Blowing dust removal device for semiconductor packaging process

Abstract

The utility model relates to the technical field of semiconductor packaging auxiliary equipment, in particular to a blowing dust removal device for a semiconductor packaging process, which comprises a frame, one side of the top of the frame is fixedly connected with a mounting plate, one side of the mounting plate is provided with a dust collection assembly, and the dust collection assembly comprises a fan. The fan is fixedly connected to one side of the mounting plate, and one side of the mounting plate fixedly communicates with a dust suction pipe. According to the blowing dust removal device for the semiconductor packaging process, when a semiconductor is conveyed by the conveying belt, dust enters the dust suction pipe and is subsequently discharged into the dust collection bag through rotation of the draught fan, in the dust suction process, the semiconductor can be turned over through cooperation of an electric push rod, a push rod and other components, and the semiconductor packaging efficiency is improved. The dust suction pipe can conveniently suck dust on the lower surface of a semiconductor, subsequent packaging of the semiconductor is facilitated, the automation degree is improved, convenience is improved, the device can be suitable for the semiconductor before and after packaging work, and practicability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging auxiliary equipment, in particular to an air blowing and dust removal device used in a semiconductor packaging process. Background Art

[0002] Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements. The packaging process is as follows: the wafers from the front-end process of the wafer are cut into small chips through a dicing process, and then the cut chips are glued to the corresponding islands of the substrate frame, and then ultra-fine metal wires or conductive resins are used to connect the bonding pads of the chips to the corresponding pins of the substrate to form the required circuit; then the independent chips are packaged and protected with a plastic shell.

[0003] During the semiconductor processing, due to problems such as air circulation in the workshop, some dust or particles will adhere to the surface of the semiconductor chips on the production line. The particles on the semiconductor chips can easily cause the semiconductor chips to tilt and create gaps with the packaging frame when they are packaged in the packaging frame.

[0004] In the prior art, before semiconductor packaging, workers are required to inspect and remove dust from the semiconductor. In the prior art, since the semiconductor is attached to a certain surface, it is difficult for the dust removal device to clean the dust on the contact surface. Utility Model Content

[0005] The purpose of the utility model is to provide an air blowing dust removal device for the semiconductor packaging process, so as to solve the problem in the prior art proposed in the above background technology that the semiconductor is attached to a certain surface, and in this case, it is difficult for the dust removal device to clean the dust on its contact surface. To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an air blowing dust removal device for a semiconductor packaging process, comprising a frame, a mounting plate is fixedly connected to one side of the top of the frame, a dust suction assembly is arranged on one side of the mounting plate, the dust suction assembly comprises a fan, the fan is fixedly connected to one side of the mounting plate, a dust suction pipe is fixedly connected to one side of the mounting plate, a folded bellows is fixedly connected to the side of the fan away from the mounting plate, a shell is fixedly connected to the top of the frame, a dust bag is movably connected to the inside of the shell, a handle is fixedly connected to one side of the dust bag, an air outlet is opened at the top of the shell, and a flip assembly is arranged in the inner cavity of the frame, when the conveyor belt transports the semiconductor, the dust enters the inside of the dust suction pipe through the rotation of the fan, and is subsequently discharged into the dust bag, and in the process of dust suction, the semiconductor can be flipped through the cooperation between the electric push rod, the push rod and other components, so that the dust suction pipe can absorb the dust on the lower surface of the semiconductor, which is convenient for subsequent packaging, thereby improving the degree of automation and increasing convenience, and can be applied before and after semiconductor packaging work, thereby increasing practicality.

[0006] Further preferably, the flip assembly includes an electric push rod, which is fixedly connected to the front side of the top of the frame, and a driving end at the bottom of the electric push rod is fixedly connected to a push rod.

[0007] Further preferably, the bottom of the push rod is fixedly connected to a fixed plate, and one side of the fixed plate is fixedly connected to a vacuum generator. The vacuum generator is used to adsorb the semiconductor through a vacuum suction head. As the push rod retracts and the conveyor belt moves, the semiconductor can be flipped and adjusted without manual operation by the staff, thereby increasing convenience.

[0008] Further preferably, a vacuum suction head is fixedly connected to a side of the fixing plate away from the vacuum generator, and one side of the vacuum suction head is fixedly connected to the vacuum generator.

[0009] Further preferably, a conveyor belt is fixedly connected to the bottom of the inner cavity of the frame, and the conveyor belt passes through the frame. The dust suction pipe extends from a side away from the mounting plate to a lower side of one side of the frame and passes through the frame.

[0010] Further preferably, the side of the folded bellows away from the fan is fixedly connected to the dust bag, and the dust in the dust collection tube can enter the interior of the folded bellows and further enter the interior of the dust bag through the rotation of the fan.

[0011] Compared with the prior art, the utility model has the following beneficial effects:

[0012] In the utility model, when the conveyor belt transports semiconductors, the dust can enter the interior of the dust suction pipe through the rotation of the fan, and then be discharged into the dust collecting bag. In the process of dust suction, the semiconductor can be turned over by the cooperation between the electric push rod, the push rod and other components, so that the dust suction pipe can absorb the dust on the lower surface of the semiconductor, which is convenient for subsequent packaging, thereby improving the degree of automation and increasing convenience. It can be applied before and after the semiconductor packaging work, which increases practicality.

[0013] In the utility model, a vacuum generator is used to adsorb the semiconductor through a vacuum suction head. With the retraction of the push rod and the movement of the conveyor belt, the semiconductor can be flipped and adjusted without manual operation by the staff, thereby increasing convenience. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0015] Figure 2 It is a schematic diagram of a partial three-dimensional structure of the utility model;

[0016] Figure 3 This is a schematic diagram of the three-dimensional structure of the utility model from top view;

[0017] Figure 4 It is a schematic diagram of a partial three-dimensional structure of the utility model;

[0018] Figure 5 It is a schematic diagram of the enlarged three-dimensional structure of the local details of the utility model.

[0019] In the figure: 1. frame; 2. mounting plate; 3. dust suction assembly; 301. fan; 302. dust suction tube; 303. folding bellows; 304. shell; 305. dust bag; 306. handle; 307. air outlet; 308. flip assembly; 3081. electric push rod; 3082. push rod; 3083. fixing plate; 3084. vacuum generator; 3085. vacuum suction head; 4. conveyor belt. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technical personnel in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-Figure 5The utility model provides a technical solution: an air blowing dust removal device for a semiconductor packaging process, comprising a frame 1, a mounting plate 2 is fixedly connected to one side of the top of the frame 1, a dust collection component 3 is arranged on one side of the mounting plate 2, the dust collection component 3 comprises a fan 301, the fan 301 is fixedly connected to one side of the mounting plate 2, a dust collection pipe 302 is fixedly connected to one side of the mounting plate 2, a folded bellows 303 is fixedly connected to one side of the fan 301 away from the mounting plate 2, a shell 304 is fixedly connected to the top of the frame 1, a dust bag 305 is movably connected to the inside of the shell 304, and a dust bag 305 is fixedly connected to one side of the dust bag 305. A handle 306 is fixedly connected, an air outlet 307 is provided on the top of the shell 304, and a flip assembly 308 is provided in the inner cavity of the frame 1. When in use, during the packaging process, the staff can place the semiconductor on the conveyor belt 4, and the conveyor belt 4 conveys it. During the transportation process, the fan 301 is started to form wind pressure through the dust suction pipe 302. Through the effect of the wind pressure, the dust on the surface of the semiconductor can enter the interior of the dust suction pipe 302, and be transported to the interior of the dust collecting bag 305 through the folded bellows 303. The dust collecting bag 305 stores the dust, and the air can be discharged through the holes on the dust collecting bag 305.

[0022] In this embodiment, Figure 1 , Figure 2 and Figure 5 As shown, the flip assembly 308 includes an electric push rod 3081, which is fixedly connected to the front side of the top of the frame 1, and a driving end at the bottom of the electric push rod 3081 is fixedly connected to a push rod 3082. Starting the electric push rod 3081 pushes the push rod 3082 down to achieve the side surface of the semiconductor fitting with the vacuum suction head 3085.

[0023] In this embodiment, Figure 1 , Figure 2 and Figure 5 As shown, the bottom of the push rod 3082 is fixedly connected to a fixed plate 3083, one side of the fixed plate 3083 is fixedly connected to a vacuum generator 3084, and the side of the fixed plate 3083 away from the vacuum generator 3084 is fixedly connected to a vacuum suction head 3085, one side of the vacuum suction head 3085 is fixedly connected to the vacuum generator 3084, and the vacuum generator 3084 is started to absorb the side surface of the semiconductor through the vacuum suction head 3085, and then the electric push rod 3081 retracts, which can drive the fixed plate 3083 to rise, and then drive the semiconductor to rise, and the lower surface of the semiconductor will be exposed.

[0024] In this embodiment, Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5As shown, a conveyor belt 4 is fixedly connected to the bottom of the inner cavity of the frame 1, and the conveyor belt 4 passes through the frame 1. The dust suction pipe 302 extends from the side away from the mounting plate 2 to the lower side of the side of the frame 1 and passes through the frame 1. The side of the folding bellows 303 away from the fan 301 is fixedly connected to the dust bag 305. Since the folding bellows 303 has a telescopic effect, when the staff pulls the handle 306, the folding bellows 303 can be extended, so that the dust bag 305 can be pulled out from the inside of the outer shell 304, so that the dust stored in the dust bag 305 can be cleaned.

[0025] The use method and advantages of the utility model: The air blowing dust removal device used in the semiconductor packaging process, when in use, the working process is as follows:

[0026] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, when in use, during the packaging process, the staff can place the semiconductor on the conveyor belt 4, and the conveyor belt 4 conveys it. During the conveying process, the fan 301 is started to form wind pressure through the dust suction pipe 302. The wind pressure can make the dust on the surface of the semiconductor enter the inside of the dust suction pipe 302, and convey it to the inside of the dust bag 305 through the folded bellows 303. The dust bag 305 stores the dust, and the air can be discharged through the holes on the dust bag 305. When the semiconductor is conveyed to a certain distance, the electric push rod 3081 is started to push the push rod 3082 down, so that the side surface of the semiconductor is attached to the vacuum suction head 3085, and the vacuum generator 3084 is started to adsorb the side surface of the semiconductor through the vacuum suction head 3085. Then The electric push rod 3081 retracts, thereby driving the fixed plate 3083 to rise, and then driving the semiconductor to rise. At this time, the lower surface of the semiconductor will be exposed, and the dust on its lower surface can be sucked into the dust suction tube 302. Then the vacuum generator 3084 is turned off to release the vacuum suction head 3085 from adsorbing the semiconductor. The conveyor belt 4 continues to convey the semiconductor to the location of the packaging device, and then the packaging work can be carried out. The subsequent staff can pull the handle 306. Since the folding bellows 303 has a telescopic effect, the folding bellows 303 can be extended during the process of the staff pulling the handle 306, so that the dust bag 305 can be pulled out from the inside of the shell 304, so that the dust stored in the dust bag 305 can be cleaned.

[0027] The above shows and describes the basic principle, main features and advantages of the utility model. Technical staff in this industry should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model will have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. An air blowing dust removal device for a semiconductor packaging process, comprising a frame (1), characterized in that: A mounting plate (2) is fixedly connected to one side of the top of the frame (1); a dust collection assembly (3) is provided on one side of the mounting plate (2); the dust collection assembly (3) comprises a fan (301); the fan (301) is fixedly connected to one side of the mounting plate (2); a dust collection pipe (302) is fixedly connected to one side of the mounting plate (2); a folded bellows (303) is fixedly connected to the side of the fan (301) away from the mounting plate (2); a housing (304) is fixedly connected to the top of the frame (1); a dust bag (305) is movably connected to the inside of the housing (304); a handle (306) is fixedly connected to one side of the dust bag (305); an air outlet (307) is provided at the top of the housing (304); and a flip assembly (308) is provided in the inner cavity of the frame (1).

2. The air blowing and dust removal device for semiconductor packaging process according to claim 1, characterized in that: The flip assembly (308) comprises an electric push rod (3081), wherein the electric push rod (3081) is fixedly connected to the front side of the top of the frame (1), and a driving end at the bottom of the electric push rod (3081) is fixedly connected to a driving rod (3082).

3. The air blowing and dust removal device for semiconductor packaging process according to claim 2, characterized in that: The bottom of the push rod (3082) is fixedly connected to a fixing plate (3083), and one side of the fixing plate (3083) is fixedly connected to a vacuum generator (3084).

4. The air blowing and dust removal device for semiconductor packaging process according to claim 3, characterized in that: A vacuum suction head (3085) is fixedly connected to a side of the fixed plate (3083) away from the vacuum generator (3084), and one side of the vacuum suction head (3085) is fixedly connected to the vacuum generator (3084).

5. The air blowing and dust removal device for semiconductor packaging process according to claim 4, characterized in that: A conveyor belt (4) is fixedly connected to the bottom of the inner cavity of the frame (1), and the conveyor belt (4) passes through the frame (1). The dust suction pipe (302) extends from a side away from the mounting plate (2) to the lower side of one side of the frame (1) and passes through the frame (1).

6. The air blowing and dust removal device for semiconductor packaging process according to claim 1, characterized in that: The side of the folded bellows (303) away from the fan (301) is fixedly connected to the dust collecting bag (305).

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