the second cooling structure 24 can be arranged on the side of the second baffle plate 22 away from the evaporation source 40.

[0186] Since the material vapor is formed by heating the vapor deposition material by the vapor deposition source 40, a second cooling structure 24 is provided on the second baffle plate 22 so that the material vapor attached to the second baffle plate 22 can be quickly solidified to form a vapor deposition film layer, thereby reducing the material vapor from escaping to other locations and also reducing the material vapor from falling during the solidification process and causing interference to the vapor deposition source 40.

[0187] In this embodiment, a second cooling structure 24 is provided on the second baffle plate 22 so that the material vapor attached to the second baffle plate 22 can solidify faster and form a solidified evaporated film layer, thereby facilitating better adhesion of the evaporated film layer to the second baffle plate 22 .

[0188] In some embodiments, the evaporation device 100 includes an evaporation source 40, a diverging space 50, a bracket 10 and a feeding structure 30 arranged in sequence from low to high along the height direction (Z); the bracket 10 is provided with an evaporation channel 101 and a baffle structure 20 for opening or closing the evaporation channel 101.

[0189] The baffle structure 20 includes a first baffle 21 and a second baffle 22. The first baffle 21 can move relative to the bracket 10, and the second baffle 22 is fixed relative to the bracket 10. The first baffle 21 can move relative to the bracket 10 along a first direction, and the angle between the first direction and the width direction (Y) is 5.5°.

[0190] When the first baffle plate 21 moves to the second position along the first direction, there is a gap between the first baffle plate 21 and the second baffle plate 22 , and the width of the gap is 2.5 mm.

[0191] The first baffle 21 includes a first plate body 211 extending along the width direction (Y) and a second plate body 212 inclined relative to the first plate body 211, the angle between the second plate body 212 and the width direction (Y) is 45°, and a first protrusion structure 213 is also provided on the second plate body 212; the first baffle 21 also includes a first cooling structure 23.

[0192] The second baffle 22 includes a third plate body 221 extending along the width direction (Y) and a fourth plate body 222 inclined relative to the third plate body 221, the angle between the fourth plate body 222 and the width direction (Y) is 75°, and a second protrusion structure 223 is also provided on the fourth plate body 222; the second baffle 22 also includes a second cooling structure 24.

[0193] On the second aspect, some embodiments of the present application also provide a battery processing system, including the evaporation device 100 provided by some embodiments of the first aspect, which can efficiently form an aluminum coating on the positive electrode collector of the battery and is not likely to cause interference to the evaporation source 40 of the evaporation device 100.

[0194] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A vapor deposition device, characterized in that: include: Evaporation source; A bracket, arranged at one side of the evaporation source along the height direction of the evaporation device, a diverging space is formed between the bracket and the evaporation source, and a evaporation channel connected to the diverging space is provided on the bracket; A feeding structure, arranged on a side of the support opposite to the evaporation source along the height direction, wherein at least a portion of the feeding structure is opposite to the evaporation channel; A baffle structure is arranged on the bracket, and the baffle structure includes a first baffle movably arranged on the bracket, and the first baffle is used to close or open the evaporation channel.

2. The evaporation device according to claim 1, characterized in that: The baffle structure has a first position and a second position arranged in sequence along a first direction, and the first baffle can move between the first position and the second position; When the first baffle is in the first position, the evaporation channel is opened; When the first baffle is in the second position, the evaporation channel is closed.

3. The evaporation device according to claim 2, characterized in that: The baffle structure further includes a second baffle, and the first baffle and the second baffle are respectively arranged on opposite sides of the evaporation channel along the first direction; When the first baffle is in the second position, the first baffle is adjacent to the second baffle and closes the evaporation channel.

4. The evaporation device according to claim 3, characterized in that: When the first baffle is at the second position, there is a gap between the first baffle and the second baffle.

5. The evaporation device according to claim 4, characterized in that: The width of the gap ranges from 2 mm to 3 mm.

6. The evaporation device according to any one of claims 3 to 5, characterized in that: The first direction is inclined relative to the width direction of the evaporation device; In the height direction, the distance between the second position and the evaporation source is smaller than the distance between the first position and the evaporation source.

7. The evaporation device according to claim 6, characterized in that: The angle between the first direction and the width direction is in the range of 5° to 6°.

8. The evaporation device according to any one of claims 1 to 7, characterized in that: The first baffle includes a first plate body and a second plate body, the first plate body is arranged perpendicular to the extension direction of the evaporation channel, and the second plate body is inclined relative to the width direction of the evaporation device, one end of the second plate body is connected to one end of the first plate body close to the evaporation channel, and the other end of the second plate body extends in a direction away from the first plate body and away from the evaporation source.

9. The evaporation device according to claim 8, characterized in that: A rounded corner is formed at a connection between the first plate body and the second plate body.

10. The evaporation device according to claim 8 or 9, characterized in that: The angle between the second plate and the width direction is in the range of 40° to 50°.

11. The evaporation device according to any one of claims 8 to 10, characterized in that: A first protrusion structure is protruded on a side of the second plate body facing the evaporation channel; and / or A first protrusion structure is protruded from one side of the first plate body facing the evaporation source.

12. The evaporation device according to any one of claims 1 to 11, characterized in that: The baffle structure further includes a first cooling structure disposed on the first baffle.

13. The evaporation device according to any one of claims 3 to 7, characterized in that: The second baffle includes a third plate and a fourth plate. The third plate is arranged perpendicular to the extension direction of the evaporation channel, and the fourth plate is inclined relative to the width direction of the evaporation device. One end of the fourth plate is connected to the third plate, and the other end of the fourth plate extends in a direction away from the third plate and away from the evaporation source.

14. The evaporation device according to claim 13, characterized in that: A rounded corner is formed at a connection between the third plate body and the fourth plate body.

15. The evaporation device according to claim 13 or 14, characterized in that: The angle between the fourth plate and the width direction is in the range of 70° to 80°.

16. The evaporation device according to any one of claims 13 to 15, characterized in that: When the first baffle is in the second position, an end of the fourth plate body facing away from the third plate body is located at a side of the first baffle plate facing away from the evaporation source.

17. The evaporation device according to any one of claims 13 to 16, characterized in that: A second protrusion structure is protruded on a side of the fourth plate body facing the evaporation channel; and / or A second protrusion structure is protruded from one side of the third plate body facing the evaporation channel.

18. The evaporation device according to any one of claims 3 to 7 and 13 to 17, characterized in that: The baffle structure also includes a second cooling structure disposed on the second baffle.

19. The evaporation device according to any one of claims 1 to 18, characterized in that: There are two brackets and they are respectively arranged on two opposite sides of the feeding structure along the height direction. There are two evaporation sources and they are respectively arranged on one side of the two brackets opposite to the feeding structure.

20. A battery processing system, characterized in that: It comprises the evaporation device as described in any one of claims 1-19.

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