Circuit board soldering tin heat resistance testing machine
By designing automated circuit board welding heat -resistant testing machines, the problem of high artificial detection costs and poor thermal heating resistance in existing technologies have been solved, and automated detection and welding heat resistance are improved, and the detection efficiency and good product rate are improved.
Patent Information
- Application Number
- CN202421095038.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-20
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-05-20
AI Technical Summary
Existing circuit board inspection mainly relies on manual operation, which leads to waste of labor costs, and the low melting point of solder can easily lead to short-circuiting of circuit boards, affecting yield.
Design a circuit board welded heat -resistant test machine, including automated small box on -board material, PCB board material area, coding zone, CCD test area, etc., automatically remove the boxes of the box through a flexible vibration plate and clamping device Put and feed, and use welds in the heat -resistant zone to improve the heat resistance of welds.
The automation operation of the box is achieved, saving labor costs, improving detection efficiency, and reducing the short circuit problem of the circuit board by improving the heat resistance of the solder and increasing the rate of good products.
Smart Images
Figure 00000000_0000_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board production equipment, in particular to a circuit board solder heat resistance testing machine. Background Art
[0002] PCB, Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, the support of electronic components, and the carrier of electrical connection of electronic components; because it is made by electronic printing, it is called "printed" circuit board. Now the production of PCB boards in the market needs to detect all aspects of PCB boards. When the pins are connected to the circuit board, they are basically connected by solder. Solder is an important industrial raw material for connecting electronic components in the welding circuit. It is a solder with a low melting point, mainly referring to solder made of tin-based alloys. In the production process of circuit boards, there will be excess solder on the surface of the circuit board. Excess solder affects the use of the circuit board, so it is necessary to detect circuit boards with excess solder.
[0003] Existing circuit board inspection generally involves manually placing the circuit board under an industrial camera for photo inspection. During the inspection, the small material box to be inspected needs to be manually taken and opened before being placed in the inspection area, which wastes manpower costs. Because tin has a low melting point, short circuit problems often occur in the circuit board. These problems need to be solved urgently. Utility Model Content
[0004] The utility model aims to provide a circuit board solder heat resistance testing machine to solve the problems raised in the above background technology.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a circuit board solder heat resistance testing machine, comprising a box body, a small box loading area is provided at the right side position of the box body, a PCB board loading area is provided at the lower side position, a coding area is provided at the right side of the PCB board loading area, a CCD test area is provided at the left side position, a good product box and a defective product box are provided between the CCD test area and the PCB board loading area, a small box picking and opening device is provided next to the small box loading area, a flexible vibration disk is provided on the other side of the small box picking and opening device, a flexible disk clearing area is provided on the other side of the flexible vibration disk, a material taking module and a visual area are connected below the flexible disk clearing area, a heat-resistant area is provided at the lower right of the material taking module and the visual area, a tinning area is provided on the right side of the heat-resistant area, and a flux box is provided on the right side of the tinning area.
[0006] The small box taking, placing and opening device includes a fixed base, support plates are fixed on both sides of the fixed base, a fixed block is provided on the top of the support plate, a counterweight is fixed on the fixed block, a first back plate is fixed on one side end of the fixed block, a first slider is fixed on the upper and lower positions of the first back plate, a belt is provided between the two first sliders, a rotating shaft is provided on the inner side of both ends of the belt, a second back plate is fixedly connected to the other side of the first slider, a second slider is fixedly provided on the upper and lower sides of the second back plate, a third back plate is fixedly connected to the other side of the second slider, and a first clamp and a second clamp are fixed on the third back plate.
[0007] Preferably, a telescopic suction cup is provided on the top of the first clamping jaw, and a longitudinal clamping jaw is provided below the telescopic suction cup.
[0008] Preferably, the second clamp is divided into two parts, an upper part and an lower part, the upper part is provided with a knocking cylinder, and the lower part is provided with a rotating shaft, the rotating shaft is connected to a fixed plate, and the horizontal clamp is installed on the fixed plate.
[0009] Preferably, the suction nozzles of the material taking module and the visual area adopt a multi-nozzle mode to be compatible with multiple models, and each suction nozzle can be moved up and down and rotated independently.
[0010] Compared with the prior art, the beneficial effects of the utility model are as follows: the circuit board solder heat resistance testing machine described in the utility model realizes automatic material loading and unloading of the material box, automatic box opening and material pouring, saving labor costs and improving efficiency; and by increasing the heat-resistant zone, the heat resistance after soldering is improved, the occurrence of circuit board short circuit problems is reduced, and the yield rate is improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0012] Figure 2 This is a top view of the internal structure of the utility model;
[0013] Figure 3 This is a schematic diagram of the structure of taking, placing and opening the box of the utility model;
[0014] Figure 4 This is an enlarged view of the structure of part A of the utility model;
[0015] In the figure: 1, box body; 2, small box loading area; 3, small box picking and opening device; 301, fixed base; 302, support plate; 303, first back plate; 3031, first slider; 304, fixed block; 305, counterweight; 306, rotating shaft; 307, belt; 308, second back plate; 309, second slider; 310, third back plate; 311, first clamp; 3111, telescopic suction cup; 312, second back plate; 313, third back plate; 314, first clamp; 315, telescopic suction cup; 316, third back plate; 317, first clamp; 318, telescopic suction cup; 319, third back plate; 320, first clamp; 321, telescopic suction cup; 322, third back plate; 323, first clamp; 324, telescopic suction cup; 325, third back plate; 326, first back plate; 327, first back plate; 328, second back plate; 329, second slider; 330, third back plate; 331, first clamp; 332, telescopic suction cup; 333, first back plate; 334, first back plate; 335, first back plate; 336, first back plate; 337, first back plate; 338, first back plate; 339, second back plate; 340, third back plate; 341, first clamp; 342, telescopic suction cup; 343, first back plate; 344, first back plate; 345, first back plate; 346, first back plate; 347, first back plate; 348, first back plate; 349, first back plate; 350, first back plate; 351, first back plate; 352, first back plate; 353, 112. Longitudinal clamp; 312. Second clamp; 3121. Beating cylinder; 313. Rotating shaft; 314. Fixed plate; 315. Horizontal clamp; 4. PCB board loading area; 5. Flexible vibration disk; 6. Inkjet printing area; 7. Material taking module and visual area; 8. Flux box; 9. Tinning area; 10. Heat-resistant area; 11. CCD test area; 12. Good product box; 13. Defective product box; 14. Flexible disk cleaning area. DETAILED DESCRIPTION
[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0017] See also Figure 1-4 The utility model provides a technical solution: a circuit board solder heat resistance testing machine, including a box body 1, a small box loading area 2 is provided near the right side of the box body 1, and the small box loading is automatically performed. The small box contains materials to be tested, and two columns of small boxes are transported at the same time. The small boxes in each column are densely arranged. A PCB board loading area 4 is provided at the lower side, and the PCB board is automatically transported. A coding area 6 is provided on the right side of the PCB board loading area 4, and the coding is sprayed above the PCB board.
[0018] A small box picking and opening device 3 is provided next to the small box loading area 2, and a flexible vibration disk 5 is provided on the other side of the small box picking and opening device 3. The small box picking and opening device 3 takes out the small material box and pours it into the flexible vibration disk 5 area after opening the cover, and at the same time, the code is sprayed on the top of the PCB.
[0019] A flexible disc clearing area 14 is provided on the other side of the flexible vibration disc 5, and a material taking module and a visual area 7 are connected below the flexible disc clearing area 14. The material taking module takes the material and sticks it on the PCB, and visually monitors it at the same time. A heat-resistant area 10 is provided at the lower right of the material taking module and the visual area 7, and a tin-wetting area 9 is provided on the right side of the heat-resistant area 10. A flux 8 is provided on the right side of the tin-wetting area. After the pasting is completed, the PCB is soldered and heat-resistant in turn. A solder toughening agent is used in the heat-resistant area 10 to improve the strength and elasticity of the solder, thereby improving the high temperature resistance of the solder.
[0020] A CCD test area 11 is provided on the left side of the box body 1, and the CCD detects the long sides of the B surface and the C surface. A good product box 12 and a defective product box 13 are provided between the CCD test area 11 and the PCB board feeding area 4. Qualified products are placed in the good product box 12, and unqualified products are placed in the defective product box 13. After each batch of material testing is completed, excess material can be cleared through the flexible disk clearing area 14. The test machine program can select whether to use flux and which flux to use according to needs.
[0021] The small box taking, placing and opening device 3 includes a fixed base 301, support plates 302 are fixed on both sides of the fixed base 301, a fixed block 304 is provided on the top of the support plate 302, a counterweight block 305 is fixed on the fixed block 304, and the counterweight block 305 acts as a stabilizing device, a first back plate 303 is fixed on one side end of the fixed block 304, a first slider 3031 is fixed at the upper and lower positions of the first back plate 303, a slide groove is provided on the first slider 3031, a belt 307 is provided between the two first sliders 3031, and the belt 307 is provided on both sides. A rotating shaft 306 is respectively provided on the inner side of each end, and the belt 307 rotates along the two rotating shafts 306 driven by the motor. A second back plate 308 is fixedly connected to the other side of the first slider 3031, and the second back plate 308 can move along the slide groove. A second slider 309 is respectively fixedly provided on the upper and lower sides of the second back plate 308, and a slide groove is also provided on the second slider 309. A third back plate 310 is fixedly connected to the other side of the second slider 309, and the third back plate 310 can also move on the corresponding slide groove. A first clamp 311 and a second clamp 312 are fixed on the third back plate 310.
[0022] A telescopic suction cup 3111 is also provided on the top of the first clamping jaw 311, and the telescopic suction cup 3111 is used to absorb the lid of the small material box to open the lid. A longitudinal clamping jaw 3112 is provided below the telescopic suction cup 3111 to clamp the small material boxes from the top of the two rows of small material boxes.
[0023] The second clamp 312 is divided into two parts, an upper part, and an upper part is provided with a knocking cylinder 3121 for knocking the inverted small material box so that the material in the small material box can be poured out better. The lower part is provided with a rotating shaft 313, and the rotating shaft 313 can realize 360° rotation, which is convenient for inverting the small material box. The rotating shaft 313 is connected to a fixed plate 314, and a horizontal clamp 315 is installed on the fixed plate 314. The horizontal clamp 315 clamps the small material box clamped by the first clamp 311 horizontally to facilitate pouring.
[0024] The suction nozzles of the material taking module and the visual area 7 adopt a multi-nozzle method to be compatible with multiple models, and each suction nozzle can be moved up and down and rotated independently.
[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A circuit board solder heat resistance testing machine, comprising a box body (1), a small box loading area (2) is provided at the right side of the box body (1), a PCB board loading area (4) is provided at the lower side, a coding area (6) is provided at the right side of the PCB board loading area (4), a CCD testing area (11) is provided at the left side, a good product box (12) and a defective product box (13) are provided between the CCD testing area (11) and the PCB board loading area (4), characterized in that: A small box loading and unloading device (3) is provided next to the small box loading and unloading device (2), a flexible vibration disk (5) is provided on the other side of the small box loading and unloading device (3), a flexible disk material cleaning area (14) is provided on the other side of the flexible vibration disk (5), a material picking module and a visual area (7) are connected below the flexible disk material cleaning area (14), a heat-resistant area (10) is provided at the lower right of the material picking module and the visual area (7), a tinning area (9) is provided on the right side of the heat-resistant area (10), and a soldering flux box (8) is provided on the right side of the tinning area (9); The small box taking-in and opening device (3) comprises a fixed base (301), support plates (302) are fixed on both sides of the fixed base (301), a fixed block (304) is provided on the top of the support plate (302), a counterweight (305) is fixed on the fixed block (304), a first back plate (303) is fixed on one side of the fixed block (304), a first slider (3031) is fixed on the upper and lower positions of the first back plate (303), a belt (307) is provided between the two first sliders (3031), a rotating shaft (306) is provided on the inner side of both ends of the belt (307), a second back plate (308) is fixedly connected to the other side of the first slider (3031), a second slider (309) is fixedly provided on the upper and lower sides of the second back plate (308), a third back plate (310) is fixedly connected to the other side of the second slider (309), and a first clamping claw (311) and a second clamping claw (312) are fixed on the third back plate (310).
2. A circuit board solder heat resistance testing machine according to claim 1, characterized in that: A telescopic suction cup (3111) is also provided on the top of the first clamping jaw (311), and a longitudinal clamping jaw (3112) is provided below the telescopic suction cup (3111).
3. A circuit board solder heat resistance testing machine according to claim 2, characterized in that: The second clamping jaw (312) is divided into two parts, an upper part and an lower part. The upper part is provided with a knocking cylinder (3121), and the lower part is provided with a rotating shaft (313). The rotating shaft (313) is connected to a fixing plate (314), and a transverse clamping jaw (315) is installed on the fixing plate (314).
4. A circuit board solder heat resistance tester according to claim 1, characterized in that: The suction nozzles of the material taking module and the visual area (7) adopt a multi-nozzle method to be compatible with multiple machine models, and each suction nozzle can be independently moved up and down and rotated.